CN110170719A - A kind of method that kovar alloy couples with tungsten-copper alloy - Google Patents
A kind of method that kovar alloy couples with tungsten-copper alloy Download PDFInfo
- Publication number
- CN110170719A CN110170719A CN201811512196.7A CN201811512196A CN110170719A CN 110170719 A CN110170719 A CN 110170719A CN 201811512196 A CN201811512196 A CN 201811512196A CN 110170719 A CN110170719 A CN 110170719A
- Authority
- CN
- China
- Prior art keywords
- alloy
- tungsten
- copper alloy
- kovar
- kovar alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
Abstract
A kind of coupling method of kovar alloy and tungsten-copper alloy comprising following steps: cleaning treatment, filling solder, preheating, pressurization, heating.The coupling method simple process of kovar alloy and tungsten-copper alloy of the present invention, time-consuming short, production cost is low, high production efficiency, while the residual thermal stress of connector is small, so that the performance of connector is good, connector is reliable, can reach the application requirement of the connecting joint of kovar alloy and tungsten-copper alloy.
Description
Technical field
The present invention relates to the connection technique fields of dissimilar materials, more particularly, to the connection of a kind of kovar alloy and tungsten-copper alloy
Connect method.
Background technique
Kovar alloy within the scope of 20-450 DEG C have with linear expansion coefficient similar in Bohemian glass, with corresponding Bohemian glass
It can be carried out effective sealing-in matching, curie point also with higher and good cryo tissue stability, but its thermal conductivity is lower.
With the development of electronic industry, higher and higher to the requirement of heat sink material, the especially requirement of thermal conductivity, Tungsten-copper Composites have with
Linear expansion coefficient similar in kovar alloy, while thermal conductivity is 4-5 times of alloy for can cutting down, but its density is 2 times of kovar alloy
Left and right, while the price of Tungsten-copper Composites is 3 times of kovar alloy or so, prepares heat sink material using full tungsten copper, not only weight weight,
And it is at high cost.Therefore, compound using kovar alloy and Tungsten-copper Composites progress, it not only can satisfy the requirement of high heat conductance, but also can
To realize the reduction of material cost.
But when kovar alloy couples with Tungsten-copper Composites at present using it is most be soldering, the complex process of soldering is time-consuming
It is long, high production cost, while fibre is welded in postwelding can generate residual thermal stress, so that the reduced performance of connector, so that connector
It is unreliable, the application requirement of the connecting joint of kovar alloy and tungsten-copper alloy cannot be reached.
Therefore, it is necessary to provide the coupling method of a kind of new kovar alloy and tungsten-copper alloy to overcome drawbacks described above.
Summary of the invention
The purpose of the present invention is to provide kovar alloys and tungsten-copper alloy that one kind can effectively solve above-mentioned technical problem
Coupling method.
For the purpose for reaching the present invention, adopt the following technical scheme that
A kind of coupling method of kovar alloy and tungsten-copper alloy comprising following steps:
S1: kovar alloy and tungsten-copper alloy are subjected to cleaning treatment；
Solder: being uniformly sprinkled upon the edge of kovar alloy to be coupled by S2, and tungsten-copper alloy to be coupled is placed
On kovar alloy, and guarantee that tungsten-copper alloy to be coupled is closely contacted with kovar alloy；
S3: and then kovar alloy, tungsten-copper alloy and the solder in S2 step are heated to 800 DEG C -950 DEG C, and
Guarantee vacuum state in heating process, then keeps the temperature 30min；
S4: kovar alloy, tungsten-copper alloy and the solder in S3 step are boosted into 3-5MPa；
S5: kovar alloy, tungsten-copper alloy and the solder in S4 step are warming up to 1030-1060 DEG C, realization can be cut down
Alloy couples with tungsten-copper alloy.
As a further improvement of the present invention, the cleaning treatment in S1 step is to be put into kovar alloy and tungsten-copper alloy
Enter 10-20min of ultrasonic cleaning in solvent type ultrasonic cleaning agent.
As a further improvement of the present invention, solder is uniformly sprinkled upon to the surrounding of kovar alloy to be coupled in S2 step
Behind edge, the height of solder is 0.5-2mm, and the width of solder is 1-2mm.
