CN105965176A - Ni-based rapidly-cooled brazing material and brazing process for brazing tungsten-copper alloy and stainless steel - Google Patents
Ni-based rapidly-cooled brazing material and brazing process for brazing tungsten-copper alloy and stainless steel Download PDFInfo
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- CN105965176A CN105965176A CN201610574070.7A CN201610574070A CN105965176A CN 105965176 A CN105965176 A CN 105965176A CN 201610574070 A CN201610574070 A CN 201610574070A CN 105965176 A CN105965176 A CN 105965176A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
Abstract
The invention discloses a Ni-based rapidly-cooled brazing material and brazing process for brazing a tungsten-copper alloy and stainless steel. The brazing process comprises the following steps that 1, the surfaces of the W-Cu alloy and stainless steel to be brazed are cleaned with metallographic abrasive paper, the two faces of the Ni-based rapidly-cooled brazing material used for brazing are subjected to abrading cleaning with W3.5# metallographic abrasive paper, the W-Cu alloy, the stainless steel and the Ni-based rapidly-cooled brazing material are put into acetone after abrading is conducted, cleaning is conducted with ultrasonic waves, and drying treatment is conducted; 2, the cleaned Ni-based rapidly-cooled brazing material is placed between the to-be-brazed surfaces of the W-Cu alloy and the stainless steel, the brazing gap is controlled to range from 15 micrometers to 25 micrometers, and all the materials are tightly assembled in a specialized brazing clamp; 3, the whole assembled clamp is put into a brazing furnace with the vacuum degree not lower than 6*10<-4> Pa, and then brazing is conducted according to a following process curve. The Ni-based rapidly-cooled brazing material is narrow in melting temperature range, short in brazing material melting time and beneficial for improving the brazing efficiency, and the Ni element can be subjected to a solid solution reaction with elements such as W, Cu, Fe and Cr.
Description
Technical field
The present invention relates to, for soldering tungsten-copper alloy and stainless Ni base chilling solder and soldering processes, belong to heterogeneous material
Material welding technology field.
Background technology
Along with tungsten-copper alloy is increasingly used on thermal structure part, tungsten-copper alloy is connected with rustless steel makes composite members
The most increasingly welcome by market.Tungsten-copper alloy is connected with stainless steel dissimilar material often because both linear expansion coefficients, molten
There is larger difference in point and thermal conductivity etc., and composite members is subject to circulation Thermal Load, joint during preparation and use
Place is easily generated stress and concentrates, and increases fracture tendency, reduces the mechanical property of weld metal.Additionally, tungsten-copper alloy is to gas
Impurity is sensitive, and weld interface is easily formed hole, and seam organization is brittle, affects air-tightness and the bearing capacity of joint.Therefore,
The welding design of intermediate alloy and the changes in microstructure caused by cycling hot load and polluted by gaseous impurity, welding stress
Subject matter that to be tungsten-copper composite material face with the welding dissimilar materials such as rustless steel that the Weld Performance that causes lost efficacy.
Soldering, because of its special process characteristic, has mother metal impact little, the advantages such as weldment stress is little with deformation.Soldering is made
For important solder technology, new material is connected there is advantage, be particularly well-suited to difficult fusion material and xenogenesis material
The connection of material.Vacuum Soldering Technology, because under vacuum conditions material being carried out soldering, is that suppression tungsten-copper alloy is by gaseous impurity
The preferable method polluted.The Chinese patent of Patent No. 201210158935.3 discloses a kind of employing Ti-Fe-Zr-Cu
Brazing filler metal soldering tungsten-copper alloy and stainless vacuum brazing technique.Compared to Ti-Fe-Zr-Cu brazing filler metal, the present invention carries
It is narrow that the Ni base chilling solder of confession has brazing filler metal melts temperature range, and the advantages such as the brazing filler metal melts time is short are conducive to improving pricker
Weldering efficiency.Additionally, use Ni base solder brazing tungsten copper and rustless steel, soldered fitting has good antioxidation and anti-corruption
Erosion performance, is more beneficial for expanding the range of application of tungsten-copper alloy.The Chinese patent of Patent No. 201510126420.9 is open
A kind of employing Zr base solder brazing tungsten-copper alloy and stainless vacuum brazing technique, wettability and joint filling are poor,
Soldered fitting is of low quality.The Chinese patent of Patent No. 201510687945.X discloses a kind of tungsten-copper alloy with stainless
The preparation method of steel integral material, prepares loaded down with trivial details, complex process.
