CN107328001A - Semiconductor air conditioner module - Google Patents
Semiconductor air conditioner module Download PDFInfo
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- CN107328001A CN107328001A CN201710688161.8A CN201710688161A CN107328001A CN 107328001 A CN107328001 A CN 107328001A CN 201710688161 A CN201710688161 A CN 201710688161A CN 107328001 A CN107328001 A CN 107328001A
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- plate
- fixed
- air conditioner
- semiconductor
- conditioner module
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000001816 cooling Methods 0.000 claims abstract description 59
- 238000003860 storage Methods 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000002528 anti-freeze Effects 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000002365 multiple layer Substances 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004378 air conditioning Methods 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000012782 phase change material Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- -1 heat pipe Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A kind of semiconductor air conditioner module, include casing, semiconductor chilling plate and conduction cooling plate, it is characterized in that the cold end of the semiconductor chilling plate is fixed with conduction cooling plate, the conduction cooling plate surface is fixed with cooling-storage structure and/or cool-guiding fin plate, the cooling-storage structure, cool-guiding fin plate are located at box house respectively, and tank surface is provided with least two interfaces.The present invention not only can be by the way of air-cooled or water cooling, and especially water-cooling pattern is suitable for the refrigerated transport of long range, or air-cooled and water cooling is used simultaneously, and air-cooled structure is used during short distance, and refrigerated transport is carried out using water-cooling structure during long range.
Description
Technical field
The present invention relates to a kind of conditioner, especially one kind is freezed by semiconductor chilling plate, using cooling-storage structure,
The various ways such as cool-guiding fin plate, air adjustment is carried out by air-cooled or water-cooling pattern, and can be to semiconductor chilling plate generation
Heat reclaim the air-conditioning module of generating.
Background technology
Traditional air-conditioning typically use compressor arrangement, by the development of decades, its structure be further improved and
Improve, maturity and reliability make it also obtain large-area applications in the market.But it for example makes there is also many deficiencies
There is spillage risk in cold medium (freon), not environmentally, and power consumption is big, and thermal pollution and noise are big etc..With the development of technology, especially
It is making rapid progress for semiconductor technology development, occurs in that the air-conditioning designed using semiconductor chilling plate, can preferably solve
Certainly above mentioned problem.Its critical component is semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.It utilizes semiconductor
The Peltier effects of material, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, be at the two ends of galvanic couple
Heat can be absorbed respectively and heat is released, it is possible to achieve the purpose of refrigeration.Due to that need not chemically react and without mechanical moving parts
Point, therefore with energy-conserving and environment-protective, air cleaning, can dehumidify, small volume is removable, simple in construction, noiseless, start it is soon etc. excellent
Gesture and be widely used.
In the prior art, it has been disclosed that have the air-conditioning that cooling and warming is carried out using semiconductor chilling plate, utilize semiconductor system
The heat that the cold and hot junction that cold cold end is produced is produced, by the air-supply of the switch control of controller, and air blower, so as to realize
To the temperature adjustment of air-conditioning surrounding air.Although the technical scheme can make full use of the refrigeration and system that semiconductor chilling plate works
Hot merit energy, but for air-conditioning in process of refrigerastion, it is difficult to recycled to the heat that hot junction is produced, and also need to pair
The heat in hot junction is cooled；In process of refrigerastion, the progress that air blower is difficult to long range is freezed, and water cooling can not be used in structure
Structure；Modularization is difficult in structure, in the production and use process, it is impossible to carry out a variety of installations and be applied in combination.
The content of the invention
In view of the above problems, the present invention provides one kind by air-cooled or water-cooling pattern adjusts air themperature, and to semiconductor
The waste heat that cooling piece is produced reclaims the air-conditioning module generated electricity.
