CN201285192Y - Novel semiconductor refrigeration device - Google Patents
Novel semiconductor refrigeration device Download PDFInfo
- Publication number
- CN201285192Y CN201285192Y CNU200820200123XU CN200820200123U CN201285192Y CN 201285192 Y CN201285192 Y CN 201285192Y CN U200820200123X U CNU200820200123X U CN U200820200123XU CN 200820200123 U CN200820200123 U CN 200820200123U CN 201285192 Y CN201285192 Y CN 201285192Y
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- CN
- China
- Prior art keywords
- flow deflector
- potsherd
- conduction cooling
- novel semi
- radiating piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a novel semiconductor refrigerator which comprises a thermopile, a radiating piece and a cooling part. The semiconductor refrigerator is characterized in that the outer side of an upper flow guiding sheet on the thermopile is fitted with the radiating piece, and at least one layer of adamantine film is arranged on the conducting surface at the outer side of the upper flow guiding sheet; a ceramic chip is arranged on the outer side of a lower flow guiding sheet on the thermopile, and the cooling part is fitted on the ceramic chip. The utility model aims to provide the novel semiconductor refrigerator with low cost, high radiating efficiency and good refrigerating effect.
Description
[technical field]
The utility model relates to a kind of novel semi-conductor refrigerator.
[background technology]
The thermoelectric semiconductor device is that the paltie effect that produces when utilizing DC current by the semi-conducting material PN junction produces refrigeration or heats the device of effect according to the sense of current.
The elementary cell of industrial typical thermoelectric semiconductor device is a pair of thermocouple at present, and behind the connection dc source DC, flow deflector and following flow deflector place will produce temperature difference and transfer of heat on thermocouple.Because the heat exchange amount of a pair of semiconductor thermocouple is very little, usually all with some semiconductor thermocouple is together in series on circuit, the thermoelectric pile that forms heat conduction parallel-connection structure between ceramic radiating insulating substrate of making and the conduction cooling insulated substrate is all arranged and be fixed on to all thermocouples.Because radiating insulating substrate and conduction cooling insulated substrate all adopt potsherd, and potsherd production cost height, fragmentation and its thermal conduction resistance are bigger easily, and radiating efficiency is low, and refrigerating efficiency is undesirable.
[utility model content]
The utility model has overcome above-mentioned technical deficiency, provides a kind of cost low and radiating efficiency is high, the novel semi-conductor refrigerator of good refrigeration effect.
For achieving the above object, the utility model has adopted following technical proposal:
The novel semi-conductor refrigerator includes thermoelectric pile, radiating piece and conduction cooling spare, it is characterized in that fitting with described radiating piece in the last flow deflector outside on the described thermoelectric pile, and last flow deflector outside conducting surface is provided with one deck diamond-film-like at least; Following flow deflector outside conducting surface on the thermoelectric pile is provided with potsherd, and described conduction cooling spare is fitted on the above-mentioned potsherd;
Described potsherd is a strip sheet, and described conduction cooling spare and following flow deflector are positioned at the potsherd two opposite sides;
Described upward flow deflector is a copper sheet;
Described DLC membrane electroplating flow deflector lateral surface on described;
The described relatively side that goes up flow deflector of described radiating piece is provided with regularly arranged a plurality of fin; Described relatively potsherd one side of described conduction cooling spare is provided with a plurality of conductive sheet that are used to increase with the air contact-making surface.
The beneficial effects of the utility model are:
1, substitute existing potsherd at the last flow deflector conducting surface coating diamond-like film that powers on, saved material, reduced production cost, conduct by diamond-film-like, improved hot and cold conducting effect, further improve radiating efficiency, refrigeration improves;
2, a plurality of fin on the radiating piece are used to increase a plurality of conductive sheet with the air contact-making surface on the conduction cooling spare, improve heat radiation, refrigeration greatly;
3, DLC English is Diamond-like Carbon, be called for short DLC,, therefore have and the unusual similar performance of diamond because it has the structure closely similar with diamond, be up to as hardness that Hv10000 is wear-resisting, thermal conductivity is the highest, so it can be used as the highest fin of radiating efficiency; DLC can large tracts of land synthesize simultaneously, and processing cost is very low, is convenient to promote to use.
