CN104911568B - A kind of method of selective chemical plating - Google Patents
A kind of method of selective chemical plating Download PDFInfo
- Publication number
- CN104911568B CN104911568B CN201510390594.6A CN201510390594A CN104911568B CN 104911568 B CN104911568 B CN 104911568B CN 201510390594 A CN201510390594 A CN 201510390594A CN 104911568 B CN104911568 B CN 104911568B
- Authority
- CN
- China
- Prior art keywords
- plating
- chemical plating
- selective chemical
- minutes
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a kind of method of selective chemical plating, belong to electroless plating technology field, its preparation method is：(a) matrix material pre-treatment；(b) matrix surface selectively printing transition zone, drying；(c) it is sensitized and activates the matrix for being printed on transition zone；(d) chemically plating obtains plating piece.The method technological process of selective chemical plating provided by the invention is simple, and cost is cheap, while has good selectivity, ensures chemical plating pattern accuracy.
Description
Technical field
The invention belongs to chemical plating field, more particularly to a kind of method of selective chemical plating.
Background technology
Electroless plating method is the self-catalysis that need not provide an electric current process, and it is by redox by metal deposit
In matrix surface, its coating prepared has good electric conductivity and heat conductivility, and its cost is relatively low, it is not necessary to complicated
Special equipment, moreover it is possible to suitable for the material of complicated shape.
Now with electronic technology and network technical development, required in some fields such as selectively masking, microelectronic component
High-precision selective chemical coating technology.Therefore a kind of selectivity simple and environmentally friendly suitable for various base materials, technique is developed
Electroplating method is learned widely to be paid close attention to.For example, patent 200810141987.3 discloses a kind of plastics composite and its surface choosing
Selecting property metallization process.The method uses laser ablation frosting, is then placed in and is soaked containing metal ion salt solution, finally
Carry out metallochemistry plating.Patent 200810142571.3 discloses a kind of selective chemical plating method for plastic basis material, this
The first coated with nano metal paste on base material of method, then laser ablation, finally carries out chemical coating.Both hair methods use
Laser ablation prepares pattern, and not only cost is high, and operation difficulty is big, and requires also higher to base material, all with patent of the present invention
There is obvious technical difference.For another example patent 201080027204.4 discloses selective deposition side of the metal on plastic base
Method, but this patent has obvious technical difference with patent of the present invention.The method, which includes, is somebody's turn to do plastic products sulfonation, activation
The plastic products of sulfonation so as to receive plating thereon.The method is only applicable to plastic basis material, additionally involves sulfonating reaction, not ring
Protect.For another example patent 201410125969.1 discloses a kind of silver-plated method of selectivity in high filling stone paper.The method bag
High filling stone paper surface printing pattern and chemical silvering are contained in, is only applicable to stone paper base material and chemical silvering, and the present invention
Difference with essence.
The content of the invention
It is an object of the invention to overcome the shortcomings of existing selective chemical plating method, there is provided one kind is applied to various bases
The simple and environmentally friendly selective chemical plating method of material, technique.
In order to solve the above technical problems, the technical scheme used is：
A kind of method of selective chemical plating, the transition zone of certain pattern is printed in substrate material surface, wherein being printed on
The part energy adsorption catalyst of layer is crossed, chemical plating can be carried out, methods described comprises the steps of：
(1) matrix material pre-treatment：Matrix material soaks in mass fraction is 1%NaOH solution under the conditions of 50-60 DEG C
1-5 minutes are steeped with oil removing, then after with deionized water, base material is cleaned up, are finally dried in an oven under the conditions of 50-80 DEG C
1-10 minutes are standby；
(2) transition zone of certain pattern is printed in matrix surface, thickness is 1~500 micron, is dried under conditions of 80 DEG C
10 minutes；
(3) matrix obtained by step (2) is immersed in the sensitizing solution that pH is 1~3 and be sensitized, it is sensitized 1 at 30-80 DEG C~
90 minutes；
(4) matrix obtained by step (3) is immersed in the activating solution that pH is 1-4 and activated, activate 1 at 30-80 DEG C~
60 minutes；
(5) matrix obtained by step (4) is cleaned in ionized water, 60 DEG C of dryings 10 minutes after chemical plating, obtains plating piece.
