CN108134000B - Light-emitting device, packaging method and projection system - Google Patents
Light-emitting device, packaging method and projection system Download PDFInfo
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- CN108134000B CN108134000B CN201611090609.8A CN201611090609A CN108134000B CN 108134000 B CN108134000 B CN 108134000B CN 201611090609 A CN201611090609 A CN 201611090609A CN 108134000 B CN108134000 B CN 108134000B
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
Abstract
The invention discloses a light-emitting device, a packaging method and a projection system, wherein the light-emitting device comprises at least two parts which are bonded and packaged together, the bonding substrate interface of the parts is divided into a first functional area and a second functional area, the first functional area is coated with high-heat-conductivity glue, the second functional area is coated with low-heat-conductivity glue, the heat conductivity of the high-heat-conductivity glue is greater than that of the low-heat-conductivity glue, and the cohesiveness of the low-heat-conductivity glue is greater than that of the high-heat-conductivity glue. The light-emitting device provided by the invention can meet the requirement of high-heat-conduction bonding while ensuring high-strength bonding performance, and realizes high reliability of the light-emitting device.
Description
Technical Field
The present invention relates to the field of lighting and display technologies, and in particular, to a light emitting device, a packaging method and a projection system.
Background
It is known that a solid-state light source such as an LED or a Laser Diode (LD) emits blue excitation light, and the excitation of a yellow or green phosphor material with the blue excitation light can obtain light of a corresponding color. When the excitation light source with short wavelength excites the fluorescent material to perform wavelength conversion to obtain corresponding color light with long wavelength, a part of energy is also converted into heat to be released. Along with the improvement of the luminous power of the exciting light, the luminous flux of the obtained converted colored light is continuously increased, the heat is also continuously increased, and the temperature of the fluorescent material is continuously increased due to the accumulation of a large amount of heat, so that the quantum conversion efficiency of the fluorescent material is influenced. Therefore, an efficient thermal interface bonding layer is required between the light emitting layer and the high thermal conductivity substrate.
The traditional technology adopts high-heat-conductivity bonding glue, the main components of which are organic bonding resin materials and high-heat-conductivity inorganic fillers, and the glue materials have the common defects that: the thermal conductivity is increased along with the increase of the inorganic heat-conducting filler, and the adhesive force is enhanced along with the increase of the organic resin material; in order to ensure effective bonding, the adding proportion of the high-heat-conductivity filler of the glue is generally not too high, and the heat conductivity of the glue is below 4W/(m.K); the glue added with the heat-conducting filler has higher hardness after being cured, and the generated structural stress is larger, so that the problems of degumming, cracking and the like exist in the working environment of cold-hot circulation, and potential reliability hazards are caused to products.
Disclosure of Invention
The invention provides a light-emitting device, a packaging method and a projection system, wherein the light-emitting device is packaged in a mode of combining high-heat-conduction glue and low-heat-conduction glue, a bonding interface is divided according to functional areas, different areas are bonded by using bonding agents with different heat conductivities and bonding properties, the high-heat-conduction bonding requirement is met while the high-strength bonding property is ensured, and the high-reliability packaging of the light-emitting device is realized.
According to a first aspect of the present invention, there is provided a light emitting device, comprising at least two components bonded and packaged together, wherein a bonding substrate interface of the components is divided into at least a first functional region and a second functional region, the first functional region is coated with a high thermal conductive glue, the second functional region is coated with a low thermal conductive glue, wherein a thermal conductivity of the high thermal conductive glue is greater than a thermal conductivity of the low thermal conductive glue, and a cohesiveness of the low thermal conductive glue is greater than a cohesiveness of the high thermal conductive glue.
Furthermore, the thermal conductivity of the high thermal conductivity glue is more than 10 w/(m.k), and the thermal conductivity of the low thermal conductivity glue is less than 10 w/(m.k).