As a further improvement of the present invention, the fit tolerance in S2 step between kovar alloy and tungsten-copper alloy be ±
0.01mm。
As a further improvement of the present invention, the heating rate in S3 step in heating is 5-15 DEG C/min, S3 step
The vacuum degree of middle vacuum state is 30-100Pa.
As a further improvement of the present invention, the boosting of S4 step is that inert gas is added into heating furnace.
As a further improvement of the present invention, the inert gas is preferably high-purity argon gas.
Compared with prior art, coupling the invention has the following beneficial effects: kovar alloy of the present invention and tungsten-copper alloy
Method and process is simple, and time-consuming short, production cost is low, high production efficiency, while the residual thermal stress of connector is small, so that the property of connector
Can be good, connector is reliable, can reach the application requirement of the connecting joint of kovar alloy and tungsten-copper alloy.
Detailed description of the invention
Fig. 1 is the flow chart of the coupling method of kovar alloy of the present invention and tungsten-copper alloy.
Fig. 2 is connecing for the coupling method kovar alloy of kovar alloy of the present invention and tungsten-copper alloy, tungsten-copper alloy and solder
Head schematic diagram.
Description of symbols: 1 is kovar alloy in Fig. 2, and 2 be tungsten-copper alloy, and 3 is at copper-based solder fillings.
Specific embodiment
Clear and complete explanation is made below in conjunction with coupling method of the attached drawing to kovar alloy of the present invention and tungsten-copper alloy.
As shown in Figure 1, the coupling method of kovar alloy of the present invention and tungsten-copper alloy comprising following steps:
S1: kovar alloy and tungsten-copper alloy are subjected to cleaning treatment.
Wherein, cleaning treatment is clear for kovar alloy and tungsten-copper alloy are put into ultrasound in solvent type ultrasonic cleaning agent
Wash 10-20min.
Solder: being uniformly sprinkled upon the edge of kovar alloy to be coupled by S2, and tungsten-copper alloy to be coupled is placed
On kovar alloy, and guarantee that tungsten-copper alloy to be coupled is closely contacted with kovar alloy.
Wherein, after solder to be uniformly sprinkled upon to the edge of kovar alloy to be coupled, the height of solder is 0.5-
2mm, the width of solder are 1-2mm, and the fit tolerance between kovar alloy and tungsten-copper alloy is ± 0.01mm.
S3: and then kovar alloy, tungsten-copper alloy and the solder in S2 step are heated to 800 DEG C -950 DEG C, and
Guarantee vacuum state in heating process, then keeps the temperature 30min.
Wherein, the heating rate in heating is 5-15 DEG C/min, and the vacuum degree of vacuum state is 30-100Pa.
S4: kovar alloy, tungsten-copper alloy and the solder in S3 step are boosted into 3-5MPa.
Wherein, it boosts as inert gas is added into heating furnace, the inert gas is preferably high-purity argon gas.
S5: kovar alloy, tungsten-copper alloy and the solder in S4 step are warming up to 1030-1060 DEG C, realization can be cut down
Alloy couples with tungsten-copper alloy.
Technical solution in order to enable those skilled in the art to better understand the present invention, below in conjunction with embodiment pair
Technical solution of the present invention is clearly and completely described, it is clear that described embodiment is only that present invention a part is implemented
Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creativeness
Every other embodiment obtained, should fall within the scope of the present invention under the premise of labour.
Embodiment 1
Kovar alloy and tungsten-copper alloy to be coupled are put into acetone and are cleaned by ultrasonic 17min.
Solder is uniformly sprinkled upon to the edge of kovar alloy to be coupled, is highly 1.5mm, width 1mm can
Cutting down the fit tolerance between alloy and tungsten-copper alloy is 0.0005mm.
Kovar alloy, tungsten-copper alloy and solder are placed in the heating furnace of 50Pa, and with the heating of 10 DEG C/min speed
Rate rises to 875 DEG C from room temperature, then keeps the temperature 30min.
High-purity argon gas will be poured in heating furnace, until the pressure in heating furnace rises to 3.5MPa.
Kovar alloy, tungsten-copper alloy and solder are warming up to 1040 DEG C, realization kovar alloy couples with tungsten-copper alloy.