To achieve these goals, the present invention passes through air-cooled or water-cooling pattern using various ways such as cold-storage, cool-guiding fin plates
Air adjustment is carried out, and to the heat that semiconductor chilling plate is produced can reclaim the air-conditioning module of generating.Its technical scheme
It is as follows：A kind of semiconductor air conditioner module, includes casing, semiconductor chilling plate and conduction cooling plate, it is characterised in that the semiconductor
The cold end of cooling piece is fixed with conduction cooling plate, and the conduction cooling plate surface is fixed with cooling-storage structure and/or cool-guiding fin plate, the cold-storage knot
Structure, cool-guiding fin plate are located at box house respectively, and tank surface is provided with least two interfaces.
The casing interface is connected with air blower and screen pack.
The inside of the casing is provided with heating element, in net distribution.
The casing interface is connected with conduction cooling pipe, and the conduction cooling pipe connection cool exchanger, water pump and casing formation circulation are logical
Filled with antifreeze storage cold night inside road, the path, air blower is fixed with the side of the cool exchanger.
The semiconductor chilling plate hot junction of the tank surface is fixed with least two layers temperature-uniforming plate.
The samming plate surface is fixed with thermo-electric generation chip.
It is provided with the thermo-electric generation chip and/or temperature-uniforming plate on insulating barrier, insulating barrier and is provided with line layer, line layer
It is connected with driving power supply.
Multiple-layer stacked is staggeredly fixed between described thermo-electric generation sheet and temperature-uniforming plate.
The thermo-electric generation chip is gradually decreased with the increase of the number of plies.
The cold end of the thermo-electric generation chip is fixed with semiconductor chilling plate.
Beneficial effects of the present invention：
The present invention not only can be by the way of air-cooled or water cooling, and especially water-cooling pattern is suitable for the refrigeration biography of long range
Defeated or air-cooled and water cooling is used simultaneously, and air-cooled structure is used during short distance, is freezed during long range using water-cooling structure
Transmission.
Cooling-storage structure is fixed by the cold end in semiconductor chilling plate, refrigeration is can speed up and stops in semiconductor chilling plate
During work, extend refrigeration, reduce temperature fluctuation during refrigeration, or even when there is short time power failure, cooling-storage structure remains to hair
The effect of waving, the temperature that can slow down air-conditioning surrounding air within a certain period of time rises.
Thermo-electric generation chip is fixed in the hot junction of semiconductor chilling plate, so as to realize that the recovery of heat generates electricity.Pass through the temperature difference
The multiple-layer stacked structure setting of generating piece and/or temperature-uniforming plate, carries out making full use of generating to reclaim to heat, substantially carries out no heat
Discharge, is especially fixed with the cold end of semiconductor chilling plate in the cold end of thermo-electric generation chip, improves thermo-electric generation chip two ends
Temperature difference, so as to further improve generating efficiency.
Temperature-uniforming plate uses modular structure design, and multiple modules, which are combined, to be used, can be according to different applied fields
Scape selects different watt level and mounting means, applied widely.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the first preferred embodiment of the present invention；
Fig. 2 is the diagrammatic cross-section of the first preferred embodiment of the present invention；
Fig. 3 is the conduction cooling plate of the first preferred embodiment of the present invention and the schematic diagram of cool-guiding fin plate；
Fig. 4 is the schematic perspective view of the second preferred embodiment of the present invention；
Fig. 5 is the diagrammatic cross-section of the second preferred embodiment of the present invention；
Fig. 6 is the conduction cooling plate of the second preferred embodiment of the present invention and the schematic diagram of cool-guiding fin plate；
Fig. 7 is the diagrammatic cross-section of the third preferred embodiment of the present invention；
Fig. 8 is the conduction cooling plate of the third preferred embodiment of the present invention and the schematic diagram of cool-guiding fin plate.
