CN107131699A - Cold storage semiconductor freezer - Google Patents
Cold storage semiconductor freezer Download PDFInfo
- Publication number
- CN107131699A CN107131699A CN201710506193.1A CN201710506193A CN107131699A CN 107131699 A CN107131699 A CN 107131699A CN 201710506193 A CN201710506193 A CN 201710506193A CN 107131699 A CN107131699 A CN 107131699A
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- China
- Prior art keywords
- chilling plate
- semiconductor chilling
- cooling
- fixed
- cold storage
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000003860 storage Methods 0.000 title claims abstract description 58
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000009826 distribution Methods 0.000 claims description 11
- 230000004888 barrier function Effects 0.000 claims description 8
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 19
- 239000010410 layer Substances 0.000 description 8
- 239000012774 insulation material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012782 phase change material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002365 multiple layer Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000008717 functional decline Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- -1 heat pipe Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/006—Self-contained movable devices, e.g. domestic refrigerators with cold storage accumulators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
Abstract
One kind can speed up refrigeration and when semiconductor chilling plate is stopped, extend the refrigerator of refrigeration, its technical scheme is as follows using semiconductor chilling plate refrigeration and cold-storage：Cold storage semiconductor freezer, includes casing, inner bag, semiconductor chilling plate and conduction cooling bar, and the cold end of the semiconductor chilling plate is fixed with conduction cooling bar, and the surface of the conduction cooling bar is fixed with cooling-storage structure, and the cooling-storage structure is arranged on the inside of inner bag.The present invention fixes cooling-storage structure by the cold end in semiconductor chilling plate, can speed up refrigeration and when semiconductor chilling plate is stopped, extends refrigeration.Such as refrigerator is when carrying out frequently switching manipulation, and cooling-storage structure can reduce the fluctuation of internal temperature of refrigerator；When being put into large article and being refrigerated or freezed, cooling-storage structure is acted on simultaneously with semiconductor chilling plate, article is comparatively fast reached preference temperature；When there is short time power failure, the temperature that cooling-storage structure can slow down refrigerator inside within a certain period of time rises.
Description
Technical field
It is especially a kind of using semiconductor chilling plate refrigeration the present invention relates to a kind of refrigerating plant, entered by cooling-storage structure
Row cold-storage, and to the heat that semiconductor chilling plate is produced can reclaim the refrigerator of generating.
Background technology
Semiconductor chilling plate is as a kind of new refrigeration structure, and it mainly uses the Peltier of semi-conducting material to imitate
Should, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the two ends of galvanic couple
With releasing heat, pass through the temperature conduction in its cold end surface, it is possible to realize the refrigeration in certain space.Because it need not
Chemical reaction and without mechanical moving parts, therefore with energy-conserving and environment-protective, food not taint of odour, simple in construction, noiseless, safely, open
Move numerous advantages such as fast.
In the prior art, it has been disclosed that have the device freezed using semiconductor chilling plate, such as refrigerator, made
While cold, the waste heat that semiconductor chilling plate hot junction is produced is recycled, and realizes the purpose of energy-saving and emission-reduction.But
It is, it is often necessary to carry out open and close operation that to be easily caused internal temperature of refrigerator unstable due to refrigerator in use, or
It is to be put into during large article refrigerated or freezed, the refrigerating efficiency of semiconductor chilling plate can not be such that article comparatively fast reaches
Preference temperature, or when there is short time power failure, refrigerator will lose refrigeration source, cause internal temperature of refrigerator to rise, refrigeration
Fresh-keeping function declines, or even when temperature rises to a certain extent, in sealing wet environment, can accelerate the rotten of food on the contrary
It is even corrupt.
The content of the invention
In view of the above problems, the present invention provides one kind is using semiconductor chilling plate refrigeration, cold-storage is carried out by cooling-storage structure,
Accelerate refrigeration and when semiconductor chilling plate is stopped, extend refrigeration, carried out while heat can be produced to cooling piece
Reclaim the refrigerator generated electricity.
