CN2811886Y - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN2811886Y CN2811886Y CN 200520100988 CN200520100988U CN2811886Y CN 2811886 Y CN2811886 Y CN 2811886Y CN 200520100988 CN200520100988 CN 200520100988 CN 200520100988 U CN200520100988 U CN 200520100988U CN 2811886 Y CN2811886 Y CN 2811886Y
- Authority
- CN
- China
- Prior art keywords
- refrigeration
- refrigerating chamber
- guiding block
- coldness
- insulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
Abstract
The utility model relates to a domestic or similar domestic appliance which supplies coldness by consuming electrical energy, particularly a semiconductor refrigerator which adopts a semiconductor refrigeration device as a core cold source and is named according to the reason. A heat insulation layer and a refrigerator door surround to form a refrigerating chamber. The top of the refrigerating chamber is provided with a refrigeration mechanism, wherein an upper axial flow fan, a radiator, a refrigeration slice, a coldness guiding block, an evaporator and a lower axial flow fan are orderly arranged from top to bottom to form the refrigeration mechanism. The upper axial flow fan, the radiator and the refrigeration slice are arranged in a cavity body at the upper part of the refrigerating chamber. The coldness guiding block is embedded in the heat insulation layer, the upper end of the coldness guiding block is connected with the refrigeration slice and the lower end is connected with the evaporator. The evaporator and the lower axial flow fan are arranged in the refrigerating chamber. The utility model solves the problems that the structure of the existing semiconductor refrigerator is complicated, the structure of the existing semiconductor refrigerator is adverse to the natural flow of cold air stream and hot air stream, the temperature in a refrigerating chamber is inhomogeneous, the refrigeration effect is not good, etc.
Description
Technical field
The utility model relates to the utensil that a kind of family expenses or similar family expenses carry out refrigeration by consumed power, especially adopt semiconductor cooler as the core low-temperature receiver and the semiconductor freezer of name thus.
Technical background
A kind of family expenses are the semiconductor freezer (application number: 03109036.2) of core low-temperature receiver with the semiconductor cooler, adopt radiating fin, heat pipe, mother board metal integral heat radiator, together with semiconductor cooler, heat conduction ware, the inherent sealed, thermally insulated refrigeration movement of good heat conduction plasticity that forms of connecting framework four key elements, the flexible frame structure of the bad heat conduction of external formation, reasonably form refrigeration and adiabatic two systems, absorber plate or device constitute five elements refrigeration assembly in addition.
But the refrigeration part horizontally set of above-mentioned patent application, structure are comparatively complicated, are unfavorable for flowing naturally of hot and cold air, refrigeration indoor temperature inequality, and refrigeration is not good.
Summary of the invention
The utility model purpose is to provide a kind of compact conformation, be beneficial to flowing naturally of hot and cold air, the refrigeration indoor temperature is comparatively even, refrigeration is semiconductor freezer preferably, the structure that has solved existing semiconductor freezer existence is comparatively complicated, be unfavorable for flowing naturally of hot and cold air, refrigeration indoor temperature inequality, problem such as refrigeration is not good.
Above-mentioned technical purpose of the present utility model mainly solves by the following technical programs: refrigerating chamber is surrounded by heat-insulation layer and chamber door, described refrigerating chamber top is provided with refrigeration mechanism, described refrigeration mechanism is by last aerofoil fan, radiator, cooling piece, cool guiding block, evaporimeter and following aerofoil fan are provided with formation successively from top to bottom, the described aerofoil fan of going up, radiator, cooling piece are located in the cavity of refrigerating chamber top, described cool guiding block is embedded in the described heat-insulation layer, its upper end is connected with cooling piece, and the lower end is connected with evaporimeter, and described evaporimeter and following aerofoil fan are located in the refrigerating chamber.Each parts above-below direction of refrigeration mechanism is provided with, reduced the thickness of refrigerator, make that the mechanism of refrigerator is more compact, simultaneously, refrigeration mechanism is located at the top of refrigerating chamber, but makes the big and sinking of nature of cold air density, hot-air is then because of the little and natural rising of density, make that the temperature in the refrigerating chamber is more even, improved the refrigeration of refrigerator.
As preferably, be provided with the hard polyaminoester layer between described cool guiding block and heat-insulation layer.
As preferably, described aerofoil fan down is provided with the blower fan guard.
Therefore, the utlity model has compact conformation, be beneficial to flowing naturally of hot and cold air, characteristics such as the refrigeration indoor temperature is comparatively even, and refrigeration is better.Each parts above-below direction of refrigeration mechanism is provided with, reduced the thickness of refrigerator, make that the mechanism of refrigerator is more compact, simultaneously, refrigeration mechanism is located at the top of refrigerating chamber, but makes the big and sinking of nature of cold air density, hot-air is then because of the little and natural rising of density, make that the temperature in the refrigerating chamber is more even, improved the refrigeration of refrigerator.
Description of drawings
Accompanying drawing 1 is a kind of structural representation of the present utility model.