Wherein, matrix material be ceramics, polyethylene, polypropylene, polyethylene terephthalate, polyvinyl alcohol, plastics,
At least one of polystyrene, polymethyl methacrylate, makrolon and PEN etc.；Transition zone is
Polymer latex containing active group such as carboxyl, amino, isocyanates and methylol, contains acrylic acid, methacrylic acid, horse
Carry out the acrylate copolymer of sour, methyl methacrylate, methyl acrylate, butyl acrylate, acrylonitrile and/or styrene
At least one in emulsion, carboxy-modified styrene-butadiene latex, polycarbonate resin, epoxy resin, phenolic resin, aqueous polyurethane etc.
Kind；The stannous chloride that sensitizing solution is；Activating solution includes metallic colloid catalyst, and wherein described metallic colloid catalyst is
At least one of palladium, platinum, silver and gold etc..
Above-mentioned transition zone printing method is spraying, roller coating, printing, silk-screen printing, blade coating, immersion plating, intaglio printing and rotation
At least one of apply etc..
Chemical plating includes at least one of electroless copper, chemical nickel plating and chemical silvering etc. in above-mentioned step (5).
In the present invention, only the transition zone of selective printing can be by being sensitized and activating, adsorbing metal colloid catalyst,
Could carry out chemical coating in chemical plating fluid, can thus chemical plating precision it is very high.
Beneficial effects of the present invention are：1st, the preparation method that the present invention uses can reduce the cost of selective chemical plating；
2nd, the preparation method that the present invention uses can realize continuous production；3rd, the preparation method that the present invention uses can be to various substrates
Carry out selective chemical plating；4th, preparation technology is simple, easily controllable, and energy consumption is low, environmental protection.
Brief description of the drawings
Fig. 1 is the three-decker schematic diagram of the present invention.
Fig. 2 is selective chemical copper facing schematic diagram in polyethylene film surface of the present invention
In accompanying drawing：1st, matrix material；2nd, transition zone；3rd, chemical plating coat.
Embodiment
The present invention is specifically described below by embodiment.It is necessarily pointed out that following examples are served only for
The present invention is further described, it is impossible to be interpreted as limiting the scope of the invention, the person skilled in the art in the field
Some nonessential modifications and adaptations are made to the present invention according to the invention described above content, be accordingly to be regarded as protection scope of the present invention it
It is interior.
Embodiment 1
PEN base material is soaked 2 points in mass fraction is 1%NaOH solution under the conditions of 55 DEG C
Clock cleans up the PEN after oil removing with oil removing, then with deionized water, in an oven in 60 DEG C of conditions
Lower drying 2 minutes.The butyl acrylate film of certain pattern is printed in matrix surface using printing technology, thickness is 30 microns,
Dried 10 minutes under the conditions of 80 DEG C；It is quick to be carried out in 2 stannous chloride solution that the matrix for being printed on butyl acrylate film is immersed into pH
Change, be sensitized 6 minutes at 30 DEG C；Next matrix after sensitization is immersed in the silver chloride solution that pH is 2.5 and activated, at 50 DEG C
Activation 4 minutes；Take out standby with deionized water cleaning, drying.
Chemical nickel-plating plating solution is prepared, bath composition is：NiSO4·7H2O (50 g/l), NaH2PO2·H2O (25 g/l),
(NH4)2·SO4(11 g/l), C6H8O7(7 g/l).Base material after activation is immersed to plating 5 in 55 DEG C of chemical nickel-plating plating solution
Minute.After chemical nickel plating, cleaned, in an oven 60 DEG C of dryings 10 minutes, produced chemical on polycarbonate substrate with deionized water
Nickel plating part, wherein being only printed on the part chemistry plated with nickel of acrylic film.
Embodiment 2：
Polyethylene terephthalate base material under the conditions of 50 DEG C is soaked 5 in mass fraction is 1%NaOH solution
Minute cleans up the polyethylene terephthalate after oil removing with oil removing, then with deionized water, in an oven in 50 DEG C
Under the conditions of dry 10 minutes.The methyl methacrylate coating of certain pattern is printed in matrix surface using plain net typography,
Thickness is 1 micron, is dried 10 minutes under the conditions of 80 DEG C；The matrix for being printed on methyl methacrylate film is immersed into the chlorine that pH is 3
Change and be sensitized in stannous solution, is sensitized 1 minute at 30 DEG C；Next matrix after sensitization is immersed into the palladium chloride solution that pH is 4
In activated, activated 1 minute at 80 DEG C；Take out standby with deionized water cleaning, drying.
Chemical silvering plating solution is prepared, bath composition is：AgNO3(29 g/l), NH3·H2O (4 g/l) and HCHO (55
G/l).Base material after activation is immersed to plating 10 minutes in 45 DEG C of chemical silvering plating solution.After chemical silvering, deionized water is used
Cleaning, 60 DEG C of dryings 10 minutes, produce the silver-plated sample of selective chemical on polyethylene terephthalate base material in an oven,
Wherein only it is printed in the part chemical plating of methyl methacrylate coating silver-colored.