To achieve these goals, the present invention can speed up system using a kind of using semiconductor chilling plate refrigeration and cold-storage
It is cold and when semiconductor chilling plate is stopped, extend the refrigerator of refrigeration, its technical scheme is as follows：Cold storage semiconductor system
Cold refrigerator, includes casing, inner bag, semiconductor chilling plate and conduction cooling bar, and the cold end of the semiconductor chilling plate is fixed with conduction cooling
Bar, the surface of the conduction cooling bar is fixed with cooling-storage structure, and the cooling-storage structure is arranged on the inside of inner bag.
Described cooling-storage structure is made up of shell with cold storage body, and cold storage body is located at enclosure, shell and semiconductor refrigerating
The cold end of piece is fixed.
The hot junction of described semiconductor chilling plate directly or indirectly be fixed with thermo-electric generation chip.
Temperature-uniforming plate is fixed between described semiconductor chilling plate hot junction and thermo-electric generation chip.
Staggeredly superposition is fixed between described thermo-electric generation sheet and temperature-uniforming plate.
Described temperature-uniforming plate is multi-disc, and to radiator since semiconductor chilling plate, quantity is gradually decreased.
It is provided with the thermo-electric generation chip and/or samming body on insulating barrier, insulating barrier and is provided with line layer.
The line layer includes solderable position and electrical connection is distributed.
Beneficial effects of the present invention：
The present invention fixes cooling-storage structure by the cold end in semiconductor chilling plate, can speed up refrigeration and in semiconductor refrigerating
When piece is stopped, extend refrigeration.Such as refrigerator is when carrying out frequently switching manipulation, and cooling-storage structure can be reduced in refrigerator
The fluctuation of portion's temperature；When being put into large article and being refrigerated or freezed, cooling-storage structure is acted on simultaneously with semiconductor chilling plate, is made
Article comparatively fast reaches preference temperature；When there is short time power failure, cooling-storage structure can slow down refrigerator inside within a certain period of time
Temperature rise.
Thermo-electric generation chip is fixed in the hot junction of semiconductor chilling plate, so as to realize that the recovery of heat generates electricity.Pass through the temperature difference
The multiple-layer stacked structure setting of generating piece and/or temperature-uniforming plate, carries out making full use of generating to reclaim, so as to further improve to heat
Generating efficiency.
The shape of temperature-uniforming plate is changed according to varying environment, for example cuboid, pyramid, "L" shaped, " U " font knot
The various structures such as structure, especially the samming plate shape near semiconductor chilling plate hot junction can carry out design, so that
Change space and position distribution, be convenient for modularized design, it is adaptable to large batch of industrialized production.
Brief description of the drawings
Fig. 1 is the schematic elevation view of a preferred embodiment of the present invention；
Fig. 2 is the schematic rear view of a preferred embodiment of the present invention；
Fig. 3 is the diagrammatic cross-section in a preferred embodiment of the present invention A-A directions；
Fig. 4 is the diagrammatic cross-section in a preferred embodiment of the present invention B-B directions；
Fig. 5 is the diagrammatic cross-section in another preferred embodiment A-A directions of the present invention.
Embodiment
As shown in Figure 1,2,3, 4, it is the schematic diagram of one embodiment of the present invention.The present embodiment main heat sink 1, second
Thermo-electric generation chip 2, insulation material 5, the 3rd temperature-uniforming plate 6, the first thermo-electric generation chip 7, the second temperature-uniforming plate 8, the first temperature-uniforming plate
9th, semiconductor chilling plate 10, conduction cooling bar 11, inner bag 12, fixed support 13, cooling-storage structure 14, casing 15, chamber door 16, interface 17,
Driving power supply 18, handle 19, catch 20, modulator 21 etc. are constituted, and constitute a complete semiconductor freezer structure.Half
The cold end of conductor cooling piece 10 is fixed with conduction cooling bar 11, and the surface of conduction cooling bar 11 is fixed with cooling-storage structure 14, cooling-storage structure 14
Installed in the inside of inner bag 12.In this embodiment, cooling-storage structure 14 is located between conduction cooling bar 11 and inner bag 12, the side of conduction cooling bar 11 1
Face is directly freezed to the space inside inner bag 12, and on the other hand cooling-storage structure 14 is freezed.