Embodiment
As shown in Figure 1, 2, 3, it is that first preferred embodiment of the invention is main by casing 1, conduction cooling plate 2, fixed plate 3, cover plate
4th, cool-guiding fin plate 5, the first semiconductor chilling plate 6, the first temperature-uniforming plate 7, the second temperature-uniforming plate 8, thermo-electric generation chip 9, the 3rd samming
Plate 10, the second semiconductor chilling plate 11, radiator 12, water pump 13, exchanger 14, air blower 15, screen pack 16, conduction cooling pipe 17,
The antifreeze cold grade of the night 18 part composition of storage.Wherein, the cold end of the first semiconductor chilling plate 6 is fixed with conduction cooling plate 2, the surface of conduction cooling plate 2
Cool-guiding fin plate 5 is fixed with, cool-guiding fin plate 5 is located at the inside of casing 1, the surface of casing 1 is provided with least two interfaces.In this reality
Apply in example, above-mentioned interface is connected with conduction cooling pipe 17, the connection of conduction cooling pipe 17 cool exchanger 14, water pump 13 and the formation circulation of casing 1 are logical
Road.Filled with antifreeze storage cold night 18 inside path, the side of cool exchanger 14 is fixed with air blower 15, in cool exchanger 14
Opposite side is fixed with screen pack 16, and screen pack 16 is located at the air inlet side of air blower 15, crosses after air filtering, makes to be drawn into air blast
Air in machine 15 keeps cleaning and health.Especially screen pack is used after activated carbon, the material of PM2.5 filter screens, can more enter one
Step purification air, allows module separately as air purifier to use.
Cool exchanger 14 is a kind of cold and hot device exchanged of cold and extraneous air progress by its inside, cold and hot to improve its
Exchange efficiency, in the present embodiment, conduction cooling pipe 17 use multiple U-shaped structures, and multiple cool guide sheets, such as aluminium alloy are fixed in its surface
What material made, cold in conduction cooling pipe 17 is quickly passed into the surface of cool guide sheet, so as to realize that it is efficient cold between air
Heat exchange.The air blower 15 fixed in the side of cool exchanger 14, suck into the air of temperature drop after cool exchanger 14, from drum
Blown out at the air outlet of blower fan 15, so as to realize the refrigeration of air.
Made in casing 1 using plastics or metal material, the interior surface of casing 1 is provided with heat-insulation layer, so as to realize
The isolation of the inside and outside temperature of casing 1, is the rectangular parallelepiped structure of upper opening.In being fixedly arranged above on cover plate 4, cover plate 4 for casing 1
Numerous perforates are provided with, the first semiconductor chilling plate 6 and its conduction structure are fixed with perforate.Fixed form is：First
The cold end of semiconductor chilling plate 6 is fixed with conduction cooling plate 2, and the surface of conduction cooling plate 2 is provided with cool-guiding fin plate 5, the first semiconductor refrigerating
After piece 6, conduction cooling plate 2 and cool-guiding fin plate 5 are pressed by fixed plate 3, it is fixed on by screw on cover plate 4, and sealed.
By the fixation of said structure, so that the cold casing 1 that is sealed in that the first semiconductor chilling plate 6 cold end is produced
Inner space, the inside of casing 1 is extended to by conduction cooling plate 2, and fixes cool-guiding fin plate 15 on the surface of conduction cooling plate 2, is expanded cold
The contact surface of conduction, improves cold conduction efficiency.In the inner space of casing 1 filled with antifreeze storage cold night 18, it is by casing 1
Internal to be circulated with conduction cooling pipe 17, the isostructural internal duct of cool exchanger 14, cold by cool-guiding fin plate 15 is quickly conducted.
Conduction cooling plate 2 is as cold conducting structure, and effect is that the cold of the cold end of the first semiconductor chilling plate 6 is transmitted into numerous lead
Cold fin 15.The shape of conduction cooling plate 2 is generally the platy structure of plane, and its structure is similar to temperature-uniforming plate, is internally provided with numerous
Heat pipe.In the present embodiment, conduction cooling plate 2 is realized the position conversion from horizontal distribution to vertical distribution, hung down by bending
Face directly and be fixed with numerous cool-guiding fin plates 15.
Antifreeze cold accumulating liquid 18 refers to, with the cold liquid being integrated with conduction cooling function of antifreeze, storage (storage), contain polyphosphazene polymer
Compound, such as high molecular nanometer polymerize carbon dust, can with long-time stable subzero 15-18 degree low temperature range.
