CN203482483U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN203482483U CN203482483U CN201320523568.2U CN201320523568U CN203482483U CN 203482483 U CN203482483 U CN 203482483U CN 201320523568 U CN201320523568 U CN 201320523568U CN 203482483 U CN203482483 U CN 203482483U
- Authority
- CN
- China
- Prior art keywords
- fracture
- circuit board
- glue
- line
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Provided is a circuit board. The circuit board includes a first flexible circuit board, a first glue layer, a first reinforcement board, a second glue layer and a second flexible circuit board, wherein the first reinforcement board is provided with a through first fracture opening, and the area, which corresponds to the first fracture opening, of the circuit boards is a bendable area.
Description
Technical field
The utility model relates to a kind of board structure of circuit.
Background technology
Flexible circuit board is widely used in many electronic products because having the characteristic that can destroy or force to yield.Flexible circuit board is comparatively soft, be unfavorable for welding and support part, in order to be conducive to weld parts and support part, need to be at the back side reinforcing plate in the flexible circuit board region of soldering part, but this has caused cannot soldering part by the flexible circuit board region of lamination reinforcement plate, therefore generally need the design that adopts the positive back side of part to stagger, make just back side while soldering part of flexible circuit board, and make the back side lamination reinforcement plate in the flexible circuit board region of soldering part, but this design can increase the area of flexible circuit board, be unfavorable for the assembling of circuit board.
Because of rigid circuit board hardness better, therefore the back side in the rigid circuit board region of soldering part does not need reinforcing plate yet, therefore rigid circuit board plate can and not be subject to position limitation at its positive back side while soldering part, still, rigid circuit board does not possess the characteristic that can destroy or force to yield.
Utility model content
In view of this, be necessary to provide a kind of can destroy or force to yield and both sides over against position the circuit board of soldering part simultaneously.
A kind of circuit board, comprise the first flexible circuit board, the first glue-line, the first stiffening plate, the second glue-line and the second flexible circuit board that are affixed successively, described the first stiffening plate has the first fracture of a perforation, the region Wei Ke flexable-broken area territory corresponding with described the second fracture of described circuit board.
Preferably, described the first glue-line has the second fracture of a perforation, and described the second glue-line has the 3rd fracture of a perforation, thus described the first fracture, the second fracture and the 3rd fracture site correspondence and shape is roughly the same connects.
Preferably, described the first flexible circuit board comprises the first covering rete, the first conducting wire layer and the first substrate layer being affixed successively, described the second flexible circuit board comprises the second covering rete, the second conducting wire layer and the second substrate layer being affixed successively, described the first substrate layer and described the first glue-line are directly affixed, and described the second substrate layer and described the second glue-line are directly affixed.
Preferably, described first covers the first opening that rete is formed with a plurality of perforations, described the first conducting wire layer of part comes out from described the first opening, described the first conducting wire layer coming out from described the first opening forms the first weld pad, described the first weld pad surface soldered has the first electronic component, the setting of staggering of described the first fracture and described the first opening.
Preferably, described second covers the second opening that rete is formed with a plurality of perforations, described the second conducting wire layer of part comes out from described the second opening, described the second conducting wire layer coming out from described the second opening forms the second weld pad, described the second weld pad surface soldered has the second electronic component, the setting of staggering of described the first fracture and described the second opening.
Preferably, described the first opening and the second opening are over against setting.
Preferably, described circuit board also comprises the 4th glue-line and the 3rd flexible circuit board of a side of described the second glue-line dorsad that is affixed on mutually successively the second flexible circuit board.
Preferably, described the first flexible circuit board has the second fracture of a perforation, described the first glue-line has the 3rd fracture of a perforation, described the second glue-line has the 4th fracture of a perforation, described the 4th glue-line has the 7th fracture of a perforation, described the 3rd flexible circuit board has the 8th fracture of a perforation, described the first, second, third, fourth, the 7th and the 8th fracture equal position correspondence and shape are roughly the same, and described the first fracture, the 3rd fracture, the second fracture and the 4th fracture connect, described the 7th fracture and the 8th fracture connect.
Preferably, described circuit board also comprises the 3rd glue-line and the second stiffening plate being affixed, and described the 3rd glue-line and described the second flexible circuit board are affixed, described the second stiffening plate and described the 4th glue-line are affixed, described the 3rd glue-line has the 5th fracture of a perforation, described the second stiffening plate has the 6th fracture of a perforation, described the 5th fracture and described the 6th fracture are all corresponding with described the first fracture site and shape is roughly the same, and described the 5th fracture, the 6th fracture, the 7th fracture and the 8th fracture connect.