The defects of connector obtained using the present embodiment mode is completely fine and close, flawless, realizes kovar alloy and tungsten copper
The positive connection of alloy.After tested, the connecting joint of kovar alloy and tungsten-copper alloy has reached application requirement.
Implementation column 2
Kovar alloy and tungsten-copper alloy to be coupled are put into acetone and are cleaned by ultrasonic 15min.
Solder is uniformly sprinkled upon to the edge of kovar alloy to be coupled, is highly 0.5mm, width 2mm can
Cutting down the fit tolerance between alloy and tungsten-copper alloy is 0.0008mm.
Kovar alloy, tungsten-copper alloy and solder are placed in the heating furnace of 30Pa, and with the heating of 15 DEG C/min speed
Rate rises to 950 DEG C from room temperature, then keeps the temperature 30min.
High-purity argon gas will be poured in heating furnace, until the pressure in heating furnace rises to 5MPa.
Kovar alloy, tungsten-copper alloy and solder are warming up to 1060 DEG C, realization kovar alloy couples with tungsten-copper alloy.
The defects of connector obtained using the present embodiment mode is completely fine and close, flawless, realizes kovar alloy and tungsten copper
The positive connection of alloy.After tested, the connecting joint of kovar alloy and tungsten-copper alloy has reached application requirement.
Implementation column 3
Kovar alloy and tungsten-copper alloy to be coupled are put into acetone and are cleaned by ultrasonic 10min.
Solder is uniformly sprinkled upon to the edge of kovar alloy to be coupled, is highly 2mm, width 2mm can cut down conjunction
Fit tolerance between gold and tungsten-copper alloy is 0.0003mm.
Kovar alloy, tungsten-copper alloy and solder are placed in the heating furnace of 100Pa, and with the heating of 5 DEG C/min speed
Rate rises to 800 DEG C from room temperature, then keeps the temperature 30min.
High-purity argon gas will be poured in heating furnace, until the pressure in heating furnace rises to 3MPa.
Kovar alloy, tungsten-copper alloy and solder are warming up to 1030 DEG C, realization kovar alloy couples with tungsten-copper alloy.
The defects of connector obtained using the present embodiment mode is completely fine and close, flawless, realizes kovar alloy and tungsten copper
The positive connection of alloy.After tested, the connecting joint of kovar alloy and tungsten-copper alloy has reached application requirement.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. the coupling method of a kind of kovar alloy and tungsten-copper alloy, it is characterised in that: its including the following steps:
S1: kovar alloy and tungsten-copper alloy are subjected to cleaning treatment；
Solder: being uniformly sprinkled upon the edge of kovar alloy to be coupled by S2, and tungsten-copper alloy to be coupled is placed on can
It cuts down on alloy, and guarantees that tungsten-copper alloy to be coupled is closely contacted with kovar alloy；
S3: kovar alloy, tungsten-copper alloy and the solder in S2 step are heated to 800 DEG C -950 DEG C, and during heating
Guarantee vacuum state, then keeps the temperature 30min；
S4: kovar alloy, tungsten-copper alloy and the solder in S3 step are boosted into 3-5MPa；
S5: being warming up to 1030-1060 DEG C for kovar alloy, tungsten-copper alloy and the solder in S4 step, realize kovar alloy with
The connection of tungsten-copper alloy.
2. the coupling method of kovar alloy as described in claim 1 and tungsten-copper alloy, it is characterised in that: the cleaning in S1 step
Processing is cleaned by ultrasonic 10-20min for kovar alloy and tungsten-copper alloy to be put into solvent type ultrasonic cleaning agent.
3. the coupling method of kovar alloy as described in claim 1 and tungsten-copper alloy, it is characterised in that: by solder in S2 step
After being uniformly sprinkled upon the edge of kovar alloy to be coupled, the height of solder is 0.5-2mm, and the width of solder is 1-
2mm。
4. the coupling method of kovar alloy as claimed in claim 1 or 3 and tungsten-copper alloy, it is characterised in that: can in S2 step
Cutting down the fit tolerance between alloy and tungsten-copper alloy is ± 0.01mm.
