CN113028677A

CN113028677A - Intelligent temperature control cold semiconductor transport case

Info

Publication number: CN113028677A
Application number: CN202110321767.4A
Authority: CN
Inventors: 金安君; 李智豪; 苏家鹏
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-03-25
Filing date: 2021-03-25
Publication date: 2021-06-25

Abstract

The invention discloses an intelligent temperature control cold semiconductor transport case which comprises a case body and a case door, wherein the case body is hinged with the case door, non-heat-conducting silica gel gaskets are arranged on the periphery of the case door, a heat insulating layer is arranged between a case body liner and a case body shell, the intelligent temperature control cold semiconductor transport case also comprises a refrigerating unit arranged between the case body liner and the case body shell, a temperature control unit used for keeping the temperature in the case body constant, and a data transmission unit used for recording and transmitting temperature data in the case body. The refrigeration unit is including leading the cold drawing, with leading the refrigeration piece that the cold drawing leaned on that lean on with the box inner bag, setting up the radiator between pressure plate and refrigeration piece, the both ends butt joint of refrigeration piece has the heat insulation layer. This scheme adopts PID control technique can realize accurate setting and the intelligent control of temperature in the box, and the real-time temperature in the box also can feed back to the user in real time simultaneously, adopts the semiconductor refrigeration piece to realize heating and radiating temperature control, and the device structure is small and exquisite light, and market prospect is extensive.

Description

Intelligent temperature control cold semiconductor transport case

Technical Field

The invention relates to the technical field of semiconductor thermostats, in particular to an intelligent temperature control cold semiconductor transport case.

Background

At present, the refrigerated medicine transport case is refrigerated by adopting an active refrigeration (semiconductor refrigeration sheet) technology. The semiconductor refrigeration piece comprises a heat dissipation surface and a refrigeration surface, the heat dissipation surface is attached to the heat dissipation fins, and the water pipes are inserted into the heat dissipation fins to transfer heat to ice water. The refrigerating surface is combined with the refrigerating fins and used for conveying cold air to the transport box. In addition, the mechanical refrigerator is researched to be miniaturized to a middle and micro scale, which will be briefly discussed. However, the cooling technology of medium and micro-machines for electronic cooling has not been successfully commercialized. Mechanical refrigeration cooling of portable devices for military or medical applications has not even been achieved. While mechanical micro coolers also benefit from the passive micro cooler technology developed to date, the primary reason for the lack of adoption of mechanical vapor compression refrigeration is the lack of reliable and/or low energy consumption gas micro compressors. The vapor compression cycle operates by compressing the refrigerant to a higher pressure, increasing the temperature of the vapor. The vapor condenses into a liquid because heat is rejected from entering the ambient temperature thermal storage layer. When expanded to a lower pressure in the evaporator, the liquid evaporates at a low temperature and absorbs heat, thereby providing cooling power. Most potential refrigerants typically require compression ratios greater than one. Problematically, the ability to compress gas does not generally expand with size reduction, particularly on a micro scale.

In a broad sense, the micro-cooler technology can be divided into two areas: refrigerated cooling and non-refrigerated cooling. Cryogenic cooling refers to systems that are capable of bringing a target temperature (e.g., junction temperature in an electronic chip) below ambient temperature or at least below a temperature that a non-cryogenic system can reach. Increasing surface area using normal-scale electronic cooling systems is rapidly reaching practical limits. Also, increasing the cooling air velocity by increasing the cooling air velocity, increasing the overall heat transfer coefficient (which is generally proportional to the air velocity) is limited by the fan power consumption, which is proportional to the square of the velocity. From a system perspective, at any given system, at some point, more power is added, even if it is available (which is incorrect for a portable system), which may generate more heat than is removed. However, the heat exchange area and heat transfer coefficient are also coupled together by heat transfer and the characteristic length scale of the system. As will be discussed, the total amount of heat transferred may be enhanced when the phenomenon length scales (e.g., fluid boundary layer and thermal diffusion length) associated with heat transfer are in the same order as the physical length scales. For military and medical applications, it is closely related whether the equipment to be cooled is portable and/or requires lightweight and small volumes. Challenges include (1) cooling energy and power densities, providing an integral cooling system that is lightweight and compact, portable, and scalable, (2) chillers that have a desired cooling rate when operating temperatures are desired, (3) not requiring high voltage sources or the power consumption of complex electronics, (4) being operationally robust; (5) and (5) controlling the cost.

However, the above control system and method can not realize accurate intelligent control of temperature, and the real-time temperature in the box body is not fed back to the user. The core function of the micro cooler in the above application is to be able to remove excess heat from the device. The heat flux removed from the device being cooled (only given by q = Kh a D T) is proportional to the thermal conductivity (Kh a), the heat transfer coefficient product, the surface area over which heat transfer occurs, and the temperature difference between the equipment surface and the environment in which the heat is rejected. The ability to actively cool is maintained by adding energy. Thermoelectric cooling devices have potential for such applications. Integrating a solid state cooler with a microfluidic heat exchanger developed for non-refrigerated micro coolers can provide the required sub-ambient temperature cooling.

Scientists have recently proposed many different types of active cooling techniques, including solid state and mechanical. Solid-state thermoelectric coolers have been subject to considerable research because the process is well known and actively developed for decades, and many thermoelectric coolers have been commercialized for cooling many electronic systems, including sensitive low-temperature optical sensors. Since the active heat pump mechanism is the transmission of a thermoelectric carrier through a semiconductor junction, it is possible to scale the solid state cooler down to micro-scale. The main problem of solid state cooling up to now is the low coefficient of performance (COP) of the solid state cooler. COP is the ratio of the amount of heat transferred to the amount of power provided to move the heat. Currently, fully integrated solid state microscale systems have an insufficient COP, which leads to difficulties with operating temperature regimes and thermal runaway. However, much research is being spent to increase the thermal efficiency of solid state coolers, making the COP of the system potentially much higher than 1, approaching that of large mechanical refrigeration systems. The disadvantages of the prior art are mainly reflected in: 1) the cold air of the refrigerating unit is dissipated, so that the refrigerating efficiency is reduced; 2) the temperature in the box body is not intelligently controlled; 3) the temperature is detected and not stored and fed back to the user.

Chinese patent publication No.: CN111319875A discloses an intelligence transport case suitable for cold chain commodity circulation, the lateral wall of transport case is equipped with controls panel and power source, the case lid articulates in the upper end of transport case, be equipped with the electric control lock between case lid and the transport case, the inside wall of transport case and case lid is equipped with the heat preservation, the inside of transport case is equipped with the bottom baffle next time, inside just being located the bottom baffle downside of transport case is equipped with refrigerator and battery, the both sides lateral wall of transport case is equipped with respectively into gas through-hole and the through-hole of giving vent to anger, the outside of going into gas through-hole and the through-hole of giving vent to anger all is equipped with the spout, both sides equal sliding connection has electronic ventilation baffle in the spout. The invention can replace a disposable express box, reduces logistics cost, can refrigerate and distribute stored fresh goods by arranging the refrigerator, can keep the circulation of air in the transport box to keep the freshness of the fresh goods, and can bring partial moisture out of the box body to avoid the fresh goods from rotting caused by moisture residue. The device can realize the replacement of cold air in the box body, but the cold air of the refrigerating unit is scattered, so that the refrigerating efficiency is reduced.

Disclosure of Invention

Aiming at the defects, the intelligent temperature control cold semiconductor transport case is designed; this scheme adopts PID control technique can realize accurate setting and the intelligent control of temperature in the box, and the real-time temperature in the box also can feed back to the user in real time simultaneously, adopts the semiconductor refrigeration piece to realize heating and radiating temperature control, and the device structure is small and exquisite light, and market prospect is extensive.

In order to achieve the technical purpose, the invention provides a technical scheme that the intelligent temperature control cold semiconductor transport case comprises a case body and a case door, wherein the case body is hinged with the case door, non-heat-conducting silica gel gaskets are arranged on the periphery of the case door, a heat insulating layer is arranged between an inner container of the case body and a case shell of the case body, the intelligent temperature control cold semiconductor transport case also comprises a refrigerating unit arranged between the inner container of the case body and the case shell of the case body, a temperature control unit used for keeping the temperature in the case body constant, and a data transmission unit used for recording and transmitting temperature data in the case body.

As preferred, the refrigeration unit including with the box inner bag paste lean on lead the cold drawing, with lead the refrigeration piece that the cold drawing pasted and lean on, set up the radiator between pressure plate and refrigeration piece, the both ends butt joint of refrigeration piece has the heat insulation layer, pressure plate, box inner bag and refrigeration piece all and be provided with the through-hole that matches the bolt, the bolt is by making pressure plate, radiator, refrigeration piece, leading cold drawing and box inner bag closely laminate. The refrigeration piece adopts a double-layer semiconductor refrigeration piece with the model of TEC2-19006, the input voltage of the double-layer semiconductor refrigeration piece is 12V, the refrigeration temperature difference can reach 82 ℃, the refrigeration power is 58W, and the product design requirement is met; the cold conducting plate is made of a copper plate and an aluminum plate with high heat conductivity coefficients, the radiator is made of red copper materials, a flow channel is designed in the radiator, the refrigerating sheet is assembled by bolts, the assembling pressure is 4-5 kg, the proper pressure can not only ensure that the ceramic surface of the refrigerating sheet cannot be fractured, but also can increase the refrigerating efficiency; the inner container of the box body is made of aluminum alloy material, the aluminum alloy has heat-conducting property second to copper, the price is low, and the whole device is supported by enough strength. The outer layer of the aluminum alloy inner container is wrapped with two layers of heat insulation materials, and the heat insulation materials are heat insulation materials compounded by a metal thin layer and glass fibers.

Preferably, the radiator is made of red copper materials, a flow channel is designed in the radiator, the flow channel is connected with the condenser through a pipeline to form the radiating mechanism, a micro pump is arranged between a liquid outlet of the condenser and a liquid inlet of the flow channel, and a refrigerant is arranged in the flow channel. The radiator adopts a principle similar to heat dissipation of a heat pipe, R245fa refrigerant is introduced into a flow channel, R245fa refrigerant is common refrigerant, the boiling point is 15 ℃, the vapor pressure and the critical pressure value are lower, the safety coefficient is high, the evaporation latent heat value and the specific heat are larger, and the radiator has the characteristics of good refrigeration effect, safety, environmental protection and the like. The R245fa refrigerant S-shaped flow channel takes away the heat generated at the hot end of the refrigeration sheet, and gasifies, and the gasified R245fa refrigerant flows through the condenser through a pipeline (adopting a copper pipe). Preferably, a corrugated condensation pipe and a cooling fan are arranged in the condenser, the condensation pipe is communicated with the pipeline, and the condensation pipe is coated with a phase-change heat-absorbing material. The condenser is filled with paraffin and other phase-change materials, the phase-change materials absorb heat brought out by the R245fa, the gaseous R245fa is condensed into liquid, the phase-change materials absorbing the heat are radiated to the outside through the aluminum alloy shell, and the liquid refrigerant is pumped into the refrigerating sheet radiating unit through the micropump to form a circulating system for continuous refrigeration.

Preferably, the temperature control unit comprises a PID controller, a plurality of temperature sensors distributed in the box body and a display screen for displaying temperature values, the PID controller is electrically connected with the temperature sensor acquisition end, the control end of the cooling fan and the control end of the micro pump respectively, and the PID controller is electrically connected with the control end of the refrigeration sheet through a power controller.

Preferably, the data transmission unit comprises a data acquisition card connected with the acquisition end of the temperature sensor, the data acquisition card is electrically connected with a PC end through a data line, Labview software is installed at the PC end, the implementation monitoring of the temperature is realized and a data report is generated through a data acquisition subprogram and a temperature alarm subprogram, and meanwhile, a real-time temperature curve is displayed on a front panel of the Labview software; when the temperature data exceeds the set upper limit or lower limit, the software sends out voice and alarm; when the alarm is given, the heating circuit or the radiating circuit is controlled according to the real-time temperature value, so that the real-time monitoring and control of the temperature are realized, and when the temperature meets the requirement, the heating or the ventilation is stopped; the data report is transmitted to the user mobile phone and the portable computer in a Web service mode.

Preferably, the heat insulating layer is filled with a heat insulating material, and the heat insulating material is a heat insulating material formed by compounding a metal thin layer and glass fibers.

Preferably, the refrigerant is R245fa refrigerant.

The invention has the beneficial effects that: the invention relates to an intelligent temperature control cold semiconductor transport case; the transport case is refrigerated by adopting a semiconductor refrigeration sheet, a semiconductor refrigeration system is arranged at the top end of the case body, and the semiconductor refrigeration system consists of the semiconductor refrigeration sheet, a radiator and a pressure plate. The heat radiating surface of the semiconductor refrigerating sheet is attached to the hot end radiator of the refrigerating sheet for radiating, the hot end radiator of the refrigerating sheet is a component of a heat radiating system, and the semiconductor refrigerating sheet further comprises a pump, a condenser and a working medium. The working medium is subjected to phase change gasification through the hot end radiator of the refrigerating sheet and takes away heat emitted by the refrigerating sheet, then flows through the condenser, is subjected to heat exchange with the phase change material in the condenser, is condensed into a liquid state, and then is supplied with energy by the pump to flow through the hot end radiator of the refrigerating sheet newly to form a circulating system. The phase change material in the condenser and the outside air are subjected to thermal interaction, and the heat absorbed from the working medium is dissipated into the air. In addition, the temperature of the heat insulation box can be automatically set on the display panel, the heat insulation box controls the refrigerating capacity of the refrigerating sheet through PID, three (or a plurality of) thermocouples are arranged at the bottom and the side of the box body for temperature detection, the measured temperature is fed back to PID, and the PID carries out refrigeration regulation according to the measured temperature, so that the temperature in the heat insulation box reaches the designated temperature. And the temperature can be displayed on the liquid crystal display panel outside the box body in real time. In order to ensure that the temperature is always within the monitoring range in the transportation process of the medicine transportation box, a data acquisition card and a data storage are arranged in the transportation box, data acquired by the data acquisition card are transmitted to a PC (personal computer), and the PC monitors and analyzes the data through programming software and visualizes the data. The detected temperature in the transportation process can be stored, and a complete real-time temperature detection report is provided for the receiver after the transportation is finished. Adopt PID control technique can realize accurate setting and the intelligent control of temperature in the box, the real-time temperature in the box also can feed back to the user in real time simultaneously, adopts the semiconductor refrigeration piece to realize heating and radiating temperature control, and the device structure is small and exquisite light, and market prospect is extensive.

Drawings

Fig. 1 is a schematic structural diagram of an intelligent temperature control cold semiconductor transportation box according to the present invention.

Fig. 2 is a schematic structural diagram of the heat dissipation mechanism of the present invention.

Fig. 3 is a schematic view of the structure of the refrigeration unit of the present invention.

Fig. 4 is a schematic diagram of data transmission of the data transfer unit according to the present invention.

The notation in the figure is: 1-box body, 2-box door, 11-box body inner container, 12-first heat insulation layer, 13-second heat insulation layer, 21-non-heat-conducting silica gel gasket, 22-nylon sealing plate, 23-heat insulation layer, 31-cold conduction plate, 32-refrigeration sheet, 33 radiator, 34-pressure plate, 35-bolt, 4-condenser, 41-phase change material, 42-pipeline, 43-micro pump, 44-condensing agent, 45-condensing pipe and 46-display screen.

Detailed Description

For the purpose of better understanding the objects, technical solutions and advantages of the present invention, the following detailed description of the present invention with reference to the accompanying drawings and examples should be understood that the specific embodiment described herein is only a preferred embodiment of the present invention, and is only used for explaining the present invention, and not for limiting the scope of the present invention, and all other embodiments obtained by a person of ordinary skill in the art without making creative efforts shall fall within the scope of the present invention.

Example (b): as shown in fig. 1, a structural schematic diagram of an intelligent temperature control cold semiconductor transport case, including box 1 and box door 2, the box is articulated with the box door, the periphery of box door is provided with non-heat conduction silica gel gasket 21, and the inboard of box door is nylon closing plate 22, is provided with heat insulation layer 23 between box inner bag 11 and the box shell, and the insulating layer of box is including first heat insulation layer 12 and second heat insulation layer 13, still including setting up the refrigeration unit between box inner bag and the box shell, be used for keeping the interior homothermal control unit of box and be used for the data transfer unit of temperature data record and transmission in the box.

As shown in fig. 3, the refrigeration unit includes a cold conducting plate 31 attached to the inner container of the refrigerator, a refrigeration sheet 32 attached to the cold conducting plate, and a heat sink 33 disposed between the pressure plate 34 and the refrigeration sheet, wherein the two ends of the refrigeration sheet are connected to first heat insulating layers, and the first heat insulating layers, the pressure plate, the inner container of the refrigerator and the refrigeration sheet are all provided with through holes matching with bolts 35, and the bolts make the pressure plate, the heat sink, the refrigeration sheet, the cold conducting plate and the inner container of the refrigerator closely attached. The refrigeration piece adopts a double-layer semiconductor refrigeration piece with the model of TEC2-19006, the input voltage of the double-layer semiconductor refrigeration piece is 12V, the refrigeration temperature difference can reach 82 ℃, the refrigeration power is 58W, and the product design requirement is met; the cold conducting plate is made of a copper plate and an aluminum plate with high heat conductivity coefficients, the radiator is made of red copper materials, a flow channel is designed in the radiator, the refrigerating sheet is assembled by bolts, the assembling pressure is 4-5 kg, the proper pressure can not only ensure that the ceramic surface of the refrigerating sheet cannot be fractured, but also can increase the refrigerating efficiency; the inner container of the box body is made of aluminum alloy material, the aluminum alloy has heat-conducting property second to copper, the price is low, and the whole device is supported by enough strength. The outer layer of the aluminum alloy inner container is wrapped with two layers of heat insulation materials, and the heat insulation materials are heat insulation materials compounded by a metal thin layer and glass fibers.

As shown in fig. 2, the heat sink is made of red copper material and has a flow channel designed therein, the flow channel is connected with the condenser 4 through a pipeline to form a heat dissipation mechanism, a micro pump 43 is arranged between a liquid outlet of the condenser and a liquid inlet of the flow channel, and a refrigerant is arranged in the flow channel. The radiator adopts a principle similar to heat dissipation of a heat pipe, R245fa refrigerant is introduced into a flow channel, R245fa refrigerant is common refrigerant, the boiling point is 15 ℃, the vapor pressure and the critical pressure value are lower, the safety coefficient is high, the evaporation latent heat value and the specific heat are larger, and the radiator has the characteristics of good refrigeration effect, safety, environmental protection and the like. The R245fa refrigerant is in S-shaped flow channel, takes away the heat generated at the hot end of the cooling fin, and is gasified, and the gasified R245fa refrigerant flows through the condenser through the pipe 42 (using copper pipe).

Be provided with ripple type condenser pipe and radiator fan in the condenser, the condenser pipe is with the pipeline intercommunication, the cladding has phase transition heat absorbing material on the condenser pipe 45. The condenser is filled with paraffin and other phase-change materials 41, the phase-change materials absorb heat brought out by the R245fa, the gaseous R245fa is condensed into liquid, the phase-change materials absorbing the heat are radiated to the outside through an aluminum alloy shell, and the liquid refrigerant is pumped into the refrigerating sheet radiating unit through the micropump to form a circulating system for continuous refrigeration.

The temperature control unit comprises a PID controller (not shown), a plurality of temperature sensors (not shown) distributed in the box body and a display screen 46 for displaying temperature values, the PID controller is respectively electrically connected with a temperature sensor acquisition end, a control end of a cooling fan and a control end of a micro pump, and the PID controller is electrically connected with the control end of the refrigeration piece through a power controller. The temperature control in the intelligent temperature control cold semiconductor transport case plays an important role in ensuring the temperature stability of the articles in the transport process and ensuring the articles to be always at the set temperature in the transport process. In order to intelligently control the temperature of the box body, a PID control technology is adopted, after the temperature of the heat preservation box is set, the PID controller acquires the temperature in the box body through acquiring temperature sensors arranged at the bottom and the side wall of the transport box, judges the temperature and the set temperature, starts a refrigeration program if the temperature in the box body is higher than the set temperature, and starts a heating program if the temperature in the box body is lower than the set temperature. The PID controller controls the working voltage and current of the refrigerating sheet through the power controller to change the refrigerating/heating quantity and the refrigerating/heating rate, and simultaneously displays the real-time temperature on an external display screen. The power supply controller can charge the energy storage battery for the working power supply through a 220V power grid or a vehicle-mounted 12V power grid, the battery power information is displayed on the display screen, and a power switch for starting and stopping the whole box circuit is arranged.