Preferably, described the first flexible circuit board comprises the first covering rete, the first conducting wire layer and the first substrate layer being affixed successively, described the 3rd flexible circuit board comprises the second covering rete, the second conducting wire layer and the second substrate layer being affixed successively, described the first substrate layer and described the first glue-line are directly affixed, and described the second substrate layer and described the 4th glue-line are directly affixed.
Preferably, described first covers the first opening that rete is formed with a plurality of perforations, described the first conducting wire layer of part comes out from described the first opening, described the first conducting wire layer coming out from described the first opening forms the first weld pad, and described the first weld pad surface soldered has the first electronic component.
Preferably, described second covers the second opening that rete is formed with a plurality of perforations, described the second conducting wire layer of part comes out from described the second opening, described the second conducting wire layer coming out from described the second opening forms the second weld pad, and described the second weld pad surface soldered has the second electronic component.
Preferably, described the first opening and the second opening are over against setting.
The technical program provide the stiffening plate of circuit board be all positioned at the internal layer of described circuit board, therefore, the welding electronic part simultaneously over against position of the both sides of described circuit board, thus the area of circuit board can be reduced, and then be also convenient to the assembling of circuit board and save circuit board making cost.
Accompanying drawing explanation
Fig. 1 is the generalized section of the circuit board that provides of the technical program the first embodiment.
Fig. 2 is the generalized section of the circuit board that provides of the technical program the second embodiment.
Main element symbol description
| |
100，900 |
| The first |
110，910 |
| The first glue- |
120，920 |
| |
130，930 |
| The second glue- |
140，940 |
| The second |
150，950 |
| First covers |
111，911 |
| The first conducting |
112，912 |
| The |
113，913 |
| The |
1111，9111 |
| The first |
1112，9112 |
| The |
131，931 |
| The |
121，916 |
| The |
141，921 |
| Second covers |
151，991 |
| The second conducting |
152，992 |
| The |
153，993 |
| The |
1511，9911 |
| The second |
1512，9912 |
| The first opening | 1113，9113 |
| The |
1121，9121 |
| The first |
114，914 |
| The first |
115，915 |
| The second opening | 1513，9913 |
| The |
1521，9921 |
| The second |
154，957 |
| The second |
155，958 |
| The first |
101，901 |
| The 3rd glue- |
960 |
| The second |
970 |
| The 4th glue- |
980 |
| The 3rd |
990 |
| The |
941 |
| The 4th covers |
951 |
| The 4th conducting |
952 |
| The |
953 |
| The 3rd conducting |
954 |
| The 3rd covers |
955 |
| The 4th adhesive- |
9511 |
| The 4th |
9512 |
| The 3rd adhesive- |
9551 |
| The 3rd dielectric layer | 9552 |
| The |
961 |
| The |
971 |
| The |
981 |
| The |
996 |
| The second |
956 |
| The first |
902 |
| The second |
903 |
Following embodiment further illustrates the utility model in connection with above-mentioned accompanying drawing.
Embodiment
Circuit board the technical program being provided below in conjunction with drawings and Examples is described in further detail.
Refer to Fig. 1, the circuit board 100 that the technical program the first embodiment provides comprises the first flexible circuit board 110, the first glue-line 120, the first stiffening plate 130, the second glue-line 140 and the second flexible circuit board 150 being affixed successively.
Described the first flexible circuit board 110 is one side flexible circuit board, and it comprises the first covering rete 111, the first conducting wire layer 112 and the first substrate layer 113 being affixed successively.Described first covers rete 111 comprises the first tack coat 1111 and the first dielectric layer 1112 fitting, and wherein, described the first tack coat 1111 is directly affixed with described the first conducting wire layer 112.The material of described the first tack coat 1111 is the flexible adhesion materials such as Epocryl or epoxy resin.The material of described the first dielectric layer 1112 and described the first substrate layer 113 is the flexible dielectric such as polyimides (PI), polyphenyl dioctyl phthalate glycol ester (PET) and PEN (PEN).Certainly, described first to cover rete 111 can be also only one deck welding resisting layer; Between described the first conducting wire layer 112 and described the first substrate layer 113, can also comprise a tack coat; Described the first flexible circuit board 110 can also be two-sided flexible circuit board or multilayer flexible circuit board, and now described the first flexible circuit board 110 also comprises the conduction fracture that is electrically connected to its each sandwich circuit; Preferably described the first flexible circuit board 110 outermost both sides are insulating barrier, so that conductive circuit pattern is carried out to insulation protection.
