CN207163051U - Cold storage semiconductor freezer - Google Patents
Cold storage semiconductor freezer Download PDFInfo
- Publication number
- CN207163051U CN207163051U CN201720763327.3U CN201720763327U CN207163051U CN 207163051 U CN207163051 U CN 207163051U CN 201720763327 U CN201720763327 U CN 201720763327U CN 207163051 U CN207163051 U CN 207163051U
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- China
- Prior art keywords
- cooling
- chilling plate
- semiconductor chilling
- fixed
- cold storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000003860 storage Methods 0.000 title claims abstract description 58
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 230000004888 barrier function Effects 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 2
- 238000005057 refrigeration Methods 0.000 abstract description 17
- 238000009826 distribution Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 239000012774 insulation material Substances 0.000 description 6
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- 239000000956 alloy Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002365 multiple layer Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
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- 230000008023 solidification Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
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- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 238000005187 foaming Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000008717 functional decline Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- -1 heat pipe Inorganic materials 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
One kind can speed up refrigeration and when semiconductor chilling plate is stopped, extended the refrigerator of refrigeration, its technical scheme is as follows using semiconductor chilling plate refrigeration and cold-storage：Cold storage semiconductor freezer, include casing, inner bag, semiconductor chilling plate and conduction cooling bar, the cold end of the semiconductor chilling plate is fixed with conduction cooling bar, and the surface of the conduction cooling bar is fixed with cooling-storage structure, and the cooling-storage structure is arranged on the inside of inner bag.The utility model fixes cooling-storage structure by the cold end in semiconductor chilling plate, can speed up refrigeration and when semiconductor chilling plate is stopped, extends refrigeration.If refrigerator is when carrying out frequently switching manipulation, cooling-storage structure can reduce the fluctuation of internal temperature of refrigerator；When being put into large article and being refrigerated or freezed, cooling-storage structure acts on simultaneously with semiconductor chilling plate, article is comparatively fast reached preference temperature；When there is short time power failure, the temperature that cooling-storage structure can slow down refrigerator inside within a certain period of time rises.
Description
Technical field
A kind of refrigerating plant is the utility model is related to, it is especially a kind of to be freezed using semiconductor chilling plate, pass through cold-storage knot
Structure carries out cold-storage, and can carry out reclaiming the refrigerator of generating to heat caused by semiconductor chilling plate.
Background technology
As a kind of new refrigeration structure, it is mainly imitated semiconductor chilling plate using the Peltier of semi-conducting material
Should, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the both ends of galvanic couple
With releasing heat, pass through the temperature conduction in its cold end surface, it is possible to realize the refrigeration in certain space.Because it need not
Chemical reaction and without mechanical moving parts, therefore with energy-conserving and environment-protective, food not taint of odour, simple in construction, noiseless, safely, open
Move numerous advantages such as fast.
In the prior art, it has been disclosed that have the device to be freezed using semiconductor chilling plate, such as refrigerator, made
While cold, waste heat caused by semiconductor chilling plate hot junction is recycled, realizes the purpose of energy-saving and emission-reduction.But
It is, due to refrigerator in use, it is often necessary to open and close operation is carried out, easily causes internal temperature of refrigerator unstable, or
It is to be put into during large article refrigerated or freezed, the refrigerating efficiency of semiconductor chilling plate can not be such that article comparatively fast reaches
Preference temperature, or when there is short time power failure, refrigerator will lose refrigeration source, cause internal temperature of refrigerator to rise, refrigeration
Fresh-keeping function declines, or even when temperature rises to a certain extent, in sealing wet environment, can accelerate the rotten of food on the contrary
Even corruption.
Utility model content
The utility model is directed to above-mentioned deficiency, there is provided one kind is freezed using semiconductor chilling plate, is carried out by cooling-storage structure
Cold-storage, accelerate refrigeration and when semiconductor chilling plate is stopped, extend refrigeration, while heat can be produced to cooling piece
Reclaim the refrigerator of generating.