Conduction cooling bar 11 is as cold conducting structure, and effect is that the cold of the cold end of semiconductor chilling plate 10 is transmitted into cooling-storage structure 14
In the space of inner bag 12, its shape is generally the platy structure of plane, and its structure is similar to temperature-uniforming plate, is internally provided with numerous
Heat pipe.It is contemplated that the size and shape of inner bag 12, it would however also be possible to employ the side that tubulose, tabular or tubulose are combined with flat board
Formula, which is fitted, is fixed on the surface of inner bag 12.The shape of conduction cooling bar 11 can be bent or reverse, thus realize conduction cooling bar 11 with
Locational space distribution conversion between semiconductor chilling plate 10, cooling-storage structure 14.In the present embodiment, conduction cooling bar 11 passes through three times
Bending, realizes the position conversion from vertical distribution to cross direction profiles, is individually fixed in semiconductor chilling plate 10 and cooling-storage structure
14 surface.
Cooling-storage structure 14 is made up of shell with cold storage body, and cold storage body is located at enclosure, and seals, shell and semiconductor system
The cold end of cold is fixed.Wherein, cold storage body is also cold storage agent or freezing liquid, is a kind of high molecular polymer, can be steady for a long time
It is scheduled on the low temperature range of subzero 15-18 degree.
By the setting of cooling-storage structure 14, refrigeration can speed up and when semiconductor chilling plate 10 is stopped, extension system
Cold effect.Such as refrigerator is when carrying out frequently switching manipulation, and cooling-storage structure 14 can keep the fluctuation of internal temperature of refrigerator to reduce；
When being put into large article and being refrigerated or freezed, cooling-storage structure 14 is acted on simultaneously with semiconductor chilling plate 10, can make article
Comparatively fast reach preference temperature；When there is short time power failure, cooling-storage structure continues to be freezed within a certain period of time, slows down refrigerator
Internal temperature rises.
The hot junction of semiconductor chilling plate 10 directly or indirectly be fixed with thermo-electric generation chip, fixed form preferably is：
First it is fixed with the first temperature-uniforming plate 9 in the hot junction of semiconductor chilling plate 10, then to be fixed with second equal in the other end of the first temperature-uniforming plate 9
Warm plate 8, in the other end of the second temperature-uniforming plate 8 fix the first thermo-electric generation chip 7, the other end of the first thermo-electric generation chip 7 is consolidated
Surely there is the 3rd temperature-uniforming plate 6, the other end of the 3rd temperature-uniforming plate 6 is fixed with the second thermo-electric generation chip 2, the second thermo-electric generation chip 2
The other end (cold end) be fixed on the lower surface of radiator 1, the fin for being exposed to the surface of casing 15 by radiator 1 enters
Row is cold and hot to be exchanged.
Fixed respectively between the hot junction of semiconductor chilling plate 10 and the first thermo-electric generation chip 7, the second thermo-electric generation chip 2
There are the first temperature-uniforming plate 9, the second temperature-uniforming plate 8 and the 3rd temperature-uniforming plate 6, it is solid by being staggeredly superimposed between thermo-electric generation sheet and temperature-uniforming plate
It is fixed, it on the one hand can uniformly expand the heat distribution area of the hot junction of semiconductor chilling plate 10 generation, so as to improve thermo-electric generation core
Distribution of the piece on temperature-uniforming plate, another aspect temperature-uniforming plate can change the direction of transfer of heat, amplify out more different directions and
The mounting surface of area, so as to change space and the position distribution of the thermo-electric generation chip installed in its surface.
