CN105578732B - Rigid Flex and terminal - Google Patents
Rigid Flex and terminal Download PDFInfo
- Publication number
- CN105578732B CN105578732B CN201610105725.6A CN201610105725A CN105578732B CN 105578732 B CN105578732 B CN 105578732B CN 201610105725 A CN201610105725 A CN 201610105725A CN 105578732 B CN105578732 B CN 105578732B
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- layer
- copper foil
- rigid
- rigid flex
- flexible substrate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of Rigid Flex and terminal, the Rigid Flex includes flexible substrate layer and rigid circuit base plate, the flexible substrate layer includes the firstth area, the rigid circuit base plate includes rigid insulation layer, line layer, anti-solder ink layer, strengthening course and multiple soldered elements, the rigid insulation layer is fixed in the flexible substrate layer, the line layer is arranged on the rigid insulation layer, the anti-solder ink layer covers the line layer, the anti-solder ink layer sets multiple welding holes, multiple soldered elements are respectively welded in multiple welding holes, the strengthening course is fixed on the anti-solder ink layer, and enclose in the week side of boss of multiple soldered elements.Enclosed using the strengthening course in the week side of boss of multiple soldered elements so that intensity increase of the Rigid Flex at firstth area, and then improve the hardness assembling intensity of the Rigid Flex.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of Rigid Flex and terminal.
Background technology
The application of Rigid Flex is more and more extensive at present, and the structure of Rigid Flex is in flexible substrate layer both sides at present
Rigid insulation layer is set, then line layer is set on rigid insulation layer, and anti-solder ink layer is covered on line layer, so as to real
The rigid circuit board structure of existing Rigid Flex, but Rigid Flex is frequently necessary to weld electricity on rigid line construction at present
Subcomponent, thus need to set welding hole on anti-solder ink layer, electronic component is welded in welding hole, with electrical interconnection
Layer.Because the quantity of electronic component is generally more, these electronic components are distributed on the line layer so that the rigid insulation
Layer bears the welding stress of the electronic component, reduces the stress that rigid insulation layer bears other external parts, so as to reduce
Assembling intensity of the Rigid Flex on rigid line construction.
The content of the invention
In view of this, the present invention provides a kind of Rigid Flex and terminal for improving hardness assembling intensity.
The present invention provides a kind of Rigid Flex, wherein, the Rigid Flex includes flexible substrate layer and rigid circuit
Substrate, the flexible substrate layer include the firstth area, and the rigid circuit base plate includes rigid insulation layer, line layer, anti-solder ink
Layer, strengthening course and multiple soldered elements, the rigid insulation layer are fixed in the flexible substrate layer, and in the flexible parent metal
Orthographic projection region on floor is coincided with firstth area, and the line layer is arranged on the rigid insulation layer, described anti-welding
Ink layer covers the line layer, and the anti-solder ink layer sets multiple welding holes, multiple soldered elements be respectively welded in
In multiple welding holes, and electrically connect the line layer, the strengthening course is fixed on the anti-solder ink layer, and enclose in
The week side of boss of multiple soldered elements.
Wherein, the Rigid Flex also includes copper foil layer, and the copper foil layer is arranged in the flexible substrate layer, and layer
It is laminated between the flexible substrate layer and the rigid insulation layer.
Wherein, the rigid insulation layer sets through hole, is set in the through hole and electrically connects the copper foil layer and the circuit
The electric conductor of layer.
Wherein, the Rigid Flex includes two layers of copper foil layer, is the first copper foil layer and the second copper foil layer respectively, institute
State the first copper foil layer and second copper foil layer is arranged in the opposite both sides of the flexible substrate layer respectively.
Wherein, first copper foil layer is provided with insertion to the signal via of second copper foil layer, in the signal via
The signal conductor for connecting first copper foil layer and second copper foil layer is set.
Wherein, first copper foil layer is provided with insertion to the ground via of second copper foil layer, in the ground via
The earth conductor for connecting first copper foil layer and second copper foil layer is set.
