CN112672543A

CN112672543A - Method for separating electroplated copper layer

Info

Publication number: CN112672543A
Application number: CN202011449382.8A
Authority: CN
Inventors: 温淦尹; 黄明安; 曾伟
Original assignee: SIHUI FUJI ELECTRONICS TECHNOLOGY CO LTD
Current assignee: SIHUI FUJI ELECTRONICS TECHNOLOGY CO LTD
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2021-04-16
Anticipated expiration: 2040-12-09
Also published as: CN112672543B

Abstract

The invention discloses a method for separating an electroplated copper layer, which comprises the following steps: drilling a hole in the production board and forming a conductive layer on the hole wall; pasting a film on a production board, sequentially exposing and developing to open a window at the position corresponding to the hole and form a plurality of dot patterns distributed in an array on the board, forming a hole ring pattern on the periphery of the open window and forming an isolation strip pattern at the position 5-50mm away from the board edge, and enabling a conductive layer at the pattern position to be covered by the film; electroplating the production plate, increasing the thickness of a copper plating layer of the hole copper, and plating a conductive layer outside the dot pattern, the hole ring pattern and the isolation strip pattern to form a net-shaped copper foil; after the film is removed, the netted copper foils on the inner side and the outer side of the isolated pattern are stripped through the gaps between the conductive layers and the netted copper foils. According to the method, the isolation belt graph is arranged at the position 5-50mm away from the plate edge, so that the mesh copper foil is conveniently stripped through the isolation belt, the edge grinding process is reduced, the production efficiency is improved, and the workload of personnel is reduced.

Description

Method for separating electroplated copper layer

Technical Field

The invention relates to the technical field of printed circuit board manufacturing, in particular to a method capable of separating an electroplated copper layer.

Background

Modern PCBs require small size, high wiring density, and thinner circuit design; whereas, the wiring density is contradictory to the surface copper thickness, the higher the wiring density, the thinner the surface copper thickness needs to be, and vice versa, and according to empirical values and etching factor constraints, the surface copper thickness is generally less than half of the minimum line pitch, e.g., 50 μm for a minimum line pitch, and less than 25 μm for a surface copper thickness.

In order to ensure the reliability of the through hole, the thickness of the copper in the through hole of the circuit board is generally required to be 25 μm, the through hole has better uniformity only when the whole board is electroplated during electroplating, the surface can be electroplated by more than 25 μm when the through hole is electroplated by 25 μm, and the surface copper thickness can be larger than 43 μm after the bottom copper is 18 μm, and the surface line spacing can only reach the limit of 86 μm.

In the industry of printed circuit boards, when the thickness of copper in holes is higher than 25 micrometers and the line-to-line distance of manufactured line width is less than 50 micrometers, copper reduction treatment needs to be carried out on the printed circuit boards, and the purpose is to reduce the surface copper below 25 micrometers after electroplating, and the main technical scheme is to reduce the copper on the board surface by adopting a grinding board after electroplating; however, in order to ensure the reliability of the circuit board, a dry film hole plating process and a strippable mesh copper foil technology are also provided in the industry to achieve the purpose of copper reduction, and the dry film hole plating process only plates through holes during electroplating, thereby achieving the purpose of reducing surface copper. The specific implementation process is that before electroplating, a layer of corrosion-resistant dry film is pasted on a substrate, a pattern is transferred in an exposure mode, the dry film at the position of a plated through hole is removed in a developing mode, electroplating is carried out, and the corrosion-resistant dry film on the substrate is removed after electroplating; the strippable netted copper foil technology is that on the basis of dry film hole plating technology, a corrosion resistant dry film is made into a square, an isolating ring is made at the edge of a hole, a layer of netted copper foil is formed after electroplating, and the plated netted copper foil can be stripped by using a tool, so that the purpose of reducing surface copper is achieved.