For example, samming plate shape can be cuboid, pyramid, "L" shaped, " U " font structure etc., thus it is possible to vary 90 degree
The space spatial distribution in direction, so as to realize the different space such as thermo-electric generation chip, temperature-uniforming plate and position distribution.
Temperature-uniforming plate is to radiator since semiconductor chilling plate, and quantity is gradually decreased.In the present embodiment, the first temperature-uniforming plate
9 and second temperature-uniforming plate 8 two panels superposition, be reduced to a piece of of the 3rd temperature-uniforming plate 6, the first temperature-uniforming plate 9 and the second temperature-uniforming plate 8
Superposition is due to that the heat in the hot junction of semiconductor chilling plate 10 is concentrated, and in order to preferably expand thermal capacitance, improves heat conduction efficiency,
So as to using two stacked systems, with the reduction in heat transfer process, answer the quantity of this temperature-uniforming plate also to reduce therewith.
In actual application process, the size of heat is produced according to semiconductor chilling plate 10, the temperature-uniforming plate of multi-disc is selected
It is overlapped, or cancels temperature-uniforming plate, is directly overlapped or multiple-layer stacked using thermo-electric generation chip.
Temperature-uniforming plate, refers to that thermal conductivity factor height, thermal resistance are small, can be quickly by heat conduction and equally distributed object after being heated
Or device, it is commonly used for including a kind of metal in copper, heat pipe, aluminium alloy, phase-change material, carbon fiber, graphene etc., nonmetallic
Or device.In the present embodiment, by taking the 3rd temperature-uniforming plate 6 as an example, temperature-uniforming plate is internally provided with numerous heat pipes, and heat pipe inner wall is set
There is male and fomale(M＆F) or filled with reticulated, inside heat pipe is filled with phase-change material, by the change of phase-change material liquid state, real
The quick conduction of existing heat.
In this embodiment, the surface of thermo-electric generation chip and/or temperature-uniforming plate is provided with insulating barrier, insulating barrier and sets wired
The surface of road floor is respectively arranged with insulating barrier, is made using enamel or anodic oxidation mode.Line layer is provided with insulating barrier, is adopted
Made of printing, plating, compound or spraying method.Line layer at least includes solderable position and electrical connection is distributed, the temperature difference
Power-generating chip is separately fixed at solderable position, and the electrical connection between each thermo-electric generation chip is series connection and/or parallel connection, is made
Each the thermo-electric generation chip formation electrical connection of samming thermo-electric generation layer is entirety, as needed, each samming thermo-electric generation
Mutual electrical connection, unified output voltage and electric current are carried out again as unit in chip layer.
On line layer in addition to solderable position and electrical connection distribution is at least included, electrostatic protection is also provided with
One or more in circuit, the circuit such as rectification, pressure limiting, current control, to meet different function needs.
On line layer in addition to solderable position and electrical connection distribution is at least included, electrostatic protection is also provided with
One or more in circuit, the circuit such as rectification, pressure limiting, current control, to meet different function needs.
In the present embodiment, described fixed form is that welding or solidification are bonded, and solidification is bonded as used high heat conduction cement
Bonded.It can pay the utmost attention to be welded as needed, such as surface is difficult to solder to due to material, can pass through electricity on surface
The mode such as plating, compound, spraying is welded again after coating a metal level.By way of welding, its thermal contact resistance can be significantly
The reduction of degree, is favorably improved heat conduction efficiency, and the another side production process is simple, is suitable for the extensive life of mass
Production, is favorably improved production efficiency, reduces production cost.
Chamber door 16 is fixed with before casing 15, catch 20 is provided with the upper end of chamber door 16, catch 20 is recessed
The structure of shape, in order to the switch of chamber door, preferably sets two catch 20 in chamber door upper end, is that door switch is more square
Just.Modulator 21 is additionally provided with chamber door 16, modulator 21 is used as the parameter controllers such as refrigeration for refrigerator power, temperature, Yi Jibing
The display of box technology parameter information, it is general to be made using liquid crystal panel, operated by button or touch-control.