Specific embodiment
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment 1: as shown in Figure 1, refrigerating chamber 9 is surrounded by heat-insulation layer 3 and chamber door 6, refrigerating chamber 9 tops are provided with refrigeration mechanism, refrigeration mechanism is by last aerofoil fan 1, radiator 10, cooling piece 11, cool guiding block 4, evaporimeter 5 and following aerofoil fan 8 are provided with formation successively from top to bottom, last aerofoil fan 1, radiator 10, cooling piece 11 are located in the cavity of refrigerating chamber top, cool guiding block 4 is embedded in the heat-insulation layer 3, its upper end is connected with cooling piece 11, and the lower end is connected with evaporimeter 4, and 3 of cool guiding block 4 and heat-insulation layers are provided with hard polyaminoester layer 2, evaporimeter 4 and following aerofoil fan 8 are located in the refrigerating chamber, and following aerofoil fan 8 is provided with blower fan guard 7.
Claims (3)
1, a kind of semiconductor freezer, refrigerating chamber (9) is surrounded by heat-insulation layer and chamber door, it is characterized in that described refrigerating chamber (9) top is provided with refrigeration mechanism, described refrigeration mechanism is by last aerofoil fan (1), radiator (10), cooling piece (11), cool guiding block (4), evaporimeter (5) and following aerofoil fan (8) are provided with formation successively from top to bottom, the described aerofoil fan (1) of going up, radiator (10), cooling piece (11) is located in the cavity of refrigerating chamber top, and described cool guiding block (4) is embedded in the described heat-insulation layer (3), and its upper end is connected with cooling piece (11), the lower end is connected with evaporimeter (4), and described evaporimeter (4) and following aerofoil fan (8) are located in the refrigerating chamber.
2, semiconductor freezer according to claim 1 is characterized in that being provided with hard polyaminoester layer (2) between described cool guiding block (4) and heat-insulation layer (3).
3, semiconductor freezer according to claim 1 and 2 is characterized in that described aerofoil fan (8) down is provided with blower fan guard (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520100988 CN2811886Y (en) | 2005-03-15 | 2005-03-15 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520100988 CN2811886Y (en) | 2005-03-15 | 2005-03-15 | Semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2811886Y true CN2811886Y (en) | 2006-08-30 |
Family
ID=36938276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520100988 Expired - Fee Related CN2811886Y (en) | 2005-03-15 | 2005-03-15 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2811886Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104309932A (en) * | 2014-10-22 | 2015-01-28 | 黄道志 | Temperature control cup |
| CN106524631A (en) * | 2016-12-20 | 2017-03-22 | 浙江聚珖科技股份有限公司 | Combined semiconductor refrigeration refrigerator |
| CN110671851A (en) * | 2018-07-02 | 2020-01-10 | 青岛海尔股份有限公司 | Refrigerator with a door |
| CN110849029A (en) * | 2019-11-20 | 2020-02-28 | 合肥美菱物联科技有限公司 | Semiconductor refrigeration assembly and refrigerator |
| WO2020168945A1 (en) * | 2019-02-19 | 2020-08-27 | 青岛海尔电冰箱有限公司 | Refrigerating and freezing apparatus |
| CN111998592A (en) * | 2020-09-22 | 2020-11-27 | 中山东菱威力电器有限公司 | Air-cooled insulation can |
| CN112665211A (en) * | 2020-12-11 | 2021-04-16 | 合肥芳容智能科技有限公司 | Multi-temperature-zone direct-cooling refrigerating device |
-
2005
- 2005-03-15 CN CN 200520100988 patent/CN2811886Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104309932A (en) * | 2014-10-22 | 2015-01-28 | 黄道志 | Temperature control cup |
| CN104309932B (en) * | 2014-10-22 | 2016-09-21 | 黄道志 | A kind of temperature control cup |
| CN106524631A (en) * | 2016-12-20 | 2017-03-22 | 浙江聚珖科技股份有限公司 | Combined semiconductor refrigeration refrigerator |
| CN110671851A (en) * | 2018-07-02 | 2020-01-10 | 青岛海尔股份有限公司 | Refrigerator with a door |
| CN110671851B (en) * | 2018-07-02 | 2022-12-20 | 海尔智家股份有限公司 | Refrigerator |
| WO2020168945A1 (en) * | 2019-02-19 | 2020-08-27 | 青岛海尔电冰箱有限公司 | Refrigerating and freezing apparatus |
| RU2770871C1 (en) * | 2019-02-19 | 2022-04-22 | Циндао Хайер Рифриджерейтор Ко., Лтд. | Cooling and freezing device |
| CN110849029A (en) * | 2019-11-20 | 2020-02-28 | 合肥美菱物联科技有限公司 | Semiconductor refrigeration assembly and refrigerator |
| CN111998592A (en) * | 2020-09-22 | 2020-11-27 | 中山东菱威力电器有限公司 | Air-cooled insulation can |
| CN112665211A (en) * | 2020-12-11 | 2021-04-16 | 合肥芳容智能科技有限公司 | Multi-temperature-zone direct-cooling refrigerating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060830 Termination date: 20140315 |