Further, the area S of the first functional regionFirst functional areaAnd the area S of the second functional regionSecond functional regionThe following conditions are satisfied:
Sfirst functional area≥SSecond functional regionAnd is and
70％*(Sfirst functional area+SSecond functional region)≥SFirst functional area≥50％*(SFirst functional area+SSecond functional region)。
Further, the opposite side of the first functional region is a heat-generating central region.
Further, the first functional region and the second functional region are concentrically and annularly distributed at intervals or are distributed at intervals along the circumferential direction.
Further, the member includes a ceramic wheel sheet including a light emitting layer, a reflective layer and a ceramic substrate laminated in this order, and a metal substrate bonded to the ceramic substrate, the ceramic substrate serving as the bonding substrate interface having the first functional region and the second functional region thereon.
Further, the ceramic wheel piece is in a ring shape, and the first functional region and the second functional region are concentrically and annularly distributed at intervals or are circumferentially distributed at intervals.
Further, the metal substrate includes a groove, and the ceramic substrate is bonded to the metal substrate by being bonded to an inner surface of the groove.
According to a second aspect of the present invention, a method for packaging a light emitting device is provided, wherein an interface of a bonding substrate is divided into at least a first functional region and a second functional region, the first functional region is coated with a high thermal conductive glue, and the second functional region is coated with a low thermal conductive glue, wherein a thermal conductivity of the high thermal conductive glue is greater than a thermal conductivity of the low thermal conductive glue, and a cohesiveness of the low thermal conductive glue is greater than a cohesiveness of the high thermal conductive glue.
Furthermore, the thermal conductivity of the high thermal conductivity glue is more than 10 w/(m.k), and the thermal conductivity of the low thermal conductivity glue is less than 10 w/(m.k).
Further, the area S of the first functional regionFirst functional areaAnd the area S of the second functional regionSecond functional regionThe following conditions are satisfied:
Sfirst functional area≥SSecond functional regionAnd is and
70％*(Sfirst functional area+SSecond functional region)≥SFirst functional area≥50％*(SFirst functional area+SSecond functional region)。
Further, the opposite side of the first functional region is a heat-generating central region.
Further, the light emitting device includes a ceramic wheel sheet including a light emitting layer, a reflective layer, and a ceramic substrate laminated in this order, the ceramic substrate serving as the bonding substrate interface having the first functional region and the second functional region thereon, and the ceramic substrate bonded to the metal substrate.
Further, the ceramic wheel piece is in a ring shape, and the first functional region and the second functional region are concentrically and annularly distributed at intervals or are circumferentially distributed at intervals.
According to a third aspect of the present invention, the present invention provides a light source system, comprising the light emitting device of the first aspect, and further comprising an excitation light source for generating excitation light, wherein the light emitting device is located on an optical path of the excitation light.
According to a fourth aspect of the present invention, there is provided a projection system comprising the light source system of the third aspect, and further comprising a projection imaging device.
The light-emitting device is packaged in a mode of combining the high-heat-conduction glue and the low-heat-conduction glue, the bonding interface is divided according to the functional areas, different areas are bonded by using the bonding agents with different heat conductivities and bonding properties, the high-strength bonding property is ensured, the requirement of high-heat-conduction bonding is met, and the high-reliability packaging of the light-emitting device is realized.
Drawings
FIG. 1 is a schematic view of a ceramic disk printed with a reflective layer and a luminescent layer according to example 1 of the present invention;
FIG. 2 is a schematic view showing the distribution of the adhesive layers on the opposite surfaces of the ceramic wheel sheet in example 1 of the present invention;
fig. 3 is a schematic view of a packaged light-emitting device in embodiment 1 of the present invention;
FIG. 4 is a schematic view showing the distribution of the adhesive layers on the opposite surfaces of the ceramic wheel sheet in example 2 of the present invention;
fig. 5 is a schematic view of a packaged light-emitting device in embodiment 2 of the invention.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings.