The material of described first and second glue-line 120,140 is the flexible adhesion materials such as Epocryl or epoxy resin.Described the first stiffening plate 130 is the conventional insulation supporting material of industry, for example, can be baseplate material (FR1, FR2, FR3, the FR4 of the impregnation resin formation such as paper, glass-fiber-fabric or nonwoven fabrics ...), can be also the materials such as polyimides.Described the first glue-line 120 is directly affixed with described the first substrate layer 113.Described the first glue-line 120 has the second fracture 121 of a perforation, and described the second fracture 121 is divided into two described the first glue-line 120, and described the second fracture 121 is positioned at described circuit board 100 by medium position.Described the first stiffening plate 130 has the first fracture 131 of a perforation, and described the first fracture 131 is divided into two described the first stiffening plate 130.Described the second glue-line 140 has the 3rd fracture 141 of a perforation, and described the 3rd fracture 141 is divided into two described the second glue-line 140.Thereby described the second fracture 121, the first fracture 131 and the 3rd fracture 141 positions are corresponding, shape is roughly the same connects, thus the region corresponding with described the second fracture 121 of described circuit board 100 do not comprise the first stiffening plate 130, for can territory, flexable-broken area.Certainly, described the second fracture 121, the first fracture 131 and the 3rd fracture 141 also can be positioned at one end of described circuit board 100; Described the second fracture 121 and the 3rd fracture 141 also can be set, now described the first glue-line 120 and described the second glue-line 140 are also filled described the first fracture 131, because the first glue-line 120 and second glue-line 140 of this case is flexible material, therefore still can destroy or force to yield in the region corresponding with described the second fracture 121 of described circuit board 100.
Described the second flexible circuit board 150 is similar with described the first flexible circuit board 110.In the present embodiment, described the second flexible circuit board 150 is one side flexible circuit board, it comprises the second covering rete 151, the second conducting wire layer 152 and the second substrate layer 153 being affixed successively, and wherein, described the second substrate layer 153 is directly affixed with described the second glue-line 140.Described second covers rete 151 comprises the second tack coat 1511 and the second dielectric layer 1512 fitting, and wherein, described the second tack coat 1511 is directly affixed with described the second conducting wire layer 152.The material of described the second tack coat 1511 is the flexible adhesion materials such as Epocryl or epoxy resin.The material of described the second dielectric layer 1512 and described the second substrate layer 153 is the flexible dielectric such as polyimides (PI), polyphenyl dioctyl phthalate glycol ester (PET) and PEN (PEN).Certainly, described second to cover rete 151 can be also only one deck welding resisting layer; Between described the second conducting wire layer 152 and described the second substrate layer 153, can also comprise a tack coat; Described the second flexible circuit board 150 can also be two-sided flexible circuit board or multilayer flexible circuit board, and preferably described the second flexible circuit board 150 outermost both sides are insulating barrier, so that conductive circuit pattern is carried out to insulation protection; When described the second flexible circuit board 150 is two-sided or multilayer flexible circuit board, described the second flexible circuit board 150 also comprises the conduction fracture that is electrically connected to its each sandwich circuit.
In the present embodiment, described first of described circuit board 100 covers rete 111 and is formed with a plurality of the first openings 1113, described the first opening 1113 connects described the first tack coat 1111 and the first dielectric layer 1112, described the first conducting wire layer 112 of part comes out from described the first opening 1113, and described the first conducting wire layer 112 coming out from described the first opening 1113 forms the first weld pad 1121.Described the first weld pad 1121 surfaces are formed with the first tin paste layer 114, and described the first tin paste layer 114 surface soldered have the first electronic component 115, and described the first electronic component 115 is electrically connected to described the first weld pad 1121.On described the second covering rete 151, be formed with a plurality of the second openings 1513, described the second opening 1513 connects described the second tack coat 1511 and the second dielectric layer 1512, described the second conducting wire layer 152 of part comes out from described the second opening 1513, and described the second conducting wire layer 152 coming out from described the second opening 1513 forms the second weld pad 1521.Described the second weld pad 1521 surfaces are formed with one second tin paste layer 154, and described the second tin paste layer 154 surface soldered have the second electronic component 155, and described the second electronic component 155 is electrically connected to described the second weld pad 1521.Wherein, the setting of staggering of described the first fracture 131 and described the first opening 1113, the setting of yet staggering of described the first fracture 131 and the second opening 1513,, the region corresponding with described the first fracture 131 of described circuit board 100 do not arrange described the first opening 1113 and the second opening 1513 yet.And, because described the first stiffening plate 130 is positioned at the internal layer of described circuit board 100, therefore, described the first electronic component 115 and described the second electronic component 155 can be positioned at described circuit board 100 both sides over against position, described the first opening 1113 and the second opening 1513 can be positioned at described circuit board 100 both sides over against position.Certainly, described the first weld pad 1121 surfaces can also be formed with one first gold medal layer, and described the first electronic component 115 is welded in described the first gold medal layer surface by described the first tin paste layer 114.Described the second weld pad 1521 surfaces can also be formed with one second gold medal layer, and described the second electronic component 155 is welded in described the second gold medal layer surface by described the second tin paste layer 154.