Embodiment 3：
Polyethylene film base material is soaked under the conditions of 60 DEG C in mass fraction is 1%NaOH solution to 1 minute with oil removing,
The polyethylene film after oil removing is cleaned up with deionized water again, dried 1 minute under the conditions of 80 DEG C in an oven.Using scraping
The acrylic acid coatings that technique prints certain pattern in matrix surface are applied, thickness is 500 microns, and 10 points are dried under the conditions of 80 DEG C
Clock；The matrix for being printed on acrylic film is immersed in the stannous chloride solution that pH is 1 and is sensitized, is sensitized 90 minutes at 80 DEG C；Connect
Get off to immerse matrix after sensitization in the palladium chloride solution that pH is 1 and activated, activated 60 minutes at 80 DEG C；Taking-up deionization
Water cleaning, drying is standby.
Electroless copper plating solution is prepared, bath composition is：NiSO4·7H2O (1 g/l), CuSO4·5H2O (24 g/l),
NaH2PO2·H2O (55 g/l), Na3C6H5O7·2H2O (1.5 g/l), H3BO3(70 g/l).Base material after activation is soaked
Enter plating 5 minutes in 40 DEG C of electroless copper plating solution.After electroless copper, cleaned with deionized water, in an oven 60 DEG C of dryings 10
Minute, electroless copper sample on polyethylene film base material is produced, wherein being only printed on the polyethylene film surface of acrylic acid coatings
Region forms Copper thin film (as shown in Figure 2).
Claims (6)
- A kind of 1. method of selective chemical plating, it is characterised in that：Methods described comprises the steps of：(1) by matrix material mass fraction be 1%NaOH solution under the conditions of 50-60 DEG C soak 1-5 minutes with oil removing, then After with deionized water, base material is cleaned up, finally dry 1-10 minutes are standby under the conditions of 50-80 DEG C in an oven；(2) matrix surface after cleaning prints the transition zone of certain pattern, and thickness is 1~500 micron, is placed in 80 DEG C afterwards Under the conditions of dry 10 minutes；(3) matrix obtained by step (2) is immersed in the sensitizing solution that pH is 1~3 and be sensitized, sensitizing temperature is 30-80 DEG C, sensitization Time is 1~90 minute；(4) matrix obtained by step (3) is immersed in the activating solution that pH is 1-4 and activated, activation temperature is 30-80 DEG C, activation Time is 1~60 minute；(5) matrix obtained by step (4) is cleaned in deionized water, 60 DEG C of dryings 10 minutes after chemical plating, obtains plating piece.
- A kind of 2. method of selective chemical plating according to claim 1, it is characterised in that：Base in the step (1) Body material is ceramics, polyethylene terephthalate, polyvinyl alcohol, nylon, polystyrene, polyethylene, polypropylene, poly- methyl At least one of methyl acrylate, makrolon and PEN.
- A kind of 3. method of selective chemical plating according to claim 1, it is characterised in that：Mistake in the step (2) It is the polymer latex containing active group such as carboxyl, amino, isocyanates and methylol to cross layer, contains acrylic acid, methyl-prop The polyacrylic acid of olefin(e) acid, maleic acid, methyl methacrylate, methyl acrylate, butyl acrylate, acrylonitrile and/or styrene Ester copolymer emulsion, carboxy-modified styrene-butadiene latex, polycarbonate resin, in epoxy resin, phenolic resin, aqueous polyurethane extremely Few one kind.
- A kind of 4. method of selective chemical plating according to claim 1, it is characterised in that：Mistake in the step (2) Layer printing method is crossed as at least one of spraying, roller coating, printing, silk-screen printing, blade coating, immersion plating, intaglio printing and spin coating.
- A kind of 5. method of selective chemical plating according to claim 1, it is characterised in that：It is sensitized in the step (3) Liquid is stannous chloride solution, and activating solution includes metallic colloid catalyst, and wherein described metallic colloid catalyst be palladium, platinum, At least one of silver and gold.