The above-mentioned methods using dry film hole plating process and peelable mesh copper foil technology have the following disadvantages:

1. the dry film hole plating process has the advantages that the current distribution is not uniform during electroplating, local current is easily overlarge, electroplated copper in the hole is crystallized roughly, and the problems of hole blockage and small hole at the orifice of the plated through hole are easily caused;

2. because the electroplating of the copper plating layer can electroplate the plate edges of the production plate together and coat the bottom copper on the inner side, the bottom copper on the inner side of the copper plating layer on the plate edges is not exposed, the strippable mesh copper foil technology can strip the electroplated copper only by exposing the bottom copper and exposing a gap between the bottom copper and the copper plating layer after the edge of the production plate is edged after the electroplating, and the whole process is complex and inconvenient; in addition, edging of the board edge usually requires manual work, resulting in a large amount of labor and inefficiency.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a method for separating the electroplated copper layer, and the isolation belt graph is arranged at the position 5-50mm away from the edge of the plate, so that the reticular copper foil is conveniently stripped through the isolation belt, the edge grinding process is reduced, the production efficiency is improved, and the workload of personnel is reduced.

In order to solve the above technical problems, the present invention provides a method for separating a copper electroplating layer, comprising the steps of:

s1, drilling holes on the production board and forming a conductive layer on the board surface and the hole wall;

s2, pasting a film on the production board, sequentially exposing and developing, windowing at the position corresponding to the hole, forming a plurality of dot patterns distributed in an array on the board, forming a hole ring pattern on the periphery of the window and forming an annular isolation strip pattern at the position 5-50mm away from the board edge, and enabling the dot patterns, the hole ring pattern and the conductive layer at the isolation strip pattern to be covered by the film;

s3, carrying out full-plate electroplating on the production board, thickening the thickness of a copper plating layer of the hole copper, and plating on a conductive layer outside the dot-shaped pattern, the hole ring pattern and the isolation strip pattern to form a net-shaped copper foil;

and S4, removing the film, exposing the conductive layer at the bottom of the isolation strip pattern, and then inserting a tool into the gap between the conductive layer and the reticular copper foil in the isolation strip pattern to strip off the reticular copper foil on the inner side and the outer side of the isolation strip pattern.

Further, in step S1, after the holes are drilled in the production board, a conductive layer is deposited on the board surface and the hole wall by a shadow process or a black hole process, and the microetching process is not performed in the shadow process or the black hole process.

Further, step S4 is followed by the following steps:

and S5, removing the conductive layer deposited by the shading process or the black hole process on the board surface through microetching.

Further, the following steps are included between steps S1 and S2:

and S11, carrying out ultrasonic cleaning and drying on the production board.

Further, in step S2, a dry film with a thickness of 15-65 μm is attached to the production board; in step S3, the thickness of the mesh copper foil is less than or equal to the thickness of the dry film.

Further, the following steps are included between steps S2 and S3:

and S21, drying the production board, wherein the temperature of the drying process is 130 ℃, and the time is 20 min.

Further, in step S2, the dot pattern is a disk pattern having a diameter of 50 to 300 μm.

Further, in step S2, the dot patterns are regular hexagonal patterns or regular octagonal patterns each having a length and width of 50 to 200 μm at maximum.

Further, in step S2, the distance between the adjacent dot patterns is 50-300 μm.

Further, in step S2, the width of the spacer tape pattern is 50 to 500 μm, and the spacer tape pattern is 25mm from the plate edge of the production plate.

Further, in step S2, the radius of the window is 50-200 μm larger than the radius of the hole, and a hole ring pattern with a ring width of 100 μm is formed on the periphery of the window to separate the hole copper plated on the whole board at the later stage from the mesh copper foil.

Furthermore, the production board is a multilayer board formed by laminating the core board and the outer copper foil into a whole through a prepreg, and the core board is provided with an inner circuit before lamination.