Wherein, the flexible substrate layer also includes the secondth area for being connected to first area edge, the Rigid Flex
Also include the first cover layer and the second cover layer, first cover layer and second cover layer fit in described first respectively
On copper foil layer and second copper foil layer, and the orthographic projection region in the flexible substrate layer coincides with secondth area.
Wherein, the Rigid Flex includes two rigid circuit base plates, two rigid circuit base plate difference
It is fixed on the flexible substrate layer both sides.
Wherein, the strengthening course is steel reinforcement.
The present invention a kind of terminal is also provided, wherein, the terminal include body, the mainboard located at the body interior and
Rigid Flex described in above-mentioned any one, the Rigid Flex is located at the body interior, and is electrically connected with the mainboard.
The Rigid Flex and terminal of the present invention, by fixing the strengthening course on the anti-solder ink layer, utilizes the strengthening course
Enclose in the week side of boss of multiple soldered elements so that intensity increase of the Rigid Flex at firstth area, and then
Improve the hardness assembling intensity of the Rigid Flex.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, the required accompanying drawing used in embodiment will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic cross-section of Rigid Flex provided by the invention；
Fig. 2 is the schematic top plan view of Fig. 1 Rigid Flex.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is carried out clear
Chu, it is fully described by.
Fig. 1 and Fig. 2, a kind of Rigid Flex 100 provided by the invention are referred to, the Rigid Flex 100 includes soft
Property substrate layer 10 and rigid circuit base plate 20, the flexible substrate layer 10 include the first area 10a, and the rigid circuit base plate 20 wraps
Include rigid insulation layer 21, line layer 22, anti-solder ink layer 23, strengthening course 24 and multiple soldered elements 25.The rigid insulation layer
21 are fixed in the flexible substrate layer 10, and the orthographic projection region in the flexible substrate layer 10 and the firstth area 10a
Coincide.The line layer 22 is arranged on the rigid insulation layer 21.The anti-solder ink layer 23 covers the line layer 22,
The anti-solder ink layer 23 sets multiple welding holes 231.Multiple soldered elements 25 are respectively welded in multiple welding holes
In 231, and electrically connect the line layer 22.The strengthening course 24 is annular in shape, and the strengthening course 24 is fixed on the anti-solder ink
On layer 23, and enclose in the week side of boss of multiple soldered elements 25.It is understood that the Rigid Flex 100 is applied to
In terminal, the terminal can be mobile phone, tablet personal computer, notebook computer etc., and the Rigid Flex 100 is responsible for the electricity in terminal
Conduction between subcomponent
By fixing the strengthening course 24 on the anti-solder ink layer 23, enclosed using the strengthening course 24 in multiple institutes
State the week side of boss of soldered elements 25 so that intensity increase of the Rigid Flex 100 at the firstth area 10a, and then improve
The hardness assembling intensity of the Rigid Flex 100.
In present embodiment, the flexible substrate layer 10 can use polyimides or the double stupid diformates of polyethylene
Materials such as (Polyethylene terephthalate PET), in order to set copper foil to walk in the flexible substrate layer 10
Line, and the flexible substrate layer 10 can provide insulation environment for copper foil cabling, in order to be divided into signal in the copper foil cabling
Cabling and ground connection cabling.Preferably, the thickness of the flexible substrate layer 10 can be 20 μm.The flexible substrate layer 10 can be set
First area 10a and the second area 10b, the secondth area 10b are used to flexibility be presented, and facilitate the Soft Bonding plate 100 to produce deformation,
And then facilitating the Rigid Flex 100 to connect external device, the firstth area 10a can fix hard plate, so as to improve
The rigidity of the Soft Bonding plate 100, so as to facilitate the Soft Bonding plate 100 to be assemblied in terminal.