To achieve these goals, the utility model uses semiconductor chilling plate refrigeration and cold-storage, Neng Goujia using a kind of
Speed is freezed and when semiconductor chilling plate is stopped, and extends the refrigerator of refrigeration, its technical scheme is as follows：It is cold storage partly to lead
System cold refrigerator, includes casing, inner bag, semiconductor chilling plate and conduction cooling bar, and the cold end of the semiconductor chilling plate is fixed with
Conduction cooling bar, the surface of the conduction cooling bar are fixed with cooling-storage structure, and the cooling-storage structure is arranged on the inside of inner bag.
Described cooling-storage structure is made up of shell and cold storage body, and cold storage body is located at enclosure, shell and semiconductor refrigerating
The cold end of piece is fixed.
The hot junction of described semiconductor chilling plate it is direct or indirect be fixed with thermo-electric generation chip.
Temperature-uniforming plate is fixed between described semiconductor chilling plate hot junction and thermo-electric generation chip.
Staggeredly superposition is fixed between described thermo-electric generation sheet and temperature-uniforming plate.
Described temperature-uniforming plate is multi-disc, is gradually decreased since semiconductor chilling plate to radiator, quantity.
Insulating barrier is provided with the thermo-electric generation chip and/or samming body, line layer is provided with insulating barrier.
The line layer includes solderable position and electrical connection is distributed.
The beneficial effects of the utility model：
The utility model fixes cooling-storage structure by the cold end in semiconductor chilling plate, can speed up refrigeration and in semiconductor
When cooling piece is stopped, extend refrigeration.If refrigerator is when carrying out frequently switching manipulation, cooling-storage structure can reduce ice
The fluctuation of case internal temperature；When being put into large article and being refrigerated or freezed, cooling-storage structure is made simultaneously with semiconductor chilling plate
With making article comparatively fast reach preference temperature；When there is short time power failure, cooling-storage structure can slow down refrigerator within a certain period of time
Internal temperature rises.
Thermo-electric generation chip is fixed in the hot junction of semiconductor chilling plate, so as to realize that the recovery of heat generates electricity.Pass through the temperature difference
The multiple-layer stacked structure setting of power generation sheet and/or temperature-uniforming plate, heat is carried out to make full use of generating to reclaim, so as to further improve
Generating efficiency.
The shape of temperature-uniforming plate is changed according to varying environment, such as cuboid, pyramid, "L" shaped, " U " font knot
The various structures such as structure, especially the samming plate shape near semiconductor chilling plate hot junction can carry out design, so as to
Change space and position distribution, modularized design is convenient for, suitable for large batch of industrialized production.
Brief description of the drawings
Fig. 1 is the schematic elevation view of a preferred embodiment of the present utility model；
Fig. 2 is the schematic rear view of a preferred embodiment of the present utility model；
Fig. 3 is the diagrammatic cross-section in preferred embodiment A-A directions of the present utility model；
Fig. 4 is the diagrammatic cross-section in preferred embodiment B-B directions of the present utility model；
Fig. 5 is the diagrammatic cross-section in another preferred embodiment A-A directions of the present utility model.
Embodiment
As shown in Figure 1,2,3, 4, it is the schematic diagram of the preferred embodiment of the utility model one.The present embodiment main heat sink 1,
Second thermo-electric generation chip 2, insulation material 5, the 3rd temperature-uniforming plate 6, the first thermo-electric generation chip 7, the second temperature-uniforming plate 8, first are equal
Warm plate 9, semiconductor chilling plate 10, conduction cooling bar 11, inner bag 12, fixed support 13, cooling-storage structure 14, casing 15, chamber door 16, interface
17th, driving power 18, handle 19, catch 20, modulator 21 etc. form, and form a complete semiconductor freezer structure.
Conduction cooling bar 11 is fixed with the cold end of semiconductor chilling plate 10, the surface of conduction cooling bar 11 is fixed with cooling-storage structure 14, cooling-storage structure
14 are arranged on the inside of inner bag 12.In this embodiment, cooling-storage structure 14 is between conduction cooling bar 11 and inner bag 12, conduction cooling bar 11
On the one hand directly the space inside inner bag 12 is freezed, on the other hand cooling-storage structure 14 freezed.