Cold conduction is carried out above by water-cooling pattern, is particularly suitable for the refrigerated transport of long range, such as large-scale center
Air-conditioning etc..
The hot junction of the first semiconductor chilling plate 6 directly or indirectly be fixed with thermo-electric generation chip, such as in semiconductor
The hot junction of cooling piece 6 is fixed with least two layers temperature-uniforming plate.It is preferred that fixed form be：It is fixed with the hot junction of semiconductor chilling plate 6
First temperature-uniforming plate 7, then the first temperature-uniforming plate 7 the other end be fixed with the second temperature-uniforming plate 8, the second temperature-uniforming plate 8 the other end consolidate
Constant temperature difference power-generating chip 9, the other end of thermo-electric generation chip 9 is fixed with the 3rd temperature-uniforming plate 10, the other end of the 3rd temperature-uniforming plate 10
The second semiconductor chilling plate 11 is fixed with, the bottom of radiator 12 is fixed in the other end (hot junction) of the second semiconductor chilling plate 11
Portion surface, is radiated by the fin on the surface of radiator 12.
The cold end of second semiconductor chilling plate 11 is fixed on the cold end of thermo-electric generation chip 9, and it is to improve temperature difference hair that it, which is acted on,
The temperature difference at the two ends of electrical chip 9, so as to further improve its generating efficiency.
It is equal by the first semiconductor chilling plate 6, the first temperature-uniforming plate 7, the second temperature-uniforming plate 8, thermo-electric generation chip 9 and the 3rd
Sandwich superposition between warm plate 10 is fixed, and on the one hand can uniformly expand the heat of the hot junction of the first semiconductor chilling plate 6 generation
Distribution area is measured, so as to improve distribution of the thermo-electric generation chip 9 on temperature-uniforming plate, on the other hand the first temperature-uniforming plate 7 and second is equal
The double-deck superposition of warm plate 8, can carry out accumulation of heat, improve thermal capacitance.Meanwhile, temperature-uniforming plate can change the direction of transfer of heat, amplification
Go out the mounting surface of more different directions and area, so as to change the space and position point of the thermo-electric generation chip installed in its surface
Cloth.
For example, samming plate shape can be cuboid, pyramid, "L" shaped, " U " font structure etc., thus it is possible to vary 90 degree
The space spatial distribution in direction, so as to realize the different space such as thermo-electric generation chip, temperature-uniforming plate and position distribution.
Thermo-electric generation chip is gradually decreased with the increase of the number of plies.In the present embodiment, the quantity of thermo-electric generation chip 9 is
4, but as the increase of the later stage number of plies, the hot junction heat of the first semiconductor chilling plate 6 are successively reclaimed, heat is reduced,
So if using multilayer thermo-electric generation chip, then its increase with the number of plies and gradually decrease.
Likewise, the two panels superposition of the first temperature-uniforming plate 7 and the second temperature-uniforming plate 8, is reduced to a piece of of the 3rd temperature-uniforming plate 10,
The superposition of first temperature-uniforming plate 7 and the second temperature-uniforming plate 8 is due to that the heat in the hot junction of the first semiconductor chilling plate 6 is concentrated, in order to
Preferably expand thermal capacitance, improve heat conduction efficiency, so that using two stacked systems, with the reduction in heat transfer process,
The quantity of this temperature-uniforming plate is answered also to reduce therewith.
In actual application process, the size of heat is produced according to the first semiconductor chilling plate 6, the samming of multi-disc is selected
Plate is overlapped, or cancels temperature-uniforming plate, is directly overlapped or multiple-layer stacked using thermo-electric generation chip.