Driving power supply 18 is installed inside the back side of casing 15, interface 17 is provided with, interface 17 is mainly used in and other
The electrical connection of refrigerator, while as the power inlet of refrigerator, be connected with driving power supply 18, the driving semiconductor of driving power supply 18
The work of cooling piece 10 is freezed, the first thermo-electric generation chip 7 and the second thermo-electric generation chip 2 connection driving power supply 18, the temperature difference
Electricity after generating is input in driving power supply 18, realizes energy back.
The upper peripheral of casing 15 is provided with positioning pit, lower peripheral is provided with positioning convex point, positioning pit and fixed
The position of position salient point is mutually corresponded to, in order to be better able to determine position in the assembling of multiple refrigerators, while can preferably prevent
The skew of stagnant ice case horizontal level.
Be symmetrically arranged with handle 19 in the side of casing 15, handle 19 be shaped as similar indent it is square, semicircle, four points
One of the structure such as circle, convenient putting forth effort in refrigerator handling process.
Insulation material 5, insulation are filled between inner bag 12 and casing 15, and in vacant gap inside radiator 1
Material 5 mainly plays temperature isolation effect, prevents the temperature exchange inside and outside casing 15, it is generally preferable to using the foaming material of insulation
Material makes.In the present embodiment, it is part around more preferable mark insulation material 15, therefore by the section of insulation material 5 in Fig. 3
Line is omitted, and is not to represent no insulation material 5. at this
Casing 15 is typically made using metal material, such as conventional aluminum alloy material, and because aluminum alloy material is lighter, height is led
Hot coefficient is higher, and in 230W/mK or so, and stabilized metal is preferably, and cost is relatively low, is easy into by techniques such as aluminium extrusions
Type, surface the technique such as can be aoxidized, be electroplated, being painted and carrying out outward appearance processing.
As shown in figure 5, for the present invention another preferred embodiment A-A in terms of diagrammatic cross-section.The present embodiment with it is above-mentioned
The main distinction of embodiment is that the cold end of semiconductor chilling plate 10 is fixed with conduction cooling bar 11, and the surface of conduction cooling bar 11 is fixed with storage
Air-cooled structure 14, conduction cooling bar 11 is located between cooling-storage structure 14 and inner bag 12, after conduction cooling bar 11 freezes to cooling-storage structure 14, by
Cooling-storage structure 14 freezes to the space inside inner bag 12.
In addition, there is no the structure reclaimed using thermo-electric generation in the present embodiment, but directly in semiconductor chilling plate 10
Hot junction fixed heat sink 1, the upper front for facing radiator 1 is fixed with fan 22, is set on the opposite casing 15 of fan 22
Air inlet 23 is equipped with, the top and bottom casing in the place inner chamber of fan 22 is respectively arranged with air-out 24.Fan 22 is operationally, outside
Air is sucked from air inlet 23 and blows to the fin surface of radiator 1, and by cross-ventilated mode, heat is passed through into air-out
Mouth 24 is passed out to outside casing 15, completes the exchange of a heat convection.
Embodiment described above, is the present invention more preferably embodiment, those skilled in the art is in skill
The usual variations and alternatives carried out in art aspects should be construed as being included in protection scope of the present invention.
Claims (8)
1. cold storage semiconductor freezer, includes casing, inner bag, semiconductor chilling plate and conduction cooling bar, it is characterised in that institute
The cold end for stating semiconductor chilling plate is fixed with conduction cooling bar, and the surface of the conduction cooling bar is fixed with cooling-storage structure, the cooling-storage structure
Installed in the inside of inner bag.
2. cold storage semiconductor freezer according to claim 1, it is characterised in that described cooling-storage structure is by shell
Constituted with cold storage body, cold storage body is located at enclosure, the cold end of shell and semiconductor chilling plate is fixed.