The packaging method of the light-emitting device adopts a mode of combining high-heat-conduction glue and low-heat-conduction glue, and is suitable for bonding any interfaces, such as bonding between interfaces of metal, ceramic, glass, metal plating and the like. A typical example is the bonding between a metal substrate and a ceramic substrate.
In the packaging method of the light-emitting device, the bonding substrate interface is divided into different areas, wherein the different areas at least comprise a first functional area and a second functional area, the first functional area is also called a high heat conduction area, the second functional area is also called an intensity bonding area, the first functional area is coated with high heat conduction glue, the second functional area is coated with low heat conduction glue, the heat conductivity of the high heat conduction glue is greater than that of the low heat conduction glue, and the cohesiveness of the low heat conduction glue is greater than that of the high heat conduction glue.
In the present invention, the high thermal conductivity region and the strength bonding region are relatively conceptual, that is, the high thermal conductivity region has a thermal conductivity greater than other regions, and the strength bonding region has a bonding strength greater than other bonding regions. Correspondingly, the glue with high thermal conductivity and the glue with low thermal conductivity are also relatively concepts, namely the thermal conductivity of the glue with high thermal conductivity is larger than that of the glue with low thermal conductivity.
The heat-conducting glue is generally composed of an organic bonding resin material and a high heat-conducting inorganic filler, wherein the bonding resin material is epoxy resin, silica gel and the like; inorganic fillers having high thermal conductivity such as metal powder (silver, copper, aluminum, tin, etc.), carbon material (graphite, carbon fiber, graphene, etc.), SiC, Al2O3、MgO、SiN、SiO2And the like. The higher the relative content of the bonding resin material is, the higher the bonding strength is, and the lower the thermal conductivity is; while the higher the relative content of inorganic filler, the higher the thermal conductivity and the lower the bond strength. Therefore, the high thermal conductivity glue and the low thermal conductivity glue show opposite performance in terms of thermal conductivity and adhesiveness. The proportion of the inorganic filler in the high-heat-conductivity glue is higher, and is generally more than 50 percent; the inorganic filler in the low-heat-conductivity glue is lower in proportion, generally 10-15 percent or less than 30 percent, and the filler is also generally Al with poor heat conductivity2O3And the like.
In the present invention, the thermal conductivity of the high thermal conductive glue and the thermal conductivity of the low thermal conductive glue may not be strictly limited. However, as a preferred embodiment of the present invention, the thermal conductivity of the high thermal conductive glue is greater than 10w/(m · k), and the thermal conductivity of the low thermal conductive glue is less than 10w/(m · k), so that good effects, i.e. good high-strength adhesive property and good high thermal conductive adhesive property, can be obtained, and the high reliability of the light emitting device is further guaranteed.
In some embodiments of the invention, the high thermal conductivity glue is selected from silver paste, the thermal conductivity of the silver paste is 60-80 w/(m.k), the hardness is Shore A75-Shore A90, and the peeling force range is 2.8-4.5 kgf; the high-thermal-conductivity silver paste has the characteristics of very high thermal conductivity and low bonding strength; the low-thermal-conductivity glue is characterized in that a thermal-conductivity powder filler is added into bonding resin, the thermal conductivity of the low-thermal-conductivity glue is 0.5-3 w/(m.k), the hardness of the low-thermal-conductivity glue is Shore A65-Shore A80, the peeling force range is 8-12 kgf, and the low-thermal-conductivity glue is low in thermal conductivity and high in bonding strength.
In the present invention, the area S of the first functional regionFirst functional areaAnd the area S of the second functional regionSecond functional regionThe inventor finds that the following conditions are met to ensure the optimal heat conductivity and bonding strength: sFirst functional area≥SSecond functional regionAnd 70% ((S))First functional area+SSecond functional region)≥SFirst functional area≥50％*(SFirst functional area+SSecond functional region). It is worth mentioning that even SFirst functional areaThe effects of the present invention can be substantially achieved without satisfying the above conditions, but in the case where the above conditions are satisfied, thermal conductivity and adhesive strength are better, and high reliability of the light emitting device is more secured.