Temperature-uniforming plate, refers to that thermal conductivity factor height, thermal resistance are small, can be quickly by heat conduction and equally distributed object after being heated
Or device, it is commonly used for including a kind of metal in copper, heat pipe, aluminium alloy, phase-change material, carbon fiber, graphene etc., nonmetallic
Or device.In the present embodiment, by taking the 3rd temperature-uniforming plate 10 as an example, temperature-uniforming plate is internally provided with numerous heat pipes, and heat pipe inner wall is set
It is equipped with male and fomale(M＆F) or filled with reticulated, inside heat pipe is filled with phase-change material, by the change of phase-change material liquid state,
Realize the quick conduction of heat.
As shown in Figure 4,5, 6, it is that second preferred embodiment of the invention is main by casing 1, conduction cooling plate 2, fixed plate 3, cover plate
4th, cool-guiding fin plate 5, the first semiconductor chilling plate 6, the first temperature-uniforming plate 7, the second temperature-uniforming plate 8, thermo-electric generation chip 9, the 3rd samming
The parts such as plate 10, the second semiconductor chilling plate 11, radiator 12, air blower 15, screen pack 16, heating element 20, driving power supply 22
Composition.The difference of the present embodiment and first embodiment is：Air blower 15 and screen pack 16 are connected with the interface of casing 1, drum
Blower fan 15 is directly installed on the interface of casing 1, is operated by the driving of driving power supply 21.In the outside of air blower 15
(air inlet) place is provided with screen pack 16, is filtered to carrying out the air inside air blower 15, and air is inhaled by screen pack 16
Enter into air blower 15, inside casing 1, air is blown out after cooling or heating from another interface of casing.
It is fixed with the inside of casing 1 outside conduction cooling plate 2, cool-guiding fin plate 5, is further fixed on heating element 20, heating element 20 is consolidated
Due to the inner upper end of casing 1, and reticulate distribution.Heating element 20 refers to the electrical equipment for converting electrical energy into heat, such as heating electric
Hinder silk, heat-generating pipe etc..The perforate 19 of venetian blind type is distributed with cool-guiding fin plate 5, the perforate 19 of the side of conduction cooling plate 2 is upward
To the perforate 19 of opposite side is direction down, can quickly be cooled by cool-guiding fin plate 5 and the air of perforate 19, is especially led to
The perforate 19 of venetian blind type is crossed, increases the path of air circulation, air cooling-down efficiency can be improved.
Above by the mode of air blower 15, the refrigeration or heating function to air can be realized, two can be warmed up by realizing
With more extensive using function.
In this embodiment, the surface of thermo-electric generation chip and/or temperature-uniforming plate is provided with insulating barrier, insulating barrier and sets wired
The surface of road floor is respectively arranged with insulating barrier, is made using enamel or anodic oxidation mode.Line layer is provided with insulating barrier, is adopted
Made of printing, plating, compound or spraying method, line layer is connected with driving power supply 22, one side semiconductor chilling plate needs
Worked by the electrical energy drive of driving power supply 22, the electric energy that another aspect thermo-electric generation chip is produced after generating electricity can be fed back to
Driving power supply 22 carries out energy supplement and used.Line layer at least includes solderable position and electrical connection is distributed, thermo-electric generation
Chip is separately fixed at solderable position, and the electrical connection between each thermo-electric generation chip is series connection and/or parallel connection, is made each
The thermo-electric generation chip formation electrical connection of samming thermo-electric generation layer is entirety, as needed, each samming thermo-electric generation chip
Mutual electrical connection is carried out again as unit on layer, and unified output voltage and electric current are fed back at driving power supply 22.
On line layer in addition to solderable position and electrical connection distribution is at least included, electrostatic protection is also provided with
One or more in circuit, the circuit such as rectification, pressure limiting, current control, to meet different function needs.
As shown in Figure 7,8, it is third preferred embodiment of the invention, essentially identical compared with second embodiment, difference is
Hold-over plate 21 is first fixed with the surface of conduction cooling plate 2, cool-guiding fin plate 5, same conduction cooling fin are fixed again on the surface of hold-over plate 21
The surface of piece 5 sets the perforate 19 that venetian blind type is distributed with, increase air circulation path.