3. cold storage semiconductor freezer according to claim 2, it is characterised in that described semiconductor chilling plate
Hot junction directly or indirectly be fixed with thermo-electric generation chip.
4. the cold storage semiconductor freezer according to claim 1-3, it is characterised in that described semiconductor chilling plate
Temperature-uniforming plate is fixed between hot junction and thermo-electric generation chip.
5. cold storage semiconductor freezer according to claim 4, it is characterised in that described thermo-electric generation sheet and
Staggeredly superposition is fixed between warm plate.
6. cold storage semiconductor freezer according to claim 5, it is characterised in that described temperature-uniforming plate is multi-disc, from
Semiconductor chilling plate starts to radiator, and quantity is gradually decreased.
7. the cold storage semiconductor freezer according to claim 4 or 5, it is characterised in that the thermo-electric generation chip
And/or be provided with samming body on insulating barrier, insulating barrier and be provided with line layer.
8. cold storage semiconductor freezer according to claim 7, it is characterised in that the line layer includes solderable
Socket part position and electrical connection distribution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710506193.1A CN107131699A (en) | 2017-06-28 | 2017-06-28 | Cold storage semiconductor freezer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710506193.1A CN107131699A (en) | 2017-06-28 | 2017-06-28 | Cold storage semiconductor freezer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107131699A true CN107131699A (en) | 2017-09-05 |
Family
ID=59735798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710506193.1A Pending CN107131699A (en) | 2017-06-28 | 2017-06-28 | Cold storage semiconductor freezer |
Country Status (1)
| Country | Link |
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| CN (1) | CN107131699A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107560264A (en) * | 2017-09-26 | 2018-01-09 | 上海创始实业（集团）有限公司 | Semiconductor chilling plate refrigerating box |
| CN108759238A (en) * | 2018-08-28 | 2018-11-06 | 浙江聚珖科技股份有限公司 | Semiconductor refrigerating vacuum refrigerator |
| CN110425793A (en) * | 2019-08-14 | 2019-11-08 | 合肥美菱物联科技有限公司 | A kind of semiconductor freezer and its refrigerating method |
| CN110456250A (en) * | 2019-09-16 | 2019-11-15 | 中国科学技术大学 | A kind of measurement method and measuring device of TEC refrigeration performance |
| CN112629120A (en) * | 2020-12-24 | 2021-04-09 | 珠海格力电器股份有限公司 | Refrigerator and control method thereof |
| CN113028677A (en) * | 2021-03-25 | 2021-06-25 | 金安君 | Intelligent temperature control cold semiconductor transport case |
| CN113867457A (en) * | 2021-10-10 | 2021-12-31 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107560264A (en) * | 2017-09-26 | 2018-01-09 | 上海创始实业（集团）有限公司 | Semiconductor chilling plate refrigerating box |
| CN108759238A (en) * | 2018-08-28 | 2018-11-06 | 浙江聚珖科技股份有限公司 | Semiconductor refrigerating vacuum refrigerator |
| CN110425793A (en) * | 2019-08-14 | 2019-11-08 | 合肥美菱物联科技有限公司 | A kind of semiconductor freezer and its refrigerating method |
| CN110456250A (en) * | 2019-09-16 | 2019-11-15 | 中国科学技术大学 | A kind of measurement method and measuring device of TEC refrigeration performance |
| CN112629120A (en) * | 2020-12-24 | 2021-04-09 | 珠海格力电器股份有限公司 | Refrigerator and control method thereof |
| CN112629120B (en) * | 2020-12-24 | 2024-04-19 | 珠海格力电器股份有限公司 | Refrigerator and control method thereof |
| CN113028677A (en) * | 2021-03-25 | 2021-06-25 | 金安君 | Intelligent temperature control cold semiconductor transport case |
| CN113867457A (en) * | 2021-10-10 | 2021-12-31 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
| CN113867457B (en) * | 2021-10-10 | 2022-06-10 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
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