From the viewpoint of optimizing the packaging effect of the present invention, the first functional region is mainly used for heat conduction, and therefore, in a preferred embodiment of the present invention, the opposite surface of the first functional region is a heat-generating central region, and since the heat-generating central region generates a larger amount of heat, the opposite surface is a first functional region with high heat conduction, which is beneficial to sufficient heat dissipation.
The technical solutions of the present invention are described in detail by the following examples, and it should be understood that the examples are only illustrative and should not be construed as limiting the scope of the present invention.
Example 1
In this embodiment, a reflective layer and a light emitting layer on the surface of the reflective layer are printed on one surface of a circular ring-shaped ceramic substrate, as shown in fig. 1, the ceramic wheel sheet includes a light emitting layer 101-a, a reflective layer 101-b, and a ceramic substrate 101-c; the ceramic wheel piece 101 is entirely constructed.
As shown in fig. 2, on the other side of the ceramic wheel piece, according to the distribution shown in fig. 2, that is, the areas of the high thermal conductive glue 103 and the low thermal conductive glue 104 are distributed at intervals along the circumferential direction, and the high thermal conductive glue 103 (with a thermal conductivity greater than 10w/(m · k)) and the low thermal conductive glue 104 (with a thermal conductivity less than 10w/(m · k)) with strong adhesion are alternately coated, respectively, so that the area S of the area of the high thermal conductive glue 103 is required to be larger than 10w/(m · k103≥S104And 70% S104+103≥S103≥50％*S104+103This ensures optimum thermal conductivity and adhesive strength. The embodiment exemplarily and non-limitedly shows that the glue 103 with high thermal conductivity and the glue 104 with low thermal conductivity are coated in a symmetrical distribution manner on the line passing through the center of circle, the curing manners of the two glues are the same, and belong to both heating curing and normal temperature moisture curing, and the curing conditions are the same or very close, and the two glues do not affect the curing performance.
As shown in fig. 3, the glue-coated surface of the ceramic wheel sheet 101 is attached to the inner surface of the groove of the metal substrate 102 (e.g., aluminum plate, copper plate, or alloy plate), and after the glue is completely cured, the motor member 105 is mounted on the metal substrate 102, thereby completing the packaging of the entire light-emitting device component. The groove on the metal substrate 102 has a limiting effect, so that the ceramic wheel sheet 101 is prevented from being excessively protruded, and the installation is facilitated.
In the embodiment, a high-thermal-conductivity and low-thermal-conductivity bonding glue alternative coating mode is adopted, the width of an alternative glue area can be adjusted randomly within a certain range, the content of the inorganic heat-conducting filler of the high-thermal-conductivity glue is high, the hardness of the glue is high, the stress generated by curing is high, the hardness of the low-thermal-conductivity glue with high bonding strength is low, and the high-thermal-conductivity bonding glue can provide stress buffering and releasing functions while providing high bonding reliability.
Example 2
In this embodiment, a reflective layer and a light emitting layer on the surface of the reflective layer are printed on one surface of a circular ring-shaped ceramic substrate, as shown in fig. 1, the ceramic wheel sheet includes a light emitting layer 101-a, a reflective layer 101-b, and a ceramic substrate 101-c; the ceramic wheel piece 101 is entirely constructed.