- A kind of 6. method of selective chemical plating according to claim 1, it is characterised in that：It is chemical in the step (5) Plating includes at least one of electroless copper, chemical nickel plating and chemical silvering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510390594.6A CN104911568B (en) | 2015-07-06 | 2015-07-06 | A kind of method of selective chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510390594.6A CN104911568B (en) | 2015-07-06 | 2015-07-06 | A kind of method of selective chemical plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104911568A CN104911568A (en) | 2015-09-16 |
| CN104911568B true CN104911568B (en) | 2018-02-09 |
Family
ID=54081000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510390594.6A Active CN104911568B (en) | 2015-07-06 | 2015-07-06 | A kind of method of selective chemical plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104911568B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105296973B (en) * | 2015-12-01 | 2018-03-09 | 中北大学 | A kind of ultra-high molecular weight polyethylene powder chemical nickel-plating method for surface |
| CN106637147A (en) * | 2016-11-16 | 2017-05-10 | 合肥乐凯科技产业有限公司 | Supporter surface selective electroless plating method |
| CN106435537A (en) * | 2016-12-06 | 2017-02-22 | 合肥乐凯科技产业有限公司 | Selective chemical plating method for polymer substrate surfaces |
| CN106947960A (en) * | 2017-04-12 | 2017-07-14 | 合肥学院 | A kind of 3D printing preparation method of polymer/metal composite powder material |
| CN108456875B (en) * | 2018-03-16 | 2019-10-18 | 华南理工大学 | A kind of low roughness silverskin and the preparation method and application thereof |
| CN111235554A (en) * | 2020-03-10 | 2020-06-05 | 中国科学院金属研究所 | In-situ activated titanium alloy surface chemical coating preparation method |
| CN111408713A (en) * | 2020-03-17 | 2020-07-14 | 苏州逸峰新材料科技有限公司 | Preparation method of nickel-coated graphite composite powder material with high coating rate |
| CN115532258B (en) * | 2022-02-09 | 2023-07-21 | 青岛大学 | Preparation method and application of charcoal-based bionic catalytic material |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101705615B (en) * | 2009-11-03 | 2011-11-23 | 上海大学 | Preparation method of nickel-plated and copper-plated aromatic polyamide conductive fibers |
| CN101705614B (en) * | 2009-11-03 | 2011-09-07 | 上海大学 | Preparation method of nickel-plated and silver-plated aromatic polyamide conductive fibers |
| CN102337526B (en) * | 2011-09-15 | 2013-05-29 | 济南大学 | Preparation method of nickel electrode made of piezoelectric composite material |
| CN103572263B (en) * | 2012-07-28 | 2016-05-11 | 比亚迪股份有限公司 | The method of metallization of plastic surface and surface have the plastic product of metal pattern |
-
2015
- 2015-07-06 CN CN201510390594.6A patent/CN104911568B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104911568A (en) | 2015-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104911568B (en) | A kind of method of selective chemical plating | |
| US3925578A (en) | Sensitized substrates for chemical metallization | |
| US7834274B2 (en) | Multi-layer printed circuit board and method for fabricating the same | |
| CN107250442B (en) | Method for forming metal pattern on substrate and consumable set used in same | |
| US20060134318A1 (en) | Method of forming a conductive metal region on a substrate | |
| CN103219243A (en) | Manufacturing method of patterning metal lines | |
| CN106435537A (en) | Selective chemical plating method for polymer substrate surfaces | |
| CN102803562A (en) | Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles | |
| CN108754461A (en) | A kind of method of surface of polymer substrates selective chemical plating | |
| WO2008091328A1 (en) | Second surface metallization | |
| CA2449358A1 (en) | Patterning method | |
| TWI291382B (en) | Method of forming a metal thin film with micro holes by ink-jet printing | |
| CN104562116A (en) | Method for pretreating PET(polyethylene terephthalate) base material before electroplating | |
| CN106637147A (en) | Supporter surface selective electroless plating method | |
| CN101513632A (en) | Method for coating Teflon on metal sheet | |
| CN101570854A (en) | Manufacture method of patterning metal oxide layer | |
| CN105979711B (en) | A kind of method for preparing plastics base and covering copper flexible PCB | |
| CN103741148B (en) | A kind of honeycomb fiber glass epoxy antenna metal metallization processes | |
| EP1689909A2 (en) | Formation of solid layers on substrates | |
| WO2002099163A2 (en) | Autocatalytic coating method | |
| JP2013216567A (en) | Glass bubble, master batch including the same, and resin particle having metal film formed on surface | |
| JP6908612B2 (en) | Material deposition in a magnetic field | |
| CN108950526A (en) | A method of the high-resolution metallized polymeric substrate based on chemical plating | |
| JP5199606B2 (en) | Method for producing molded article subjected to electroless plating | |
| CN114481041A (en) | Method for manufacturing vacuum evaporation non-metal electroforming mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |