CN109041418A - A kind of board structure of circuit and electronic equipment - Google Patents
A kind of board structure of circuit and electronic equipment Download PDFInfo
- Publication number
- CN109041418A CN109041418A CN201811150119.1A CN201811150119A CN109041418A CN 109041418 A CN109041418 A CN 109041418A CN 201811150119 A CN201811150119 A CN 201811150119A CN 109041418 A CN109041418 A CN 109041418A
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- Prior art keywords
- circuit
- circuit board
- component
- pin
- board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
It includes first circuit board and second circuit board that the present invention, which provides a kind of board structure of circuit and electronic equipment, board structure of circuit, at least one first component is provided between first circuit board and second circuit board；Every one first component is provided with the first pin and the second pin；First circuit board is equipped with the first pad corresponding with the first pin, second circuit board is equipped with the second pad corresponding with the second pin, first pin is welded in the first pad, and the second pin is welded in the second pad, and first circuit board is electrically connected by the first component with second circuit board.Board structure of circuit provided in an embodiment of the present invention, the route on first circuit board and second circuit board is electrically connected by the first component, the length of route on first circuit board and second circuit board can be shortened, conduct performance between first circuit board and second circuit board to be promoted.
Description
Technical field
The present invention relates to circuit design field more particularly to a kind of board structure of circuit and electronic equipment.
Background technique
With the rapid development of electronic technology, the electronic equipments such as smart phone and tablet computer are more more and more universal, and have become
For tool indispensable in people's daily life.In order to meet the needs of people are for electronic equipment, electronic equipment passes through member
The improvement of device performance and newly-increased component realize more and more functions.
Since component is continuously increased in electronic equipment, component needs to occupy printed circuit board (Printed
Circuit Board, PCB) on more and more loaded areas.In the prior art, the stack manner of use " sandwich "
Realize the loaded area for increasing component, i.e., as shown in Figure 1, the bearer circuit plate for being used to carry component for two pieces is mutually folded
And if another connection circuit board is welded between two blocks of bearer circuit plates, which usually surrounds two pieces of bearer circuits
Component setting between plate passes through two blocks of bearer circuit plates of connection board support and electrical connection.But due to passing through connection
Circuit board connection will increase the length of the connection line between two blocks of bearer circuit plates, lead to the electricity between two blocks of bearer circuit plates
Conduction property reduces, when the connection line between especially two blocks of bearer circuit plates is more.
As it can be seen that presently, there are causing the length of the connection line between two blocks of bearer circuit plates to increase because of connection circuit board,
Cause between two blocks of bearer circuit plates the problem of conducting reduced performance.
Summary of the invention
The embodiment of the present invention provides a kind of board structure of circuit and electronic equipment, and to solve, presently, there are because connection circuit board draws
The length for playing the connection line between two blocks of bearer circuit plates increases, and causes to conduct performance drop between two blocks of bearer circuit plates
Low problem.
In order to solve the above technical problems, the present invention is implemented as follows:
In a first aspect, the embodiment of the present invention provides a kind of board structure of circuit, including first circuit board and second circuit board:
At least one first component is provided between the first circuit board and the second circuit board；
Each first component is provided with the first pin and the second pin；
The first circuit board is equipped with the first pad corresponding with first pin, and the second circuit board is equipped with and institute
Corresponding second pad of the second pin is stated, first pin is welded in first pad, and second pin is welded in institute
The second pad is stated, and the first circuit board is electrically connected by first component with the second circuit board.
Second aspect, the embodiment of the present invention also provide a kind of electronic equipment, including the hardened structure of foregoing circuit.
In the embodiment of the present invention, board structure of circuit includes first circuit board and second circuit board, first circuit board and second
At least one first component is provided between circuit board；Every one first component is provided with the first pin and the second pin；The
One circuit board is equipped with the first pad corresponding with the first pin, and second circuit board is equipped with the second pad corresponding with the second pin,
First pin is welded in the first pad, and the second pin is welded in the second pad, and the first component is by first circuit board and second
Circuit board electrical connection.In this way, being electrically connected the route on first circuit board and second circuit board by the first component, can contract
The length of route on short first circuit board and second circuit board, to promote the conductance between first circuit board and second circuit board
General character energy.
Detailed description of the invention
Fig. 1 is one of the structural schematic diagram of board structure of circuit provided in an embodiment of the present invention；
Fig. 2 is the second structural representation of board structure of circuit provided in an embodiment of the present invention；
Fig. 3 is the third structural representation of board structure of circuit provided in an embodiment of the present invention；
Fig. 4 is the four of the structural schematic diagram of board structure of circuit provided in an embodiment of the present invention；
Fig. 5 is the five of the structural schematic diagram of board structure of circuit provided in an embodiment of the present invention；
Fig. 6 is the six of the structural schematic diagram of board structure of circuit provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It is a kind of structural schematic diagram of board structure of circuit provided in an embodiment of the present invention referring to Fig. 1, Fig. 1, as shown in Figure 1,
Board structure of circuit includes first circuit board 10 and second circuit board 20, it is characterised in that:
At least one first component 30 is provided between first circuit board 10 and second circuit board 20；
Every one first component 30 is provided with the first pin 31 and the second pin 32；
First circuit board 10 is equipped with first pad 11 corresponding with the first pin 31, and second circuit board 20 is equipped with and the second pipe
Corresponding second pad 21 of foot 32, the first pin 31 are welded in the first pad 11, and the second pin 32 is welded in the second pad 21, and
First circuit board 10 is electrically connected by the first component 30 with second circuit board 20.
Here, due to the component that the first component 30 carries between first circuit board 10 and second circuit board 20,
One component 30 can be close to the center setting of first circuit board 10 and the bearing area on second circuit board 20, the carrying
Region passes through the first component 30 for the line electricity on first circuit board 10 and second circuit board 20 for carrying component
Connection, can shorten the length of route on first circuit board 10 and second circuit board 20, to promote first circuit board 10 and the
Performance is conducted between two circuit boards 20.
It should be noted that above-mentioned first circuit board 10 and second circuit board 20 can be and any can carry component 30
Circuit board, can be the circuit board of single layer board, double-layer circuit board or three layers or three layers or more, such as: above-mentioned
One circuit board 10 and second circuit board 20 all can be single layer boards；Or one in first circuit board 10 and second circuit board 20
Block circuit board is single layer board and another piece of circuit board is double-layer circuit board, etc., is not defined herein.
In addition, due on by first circuit board 10 to the direction of second circuit board 20, first circuit board 10 and the second electricity
The length of component between road plate 20 may be longer, so as to cause the general thickness of board structure of circuit thicker.
In the embodiment of the present invention, the one side of either circuit plate can be opened up in first circuit board 10 and second circuit board 20
Have opening so that on another circuit board higher component by the opening across above-mentioned side so that on a circuit board
Component can partially protrude into or through another circuit board, realize the reduction of board structure of circuit general thickness.
Wherein, above-mentioned opening can be the sunk area on circuit board or the opening of hollowed out area, can according to
The height of the opposite component of the opening is set.Such as: as shown in Fig. 2, the component A on second circuit board 20 is slightly higher
In the case where, the first opening 101 of sunk area can be offered on first circuit board 10, and on second circuit board 20 and be somebody's turn to do
First 101 opposite component A of opening can be partially protruded into the first opening 101, i.e. component A does not run through first circuit board
10；And when the component B on first circuit board 10 is much higher than the height of component A, it can be opened up on second circuit board 20
There is the second opening 201 of hollowed out area, and can pass through on first circuit board 10 with second opening, 201 opposite component B
Second opening 201 runs through second circuit board 20.
In the embodiment of the present invention, at least one above-mentioned first component 30, which can be, is set to first circuit board 10 and second
It is some or all of in component between circuit board 20, such as: between first circuit board 10 and second circuit board 20
Component number is less, and each component height it is consistent when, can will be between first circuit board 10 and second circuit board 20
All components are as above-mentioned first component 30.