Conduction cooling bar 11 is used as cold conducting structure, and effect is that the cold of the cold end of semiconductor chilling plate 10 is transmitted into cooling-storage structure 14
In the space of inner bag 12, its shape is generally the platy structure of plane, and its structure is similar to temperature-uniforming plate, is internally provided with numerous
Heat pipe.It is contemplated that the size and shape of inner bag 12, the side that tubulose, tabular or tubulose can also be used to be combined with flat board
Formula is bonded the surface for being fixed on inner bag 12.The shape of conduction cooling bar 11 can be bent or reverse, so as to realize conduction cooling bar 11 with
Locational space distribution conversion between semiconductor chilling plate 10, cooling-storage structure 14.In the present embodiment, conduction cooling bar 11 is by three times
Bending, the position conversion from vertical distribution to cross direction profiles is realized, is individually fixed in semiconductor chilling plate 10 and cooling-storage structure
14 surface.
Cooling-storage structure 14 is made up of shell and cold storage body, and cold storage body is located at enclosure, and seals, shell and semiconductor system
The cold end of cold is fixed.Wherein, cold storage body is also cold storage agent or freezing liquid, is a kind of high molecular polymer, can be steady for a long time
It is scheduled on the low temperature range of subzero 15-18 degree.
By the setting of cooling-storage structure 14, it can speed up refrigeration and when semiconductor chilling plate 10 is stopped, extend system
Cold effect.If refrigerator is when carrying out frequently switching manipulation, cooling-storage structure 14 can keep the fluctuation of internal temperature of refrigerator to reduce；
When being put into large article and being refrigerated or freezed, cooling-storage structure 14 acts on simultaneously with semiconductor chilling plate 10, can make article
Comparatively fast reach preference temperature；When there is short time power failure, cooling-storage structure continues to be freezed within a certain period of time, slows down refrigerator
Internal temperature rises.
The hot junction of semiconductor chilling plate 10 it is direct or indirect be fixed with thermo-electric generation chip, preferable fixed form is：
First it is fixed with the first temperature-uniforming plate 9 in the hot junction of semiconductor chilling plate 10, then to be fixed with second equal in the other end of the first temperature-uniforming plate 9
Warm plate 8, in the other end of the second temperature-uniforming plate 8 the first thermo-electric generation chip 7 is fixed, the other end of the first thermo-electric generation chip 7 is consolidated
Surely there is the 3rd temperature-uniforming plate 6, the other end of the 3rd temperature-uniforming plate 6 is fixed with the second thermo-electric generation chip 2, the second thermo-electric generation chip 2
The other end (cold end) be fixed on the lower surface of radiator 1, the fin that the surface of casing 15 is exposed to by radiator 1 enters
The cold and hot exchange of row.
Fixed respectively between the hot junction of semiconductor chilling plate 10 and the first thermo-electric generation chip 7, the second thermo-electric generation chip 2
There are the first temperature-uniforming plate 9, the second temperature-uniforming plate 8 and the 3rd temperature-uniforming plate 6, it is solid by being staggeredly superimposed between thermo-electric generation sheet and temperature-uniforming plate
It is fixed, it on the one hand can uniformly expand heat distribution area caused by the hot junction of semiconductor chilling plate 10, so as to improve thermo-electric generation core
Distribution of the piece on temperature-uniforming plate, another aspect temperature-uniforming plate can change the direction of transfer of heat, amplify out more different directions and
The mounting surface of area, so as to change the space of the thermo-electric generation chip installed in its surface and position distribution.
For example, samming plate shape can be cuboid, pyramid, "L" shaped, " U " font structure etc., thus it is possible to vary 90 degree
The space spatial distribution in direction, so as to realize the different space such as thermo-electric generation chip, temperature-uniforming plate and position distribution.
Temperature-uniforming plate gradually decreases since semiconductor chilling plate to radiator, quantity.In the present embodiment, the first temperature-uniforming plate
9 and second temperature-uniforming plate 8 two panels superposition, be reduced to a piece of of the 3rd temperature-uniforming plate 6, the first temperature-uniforming plate 9 and the second temperature-uniforming plate 8
Superposition is due to that the heat in the hot junction of semiconductor chilling plate 10 is concentrated, and in order to preferably expand thermal capacitance, improves heat conduction efficiency,
So as to use two stacked systems, with the reduction in heat transfer process, the quantity of this temperature-uniforming plate is answered also to reduce therewith.