In present embodiment, the rigid insulation layer 21 uses polyethylene material, and the rigid insulation layer 21 has insulation
Property characteristic so that the copper foil cabling on the line layer 22 and the flexible substrate layer 10 mutually completely cuts off, described soft so as to facilitate
The trace arrangements variation of scleroma plywood 100.The number of plies of the rigid insulation layer 21 can be two layers, can also set individual layer,
Two layers of rigid insulation layer 21 fits in the both sides of the flexible substrate layer 10 respectively, and corresponds to the flexible substrate layer 10
The first area 10a.Utilize the hardness of the rigid insulation layer 21 so that the Rigid Flex 100 is on the firstth area 10a
Intensity increase so that the Rigid Flex 100 is not easy bending in the firstth area 10a, so as to facilitate the soft or hard combination
Plate 100 can be consolidated and is assemblied in terminal, such as drill out screw hole in the rigid insulation layer 21.Meanwhile the rigid insulation
Copper foil cabling of 21 pairs of the floor flexible substrate layer 10 at the first area 10a is protected, and increases the Rigid Flex 100
Structural soundness.In present embodiment, the line layer 22 can be the etched technological forming of copper foil.The layer of the line layer 22
Number can be fitted on two layers of rigid insulation layer 21 respectively with two layers or individual layer, two layers of line layer 22.Described in two layers
Line layer 22 may each be setting circuit, so as to increase the circuit configuration of the Rigid Flex 100.
In present embodiment, the circuit on 23 pairs of the anti-solder ink layer line layer 22 is protected, and is prevented described
Line short on line layer 22, and prevent the circuit on the line layer 22 from wearing, so as to avoid the line layer 22
Circuit disconnects.
In present embodiment, the strengthening course 24 can be steel reinforcement.The 24 rectangular ring-type of strengthening course, the reinforcement
Layer 24 is fitted on the anti-solder ink layer 23.The strengthening course 24 is unlikely to deform, and has higher intensity, thus the reinforcement
Floor 24 causes intensity increase of the Rigid Flex 100 in the first area 10a, so that Rigid Flex 100 is more prone to
It is assemblied in terminal, and larger adhesive force can be born.In other embodiments, the strengthening course 24 can also be poly-
Ester reinforcement or glass fiber-reinforced or be aluminium platinum reinforcement.
The soldered elements 25 can be the electronic components such as resistance, electric capacity or diode.Multiple soldered elements 25
The anti-solder ink layer 23 is both passed through, spacing be present between multiple soldered elements 25.Utilize multiple soldered elements 25
Positioned at the inner side of strengthening course 24 so that multiple strengthening courses 24 can obtain larger layout area, so that described
The supporting role increase of strengthening course 24, so as to further improve the assembling intensity of the Rigid Flex 100.By multiple institutes
Soldered elements 25 are stated positioned at the inner side of strengthening course 24 so that work of multiple soldered elements 25 to the rigid insulation layer 21
Firmly relatively concentrate, and the strengthening course 24 can be supported to the peripheral region at stress of rigid insulation layer 21, so as to
So that rigid insulation layer 21 is unlikely to deform, strengthen intensity of the Rigid Flex 100 in the first area 10a.
Further, the Rigid Flex 100 also includes copper foil layer 30, and the copper foil layer 30 is arranged in the flexible base
On material layer 10, and it is laminated between the flexible substrate layer 10 and the rigid insulation layer 21.
In present embodiment, the copper foil layer 30 is the plate that copper foil is set on film, can be set on the copper foil layer 30
Put ground connection cabling and signal lead, the ground connection cabling and signal lead be copper foil according to the etched technique of prescribed route structure and
Into.Ground connection cabling and signal lead on the copper foil layer 30 can be wholely set, the signal lead on the copper foil layer 30
Realize the conduction between electric elements, the ground connection cabling on the copper foil layer 30 is grounded.Etched using the copper foil layer 30
In in the flexible substrate layer 10, the copper foil layer 30 is disposed opposite to each other with the line layer 22, so that the soft or hard combination
Plate 100 can provide various lines structure.