Summary of the invention
Goal of the invention: in order to overcome the deficiencies in the prior art, the present invention provide a kind of for soldering tungsten-copper alloy with
Stainless Ni base chilling solder and soldering processes, the method uses Ni base chilling solder to enter tungsten-copper alloy with rustless steel
Row vacuum brazing technique, it is provided that Ni base chilling solder there is fusion temperature narrow range, fusing time is short, antioxidation and
The advantages such as corrosion resistance is good, can obtain the high-strength joint of dense structure；The vacuum brazing technique provided is without adding pricker
Agent and other protective measures, implement convenient and swift, the preparation of solder and the repeatable reproduction of soldering processes, it is simple to promote with
Application.
Technical scheme: for solving above-mentioned technical problem, the one of the present invention is for soldering tungsten-copper alloy and stainless Ni
Base chilling solder, Ni base chilling solder mass percent consists of: Mn 20.0～25.0%, Si 3.0～5.0%, Cu
3.5～5.5%, Zr 0.6～0.9%, surplus is Ni.
As preferably, Ni base chilling solder mass percent consists of: Mn 23.0%, Si 4.0%, Cu 5.0%, Zr 0.8%,
Surplus is Ni.
As preferably, Ni base chilling solder is foil-like, and thickness is 50～80 μm.
A kind of tungsten-copper alloy and stainless soldering processes, comprise the following steps:
(1) utilize W28～W3.5 abrasive paper for metallograph that W-Cu alloy to be brazed and stainless steel surfaces are cleared up,
Emphasis clears up the impurity on to be brazed, greasy dirt and oxide-film；Utilize W3.5 abrasive paper for metallograph to being used for soldering
Ni base chilling solder two-sided be ground cleaning, by W-Cu alloy, rustless steel and Ni base chilling solder one after grinding
Rise and be placed in acetone, after using ultrasonic waves for cleaning 15～20min, carry out drying and processing；
(2) the Ni base chilling solder after cleaning is placed between W-Cu alloy and rustless steel welding surface, controls soldering
Gap 15～25 μm, and be close to be assemblied in special brazing jig, it is ensured that the precision of connection, fixture is placed specified matter
The pressure head of amount；
(3) fixture assembled is integrally placed at vacuum and is not less than 6 × 10-4In the soldering oven of Pa, then by following work
Skill curve carries out soldering:
A) it is heated to 300～350 DEG C with 8～12 DEG C/min, at such a temperature insulation 15～20min；
B) continue to be heated to 750～850 DEG C with 5～10 DEG C/min, at such a temperature insulation 15～20min；
C) continue to be heated to brazing temperature 1020～1035 DEG C with 7～13 DEG C/min, under brazing temperature, be incubated 15～20min；
D) with 5～8 DEG C/min's；Rate of cooling is cooled to 400～600 DEG C；
E) program end of run, closes heating, and weldment carries out furnace cooling, treats that vacuum chamber temperature is cooled to less than 100 DEG C and takes
Go out weldment.
As preferably, Ni base chilling solder thickness used in described step (1) is 50～80 μm,
As preferably, in described step (1), Ni base chilling solder mass percent consists of: Mn 20.0～25.0%,
Si 3.0～5.0%, Cu 3.5～5.5%, Zr 0.6～0.9%, surplus is Ni.
As preferably, in described step (1), Ni base chilling solder mass percent consists of: Mn 23.0%, Si 4.0%,
Cu 5.0%, Zr 0.8%, surplus is Ni.
As preferably, the pressure head placing nominal-mass in described step (2) on fixture produces 0.01～0.04MPa
Constant perpendicular pressure.
As preferably, described step (2) is placed between solder and rustless steel mother metal the rustless steel that thickness is 15～25 μm
Sheet.