In the application process of reality, the size of heat is produced according to semiconductor chilling plate 10, selects the temperature-uniforming plate of multi-disc
It is overlapped, or cancels temperature-uniforming plate, is directly overlapped using thermo-electric generation chip or multiple-layer stacked.
Temperature-uniforming plate, refer to that thermal conductivity factor is high, thermal resistance is small, can be quickly by heat conduction and equally distributed object after being heated
Or device, it is commonly used for including a kind of metal in copper, heat pipe, aluminium alloy, phase-change material, carbon fiber, graphene etc., nonmetallic
Or device.In the present embodiment, by taking the 3rd temperature-uniforming plate 6 as an example, temperature-uniforming plate is internally provided with numerous heat pipes, and heat pipe inner wall is set
There is male and fomale(M＆F) or be filled with phase-change material filled with reticulated, inside heat pipe, it is real by the change of phase-change material liquid state
The quick conduction of existing heat.
In this embodiment, the surface of thermo-electric generation chip and/or temperature-uniforming plate is provided with insulating barrier, is set on insulating barrier wired
The surface of road floor is respectively arranged with insulating barrier, is made using enamel or anodic oxidation mode.Line layer is provided with insulating barrier, is adopted
Made of printing, plating, compound or spraying method.Line layer, which comprises at least, has solderable position and electrical connection to be distributed, the temperature difference
Power-generating chip is separately fixed at solderable position, and the electrical connection between each thermo-electric generation chip is series connection and/or in parallel, is made
The thermo-electric generation chip of each samming thermo-electric generation layer forms electrical connection to be overall, as needed, each samming thermo-electric generation
Mutual electrical connection, unified output voltage and electric current are carried out again as unit in chip layer.
On line layer in addition to including at least having solderable position and electrical connection distribution, electrostatic protection is also provided with
One or more in the circuit such as circuit, rectification, pressure limiting, current control, to meet different function needs.
In the present embodiment, described fixed form is bonded for welding or solidification, and solidification is bonded as used high heat conduction cement
Bonded.It can pay the utmost attention to be welded as needed, such as surface because material is difficult to solder to, electricity can be passed through on surface
The mode such as plating, compound, spraying is welded again after coating a metal level.By way of welding, its thermal contact resistance can be significantly
The reduction of degree, heat conduction efficiency is favorably improved, the another side production process is simple, is suitable for the extensive life of mass
Production, production efficiency is favorably improved, reduces production cost.
Chamber door 16 is fixed with before casing 15, catch 20 is provided with the upper end of chamber door 16, catch 20 is recessed
The structure of shape, in order to the switch of chamber door, two catch 20 preferably are set in chamber door upper end, are that door switch is more square
Just.Modulator 21 is additionally provided with chamber door 16, modulator 21 is as the parameter controllers such as refrigeration for refrigerator power, temperature, Yi Jibing
The display of box technology parameter information, typically made using liquid crystal panel, operated by button or touch-control.
Driving power 18 is installed inside the back side of casing 15, is provided with interface 17, interface 17 is mainly used in and other
The electrical connection of refrigerator, while as the power inlet of refrigerator, be connected with driving power 18, driving power 18 drives semiconductor
The work of cooling piece 10 is freezed, the first thermo-electric generation chip 7 and the second thermo-electric generation chip 2 connection driving power 18, the temperature difference
Electricity after generating is input in driving power 18, realizes energy back.
The upper peripheral of casing 15 is provided with positioning pit, lower peripheral is provided with positioning convex point, positioning pit and fixed
The position of position salient point is mutually corresponding, in order to be better able to determine position in the assembling of multiple refrigerators, while can preferably prevent
The skew of stagnant ice case horizontal level.
Be symmetrically arranged with handle 19 in the side of casing 15, handle 19 be shaped as similar indent it is square, semicircle, four points
One of the structure such as circle, it is convenient to put forth effort in refrigerator handling process.