Further, the rigid insulation layer 21 sets through hole 211, is set in the through hole 211 and electrically connects the copper foil
The electric conductor 212 of layer 30 and the line layer 22.It is described to pass through the rigid insulation layer 21 to electric body 212.Utilize the conduction
Body 212 turns on the signal lead of the line layer 22 and the ground connection cabling of the copper foil layer 30, so as to be conveniently the line layer
Circuit on 22 is grounded, so that the Rigid Flex 100 is simple in construction, improves electric conductivity, or can be with
It is to realize that the signal lead of the line layer 22 and the signal lead of the copper foil layer 30 are conducted, so as to realize the soft or hard knot
The various lines structure of plywood 100.In other embodiments, the number of the through hole 211 can be multiple, so as to realize
Line layer 22 is stated to turn on the various ways of copper foil layer 30.
Further, the Rigid Flex 100 includes two layers of copper foil layer 30, is the first copper foil layer 31 and respectively
Two copper foil layers 32, first copper foil layer 31 and second copper foil layer 32 are arranged in the both sides of flexible substrate layer 10 respectively.
In present embodiment, first copper foil layer 31 and second copper foil layer 32 are respectively equipped with different circuits, with described in increase
The circuit layout space of Rigid Flex 100, improve the electric conductivity of the Rigid Flex 100.First copper foil layer 31
Set in signal via 30a, the signal via 30a provided with insertion to second copper foil layer 32 and connect first copper foil
The signal conductor 30b of layer 31 and second copper foil layer 32.The signal via 30a is opened in the line of first copper foil layer 31
Road one end, the circuit towards second copper foil layer 32 extend.Specifically, the signal via 30a also extends through the flexible parent metal
Layer 10, it is the copper post through the signal via 30a that the signal, which leads 30b,.The signal conductor 30b realizes first copper foil
The signal conduction of layer 31 and second copper foil layer 32, so as to ensure that the multi-line cabling requirement of the Rigid Flex 100.
The signal via 30a is opened in the second area 10b of the relatively described flexible substrate layer 10 of the copper foil layer 30, described so as to cut down
Copper foil layer 30 so that Rigid Flex 100 is in second area's 10b remitted its furys, thus can make in the second area 10a stress
Obtain intensity of the Rigid Flex 100 in the firstth area 10a not to be weakened, so as to ensure the Rigid Flex 100
Rigid line construction intensity, so as to improve assembling intensity of the Rigid Flex 100 in the first area 10a.In other embodiment party
In formula, the number of the signal via can be multiple, and multiple signal electric conductors 212 can realize multiple signal lead phases
Mutually conducting.
Further, first copper foil layer 31 is additionally provided with insertion to the ground via 30c of second copper foil layer 32, institute
State the earth conductor 30d for being set in ground via 30c and connecting first copper foil layer 31 and second copper foil layer 32.It is described to connect
Ground via 30c is opened on the ground path of first copper foil layer 31, and the circuit towards second copper foil layer 32 extends.So as to
So that first copper foil layer 31 provides grounding electrode, the circuit of second copper foil layer 32 is grounded.Specifically, described connect
Ground via 30c runs through the flexible substrate layer 10, and the earth conductor 30d is the copper post through the ground via 30c.It is described
Earth conductor 30d realizes that second copper foil layer 32 is grounded, so as to provide the various lines knot of the Rigid Flex 100
Structure.The ground via 30c is separated from each other with the signal via 30a, and the ground via 30c be similarly positioned in it is described soft
Property substrate layer 10 the second area 10b in, the ground via 30c cuts down second area's 10b stress of flexible parent metal 10 so that described
Rigid Flex 100 is ensureing the first area 10a assemblings of the Rigid Flex 100 by force in the flexible raisings of the second area 10b
In the case of degree so that the second area 10b is easier to deformation, and Rigid Flex 100 can be allowd to adapt to multiple terminal, improves
The assembly performance of the Rigid Flex 100.In other embodiments, the flexible substrate layer 10 can also set two phases
The second area 10b between two the firstth area 10a is connected to every the firstth area 10a of setting and one, so as to utilize institute
State the second area 10b flexible raising so that the line layer 22 on one of them described firstth area 10a, and the electricity on line layer 22
Subcomponent is used as plug port, so as to improve the assembly performance of Rigid Flex 100.
Further, the Rigid Flex 100 also includes the first cover layer 41 and the second cover layer 42, and described first covers
Epiphragma 41 and second cover layer 42 fit on first copper foil layer 31 and second copper foil layer 32 respectively, and in institute
The orthographic projection region and the secondth area 10b for stating in flexible substrate layer 10 coincide.
In present embodiment, first cover layer 41 and second cover layer 42 are respectively to first copper foil layer 31
Protected with second copper foil layer 32.First cover layer 41 and second cover layer 42 with the flexible parent metal
Second area 10b of floor 10 is corresponding.First cover layer 41 and second cover layer 42 show flexibility, so that institute
Rigid Flex 100 is stated in the second easy bendings of area 10b, improves the flexibility of the Rigid Flex 100.First cover layer 41
It is seamless spliced in the flexible substrate layer 10 with the rigid insulation layer 21, so as to jointly in the flexible substrate layer 10
First copper foil layer 31 is covered, and then avoids first copper foil layer 31 from being exposed in air, prevents first copper foil layer
31 short circuits.Specifically, first cover layer 41 can use polyester material progress hot-forming.First cover layer 41 is logical
Paste adhesive is crossed on first copper foil layer 31.Specifically, first cover layer 41 fits in first copper foil completely
On layer 31, and signal lead of first copper foil layer 31 on the secondth area 10b and ground connection cabling are covered, with described in protection
Signal lead and ground connection cabling are not lost or damaged on first copper foil layer 41, meanwhile, by the way of paste adhesive,
Enable to the connection of first cover layer 41 and first copper foil layer 31 closer, prevent first cover layer 41 from moving
Position and the part cabling for exposing first cover layer 41 can not be protected.Second cover layer 42 covers with described first
The identical setting of the structure of epiphragma 41, will not be repeated here.Certainly, in other embodiments, if the Rigid Flex 100 is only set
One layer of first copper foil layer 31 is put, then the Rigid Flex 100 can also only set one layer of first cover layer 41.
Further, the Rigid Flex 100 includes two rigid circuit base plates 20, two rigid circuits
Substrate 20 is individually fixed in the both sides of flexible substrate layer 10.
In present embodiment, the rigid insulation layer 21 of two rigid circuit base plates 20 fits in first bronze medal respectively
In layers of foil 21 and second copper foil layer 22.It can also set and run through between the line layer 22 of two rigid circuit base plates 20
The signal electric conductor of two layers of rigid insulation layer 21 and the flexible substrate layer 10, utilize the both ends point of the signal electric conductor
The signal lead of two layers of line layer 22 is not electrically connected to, so as to realize the signal conduction of two layers of line layer 22, so as to
So that the line construction variation of the soft junction plywood 100, and be also possible that on two rigid circuit base plates 20
The mutual conduction of soldered elements 25, so as to further cause the structure diversification of Rigid Flex 100.In other embodiment
In, signal lead can set two kinds of different arrangement modes respectively on the line layer 22 of two rigid circuit base plates 10,
The soldered elements 25 of two rigid circuit base plates 10 can be different with the signal lead arrangement mode of line layer 22 respectively
And different welding positions is set to be laid out.
The present invention also provides a kind of terminal (not shown), and the terminal includes body (not shown), in the body
The mainboard (not shown) and the Rigid Flex 100 in portion, the Rigid Flex 100 are located at the body interior, and with
The mainboard electrical connection.The terminal can be mobile phone, computer, flat board, handheld device or media player etc..
The Rigid Flex and terminal of the present invention, by fixing the strengthening course on the anti-solder ink layer, utilizes institute
State strengthening course to enclose in the week side of boss of multiple soldered elements so that intensity of the Rigid Flex at firstth area increases
Greatly, so improve the Rigid Flex hardness assembling intensity.
Above is the preferred embodiment of the present invention, it is noted that for those skilled in the art,
Under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (10)
1. a kind of Rigid Flex, it is characterised in that the Rigid Flex includes flexible substrate layer and rigid circuit base plate, institute
Stating flexible substrate layer includes the firstth area, and the rigid circuit base plate includes rigid insulation layer, line layer, anti-solder ink layer, reinforcement
Layer and multiple soldered elements, the rigid insulation layer are fixed in the flexible substrate layer, and in the flexible substrate layer
Orthographic projection region is coincided with firstth area, and the line layer is arranged on the rigid insulation layer, the anti-solder ink layer
The line layer is covered, the anti-solder ink layer sets multiple welding holes, and multiple soldered elements are respectively welded in multiple institutes
State in welding hole, and electrically connect the line layer, the strengthening course is fixed on the anti-solder ink layer, and is enclosed in multiple institutes
The week side of boss of soldered elements is stated, so that intensity increase of the Rigid Flex at firstth area, and then improve described soft or hard
The hardness assembling intensity of board.
2. Rigid Flex according to claim 1, it is characterised in that the Rigid Flex also includes copper foil layer, institute
State copper foil layer to be arranged in the flexible substrate layer, and be laminated between the flexible substrate layer and the rigid insulation layer.
3. Rigid Flex according to claim 2, it is characterised in that the rigid insulation layer sets through hole, described logical
The electric conductor for electrically connecting the copper foil layer and the line layer is set in hole.
4. Rigid Flex according to claim 2, it is characterised in that the Rigid Flex includes two layers of copper foil
Layer, is the first copper foil layer and the second copper foil layer respectively, and first copper foil layer and second copper foil layer are arranged in described respectively
The opposite both sides of flexible substrate layer.
5. Rigid Flex according to claim 4, it is characterised in that first copper foil layer is provided with insertion to described the
The signal via of two copper foil layers, the letter for connecting first copper foil layer and second copper foil layer is provided with the signal via
Number conductor.
6. Rigid Flex according to claim 4, it is characterised in that first copper foil layer is provided with insertion to described the
The ground via of two copper foil layers, the ground via is interior to set the ground connection for connecting first copper foil layer and second copper foil layer
Conductor.
7. Rigid Flex according to claim 4, it is characterised in that the flexible substrate layer is also described including being connected to
Secondth area of the first area edge, the Rigid Flex also include the first cover layer and the second cover layer, first cover layer
Fitted in respectively on first copper foil layer and second copper foil layer with second cover layer, and in the flexible substrate layer
On orthographic projection region coincided with secondth area.
8. Rigid Flex according to claim 1, it is characterised in that the Rigid Flex includes two hardness
Circuit base plate, two rigid circuit base plates are individually fixed in the flexible substrate layer both sides.
9. Rigid Flex according to claim 1, it is characterised in that the strengthening course is steel reinforcement.
10. a kind of terminal, it is characterised in that the terminal includes body, the mainboard located at the body interior and such as right
It is required that Rigid Flex described in 1~9 any one, the Rigid Flex is located at the body interior, and electric with the mainboard
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105725.6A CN105578732B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105725.6A CN105578732B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578732A CN105578732A (en) | 2016-05-11 |
| CN105578732B true CN105578732B (en) | 2018-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105725.6A Active CN105578732B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
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| CN (1) | CN105578732B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI604763B (en) * | 2016-11-18 | 2017-11-01 | 同泰電子科技股份有限公司 | Rigid-flex board structure |
| CN111425826A (en) * | 2019-01-10 | 2020-07-17 | 同扬光电（江苏）有限公司 | Soft and hard combined line structure and backlight module with same |
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2016
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|---|---|---|---|---|
| JP2002176247A (en) * | 2000-12-11 | 2002-06-21 | Ibiden Co Ltd | Method for filling hole of flat body |
| CN102159026A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN105578732A (en) | 2016-05-11 |
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