Ni base chilling solder prepared by the present invention, makes solder have good soldering by rationally adding multiple alloying element
Processing performance, meets W-Cu alloy and rustless steel soldered fitting performance requirement in complex environment.Wherein add appropriate
Mn element can by solid solution effect improve soldered fitting mechanical property；Add appropriate Si element and can reduce solder
Fusing point and improve wettability；Add appropriate Cu element and can improve plasticity and the intensity of solder alloy, improve solder pair
The wettability of mother metal, promotes the solid solution metallurgical reaction of solder and mother metal, improves the combination property of soldered fitting；Add appropriate
Zr element can with crystal grain thinning, improve strength of joint, toughness and corrosion resistance；Substantial amounts of Ni element in solder simultaneously
It is possible not only to improve the solder wettability to mother metal, it is also possible to by improving the intensity of joint with the solid solution reaction of mother metal element
And antioxidation corrosion resistance.
The present invention provide soldering processes be use first by W-Cu alloy, Ni base chilling solder and rustless steel with docking side
Formula is put in special brazing jig, then sample and fixture are together put into vacuum drying oven completes soldering, and high vacuum environment coordinates
Reasonably processing parameter setting so that whole component is without deformation, without microfissure, pore with the defect such as be mingled with, contributes to
Obtain the soldered fitting of good mechanical properties.
Beneficial effect: compared with prior art, the invention have the advantages that
(1) the Ni base chilling brazing filler metal melts temperature range that the present invention provides is narrow, and the brazing filler metal melts time is short, is conducive to improving
Soldering efficiency, and Ni element energy and W, there is certain solid solution reaction, beneficially Ni base in the element such as Cu, Fe, Cr
Chilling solder, to the moistening of two kinds of mother metals and joint filling, finally can form dense structure, the soldered fitting that intensity is high.
(2) nickel-based solder is a kind of general Mobyneb solder, uses nickel-based solder soldering tungsten copper and rustless steel, connects
Head has good antioxidation and corrosion resistance, expands the application scenario of tungsten-copper alloy.
(3) vacuum brazing technique that the present invention provides need not add brazing flux and other protective measures, and high vacuum environment coordinates
Reasonably processing parameter setting so that whole component is without deformation, without microfissure, pore with the defect such as be mingled with, contributes to
Obtain the soldered fitting of good mechanical properties.
Accompanying drawing explanation
Fig. 1 is the braze-welded structure part structural representation of detailed description of the invention 1；
Fig. 2 is to be embodied as the 1 soldered fitting stereoscan photograph obtained；
Fig. 3 is to be embodied as the 1 soldered fitting shear fracture microscopic appearance photo obtained.
Detailed description of the invention
Embodiment 1
W55-Cu alloy and austenitic stainless steel is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W55-Cu alloy is with difficult to understand
Family name's body rustless steel specimen size is 20mm × 20mm × 5mm, and to be brazed is 20mm × 5mm cross section.
Ni base chilling solder thickness used is 50 μm, and mass percent consists of: Mn 23.0%, Si 4.0%, Cu
5.0%, Zr 0.8%, surplus is Ni.
A kind of tungsten-copper alloy and stainless soldering processes, comprise the following steps:
(1) utilize W28～W3.5 abrasive paper for metallograph that W-Cu alloy to be brazed and stainless steel surfaces are cleared up,
Emphasis clears up the impurity on to be brazed, greasy dirt and oxide-film；Utilize W3.5 abrasive paper for metallograph will be used for soldering
Ni base chilling solder two-sided be ground cleaning, by W-Cu alloy after grinding, rustless steel and Ni base chilling solder one
Rise and be placed in acetone, after using ultrasonic waves for cleaning 15～20min, carry out drying and processing；
(2) the Ni base chilling solder after cleaning is placed between W-Cu alloy and rustless steel welding surface, controls soldering
Gap 20 μm, and be close to be assemblied in special brazing jig, it is ensured that the precision of connection, fixture is placed nominal-mass
Pressure head, produce 0.02MPa constant perpendicular pressure, as shown in Figure 1；
(3) fixture assembled is integrally placed at vacuum and is not less than 6 × 10-4In the soldering oven of Pa, then by following work
Skill curve carries out soldering:
A) it is heated to 300 DEG C with 10 DEG C/min；
B) 15min it is incubated at such a temperature, it is therefore an objective to the deflation course enabling mother metal and solder surface or inside is abundant
Carry out；
C) continue to be heated to 800 DEG C with 7 DEG C/min；
D) 15min it is incubated at such a temperature, it is therefore an objective to avoid excessive thermal inertia and ensure temperature-controlled precision；
E) continue to be heated to brazing temperature 1025 DEG C with 11 DEG C/min；
F) under brazing temperature, 15min it is incubated, it is therefore an objective to enable brazing process fully to carry out, prevent incomplete penetration etc.
Weld defect；
G) it is cooled to 500 DEG C with 7 DEG C/min；
H) program end of run, closes heating, and weldment carries out furnace cooling, treats that vacuum chamber temperature is cooled to less than 100 DEG C and takes
Go out weldment.
Experimental result: the W55-Cu alloy of acquisition and austenitic stainless steel joint beautiful appearance, as shown in Figures 2 and 3,
Scanning electron microscopic observation finds that solder has good wettability to both sides mother metal, and soldering interface forms the interface cohesion of densification,
Non-microcracked, the defect such as pore, room temperature shear strength is 275MPa.
Embodiment 2
W55-Cu alloy and austenitic stainless steel is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W55-Cu alloy is with difficult to understand
Family name's body rustless steel specimen size is 20mm × 20mm × 5mm, and to be brazed is 20mm × 5mm cross section.
Ni base chilling solder thickness used is 70 μm, and mass percent consists of: Mn 21.0%, Si 3.0%, Cu
4.0%, Zr 0.6%, surplus is Ni.
A kind of tungsten-copper alloy and stainless soldering processes, comprise the following steps:
(1) utilize W28～W3.5 abrasive paper for metallograph that W-Cu alloy to be brazed and stainless steel surfaces are cleared up,
Emphasis clears up the impurity on to be brazed, greasy dirt and oxide-film；Utilize W3.5 abrasive paper for metallograph will be used for soldering
Ni base chilling solder two-sided be ground cleaning, by W-Cu alloy after grinding, rustless steel and Ni base chilling solder one
Rise and be placed in acetone, after using ultrasonic waves for cleaning 15～20min, carry out drying and processing；
(2) the Ni base chilling solder after cleaning is placed between W-Cu alloy and rustless steel welding surface, controls soldering
Gap 15 μm, and be close to be assemblied in special brazing jig, it is ensured that the precision of connection, fixture is placed nominal-mass
Pressure head, produce 0.03MPa constant perpendicular pressure；
(3) fixture assembled is integrally placed at vacuum and is not less than 6 × 10-4In the soldering oven of Pa, then by following work
Skill curve carries out soldering:
A) it is heated to 350 DEG C with 12 DEG C/min；
B) 20min it is incubated at such a temperature, it is therefore an objective to the deflation course enabling mother metal and solder surface or inside is abundant
Carry out；
C) continue to be heated to 850 DEG C with 5 DEG C/min；
D) 20min it is incubated at such a temperature, it is therefore an objective to avoid excessive thermal inertia and ensure temperature-controlled precision；
E) continue to be heated to brazing temperature 1030 DEG C with 10 DEG C/min；
F) under brazing temperature, 20min it is incubated, it is therefore an objective to enable brazing process fully to carry out, prevent incomplete penetration etc.
Weld defect；
G) it is cooled to 600 DEG C with 5 DEG C/min；
H) program end of run, closes heating, and weldment carries out furnace cooling, treats that vacuum chamber temperature is cooled to less than 100 DEG C and takes
Go out weldment.
Experimental result: the W55-Cu alloy of acquisition and austenitic stainless steel joint beautiful appearance, scanning electron microscopic observation finds
Solder has good wettability to both sides mother metal, and soldering interface forms the interface cohesion of densification, non-microcracked, pore etc.
Defect, room temperature shear strength is 249MPa.
Embodiment 3
W55-Cu alloy and austenitic stainless steel is selected to carry out banjo fixing butt jointing vacuum brazing.Wherein W55-Cu alloy is with difficult to understand
Family name's body rustless steel specimen size is 20mm × 20mm × 5mm, and to be brazed is 20mm × 5mm cross section.
Ni base chilling solder thickness used is 80 μm, and mass percent consists of: Mn 25.0%, Si 5.0%, Cu
5.5%, Zr 0.9%, surplus is Ni.
A kind of tungsten-copper alloy and stainless soldering processes, comprise the following steps:
(1) utilize W28～W3.5 abrasive paper for metallograph that W-Cu alloy to be brazed and stainless steel surfaces are cleared up,
Emphasis clears up the impurity on to be brazed, greasy dirt and oxide-film；Utilize W3.5 abrasive paper for metallograph will be used for soldering
Ni base chilling solder two-sided be ground cleaning, by W-Cu alloy after grinding, rustless steel and Ni base chilling solder one
Rise and be placed in acetone, after using ultrasonic waves for cleaning 15～20min, carry out drying and processing；
(2) the Ni base chilling solder after cleaning is placed between W-Cu alloy and rustless steel welding surface, controls soldering
Gap 25 μm, and be close to be assemblied in special brazing jig, it is ensured that the precision of connection, fixture is placed nominal-mass
Pressure head, produce 0.04MPa constant perpendicular pressure；
(3) fixture assembled is integrally placed at vacuum and is not less than 6 × 10-4In the soldering oven of Pa, then by following work
Skill curve carries out soldering:
A) it is heated to 300 DEG C with 8 DEG C/min；
B) 15min it is incubated at such a temperature, it is therefore an objective to the deflation course enabling mother metal and solder surface or inside is abundant
Carry out；
C) continue to be heated to 850 DEG C with 9 DEG C/min；
D) 20min it is incubated at such a temperature, it is therefore an objective to avoid excessive thermal inertia and ensure temperature-controlled precision；
E) continue to be heated to brazing temperature 1035 DEG C with 13 DEG C/min；
F) under brazing temperature, 20min it is incubated, it is therefore an objective to enable brazing process fully to carry out, prevent incomplete penetration etc.
Weld defect；
G) it is cooled to 400 DEG C with 8 DEG C/min；
H) program end of run, closes heating, and weldment carries out furnace cooling, treats that vacuum chamber temperature is cooled to less than 100 DEG C and takes
Go out weldment.
Experimental result: the W55-Cu alloy of acquisition and austenitic stainless steel joint beautiful appearance, scanning electron microscopic observation finds
Solder has good wettability to both sides mother metal, and soldering interface forms the interface cohesion of densification, non-microcracked, pore etc.
Defect, room temperature shear strength is 271MPa.
For the ease of contrasting with above-described embodiment, then it is 5 groups of comparative examples: each comparative example is with embodiment 1 only
Only Ni base chilling brazing filler metal compositions useful is different, and other welding procedure is the most identical.Table 1 lists solder group in each comparative example
The performance parameter of joint after becoming mass percent and welding.
Table 1
Being drawn by embodiment 1 to 3 and comparative example 1 to 5, the effect in Ni base solder of the Mn element is mainly
Generate Cu (Mn) solid solution with the Cu element generation solid solution reaction in mother metal, thus improve the mechanical property of soldered fitting
Energy.It appeared that the shear strength of soldered fitting is relatively low in the comparative example 1 without Mn element.Si element exists
Effect in Ni base solder mainly reduces solder fusing point and provides the effect of solder wetting.Right without Si element
Than in embodiment 2 it appeared that this solder wetting is general, postwelding joint finds the discontinuous defect of brazed seam.Cu element exists
Effect one in Ni base solder is the wettability improving Ni base solder；Two are and Ni, and Mn, Fe element generation solid solution is anti-
Should, improve joint mechanical property.It appeared that the wettability of joint is general in the comparative example 3 without Cu element,
Shear strength is relatively low.The effect adding appropriate Zr element in Ni base solder is mainly crystal grain thinning, improves joint
Plasticity and toughness.It appeared that the shear strength of joint is compared in embodiment 1 in the comparative example 4 without Zr element
Shear strength have dropped a lot.The effect one of the essential element Ni in Ni base solder is to improve the solder moistening to mother metal
Property；Two are and the element generation solid solution reaction such as the W in mother metal, Cu, Fe, Cr, improve the mechanical property of joint and anti-
Oxide etch performance.In comparative example 5, owing in this solder system, Ni constituent content is less, the head brought
Wanting problem is that solder is poor to the wettability of mother metal, and the especially wettability in rustless steel side is very poor, thus causes joint not
On pricker.Further, since the Si element containing excess and Zr element, joint can form substantial amounts of frangible compounds, greatly
Reduce the mechanical property of joint.
The above is only the preferred embodiment of the present invention, it should be pointed out that: for those skilled in the art
For, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also
Should be regarded as protection scope of the present invention.
Claims (9)
1. one kind is used for soldering tungsten-copper alloy and stainless Ni base chilling solder, it is characterised in that: Ni base chilling solder mass percent consists of: Mn 20.0～25.0%, Si 3.0～5.0%, Cu 3.5～5.5%, Zr 0.6～0.9%, and surplus is Ni.