The function pin for realizing its normal work, and the function pin of component are usually provided in existing component
It is usually only welded on first circuit board 10 or second circuit board 20, component and circuit where it is realized by function pin
The electrical connection of plate, to realize the normal work of the component.
Wherein, the first pin 31 on above-mentioned first component 30 or the second pin 32 can be the first component 30
Function pin, and when first circuit board 10 and second circuit board 20 are electrically connected by the first component 30, the first pin 31 or
The normal work of the first component 30 still may be implemented in second pin 32；Alternatively, above-mentioned first pin 31 and the second pin 32
It is also possible to be different from the newly-increased pin of the function pin of the first component 30.
In addition, being welded on the first pad 11 in the first pin 31 and the second pin 32 is welded on the second pad 21
In the case where, first circuit board 10 and second circuit board 20 can be electrically connected by the first component 30, thus the first pin 31
And second need to be set as to electrically conduct between pin 32.
First pin 31 and one are provided only with it should be noted that can be on above-mentioned every one first component 30
Second pin 32, to realize the conducting of a route between first circuit board 10 and second circuit board 20；Certainly, above-mentioned each
Also multiple first pins 31 and multiple second pins 32 can be set on first component 30, passed through multiple second pin, 31 Hes
Multiple second pins 32 realize the conducting of a plurality of route between first circuit board 10 and second circuit board 20.
In addition, the first pin 31 and the second pin 32 electrically conduct, it can be and mark line on the surface of the first component 30
Road passes through route the first pin 31 of realization of marking and electrically conducting for the second pin 32, naturally it is also possible to by other means,
Herein and it is not construed as limiting.
In the embodiment of the present invention, can be between above-mentioned first circuit board 10 and second circuit board 20 only by it is above-mentioned at least
One the first component 30 supports and realizes electrical connection, at least one first component 30 above-mentioned at this time can be by first circuit board
All line conductions for needing to be electrically connected between 10 and second circuit board 20, and at least one first component 30 can be first
Circuit board 10 and second circuit board 20 provide enough support forces, play the role of bracket.
Alternatively, optional, as shown in figure 3, being provided with bearing area on first circuit board 10 and second circuit board 20, (figure is not
Show), bearing area is used for welding component, and at least one first component 30 is located in bearing area；Board structure of circuit is also
Including tertiary circuit plate 40, tertiary circuit plate 40 is located between first circuit board 10 and second circuit board 20, and tertiary circuit
Plate 40 is arranged around bearing area；First circuit board 10 and second circuit board 20 are also electrically connected by tertiary circuit plate 40.
Here, tertiary circuit plate 40 is located between first circuit board 10 and second circuit board 20, can be to the first circuit
Plate 10 and second circuit board 20 are supported, and promote the fastness of board structure of circuit；Moreover, first circuit board 10 and second circuit
Plate 20 is also electrically connected by tertiary circuit plate 40, so as to connect between flexible setting first circuit board 10 and second circuit board 20
The cabling mode of link, and then can further shorten connection line between first circuit board 10 and second circuit board 20
Length.
Wherein, above-mentioned tertiary circuit plate 40 can be and any can prop up first circuit board 10 and second circuit board 20
Support, and the circuit board that first circuit board 10 and second circuit board 20 are electrically connected can be single layer board or multilayer electricity
Road plate；And tertiary circuit plate 40 can be one block of integrated circuit plate, or be made of muti-piece circuit board, herein and without limit
It is fixed.
In addition, at least one first component 30 is set to carrying since tertiary circuit plate 40 is around bearing area setting
In region, and first circuit board 10 and second circuit board 20 can pass through tertiary circuit plate 40 and every one first component 30 respectively
Therefore electrical connection selects suitable connection type that can effectively shorten the company between first circuit board 10 and second circuit board 20
The length of link.
Optionally, it is provided with the first circuit on first circuit board 10, second circuit, and are provided on second circuit board 20
One circuit and second circuit pass through at least one first component 30 and are electrically connected, wherein the first circuit and second circuit at least
The sum of the distance between one first component 30, less than the first circuit and the distance between second circuit and tertiary circuit plate 40
The sum of, since the sum of the first circuit and the distance between second circuit and the first component 30 are closer, the first circuit and the second electricity
Road is electrically connected by the first component 30, so as to further shorten the company between first circuit board 10 and second circuit board 20
The length of link.
Since first circuit board 10 and second circuit board 20 can pass through at least one first component 30 and third simultaneously
Circuit board 40 supports, i.e., at least the first component 30 and tertiary circuit plate 40 are welded in first circuit board 10 and second circuit board
Between 20.Optionally, in first circuit board 10 towards on the direction of second circuit board 20, the height of the first component 30 is equal to the
At least one the first component 30 and tertiary circuit plate 40 are welded in the first electricity to be easily achieved by the height of three-circuit plate 40
Between road plate 10 and second circuit board 20, while promoting the welding stability of board structure of circuit.
Certainly, in first circuit board 10 towards on the direction of second circuit board 20, the first component 30 and tertiary circuit plate
Also it can have certain difference in height between 40, above-mentioned difference in height can be made up by welding compounds such as scolding tin in welding.
It should be noted that at least one above-mentioned first component 30 is set in bearing area, at least one can be
First component 30 is set to any position in bearing area.Optionally, at least one first component 30 is one first
Component 30, first component 30 are set to the central location of bearing area；At least one first component 30 includes more
A first component 30, multiple first components 30 are uniformly distributed in bearing area, so as to increase at least one first yuan
Device 30 can further shorten 10 He of first circuit board to the enabling capabilities of first circuit board 10 and second circuit board 20
The length of connection line between second circuit board 20.
As above, it includes first component 30 that board structure of circuit, which can be only, is also possible to include multiple first yuan of device
Part 30, and in the case where board structure of circuit includes multiple first component 30, to promote each first component 30 to the first electricity
Support balance quality between road plate 10 and second circuit board, optionally, board structure of circuit include multiple first components 30,
Towards on the direction of second circuit board 20, the difference in height between multiple first components 30 is less than or equal to first circuit board 10
Preset height is poor.
In the embodiment of the present invention, above-mentioned first component 30 can also be that at least two components stack the first device to be formed
Part, and can be electrically connected between at least two component, such as: as shown in figure 4, the first component 30 is by component C and member
Device D is folded to be set to be formed, and component C and component D weld together, and component C is welded on first circuit board 10, component
D is welded on second circuit board.
Optionally, as shown in figure 5, the first component 30 is equipped with third pin 33, first circuit board 10 is equipped with and the
The corresponding third pad 12 of three-prong 33, third pin 33 are welded on third pad 12；
Board structure of circuit further includes the second component 50, and the second component 50 is set to first circuit board 10 far from the second electricity
The side of road plate 20, the second component 50 are equipped with the 4th pin 51, and first circuit board 10 is equipped with corresponding with the 4th pin 51
4th pad 13, the 4th pin 51 are welded on the 4th pad 13, and the 4th pin 51 passes through first circuit board 10 and third pipe
Foot 33 is electrically connected.
Here, the 4th pin 51 on the second component 50 passes through the third on first circuit board 10 and the first component 30
Pin 33 is electrically connected, so as to realize the electrical connection of the first component 30 and the second component 50, when 30 He of the first component
When second component 50 is stackable component, compared to the mode of stacking, by the first component 30 and the second component 50
The two sides of first circuit board 10 are set to, the height of board structure of circuit, 30 He of especially the first component can be effectively reduced
In higher-height situation when second component 50 stacks.
Wherein, above-mentioned third pin 33 can be the pin that the first pin 31 is different from the first component 30, to make
First component 30 can be not only electrically connected with the second component 50 on first circuit board 10, can also be with first circuit board 10
On other circuits or component electrical connection；Alternatively, optional, third pin 33 is the first pin 31, to realize first
Component 30 is only electrically connected with the second component 50.
It is electrically connected in addition, above-mentioned 4th pin 51 passes through first circuit board 10 with third pin 33, then first circuit board 10
On be provided with connection the 4th pin 51 and third pin 33 connection line.Optionally, third pad 12 and the 4th pad 13 be just
To the two sides for being set to first circuit board 10, and first circuit board 10 is equipped with and is extended from third pad 12 to the 4th pad 13
Connection line, third pad 12 and the 4th pad 13 be electrically connected by connection line, thus when third pin 33 managed with the 4th
Connection line between foot 51 is most short, and further promote board structure of circuit conducts performance.
Certainly, a component being electrically connected with the first component 30 also can be set on above-mentioned second circuit board 10, herein
And without repeating.
It should be noted that the hardened structure of foregoing circuit in addition to including above-mentioned each component, can also include other component, example
Such as: as shown in fig. 6, board structure of circuit can also include shielding part 60, the setting of shielding part 60 is with first circuit board 10 far from second
The one side of circuit board 20, shielding part 60 and first circuit board 10 surround accommodating space 70, and first circuit board 10 is far from second
Component on the one side of circuit board 20 is contained in above-mentioned accommodating space 70, and shielding part 60 can will be located at accommodating space
Component and extraneous shielding in 70；Similarly, screen also can be set in one side of the second circuit board 20 far from first circuit board 10
Shield 60, herein and without repeating.
In the embodiment of the present invention, board structure of circuit includes first circuit board and second circuit board, first circuit board and second
At least one first component is provided between circuit board；Every one first component is provided with the first pin and the second pin；The
One circuit board is equipped with the first pad corresponding with the first pin, and second circuit board is equipped with the second pad corresponding with the second pin,
First pin is welded in the first pad, and the second pin is welded in the second pad, and the first component is by first circuit board and second
Circuit board electrical connection.In this way, being electrically connected the route on first circuit board and second circuit board by the first component, can contract
The length of route on short first circuit board and second circuit board, to promote the conductance between first circuit board and second circuit board
General character energy.
Optionally, during the present invention is implemented, the first component is the component of encapsulating structure.Pin can be from package main body
The pin of extraction is also possible to the pad on package main body surface, for welding with circuit board patch.
Based on the hardened structure of foregoing circuit, the embodiment of the present invention also provides a kind of electronic equipment, including the hardened structure of foregoing circuit.
Since the structure of electronic equipment ontology is the prior art, board structure of circuit has carried out specifically in the above-described embodiments
It is bright, therefore, the structure of specific electronic equipment is repeated no more in the present embodiment.
In the embodiment of the present invention, above-mentioned electronic equipment can be mobile terminal, such as: mobile phone, tablet computer (Tablet
Personal Computer), laptop computer (Laptop Computer), personal digital assistant (personal digital
Assistant, abbreviation PDA), mobile Internet access device (Mobile Internet Device, MID) or wearable device
(Wearable Device) etc. can also be other electronic equipments, such as digital camera, e-book, navigator.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (10)
1. a kind of board structure of circuit, including first circuit board and second circuit board, it is characterised in that:
At least one first component is provided between the first circuit board and the second circuit board；
Each first component is provided with the first pin and the second pin；
The first circuit board is equipped with the first pad corresponding with first pin, and the second circuit board is equipped with and described the
Corresponding second pad of two pins, first pin are welded in first pad, and second pin is welded in described
Two pads, and the first circuit board is electrically connected by first component with the second circuit board.
2. board structure of circuit according to claim 1, it is characterised in that:
First component is equipped with third pin, and the first circuit board is equipped with third corresponding with the third pin
Pad, the third pin are welded on the third pad；
The board structure of circuit further includes the second component, and second component is set to the first circuit board far from described
The side of second circuit board, second component are equipped with the 4th pin, and the first circuit board is equipped with and the 4th pipe
Corresponding 4th pad of foot, the 4th pin are welded on the 4th pad, and the 4th pin passes through described first
Circuit board is electrically connected with the third pin.
3. board structure of circuit according to claim 2, it is characterised in that:
The third pin is first pin.
4. according to board structure of circuit described in claim 2 or 3, it is characterised in that:
The third pad and the 4th pad face are set to the two sides of the first circuit board, and first circuit
Plate is equipped with the connection line extended from the third pad to the 4th pad, the third pad and the 4th pad
It is electrically connected by the connection line.
5. board structure of circuit according to claim 1, it is characterised in that:
Bearing area is provided on the first circuit board and the second circuit board, the bearing area is for welding first device
Part, and at least one described first component is located in the bearing area；
The board structure of circuit further includes tertiary circuit plate, and the tertiary circuit plate is located in the first circuit board and described
Between two circuit boards, and the tertiary circuit plate is arranged around the bearing area；The first circuit board and second electricity
Road plate also passes through the tertiary circuit plate electrical connection.
6. board structure of circuit according to claim 5, it is characterised in that:
It is provided with the first circuit on the first circuit board, second circuit, and described first are provided on the second circuit board
Circuit and the second circuit pass through at least one first component electrical connection, wherein first circuit and described the
The sum of the distance between two circuits and at least one first component, be less than first circuit and the second circuit with
The sum of the distance between described tertiary circuit plate.
7. according to board structure of circuit described in claim 5 or 6, it is characterised in that:
In the first circuit board towards on the direction of the second circuit board, the height of first component is equal to described the
The height of three-circuit plate.
8. according to board structure of circuit described in claim 5 or 6, it is characterised in that:
At least one described first component is first component, and one first component is set to the supporting region
The central location in domain；
At least one described first component includes multiple first components, and the multiple first component is uniformly distributed in described
Bearing area.
9. board structure of circuit according to claim 1, it is characterised in that:
The board structure of circuit includes multiple first components, in the first circuit board towards the second circuit board
On direction, it is poor that the difference in height between multiple first components is less than or equal to preset height.
10. a kind of electronic equipment, which is characterized in that the electronic equipment includes electric as claimed in any one of claims 1-9 wherein
The hardened structure in road.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811150119.1A CN109041418B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
| PCT/CN2019/107755 WO2020063645A1 (en) | 2018-09-29 | 2019-09-25 | Circuit board structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811150119.1A CN109041418B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109041418A true CN109041418A (en) | 2018-12-18 |
| CN109041418B CN109041418B (en) | 2020-08-11 |
Family
ID=64615065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811150119.1A Active CN109041418B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109041418B (en) |
| WO (1) | WO2020063645A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020063645A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
| CN113692116A (en) * | 2021-07-16 | 2021-11-23 | 苏州浪潮智能科技有限公司 | Integrated circuit board assembly, manufacturing method thereof and electronic equipment |
| WO2021244530A1 (en) * | 2020-06-02 | 2021-12-09 | 苏州旭创科技有限公司 | Circuit board assembly, assembling method, and optical module |
| US11825604B2 (en) | 2021-10-14 | 2023-11-21 | Unimicron Technology Corporation | Circuit board assembly |
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| CN108353500A (en) * | 2015-11-27 | 2018-07-31 | 索尼公司 | Board device and the method for manufacturing board device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020063645A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
| WO2021244530A1 (en) * | 2020-06-02 | 2021-12-09 | 苏州旭创科技有限公司 | Circuit board assembly, assembling method, and optical module |
| CN113692116A (en) * | 2021-07-16 | 2021-11-23 | 苏州浪潮智能科技有限公司 | Integrated circuit board assembly, manufacturing method thereof and electronic equipment |
| US11825604B2 (en) | 2021-10-14 | 2023-11-21 | Unimicron Technology Corporation | Circuit board assembly |
| TWI824318B (en) * | 2021-10-14 | 2023-12-01 | 欣興電子股份有限公司 | Circuit board connection structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109041418B (en) | 2020-08-11 |
| WO2020063645A1 (en) | 2020-04-02 |
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