As shown in the figure4, on the other side of the ceramic wheel piece, according to the distribution schematic shown in fig. 4, that is, the high thermal conductive glue 103 area and the low thermal conductive glue 104 area are concentrically and annularly distributed at intervals, the high thermal conductive glue 103 and the low thermal conductive glue 104 with strong adhesion are respectively coated (or printed) in a spot manner, and the area S of the high thermal conductive glue 103 area is required103≥S104And 70% S104+103≥S103≥50％*S104+103。
As shown in fig. 5, the opposite surface of the high thermal conductive glue 103 region is a laser spot irradiated region 106 of the light emitting layer, which is a heating central region, and therefore the opposite surfaces need to be bonded by the high thermal conductive glue; the two glues have the same curing mode, belong to heating curing or normal temperature moisture curing, and the curing conditions are the same or very close, and the two do not influence the curing performance each other.
The coated glue surface of the ceramic wheel sheet 101 is attached to the inner surface of the groove of the metal substrate 102 (such as an aluminum plate, a copper plate or an alloy plate), after the glue is completely cured, the motor part 105 is mounted on the metal substrate 102, and the whole light-emitting device component is packaged. The groove on the metal substrate 102 has a limiting effect, so that the ceramic wheel sheet 101 is prevented from being excessively protruded, and the installation is facilitated.
In this embodiment, a bonding manner of bonding glue with high and low thermal conductivity is adopted, the opposite surfaces of the heating center region are bonded by glue with high thermal conductivity, i.e., the high thermal conductivity glue 103 region, and the glue with low thermal conductivity and high bonding strength is adopted to bond the two side regions of the high thermal conductivity bonding region, i.e., the low thermal conductivity glue 104 region. The high-heat-conduction glue bonding area can effectively transfer the heat of the high-heat-generation area to the metal substrate below, and mainly plays a role in heat conduction; the glue with high bonding strength and low heat conduction of the inner ring and the outer ring ensures the effective bonding strength of the two interfaces and the bonding reliability of the product.
The invention also provides a light source system, which comprises the light-emitting device provided by the embodiment of the invention and an excitation light source used for generating excitation light, wherein the light-emitting device is positioned on the light path of the excitation light.
The invention also provides a projection system, which comprises the light source system of the embodiment of the invention and a projection imaging device.
The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and the practice of the invention is not to be considered limited to those descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (15)
1. A light-emitting device is characterized by comprising at least two parts which are bonded and packaged together, wherein a bonding substrate interface of each part is divided into a high heat conduction area and an intensity bonding area, the opposite surface of the high heat conduction area is a heating central area, the high heat conduction area is coated with high heat conduction glue, the intensity bonding area is coated with low heat conduction glue, the heat conductivity of the high heat conduction glue is greater than that of the low heat conduction glue, and the cohesiveness of the low heat conduction glue is greater than that of the high heat conduction glue.
2. The lighting device as claimed in claim 1, wherein the thermal conductivity of the high thermal conductivity glue is greater than 10 w/(m-k), and the thermal conductivity of the low thermal conductivity glue is less than 10 w/(m-k).
3. The light-emitting device according to claim 1, wherein the area S of the high thermal conductive regionHigh heat conduction areaAnd area S of the strength-bonding zoneStrength bond areaThe following conditions are satisfied:
Shigh heat conduction area≥SStrength bond areaAnd is and
70％*(Shigh heat conduction area+SStrength bond area)≥SHigh heat conduction area≥50％*(SHigh heat conduction area+SStrength bond area)。
4. The lighting device as claimed in claim 1, wherein the high thermal conductivity region and the intensity bonding region are concentrically and annularly spaced or circumferentially spaced.
5. The light-emitting device according to claim 1, wherein the member comprises a ceramic wheel sheet and a metal substrate, the ceramic wheel sheet comprises a luminescent layer, a reflective layer and a ceramic substrate laminated in this order, the ceramic substrate serves as the bonding substrate interface having the high thermal conductive region and the strength bonding region thereon, and the ceramic substrate is bonded to the metal substrate.
6. The lighting device as claimed in claim 5, wherein the ceramic wheel is circular ring-shaped, and the high thermal conductivity region and the strength bonding region are concentrically and annularly spaced or circumferentially spaced.