On described circuit board 100, be also formed with the first conductive hole 101 that is electrically connected to described the first conducting wire layer 112 and described the second conducting wire layer 152.Described the first conductive hole 101 extends to described the second conducting wire layer 152 from described the first conducting wire layer 112, described the first conductive hole 101 can connect described the first conducting wire layer 112, the first substrate layer 113, the first glue-line 120, the first stiffening plate 130, the second glue-line 140, the second substrate layer 153, described the second conducting wire layer 152 also terminates in described the second conducting wire layer 152, also can connect described the first conducting wire layer 112, the first substrate layer 113, the first glue-line 120, the first stiffening plate 130, the second glue-line 140, the second substrate layer 153 also terminates in described the second substrate layer 153.Described the first conductive hole 101 can, for plated metal forms, also can form for filled conductive lotion.
Refer to Fig. 2, the circuit board 900 that the technical program the second embodiment provides comprises the first flexible circuit board 910, the first glue-line 920, the first stiffening plate 930, the second glue-line 940, the second flexible circuit board 950, the 3rd glue-line 960, the second stiffening plate 970, the 4th glue-line 980 and the 3rd flexible circuit board 990 being affixed successively.
Described the first flexible circuit board 910 is one side flexible circuit board, and it comprises the first covering rete 911, the first conducting wire layer 912 and the first substrate layer 913 being affixed successively.Described first covers rete 911 comprises the first tack coat 9111 and the first dielectric layer 9112 fitting.Described the first tack coat 9111 is directly affixed with described the first conducting wire layer 912.The material of described the first tack coat 9111 is the flexible adhesion materials such as Epocryl or epoxy resin.The material of the first dielectric layer 9112 and described the first substrate layer 913 is the flexible dielectric such as polyimides (PI), polyphenyl dioctyl phthalate glycol ester (PET) and PEN (PEN).Certainly, described first to cover rete 911 can be also only one deck welding resisting layer; Between described the first conducting wire layer 912 and described the first substrate layer 913, can also comprise one second tack coat; Described the first flexible circuit board 910 can also be two-sided or multilayer flexible circuit board, and now described the first flexible circuit board 110 also comprises the conduction fracture that is electrically connected to its each sandwich circuit; Preferably described the first flexible circuit board 110 outermost both sides are insulating barrier, so that conductive circuit pattern is carried out to insulation protection.
The material of described the first glue-line 920 and described the second glue-line 940 is the flexible adhesion materials such as Epocryl or epoxy resin.Described the first stiffening plate 930 is the conventional insulation supporting material of industry, for example, can be baseplate material (FR1, FR2, FR3, the FR4 of the impregnation resin formation such as paper, glass-fiber-fabric or nonwoven fabrics ...), can be also the materials such as polyimides.Described the first glue-line 920 is directly affixed with described the first substrate layer 913.
Described the first flexible circuit board 910 also has the second fracture 916 that connects first covering rete 911, the first conducting wire layer 912 and the first substrate layer 913, described the second fracture 916 is divided into two described the first flexible circuit board 910, and described the second fracture 916 is positioned at described circuit board 900 by medium position.Described the first glue-line 920 has the 3rd fracture 921 of a perforation.Described the first stiffening plate 930 has the first fracture 931 of a perforation.Described the second glue-line 940 has the 4th fracture 941 of a perforation.Described the second fracture 916, the 3rd fracture 921, the first fracture 931 and the 4th fracture 941 positions are corresponding, shape is roughly the same and connect.