Compared with the prior art, the invention has the following beneficial effects:

according to the method, the isolation belt graph is arranged at the position 5-50mm away from the plate edge, the net-shaped copper foil is divided into the inner part and the outer part through the isolation belt after the net-shaped copper foil is formed through electroplating, and the step fall is formed at the isolation belt after the film is removed, so that the gap between the conductive layer and the net-shaped copper foil can be seen through the isolation belt, and the inner part and the outer part of the net-shaped copper foil are stripped off at the gap at the isolation belt by using a tool; in addition, after drilling, a conductive layer is formed on the board surface and in the hole through a shadow process or a black hole process, so that the graphite or carbon black is utilized to separate the bottom copper and the copper plating layer (namely, the net-shaped copper foil) on the board surface, on one hand, the bonding force of the copper plating layer can be reduced, so that the net-shaped copper foil is convenient to strip at the later stage, on the other hand, the black conductive layer personnel can better distinguish the gap between the copper plating layer (namely, the net-shaped copper foil) and the gap between the copper plating layer and the net; the conductive layer formed by graphite or carbon black on the board surface is etched and removed through microetching after the reticular copper foil is stripped, so that the etching operation during the later-stage circuit manufacturing is avoided being influenced, the binding force between a plating layer and the board surface bottom copper during the later-stage pattern electroplating or surface treatment is avoided being influenced, and the production quality of the circuit board is improved; compared with the square shape in the prior art, the dot-shaped pattern is designed into the disc shape, the regular hexagon or the regular octagon, so that the mesh copper foil is not easy to tear when being stripped, the problem that the mesh copper foil is not cleanly stripped is avoided, and the yield of the circuit board is improved.

Drawings

Fig. 1 is a schematic diagram of an embodiment in which an isolation band pattern and a dot pattern are formed on a board.

Detailed Description

In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.

Examples

The method for manufacturing a circuit board according to this embodiment can conveniently separate the electroplated copper layer, and sequentially includes the following processing steps:

(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 oz.

(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.

(3) And (3) laminating: and (3) brown-oxidizing at a brown-oxidizing speed according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements, wherein the thickness of the outer copper foil is 0.5oz, and then pressing the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form the production plate.

(4) Drilling: according to the existing drilling technology, drilling processing is carried out on the production plate according to design requirements.

(5) Shadow or black hole: depositing a conductive layer on the plate surface and the hole wall by a shadow process or a black hole process, testing in a backlight mode for 10 grades, wherein the thickness of the conductive layer in the hole is 0.5 mu m, and a microetching flow is not performed in the shadow process or the black hole process; wherein, the conductive layer formed by adopting the shadow process is graphite, and the conductive layer formed by adopting the black hole process is carbon black.

(6) Cleaning: the production board is cleaned and dried by ultrasonic wave, oxidation, oil stain and the like on the board surface are removed, and the binding force between the production board and the dry film at the later stage is improved.

(7) Plating a hole pattern: as shown in fig. 1, a dry film with a thickness of 15-65 μm is pasted on a production board, after exposure and development are sequentially carried out, windowing is carried out at the position corresponding to a hole, a plurality of dot patterns 1 distributed in an array are formed on the board, a hole ring pattern (not shown in the figure) is formed on the periphery of the windowing, an annular isolation strip pattern 2 is formed at the position 5-50mm (preferably 25mm) away from the board edge, and the conductive layers at the dot patterns, the hole ring patterns and the isolation strip patterns are covered by the dry film; and during exposure, exposure is carried out at one time by adopting a laser imaging mode, and compared with the traditional film exposure mode, the process of drawing an exposure negative film by a photoplotter is reduced.

The spot patterns are disc patterns with the diameter of 50-300 mu m, the distance between every two adjacent spot patterns is 50-300 mu m, and by arranging the disc patterns with proper size and interval, the uniform distribution of electroplating current can be ensured, the bonding area of a later-stage copper-plated layer (net copper foil) and the board surface can be maximally reduced, the bonding force between the later-stage copper-plated layer and the board surface is reduced, and the later-stage stripping is facilitated; the width of the isolation strip pattern is 50-500 mu m, the width can be well used for stripping the reticular copper foil, and the problem that the electroplating current is unevenly distributed due to the overlarge width or the use of a stripping tool which is inconvenient to use in the later period due to the overlarge width can be avoided.

The radius of the window is 50-200 mu m larger than the radius of the hole, so that certain hole ring copper is formed after electroplating, the hole ring copper is in a riveting structure, the bonding force between the hole copper and a production board is improved, and a hole ring pattern with the ring width of 100 mu m is formed by arranging plating resistance on the periphery of the window, so that the hole copper electroplated on the whole board at the later stage is separated from a board surface copper layer (namely, a net copper foil), and the phenomenon that burrs are left at the hole to influence the quality of the hole copper when the net copper foil is stripped is avoided.

(8) Baking: and drying the production board at 130 ℃ for 20min to remove water on the board and improve the bonding force between the dry film and the board surface.

(9) Electroplating the whole plate: and performing full-plate electroplating for 120min at a current density of 18ASF, thickening the thickness of the hole copper to be more than 25 μm, and plating a conductive layer outside the dot pattern, the hole ring pattern and the isolation strip pattern to form a mesh copper foil, wherein the thickness of the mesh copper foil is less than or equal to that of the dry film.

(10) Copper stripping: after the film is removed, the conductive layer at the bottom of the isolation strip pattern is exposed, and then a tool (such as a fin) is inserted into a gap between the conductive layer and the reticular copper foil in the isolation strip so as to strip off the reticular copper foil on the inner side and the outer side of the isolation strip pattern.

(11) Micro-etching: and removing the conductive layer deposited on the board surface by a shadow process or a black hole process through microetching, so that the thickness of the copper layer on the board surface is the thickness of the outer copper foil during pressing.

(12) Manufacturing an outer layer circuit (negative film process): transferring an outer layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing outer layer line exposure by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the outer layer, namely etching the exposed and developed production board to form an outer layer circuit, wherein the width of the outer layer circuit is measured to be 3 mil; outer layer AOI, then checking the defects of open short circuit, line gap, line pinhole, etc. of outer layer line, discarding the defect, and discharging the product without defect to the next process

(13) Solder resist and silk screen printing of characters: after solder resist ink is sprayed on the surface of the production board, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermosetting treatment in sequence; specifically, TOP surface solder resist ink is sprayed and printed, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the protective layer has the function of beautifying the appearance.

(14) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.

(15) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.

(16) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.

(17) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.

(18) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.

(19) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.

In other embodiments, the dot pattern may be a regular hexagonal pattern or a regular octagonal pattern with a length and width of 50-200 μm at most.

The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.

Claims

1. A method of separating a layer of electroplated copper, comprising the steps of:

and S4, removing the film to expose the conductive layer at the bottom of the isolated pattern, and peeling off the reticular copper foil at the inner side and the outer side of the isolated pattern through the gap between the conductive layer and the reticular copper foil.

2. The method of claim 1, wherein in step S1, after the hole is drilled in the board, a conductive layer is deposited on the surface and the walls of the hole by shadow process or black hole process, and the microetching process is not performed in the shadow process or black hole process.

3. The method of claim 2, further comprising the step of, after step S4:

4. The method of separable copper plating according to claim 1, further comprising, between steps S1 and S2, the steps of:

and S11, carrying out ultrasonic cleaning and drying on the production board.

5. The method of separating an electroplated copper layer as claimed in claim 1, characterized in that in step S2, a dry film of 15-65 μm thickness is pasted on the production board; in step S3, the thickness of the mesh copper foil is less than or equal to the thickness of the dry film.

6. The method of separable copper plating according to claim 1, further comprising, between steps S2 and S3, the steps of:

7. The method of claim 1, wherein in step S2, said dot patterns are disk patterns having a diameter of 50-300 μm, and a distance between adjacent dot patterns is 50-300 μm.

8. The method of claim 1, wherein in step S2, said dot patterns are regular hexagonal patterns or regular octagonal patterns each having a length and width dimension of 50 to 200 μm at maximum, and a distance between adjacent dot patterns is 50 to 300 μm.

9. The method of separable copper electroplating layer according to claim 1, wherein in step S2, the width of the release tape pattern is 50-500 μm and the release tape pattern is 25mm from the edge of the production sheet.

10. The method of claim 1, wherein in step S2, the radius of the window is 50-200 μm larger than the radius of the hole, and a hole ring pattern with a plating-resistant ring width of 100 μm is provided on the periphery of the window to separate the hole copper for the post full plate plating from the mesh copper foil.