As shown in fig. 4, the data transmission unit includes a data acquisition card connected to the acquisition end of the temperature sensor, the data acquisition card is electrically connected to the PC end via a data line, the data acquisition card is used for collecting, conditioning and converting temperature signals, the PC end is equipped with Labview software, and implements monitoring of temperature and generating data report via data acquisition subprogram and temperature alarm subprogram, and displays real-time temperature curve on the front panel of the Labview software; when the temperature data exceeds the set upper limit or lower limit, the software sends out voice and alarm; when the alarm is given, the heating circuit or the radiating circuit is controlled according to the real-time temperature value, so that the real-time monitoring and control of the temperature are realized, and when the temperature meets the requirement, the heating or the ventilation is stopped; the data report is transmitted to the user mobile phone and the portable computer in a Web service mode.

The above-mentioned embodiments are preferred embodiments of the intelligent temperature control cold semiconductor transport case of the present invention, and the scope of the present invention is not limited thereto, and the present invention includes and is not limited thereto, and all equivalent changes made to the shape, structure and apparatus designed according to the cold conduction ratio of the solid refrigeration chip according to the present invention are within the protection scope of the present invention.

Claims

1. The utility model provides a cold semiconductor transport case of intelligence temperature control, including box and chamber door, box and chamber door are articulated, the periphery of chamber door is provided with not heat conduction silica gel packing ring, is provided with the heat insulation layer between box inner bag and the box shell, its characterized in that still including set up refrigeration unit between box inner bag and the box shell, be used for keeping the interior homothermal control unit of box and be used for the interior temperature data record of box and the data transfer unit who transmits.

2. The intelligent temperature control cold semiconductor transportation box according to claim 1, wherein the refrigeration unit comprises a cold guide plate attached to the inner container of the box body, a refrigeration sheet attached to the cold guide plate, and a heat radiator arranged between the pressure plate and the refrigeration sheet, wherein the two ends of the refrigeration sheet are abutted to the heat insulation layer, the pressure plate, the inner container of the box body and the refrigeration sheet are all provided with through holes matched with bolts, and the bolts enable the pressure plate, the heat radiator, the refrigeration sheet, the cold guide plate and the inner container of the box body to be tightly attached.

3. The intelligent temperature control cold semiconductor transportation box according to claim 2, wherein the heat sink is made of red copper material and has a flow channel designed therein, the flow channel is connected with the condenser through a pipeline to form a heat dissipation mechanism, a micro pump is arranged between a liquid outlet of the condenser and a liquid inlet of the flow channel, and a refrigerant is arranged in the flow channel.

4. The intelligent temperature control cold semiconductor transportation box according to claim 3, wherein a corrugated condensation pipe and a heat radiation fan are arranged in the condenser, the condensation pipe is communicated with a pipeline, and the condensation pipe is coated with a phase change heat absorption material.

5. The intelligent temperature-control cold semiconductor transportation box according to claim 4, wherein the temperature control unit comprises a PID controller, a plurality of temperature sensors distributed in the box body and a display screen for displaying temperature values, the PID controller is respectively electrically connected with the temperature sensor acquisition end, the control end of the cooling fan and the control end of the micro pump, and the PID controller is electrically connected with the control end of the refrigeration sheet through a power controller.

6. The intelligent temperature control cold semiconductor transportation box according to claim 4, wherein the data transmission unit comprises a data acquisition card connected with the acquisition end of the temperature sensor, the data acquisition card is electrically connected with the PC end through a data line, the PC end is provided with Labview software, the Labview software realizes the implementation monitoring of the temperature and generates a data report through a data acquisition subprogram and a temperature alarm subprogram, and simultaneously, a real-time temperature curve is displayed on a front panel of the Labview software; when the temperature data exceeds the set upper limit or lower limit, the software sends out voice and alarm; when the alarm is given, the heating circuit or the radiating circuit is controlled according to the real-time temperature value, so that the real-time monitoring and control of the temperature are realized, and when the temperature meets the requirement, the heating or the ventilation is stopped; the data report is transmitted to the user mobile phone and the portable computer in a Web service mode.

7. The intelligent temperature control cold semiconductor transportation box according to claim 1 or 2, wherein the thermal insulation layer is filled with thermal insulation material, and the thermal insulation material is thermal insulation material formed by compounding a metal thin layer and glass fiber.

8. The intelligent temperature controlled cold semiconductor transport container according to claim 3, wherein the refrigerant is R245fa refrigerant.