Described the second flexible circuit board 950 is two-sided flexible circuit board, and it comprises that the 4th covering rete 951, the 4th conducting wire layer 952, the 3rd substrate layer 953, the 3rd conducting wire layer 954 and the 3rd that are affixed successively cover rete 955.The described the 4th covers rete 951 comprises the 4th tack coat 9511 and the 4th dielectric layer 9512 fitting.Described the 4th dielectric layer 9512 is directly affixed with described the second glue-line 940.The described the 3rd covers rete 955 comprises the 3rd tack coat 9551 and the 3rd dielectric layer 9552 fitting.Described the 3rd tack coat 9551 is directly affixed with described the 3rd conducting wire layer 954.The described the 4th and the material of the 3rd tack coat 9511,9551 be the flexible adhesion materials such as Epocryl or epoxy resin.The material of the described the 4th and the 3rd dielectric layer 9512,9552 and the 3rd substrate layer 953 is the flexible dielectric such as polyimides (PI), polyphenyl dioctyl phthalate glycol ester (PET) and PEN (PEN).On described the second flexible circuit board 950, be formed with the second conductive hole 956 that is electrically connected to described the 4th conducting wire layer 952 and described the 3rd conducting wire layer 954.Described the second conductive hole 956 extends and terminates in described the 3rd conducting wire layer 954 or terminate in described the 3rd substrate layer 953 to described the 3rd conducting wire layer 954 from described the 4th conducting wire layer 952.Described the second conductive hole 956 can form for hole wall plated metal, also can form for filled conductive lotion in hole.Certainly, described second and third covers rete 951,955 and also can be one deck welding resisting layer; Between described the 4th conducting wire layer 952 and described the 3rd substrate layer 953, and all can comprise a tack coat between described the 3rd conducting wire layer 954 and described the 3rd substrate layer 953; Described the second flexible circuit board 950 can also be one side or multilayer flexible circuit board, and preferably its outermost both sides are insulating barrier, so that conductive circuit pattern is carried out to insulation protection.
The material of described the 3rd glue-line 960 and the 4th glue-line 980 is the flexible adhesion materials such as Epocryl or epoxy resin.Described the second stiffening plate 970 is the conventional insulation supporting material of industry, for example, can be baseplate material (FR1, FR2, FR3, the FR4 of the impregnation resin formation such as paper, glass-fiber-fabric or nonwoven fabrics ...), can be also the materials such as polyimides.Described the 3rd glue-line 960 is directly affixed with described the 3rd dielectric layer 9552.
Described the 3rd flexible circuit board 990 is similar with described the first flexible circuit board 910.In the present embodiment, described the 3rd flexible circuit board 990 is for being one side flexible circuit board, and it comprises the second covering rete 991, the second conducting wire layer 992 and the second substrate layer 993 being affixed successively.Described the second substrate layer 993 is directly affixed with described the 4th glue-line 980.Described second covers rete 991 comprises the second tack coat 9911 and the second dielectric layer 9912 fitting.Described the second tack coat 9911 is directly affixed with described the second conducting wire layer 992.The material of described the second tack coat 9911 is the flexible adhesion materials such as Epocryl or epoxy resin.The material of described the second dielectric layer 9912 and described the second substrate layer 993 is the flexible dielectric such as polyimides (PI), polyphenyl dioctyl phthalate glycol ester (PET) and PEN (PEN).Certainly, described second to cover rete 991 can be also only one deck welding resisting layer; Between described the second conducting wire layer 992 and the second substrate layer 993, can also comprise a tack coat; Described the 3rd flexible circuit board 990 can also be two-sided flexible circuit board or multilayer flexible circuit board, and now described the 3rd flexible circuit board 990 also comprises the conduction fracture that is electrically connected to its each sandwich circuit; Preferably described the 3rd flexible circuit board 990 outermost both sides are insulating barrier, so that conductive circuit pattern is carried out to insulation protection.
Described the 3rd flexible circuit board 990 also has the 8th fracture 996 that connects described second covering rete 991, the second conducting wire layer 992 and the second substrate layer 993, and described the 3rd glue-line 960 has the 5th fracture 961 of a perforation.Described the second stiffening plate 970 has the 6th fracture 971 of a perforation.Described the 4th glue-line 980 has the 7th fracture 981 of a perforation.Described the 5th fracture 961, the 6th fracture 971, the 7th fracture 981 and the 8th fracture 996 all corresponding with described the second fracture 916 positions, shape is roughly the same, and described the 5th fracture 961, the 6th fracture 971, the 7th fracture 981 and the 8th fracture 996 connect, thereby the region corresponding with described the second fracture 916 of described circuit board 900 do not comprise first and second stiffening plate 930,970, for can territory, flexable-broken area.Certainly, described each fracture also can be positioned at one end of described circuit board 900; In addition, because of the first flexible circuit board 910, the first glue-line 920, the second glue-line 940 the 3rd glue-line 960, the 4th glue-line 980 and the 3rd flexible circuit board 990 of this case all has can flexility, therefore, described the second fracture 916, the 3rd fracture 921, the 4th fracture 941, the 8th fracture 996, the 5th fracture 961 and the 7th fracture 981 also can be set, now described the first glue-line 920 and described the second glue-line 940 are also filled in described the first fracture 931, and described the 3rd glue-line 960 and described the 4th glue-line 980 are also filled described the 6th fracture 971.
In the present embodiment, described first of described circuit board 900 covers rete 911 and is formed with a plurality of the first openings 9113, described the first opening 9113 connects described the first tack coat 9111 and the first dielectric layer 9112, described the first conducting wire layer 912 of part comes out from described the first opening 9113, and described the first conducting wire layer 912 coming out from described the first opening 9113 forms the first weld pad 9121.Described the first weld pad 9121 surfaces are formed with the first tin paste layer 914, and described the first tin paste layer 914 surface soldered have the first electronic component 915, and described the first electronic component 915 is electrically connected to described the first weld pad 9121.On described the second covering rete 991, be formed with a plurality of the second openings 9913, described the second opening 9913 connects described the second tack coat 9911 and the second dielectric layer 9912, described the second conducting wire layer 992 of part comes out from described the second opening 9913, and described the second conducting wire layer 992 coming out from described the second opening 9913 forms the second weld pad 9921.Described the second weld pad 9921 surfaces are formed with one second tin paste layer 994, and described the second tin paste layer 994 surface soldered have the second electronic component 995, and described the second electronic component 995 is electrically connected to described the second weld pad 9921.Wherein, because of described first and second stiffening plate 930,970 are all positioned at the internal layer of described circuit board 900, therefore, described the first electronic component 915 and described the second electronic component 995 can be positioned at described circuit board 100 both sides over against position, described the first opening 9113 and the second opening 9913 can be positioned at described circuit board 900 both sides over against position.Be appreciated that, when described the second fracture 916, the 3rd fracture 921, the 4th fracture 941, the 8th fracture 996, the 5th fracture 961 and the 7th fracture 981 are not set, the setting of staggering of described the second fracture 916 and described the first opening 9113, the setting of also staggering of described the second fracture 916 and described the second opening 9913,, the region corresponding with described the second fracture 916 of described the first flexible PCB 900 do not arrange described the first opening 9113 and the second opening 9913 yet.In addition, described the first weld pad 9121 surfaces can also be formed with one first gold medal layer, and described the first electronic component 915 is welded in described the first gold medal layer surface by described the first tin paste layer 914.Described the second weld pad 9921 surfaces can also be formed with one second gold medal layer, and described the second electronic component 995 is welded in described the second gold medal layer surface by described the second tin paste layer 994.
On described circuit board 900, be also formed with the first conductive hole 901, the first blind hole 902 and the second blind hole 903, described the first conductive hole 901 is at least electrically connected to described first and second conducting wire layer 912,992.Described the first blind hole 902 is electrically connected to the described first and the 4th conducting wire layer 912,952.Described the second blind hole 903 is electrically connected to the described the 3rd and second conducting wire layer 954,992.Described the first conductive hole 901, the first blind hole 902 and the second blind hole 903 can form for hole wall plated metal, also can form for filled conductive lotion in hole.
Certainly, if described the first stiffening plate 930 thickness enough support each electronic component, described the 3rd glue-line 960 and described the second stiffening plate 970 also can be set.
The circuit board 100 that the technical program provides, 900 stiffening plate is all positioned at described circuit board 100,900 internal layer, therefore, described circuit board 100, the welding electronic part simultaneously over against position of 900 both sides, thus the area of circuit board can be reduced, and then be also convenient to the assembling of circuit board and save circuit board making cost.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical conceive of the present utility model, and all these change and distortion all should belong to the protection range of the utility model claim.
Claims (13)
1. a circuit board, comprise the first flexible circuit board, the first glue-line, the first stiffening plate, the second glue-line and the second flexible circuit board that are affixed successively, described the first stiffening plate has the first fracture of a perforation, the region Wei Ke flexable-broken area territory corresponding with described the first fracture of described circuit board.