Hold-over plate 21 is made up of typically all shells and internal cold-storage liquid, and it is the cold of the transmission of savings conduction cooling plate 2 that it, which is acted on, and
With good conduction cooling performance.Wherein, cold-storage liquid is also cold storage agent or freezing liquid, similar to the composition at antifreeze storage cold night 18.
By the setting of hold-over plate 21, refrigeration can speed up and when the first semiconductor chilling plate 6 is stopped, extension system
Cold effect, keeps the stability of the surface temperature of cool-guiding fin plate 5.
Embodiment described above, is the present invention more preferably embodiment, those skilled in the art is in skill
The usual variations and alternatives carried out in art aspects should be construed as being included in protection scope of the present invention.
Claims (10)
1. semiconductor air conditioner module, includes casing, semiconductor chilling plate and conduction cooling plate, it is characterised in that the semiconductor refrigerating
The cold end of piece is fixed with conduction cooling plate, and the conduction cooling plate surface is fixed with cooling-storage structure and/or cool-guiding fin plate, the cooling-storage structure,
Cool-guiding fin plate is located at box house respectively, and tank surface is provided with least two interfaces.
2. semiconductor air conditioner module according to claim 1, it is characterised in that the casing interface be connected with air blower and
Screen pack.
3. semiconductor air conditioner module according to claim 2, it is characterised in that the inside of the casing is provided with heating element,
In net distribution.
4. semiconductor air conditioner module according to claim 1, it is characterised in that the casing interface is connected with conduction cooling pipe, institute
State inside conduction cooling pipe connection cool exchanger, water pump and casing formation peripheral passage, the path filled with antifreeze storage cold night, in institute
The side for stating cool exchanger is fixed with air blower.
5. the semiconductor air conditioner module according to any one claims of claim 2-4, it is characterised in that the casing table
The semiconductor chilling plate hot junction in face is fixed with least two layers temperature-uniforming plate.
6. semiconductor air conditioner module according to claim 5, it is characterised in that the samming plate surface is fixed with temperature difference hair
Electrical chip.
7. semiconductor air conditioner module according to claim 6, it is characterised in that the thermo-electric generation chip and/or temperature-uniforming plate
On be provided with insulating barrier, insulating barrier and be provided with line layer, line layer is connected with driving power supply.
8. semiconductor air conditioner module according to claim 7, it is characterised in that described thermo-electric generation sheet and temperature-uniforming plate it
Between staggeredly fixed multiple-layer stacked.
9. semiconductor air conditioner module according to claim 8, it is characterised in that the thermo-electric generation chip is with the number of plies
Increase is gradually decreased.
10. semiconductor air conditioner module according to claim 9, it is characterised in that the cold end of the thermo-electric generation chip is fixed
There is semiconductor chilling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710688161.8A CN107328001A (en) | 2017-08-12 | 2017-08-12 | Semiconductor air conditioner module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710688161.8A CN107328001A (en) | 2017-08-12 | 2017-08-12 | Semiconductor air conditioner module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107328001A true CN107328001A (en) | 2017-11-07 |
Family
ID=60225775
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710688161.8A Pending CN107328001A (en) | 2017-08-12 | 2017-08-12 | Semiconductor air conditioner module |
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| CN (1) | CN107328001A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107781936A (en) * | 2017-11-22 | 2018-03-09 | 纳琦环保科技有限公司 | A kind of fluid temperature control smooth breathing filter instrument |
| CN108834366A (en) * | 2018-06-08 | 2018-11-16 | 贵州绿云科技有限公司 | A kind of data machine room air-conditioning system |
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2727613Y (en) * | 2004-04-23 | 2005-09-21 | 陈尊山 | Integrative air conditioner using antifreezing fluid for cold storage and low pressure cyclic cold delivery |
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| CN108834366A (en) * | 2018-06-08 | 2018-11-16 | 贵州绿云科技有限公司 | A kind of data machine room air-conditioning system |
| CN108834366B (en) * | 2018-06-08 | 2023-10-27 | 贵州绿云科技有限公司 | Air conditioning system of data machine room |
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
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Application publication date: 20171107 |