5. the coupling method of kovar alloy as described in claim 1 and tungsten-copper alloy, it is characterised in that: in S3 step in heating
Heating rate be 5-15 DEG C/min, the vacuum degree of vacuum state is 30-100Pa in S3 step.
6. the coupling method of kovar alloy as described in claim 1 and tungsten-copper alloy, it is characterised in that: S4 step boosting for
Inert gas is added in heating furnace.
7. the coupling method of kovar alloy as claimed in claim 6 and tungsten-copper alloy, it is characterised in that: the inert gas is excellent
It is selected as high-purity argon gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811512196.7A CN110170719A (en) | 2018-12-11 | 2018-12-11 | A kind of method that kovar alloy couples with tungsten-copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811512196.7A CN110170719A (en) | 2018-12-11 | 2018-12-11 | A kind of method that kovar alloy couples with tungsten-copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110170719A true CN110170719A (en) | 2019-08-27 |
Family
ID=67688982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811512196.7A Pending CN110170719A (en) | 2018-12-11 | 2018-12-11 | A kind of method that kovar alloy couples with tungsten-copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110170719A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112756779A (en) * | 2020-12-14 | 2021-05-07 | 江苏奥雷光电有限公司 | Welding method of tungsten-copper alloy and thin plate kovar alloy |
| CN114029354A (en) * | 2021-10-19 | 2022-02-11 | 武汉理工大学 | Extrusion device for Kovar alloy wrapped Cu core composite bar with controllable diameter ratio and preparation process thereof |
| CN114161090A (en) * | 2021-12-03 | 2022-03-11 | 深圳市宏钢机械设备有限公司 | Processing technology of kovar alloy and tungsten-copper alloy packaging shell |
| CN114406388A (en) * | 2022-02-21 | 2022-04-29 | 无锡鑫巨宏智能科技有限公司 | Tungsten copper and dissimilar metal welding structure and method |
| CN115805236A (en) * | 2023-02-09 | 2023-03-17 | 西安稀有金属材料研究院有限公司 | Process for preparing kovar alloy/AgCu alloy composite foil strip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006191124A (en) * | 2006-01-24 | 2006-07-20 | Sumitomo Electric Ind Ltd | Holder for treated object, treatment apparatus and ceramic susceptor for semiconductor manufacturing apparatus |
| CN105845186A (en) * | 2016-03-30 | 2016-08-10 | 清华大学 | Medium-voltage power electrical penetration assembly of high-temperature gas-cooled reactor and preparation method thereof |
| CN105965176A (en) * | 2016-07-20 | 2016-09-28 | 江苏科技大学 | Ni-based rapidly-cooled brazing material and brazing process for brazing tungsten-copper alloy and stainless steel |
| CN106271015A (en) * | 2016-09-18 | 2017-01-04 | 西南交通大学 | A kind of rustless steel and kovar alloy dissimilar metal diffusion welding method |
| CN108701665A (en) * | 2016-02-19 | 2018-10-23 | 贺利氏德国有限两合公司 | Method, heat sink, the method for manufacturing semiconductor module and semiconductor module for manufacturing heat sink |
| CN108701666A (en) * | 2016-02-19 | 2018-10-23 | 贺利氏德国有限两合公司 | Method, underboarding, the method for manufacturing semiconductor module and semiconductor module for manufacturing underboarding |
-
2018
- 2018-12-11 CN CN201811512196.7A patent/CN110170719A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006191124A (en) * | 2006-01-24 | 2006-07-20 | Sumitomo Electric Ind Ltd | Holder for treated object, treatment apparatus and ceramic susceptor for semiconductor manufacturing apparatus |
| CN108701665A (en) * | 2016-02-19 | 2018-10-23 | 贺利氏德国有限两合公司 | Method, heat sink, the method for manufacturing semiconductor module and semiconductor module for manufacturing heat sink |
| CN108701666A (en) * | 2016-02-19 | 2018-10-23 | 贺利氏德国有限两合公司 | Method, underboarding, the method for manufacturing semiconductor module and semiconductor module for manufacturing underboarding |
| CN105845186A (en) * | 2016-03-30 | 2016-08-10 | 清华大学 | Medium-voltage power electrical penetration assembly of high-temperature gas-cooled reactor and preparation method thereof |