2. circuit board as claimed in claim 1, it is characterized in that, described the first glue-line has the second fracture of a perforation, and described the second glue-line has the 3rd fracture of a perforation, thus described the first fracture, the second fracture and the 3rd fracture site correspondence and shape is roughly the same connects.
3. circuit board as claimed in claim 1, it is characterized in that, described the first flexible circuit board comprises the first covering rete, the first conducting wire layer and the first substrate layer being affixed successively, described the second flexible circuit board comprises the second covering rete, the second conducting wire layer and the second substrate layer being affixed successively, described the first substrate layer and described the first glue-line are directly affixed, and described the second substrate layer and described the second glue-line are directly affixed.
4. circuit board as claimed in claim 3, it is characterized in that, described first covers the first opening that rete is formed with a plurality of perforations, described the first conducting wire layer of part comes out from described the first opening, described the first conducting wire layer coming out from described the first opening forms the first weld pad, described the first weld pad surface soldered has the first electronic component, the setting of staggering of described the first fracture and described the first opening.
5. circuit board as claimed in claim 4, it is characterized in that, described second covers the second opening that rete is formed with a plurality of perforations, described the second conducting wire layer of part comes out from described the second opening, described the second conducting wire layer coming out from described the second opening forms the second weld pad, described the second weld pad surface soldered has the second electronic component, the setting of staggering of described the first fracture and described the second opening.
6. circuit board as claimed in claim 5, is characterized in that, described the first opening and the second opening are over against setting.
7. circuit board as claimed in claim 1, is characterized in that, described circuit board also comprises the 4th glue-line and the 3rd flexible circuit board of a side of described the second glue-line dorsad that is affixed on mutually successively the second flexible circuit board.
8. circuit board as claimed in claim 7, it is characterized in that, described the first flexible circuit board has the second fracture of a perforation, described the first glue-line has the 3rd fracture of a perforation, described the second glue-line has the 4th fracture of a perforation, described the 4th glue-line has the 7th fracture of a perforation, described the 3rd flexible circuit board has the 8th fracture of a perforation, described first, second, the 3rd, the 4th, the the 7th and the 8th fracture equal position correspondence and shape are roughly the same, and described the first fracture, the 3rd fracture, the second fracture and the 4th fracture connect, described the 7th fracture and the 8th fracture connect.
9. circuit board as claimed in claim 8, it is characterized in that, described circuit board also comprises the 3rd glue-line and the second stiffening plate being affixed, and described the 3rd glue-line and described the second flexible circuit board are affixed, described the second stiffening plate and described the 4th glue-line are affixed, described the 3rd glue-line has the 5th fracture of a perforation, described the second stiffening plate has the 6th fracture of a perforation, described the 5th fracture and described the 6th fracture are all corresponding with described the first fracture site and shape is roughly the same, and described the 5th fracture, the 6th fracture, the 7th fracture and the 8th fracture connect.
10. circuit board as claimed in claim 8 or 9, it is characterized in that, described the first flexible circuit board comprises the first covering rete, the first conducting wire layer and the first substrate layer being affixed successively, described the 3rd flexible circuit board comprises the second covering rete, the second conducting wire layer and the second substrate layer being affixed successively, described the first substrate layer and described the first glue-line are directly affixed, and described the second substrate layer and described the 4th glue-line are directly affixed.
11. circuit boards as claimed in claim 10, it is characterized in that, described first covers the first opening that rete is formed with a plurality of perforations, described the first conducting wire layer of part comes out from described the first opening, described the first conducting wire layer coming out from described the first opening forms the first weld pad, and described the first weld pad surface soldered has the first electronic component.
12. circuit boards as claimed in claim 11, it is characterized in that, described second covers the second opening that rete is formed with a plurality of perforations, described the second conducting wire layer of part comes out from described the second opening, described the second conducting wire layer coming out from described the second opening forms the second weld pad, and described the second weld pad surface soldered has the second electronic component.