[description of drawings]
Be described in further detail below in conjunction with accompanying drawing and embodiment of the present utility model:
Fig. 1 is the utility model structural representation.
[specific embodiment]
As shown in the figure, the novel semi-conductor refrigerator includes thermoelectric pile 1, radiating piece 2 and conduction cooling spare 3.Wherein, the elementary cell of thermoelectric pile 1 is a P type thermoelectric semiconductor elements 15 and N type thermoelectric semiconductor elements 16 is used flow deflector 11 and following flow deflector 12 is coupled to a pair of thermocouple, after thermoelectric pile 1 is connected dc source, will produce temperature difference and transfer of heat at last flow deflector 11 and following flow deflector 12 places.In the utility model,, be called cold junction in flow deflector 12 places temperature decline and heat absorption down; Rise and heat release in last flow deflector 11 place's temperature, be called the hot junction.Because the copper sheet conductive performance is better, last flow deflector 11 and following flow deflector 12 are the copper sheet manufacturing.
In the utility model, last flow deflector 11 outsides on the thermoelectric pile 1 and radiating piece 2 are fitted, and last flow deflector 11 outside conducting surfaces are provided with one or more layers diamond-film-like 4, and diamond-film-like 4 is electroplated on last flow deflector 11 lateral surfaces; Following flow deflector 12 outside conducting surfaces on the thermoelectric pile 1 are provided with potsherd 6, and conduction cooling spare 3 is fitted on the above-mentioned potsherd 6.Potsherd 6 is a strip sheet, and conduction cooling spare 3 and following flow deflector 12 are positioned at the inside and outside two opposite sides of potsherd 6.The side that radiating piece 2 is gone up flow deflector 11 relatively is provided with regularly arranged a plurality of fin 210; Conduction cooling spare 3 relative potsherd 6 one sides are provided with a plurality of conductive sheet 310 that are used to increase with the air contact-making surface.
Claims (5)
1, novel semi-conductor refrigerator, include thermoelectric pile (1), radiating piece (2) and conduction cooling spare (3), it is characterized in that last flow deflector (11) outside and described radiating piece (2) applying on the described thermoelectric pile (1), last flow deflector (11) outside conducting surface is provided with one deck diamond-film-like (4) at least; Following flow deflector (12) outside conducting surface on the thermoelectric pile (1) is provided with potsherd (6), and described conduction cooling spare (3) is fitted on the above-mentioned potsherd (6).
2, novel semi-conductor refrigerator according to claim 1 is characterized in that described potsherd (6) is a strip sheet, and described conduction cooling spare (3) and following flow deflector (12) are positioned at potsherd (6) two opposite sides.
3, novel semi-conductor refrigerator according to claim 1 is characterized in that described upward flow deflector (11) is a copper sheet.
4,, it is characterized in that described diamond-film-like (4) electroplates flow deflector (11) lateral surface on described according to claim 1 or 3 described novel semi-conductor refrigerators.
5, novel semi-conductor refrigerator according to claim 1 is characterized in that the described relatively side that goes up flow deflector (11) of described radiating piece (2) is provided with regularly arranged a plurality of fin (210); Described relatively potsherd (6) one sides of described conduction cooling spare (3) are provided with a plurality of conductive sheet (310) that are used to increase with the air contact-making surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820200123XU CN201285192Y (en) | 2008-09-02 | 2008-09-02 | Novel semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820200123XU CN201285192Y (en) | 2008-09-02 | 2008-09-02 | Novel semiconductor refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201285192Y true CN201285192Y (en) | 2009-08-05 |
Family
ID=40950178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820200123XU Expired - Fee Related CN201285192Y (en) | 2008-09-02 | 2008-09-02 | Novel semiconductor refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201285192Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
-
2008
- 2008-09-02 CN CNU200820200123XU patent/CN201285192Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20110902 |