| CN105965176A (en) * | 2016-07-20 | 2016-09-28 | 江苏科技大学 | Ni-based rapidly-cooled brazing material and brazing process for brazing tungsten-copper alloy and stainless steel |
| CN106271015A (en) * | 2016-09-18 | 2017-01-04 | 西南交通大学 | A kind of rustless steel and kovar alloy dissimilar metal diffusion welding method |
Non-Patent Citations (1)
| Title |
|---|
| 王振东 等: "铜-可伐合金热静压焊接接头力学性能研究", 《中国核学会核材料分会2007年度学术交流会》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112756779A (en) * | 2020-12-14 | 2021-05-07 | 江苏奥雷光电有限公司 | Welding method of tungsten-copper alloy and thin plate kovar alloy |
| CN114029354A (en) * | 2021-10-19 | 2022-02-11 | 武汉理工大学 | Extrusion device for Kovar alloy wrapped Cu core composite bar with controllable diameter ratio and preparation process thereof |
| CN114161090A (en) * | 2021-12-03 | 2022-03-11 | 深圳市宏钢机械设备有限公司 | Processing technology of kovar alloy and tungsten-copper alloy packaging shell |
| CN114161090B (en) * | 2021-12-03 | 2022-11-11 | 深圳市宏钢机械设备有限公司 | Processing technology of kovar alloy and tungsten-copper alloy packaging shell |
| CN114406388A (en) * | 2022-02-21 | 2022-04-29 | 无锡鑫巨宏智能科技有限公司 | Tungsten copper and dissimilar metal welding structure and method |
| CN115805236A (en) * | 2023-02-09 | 2023-03-17 | 西安稀有金属材料研究院有限公司 | Process for preparing kovar alloy/AgCu alloy composite foil strip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110170719A (en) | A kind of method that kovar alloy couples with tungsten-copper alloy | |
| CN101745736B (en) | Diffusion welding method of copper alloy and stainless steel | |
| CN101494322B (en) | Tungsten copper connection method | |
| CN105418131B (en) | A kind of aluminium oxide ceramics low temperature brazing connection method | |
| CN102489865A (en) | Welding method for copper back plate and target | |
| CN104475898B (en) | The foreign material method for welding of porous interlayer structure brazed seam | |
| CN103934534B (en) | The vacuum welding method of a kind of thick film substrate and power shell | |
| CN105499833A (en) | High-temperature brazing material for brazing tungsten-copper alloy and copper or copper alloy and brazing method of high-temperature brazing material | |
| CN113478040B (en) | Active brazing method for improving performance of graphite/copper dissimilar material joint | |
| CN111347146A (en) | Tungsten and heat sink material connector and preparation method thereof | |
| CN105728981A (en) | Brazing filler metal for welding Si3N4 ceramic-stainless steel and brazing method thereof | |
| CN105057873A (en) | Method for preparing CuW/Cu/CuCrZr integrated contact through electron beam welding | |
| CN104741722A (en) | TiNi solder vacuum brazing TZM alloy and ZrC/W composite method | |
| CN105418135B (en) | A kind of SiO2The method for welding of ceramic matric composite | |
| CN112296472A (en) | Brazing method of graphite material | |
| CN102485698B (en) | Connection method of brass and silicon carbide ceramic, and connected piece | |
| CN106735665B (en) | A kind of device for welding cvd diamond and hard alloy, method and its application | |
| CN105834540B (en) | A kind of method of Ti-Ni high-temp solder soldering TZM alloy | |
| CN102468092B (en) | Method for preparing heat element for heated cathode | |
| JP2003031606A (en) | Gold wire bonding method, device and system | |
| CN109836166B (en) | Electromagnetic ultrasonic brazing method for SiC ceramic | |
| CN106378506B (en) | A kind of technique that SiC based composites are brazed using brazing material | |
| CN105081503A (en) | Soldering method for achieving connection of SiC-based composite ceramic and Invar alloy by means of NiCrSi | |
| JP2004132556A (en) | Water-cooled conductor and manufacturing method thereof | |
| CN107433401B (en) | It is a kind of to use Al base solder brazing Ti2The method of AlC ceramics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190827 |
|
| WD01 | Invention patent application deemed withdrawn after publication |