It is the most according to claim 1 for soldering tungsten-copper alloy and stainless Ni base chilling solder, it is characterised in that: Ni base chilling solder mass percent consists of: Mn 23.0%, Si 4.0%, Cu 5.0%, Zr 0.8%, and surplus is Ni.
It is the most according to claim 1 for soldering tungsten-copper alloy and stainless Ni base chilling solder, it is characterised in that: Ni base chilling solder is foil-like, and thickness is 50～80 μm.
4. a tungsten-copper alloy and stainless soldering processes, it is characterised in that comprise the following steps:
(1) utilizing W28～W3.5 abrasive paper for metallograph to clear up W-Cu alloy to be brazed and stainless steel surfaces, emphasis clears up the impurity on to be brazed, greasy dirt and oxide-film；Utilize W3.5 abrasive paper for metallograph to be ground cleaning to the Ni base chilling solder that will be used for soldering is two-sided, after grinding, W-Cu alloy, rustless steel and Ni base chilling solder are placed in acetone together, after using ultrasonic waves for cleaning 15～20min, carry out drying and processing；
(2) the Ni base chilling solder after cleaning is placed between W-Cu alloy and rustless steel welding surface, controls joint clearance of brazing 15～25 μm, and is close to be assemblied in special brazing jig, it is ensured that the precision of connection, places the pressure head of nominal-mass on fixture；
(3) fixture assembled is integrally placed at vacuum and is not less than 6 × 10-4In the soldering oven of Pa, then carry out soldering by following process curve:
A) it is heated to 300～350 DEG C with 8～12 DEG C/min, at such a temperature insulation 15～20min；
B) continue to be heated to 750～850 DEG C with 5～10 DEG C/min, at such a temperature insulation 15～20min；
C) continue to be heated to brazing temperature 1020～1035 DEG C with 7～13 DEG C/min, under brazing temperature, be incubated 15～20min；
D) with 5～8 DEG C/min's；Rate of cooling is cooled to 400～600 DEG C；
E) program end of run, closes heating, and weldment carries out furnace cooling, treats that vacuum chamber temperature is cooled to less than 100 DEG C and takes out weldment.
Tungsten-copper alloy the most according to claim 4 and stainless soldering processes, it is characterised in that: Ni base chilling solder thickness used in described step (1) is 50～80 μm.
Tungsten-copper alloy the most according to claim 4 and stainless soldering processes, it is characterized in that: in described step (1), Ni base chilling solder mass percent consists of: Mn 20.0～25.0%, Si 3.0～5.0%, Cu 3.5～5.5%, Zr 0.6～0.9%, surplus is Ni.
Tungsten-copper alloy the most according to claim 4 and stainless soldering processes, it is characterised in that: in described step (1), Ni base chilling solder mass percent consists of: Mn 23.0%, Si 4.0%, Cu 5.0%, Zr 0.8%, and surplus is Ni.
Tungsten-copper alloy the most according to claim 4 and stainless soldering processes, it is characterised in that: the pressure head placing nominal-mass in described step (2) on fixture produces the constant perpendicular pressure of 0.01～0.04MPa.
Tungsten-copper alloy the most according to claim 4 and stainless soldering processes, it is characterised in that: described step (2) is placed between solder and rustless steel mother metal the stainless steel substrates that thickness is 15～25 μm.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN115335187A (en) * | 2020-10-26 | 2022-11-11 | 联合材料公司 | Composite material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106862799A (en) * | 2017-02-27 | 2017-06-20 | 南通开利浦材料科技有限公司 | The Ni-based foil solder of iron and its application |
| CN110170719A (en) * | 2018-12-11 | 2019-08-27 | 苏州赛特锐精密机械配件有限公司 | A kind of method that kovar alloy couples with tungsten-copper alloy |
| EP4065301A4 (en) * | 2019-11-26 | 2023-12-13 | Oerlikon Metco (US) Inc. | Low melting nickel-manganese-silicon based braze filler metals for heat exchanger applications |
| CN115335187A (en) * | 2020-10-26 | 2022-11-11 | 联合材料公司 | Composite material |
| CN115335187B (en) * | 2020-10-26 | 2024-04-12 | 联合材料公司 | Composite material |
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