7. The light-emitting device according to claim 5, wherein the metal substrate includes a groove, and the ceramic substrate is bonded to the metal substrate by bonding to an inner surface of the groove.
8. A packaging method of a light-emitting device is characterized in that a bonding substrate interface is divided into a high heat conduction area and an intensity bonding area, high heat conduction glue is coated on the high heat conduction area, low heat conduction glue is coated on the intensity bonding area, the heat conductivity of the high heat conduction glue is larger than that of the low heat conduction glue, and the cohesiveness of the low heat conduction glue is larger than that of the high heat conduction glue.
9. The method for packaging a light emitting device according to claim 8, wherein the thermal conductivity of the high thermal conductivity glue is greater than 10 w/(m-k), and the thermal conductivity of the low thermal conductivity glue is less than 10 w/(m-k).
10. The method of claim 8, wherein the area S of the high thermal conductivity region is larger than the area S of the high thermal conductivity regionHigh heat conduction areaAnd the area S of the strength-bond regionStrength bond areaThe following conditions are satisfied:
Shigh heat conduction area≥SStrength bond areaAnd is and
70％*(Shigh heat conduction area+SStrength bond area)≥SHigh heat conduction area≥50％*(SHigh heat conduction area+SStrength bond area)。
11. The method of claim 8, wherein the opposite sides of the high thermal conductivity region are heat-generating central regions.
12. The method of claim 8, wherein the light emitting device comprises a ceramic wheel sheet and a metal substrate, the ceramic wheel sheet comprises a light emitting layer, a reflective layer and a ceramic substrate laminated in this order, the ceramic substrate serves as the bonding substrate interface having the high thermal conductivity region and the strength bonding region thereon, and the ceramic substrate is bonded to the metal substrate.
13. The method of claim 12, wherein the ceramic wheel is circular, and the high thermal conductivity region and the strength bonding region are concentrically and annularly spaced or circumferentially spaced.
14. A light source system comprising the light-emitting device according to any one of claims 1 to 7, and further comprising an excitation light source for generating excitation light, wherein the light-emitting device is located on an optical path of the excitation light.
15. A projection system comprising the light source system of claim 14 and further comprising a projection imaging device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611090609.8A CN108134000B (en) | 2016-12-01 | 2016-12-01 | Light-emitting device, packaging method and projection system |
| PCT/CN2017/109331 WO2018099242A1 (en) | 2016-12-01 | 2017-11-03 | A light emitting device and packaging method and projection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611090609.8A CN108134000B (en) | 2016-12-01 | 2016-12-01 | Light-emitting device, packaging method and projection system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108134000A CN108134000A (en) | 2018-06-08 |
| CN108134000B true CN108134000B (en) | 2020-12-08 |
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| JP4895293B2 (en) * | 2007-01-26 | 2012-03-14 | 新日鐵化学株式会社 | Flexible thermoelectric conversion element and manufacturing method thereof |
| JP5493562B2 (en) * | 2009-08-03 | 2014-05-14 | 富士通株式会社 | Thermoelectric conversion module |
| JP6219042B2 (en) * | 2013-03-14 | 2017-10-25 | コスモ石油ルブリカンツ株式会社 | High thermal conductive epoxy resin composition |
| EP3035396A4 (en) * | 2013-09-25 | 2017-04-19 | Lintec Corporation | Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same |
| CN203489181U (en) * | 2013-10-15 | 2014-03-19 | 深圳市光峰光电技术有限公司 | Color wheel, light source system of color wheel and projection system |
| CN104124217B (en) * | 2014-07-17 | 2017-12-29 | 西安电子科技大学 | A kind of high-temperature carborundum power device packaging structure and preparation method thereof |
| CN204730123U (en) * | 2015-06-01 | 2015-10-28 | 深圳市光峰光电技术有限公司 | Wavelength converter, light-source system and optical projection system |
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| CN108134000A (en) | 2018-06-08 |
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