Between inner bag 12 and casing 15, and insulation material 5 is filled with vacant gap inside radiator 1, be incubated
Material 5 mainly plays temperature isolation effect, prevents the temperature exchange inside and outside casing 15, it is generally preferable to using the foaming material of insulation
Material makes.In the present embodiment, it is the part around more preferable mark insulation material 15, therefore by the section of insulation material 5 in Fig. 3
Line is omitted, and is not to represent no insulation material 5. at this
Casing 15 is typically made using metal material, such as conventional aluminum alloy material, and because aluminum alloy material is lighter, height is led
Hot coefficient is higher, and in 230W/mK or so, and stabilized metal is preferable, and cost is relatively low, is easy into by techniques such as aluminium extrusions
Type, surface the technique such as can be aoxidized, be electroplated, being painted and carrying out outward appearance processing.
As shown in figure 5, the diagrammatic cross-section in terms of for another preferred embodiment A-A of the present utility model.The present embodiment with
The main distinction of above-described embodiment is that the cold end of semiconductor chilling plate 10 is fixed with conduction cooling bar 11, and the surface of conduction cooling bar 11 is fixed
There is cooling-storage structure 14, between cooling-storage structure 14 and inner bag 12, conduction cooling bar 11 freezes conduction cooling bar 11 to cooling-storage structure 14
Afterwards, the space inside inner bag 12 is freezed by cooling-storage structure 14.
In addition, there is no the structure using thermo-electric generation recovery in the present embodiment, but directly in semiconductor chilling plate 10
Hot junction fixed heat sink 1, the upper front for facing radiator 1 are fixed with fan 22, are set on the opposite casing 15 of fan 22
Air inlet 23 is equipped with, the top and bottom casing in the place inner chamber of fan 22 is respectively arranged with air-out 24.Fan 22 is at work, outside
Air is sucked from air inlet 23 and blows to the fin surface of radiator 1, and by cross-ventilated mode, heat is passed through into air-out
Mouth 24 is passed out to outside casing 15, completes the exchange of a heat convection.
Embodiment described above, simply the utility model more preferably embodiment, those skilled in the art
The usual variations and alternatives carried out in the range of technical scheme should be construed as being included in the scope of protection of the utility model.
Claims (8)
1. cold storage semiconductor freezer, include casing, inner bag, semiconductor chilling plate and conduction cooling bar, it is characterised in that institute
The cold end for stating semiconductor chilling plate is fixed with conduction cooling bar, and the surface of the conduction cooling bar is fixed with cooling-storage structure, the cooling-storage structure
Installed in the inside of inner bag.
2. cold storage semiconductor freezer according to claim 1, it is characterised in that described cooling-storage structure is by shell
Formed with cold storage body, cold storage body is located at enclosure, and the cold end of shell and semiconductor chilling plate is fixed.
3. cold storage semiconductor freezer according to claim 2, it is characterised in that described semiconductor chilling plate
Hot junction it is direct or indirect be fixed with thermo-electric generation chip.
4. the cold storage semiconductor freezer according to claims 1 to 3 any one, it is characterised in that described partly leads
Temperature-uniforming plate is fixed between body cooling piece hot junction and thermo-electric generation chip.
5. cold storage semiconductor freezer according to claim 4, it is characterised in that described thermo-electric generation sheet and
Staggeredly superposition is fixed between warm plate.
6. cold storage semiconductor freezer according to claim 5, it is characterised in that described temperature-uniforming plate is multi-disc, from
Semiconductor chilling plate starts to radiator, quantity to gradually decrease.
7. cold storage semiconductor freezer according to claim 4, it is characterised in that the thermo-electric generation chip and/or
Insulating barrier is provided with samming body, line layer is provided with insulating barrier.
8. cold storage semiconductor freezer according to claim 7, it is characterised in that the line layer includes solderable
Socket part position and electrical connection are distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720763327.3U CN207163051U (en) | 2017-06-28 | 2017-06-28 | Cold storage semiconductor freezer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720763327.3U CN207163051U (en) | 2017-06-28 | 2017-06-28 | Cold storage semiconductor freezer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207163051U true CN207163051U (en) | 2018-03-30 |
Family
ID=61711977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720763327.3U Expired - Fee Related CN207163051U (en) | 2017-06-28 | 2017-06-28 | Cold storage semiconductor freezer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207163051U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
-
2017
- 2017-06-28 CN CN201720763327.3U patent/CN207163051U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180330 |