13. circuit boards as claimed in claim 12, is characterized in that, described the first opening and the second opening are over against setting.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320523568.2U CN203482483U (en) | 2013-08-27 | 2013-08-27 | Circuit board |
| TW102216774U TWM502303U (en) | 2013-08-27 | 2013-09-06 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320523568.2U CN203482483U (en) | 2013-08-27 | 2013-08-27 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203482483U true CN203482483U (en) | 2014-03-12 |
Family
ID=50230724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320523568.2U Expired - Fee Related CN203482483U (en) | 2013-08-27 | 2013-08-27 | Circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203482483U (en) |
| TW (1) | TWM502303U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104601869A (en) * | 2015-01-30 | 2015-05-06 | 南昌欧菲光电技术有限公司 | Camera die set and flexible circuit board |
| CN105578732A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and terminal |
| CN107820362A (en) * | 2016-09-14 | 2018-03-20 | 鹏鼎控股(深圳)股份有限公司 | Hollow out flexible circuit board and preparation method |
| CN107920417A (en) * | 2017-12-18 | 2018-04-17 | 广州兴森快捷电路科技有限公司 | Wiring board and its manufacture method |
| WO2021212480A1 (en) * | 2020-04-24 | 2021-10-28 | 庆鼎精密电子（淮安）有限公司 | Rigid-flexible printed circuit board and manufacturing method therefor |
-
2013
- 2013-08-27 CN CN201320523568.2U patent/CN203482483U/en not_active Expired - Fee Related
- 2013-09-06 TW TW102216774U patent/TWM502303U/en not_active IP Right Cessation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104601869A (en) * | 2015-01-30 | 2015-05-06 | 南昌欧菲光电技术有限公司 | Camera die set and flexible circuit board |
| CN105578732A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and terminal |
| CN105578732B (en) * | 2016-02-25 | 2018-01-23 | 广东欧珀移动通信有限公司 | Rigid Flex and terminal |
| CN107820362A (en) * | 2016-09-14 | 2018-03-20 | 鹏鼎控股(深圳)股份有限公司 | Hollow out flexible circuit board and preparation method |
| TWI676404B (en) * | 2016-09-14 | 2019-11-01 | 大陸商鵬鼎控股（深圳）股份有限公司 | Hollow flexible circuit board and method for manufacturing same |
| CN107820362B (en) * | 2016-09-14 | 2020-07-24 | 鹏鼎控股(深圳)股份有限公司 | Hollow flexible circuit board and manufacturing method thereof |
| CN107920417A (en) * | 2017-12-18 | 2018-04-17 | 广州兴森快捷电路科技有限公司 | Wiring board and its manufacture method |
| WO2021212480A1 (en) * | 2020-04-24 | 2021-10-28 | 庆鼎精密电子（淮安）有限公司 | Rigid-flexible printed circuit board and manufacturing method therefor |
| CN114375615A (en) * | 2020-04-24 | 2022-04-19 | 庆鼎精密电子（淮安）有限公司 | Rigid-flexible circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM502303U (en) | 2015-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203482483U (en) | Circuit board | |
| WO2011118911A3 (en) | Pad for touch panel and touch panel using same | |
| CN207603986U (en) | Anti-tear flexible PCB | |
| CN102625581B (en) | Flexible circuit board and manufacturing method thereof | |
| CN102858086A (en) | Printed wiring board with improved corrosion resistance and yield | |
| CN204721708U (en) | A kind of two-layer printed circuit board of resistance to bending | |
| CN202121857U (en) | Multilayer flexible printed circuit | |
| CN103338590A (en) | Flexible circuit board and manufacturing method thereof | |
| CN105578749A (en) | Circuit board connecting assembly and mobile terminal | |
| JP2012506161A (en) | Flexible printed circuit board | |
| CN202206659U (en) | Double-layered circuit board with buried element | |
| CN103781281A (en) | Circuit board and manufacturing method thereof | |
| CN205912321U (en) | Flexible circuit board with hollow out construction | |
| CN105307387B (en) | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof | |
| CN104853542A (en) | Manufacturing method of rigid-flex printed circuit board | |
| JP2011009271A (en) | Printed wiring board and method for manufacturing the same | |
| CN203181416U (en) | Jumper wire for printed circuit board and printed circuit board thereof | |
| JP5677475B2 (en) | Printed wiring board | |
| CN210579421U (en) | Flexible circuit board | |
| CN203788548U (en) | Flexible circuit board | |
| CN208434179U (en) | A kind of circuit board | |
| CN206835451U (en) | Flexible PCB with bending resistance folded structure | |
| CN202514155U (en) | Improvement of multilayer soft circuit board structure | |
| CN102378489B (en) | Soft and hard circuit board and manufacturing method thereof | |
| CN102348327A (en) | Printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO Free format text: FORMER OWNER: FUKUI PRECISION ASSEMBLY (SHENZHEN) CO., LTD. Effective date: 20140901 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518103 SHENZHEN, GUANGDONG PROVINCE TO: 066000 QINHUANGDAO, HEBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140901 Address after: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee after: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170710 Address after: No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Co-patentee before: Zhen Ding Technology Co.,Ltd. Patentee before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |