CN105430886A - Flexible circuit board and mobile terminal - Google Patents
Flexible circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105430886A CN105430886A CN201511027990.9A CN201511027990A CN105430886A CN 105430886 A CN105430886 A CN 105430886A CN 201511027990 A CN201511027990 A CN 201511027990A CN 105430886 A CN105430886 A CN 105430886A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- line
- electronic conduction
- line layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
Abstract
The invention relates to a flexible circuit board and a mobile terminal. The flexible circuit board includes a dielectric layer, a line layer and a covering film; the line layer is arranged on the dielectric layer; the line layer includes a bending region and a non-bending region arranged at one side of the bending region; the line layer is provided with at least one conductor at the non-bending region and is provided a plurality of sub conductors which are arranged side by side and are located at the bending region; one end of each sub conductor is connected with a corresponding conductor; the plurality of sub conductors are isolated from each other; the width of the sub conductors is smaller than the width of the conductors; and the covering film is stacked on the line layer and covers the bending region and the non-bending region. According to the flexible circuit board, one end of each sub conductor is connected with the conductor, and the plurality of sub conductors are isolated from each other; the width of the sub conductor is smaller than the width of the conductors; and therefore, the stress of the flexible circuit board at the bending region can be decreased, and the flexibility of the flexible circuit board at the bending region can be improved.
Description
Technical field
The present invention relates to the communications field, particularly relate to a kind of flexible circuit board and mobile terminal.
Background technology
Along with electronic technology development, along with mobile terminal meets the function such as charging rate and charging property, the requirement of flexible circuit board to conductor wire is more and more higher, the power of mobile terminal rises under normal circumstances, overcurrent capability is needed to increase, thus corresponding conductor wire width and thickness increase, and cause the pliability of flexible circuit board to be deteriorated, circuit loss increases.
The conductor wire DC impedance of current flexible circuit board determined by the width of the conductor wire of flexible circuitry intralamellar part usually, therefore in order to meet the DC impedance requirement of flexible circuit board, usually conductor wire live width is controlled within the specific limits, but when conductor wire live width is wider, although the overcurrent capability of conductor wire increases, but the live width of conductor wire and thickness also can increase thereupon, thus the stress of conductor wire is strengthened, thus the intensity of flexible circuit board is increased, thus the flexibility of flexible circuit board is caused to reduce.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides a kind of and improves flexible flexible circuit board and mobile terminal.
The invention provides a kind of flexible circuit board, wherein, described flexible circuit board comprises dielectric layer, line layer and coverlay, described line layer is located on described dielectric layer, described line layer comprises flex area and the non-flex area being connected described flex area side, described line layer is provided with at least one conductor wire in described non-flex area, and the many electronic conduction lines be arranged side by side are provided with in described flex area, one end of many described electronic conduction lines is all connected on described conductor wire, and many described electronic conduction lines completely cut off mutually, the width of described electronic conduction line is less than the width of described conductor wire, described coverlay is laminated on described line layer, cover described flex area and described non-flex area.
Wherein, described line layer comprises the first line layer and the second line layer that are laminated in described dielectric layer both sides, described conductor wire is arranged on described first line layer, described second line layer is provided with the electric-conductor of the described conductor wire of corresponding electrical connection at described flex area place, multiple described electronic conduction line comprises the first electronic conduction line being arranged at described first line layer and the second electronic conduction line being arranged at described second line layer, one end of described first electronic conduction line is electrically connected on described conductor wire, and one end of described second electronic conduction line is electrically connected on described electric-conductor.
Wherein, the number of described first electronic conduction line is multiple, and the number of described second electronic conduction line is multiple.
Wherein, described coverlay comprises the first coverlay fitting in described first line layer and the second coverlay fitting in described second line layer.
Wherein, described line layer arranges slotted eye at described flex area place, and the length direction of described slotted eye parallels with the length direction of described electronic conduction line, and described slotted eye is positioned at described electronic conduction line side.
Wherein, described coverlay is adhered on described line layer by viscose glue.
Wherein, described conductor wire and described electronic conduction line are Copper Foil.
Wherein, the width sum of multiple described electronic conduction line equals the width of described conductor wire.
Wherein, the thickness of described coverlay is 12 μm ~ 25 μm.
A kind of mobile terminal, wherein, described mobile terminal comprises apparatus body, is located at flexible circuit board described in the mainboard of described apparatus body inside and above-mentioned any one, and it is inner that described flexible circuit board is located at described apparatus body, and be electrically connected with described mainboard.
Flexible circuit board provided by the invention is by arranging multiple electronic conduction line side by side in described non-flex area, one end of multiple described electronic conduction line is utilized to be connected on described conductor wire, and be isolated each other, and the width arranging described electronic conduction line is less than described conductor wire width, thus reduce the stress of described flexible circuit board in flex area, the flex area flexibility of described flexible circuit board is improved.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the flexible circuit board that the embodiment of the present invention provides;
Fig. 2 is the vertical view of the flexible circuit board of Fig. 1.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1 and Fig. 2, the invention provides a kind of mobile terminal of embodiment, comprise apparatus body (not indicating in figure), be located at the mainboard (not indicating in figure) of described apparatus body inside and flexible circuit board 100, it is inner that described flexible circuit board 100 is located at described apparatus body, and be electrically connected with described mainboard.
Described mobile terminal can be the intelligent mobile terminals such as mobile phone, computer, flat board, handheld device or media player.In the present embodiment, for described mobile terminal for mobile phone is described.
Described flexible circuit board 100 comprises dielectric layer 10, line layer 20 and coverlay 30, described line layer 20 is located on described dielectric layer 10, described line layer 20 comprises flex area 21 and non-flex area 22, described line layer 20 is provided with at least one conductor wire 23 in described non-flex area 22, and is provided with the many electronic conduction lines 24 be arranged side by side in described flex area.One end of many described electronic conduction lines 24 is all connected on described conductor wire 23, and many described electronic conduction lines 24 completely cut off mutually, and 24 width of described electronic conduction line are less than the width of described conductor wire 23.Described coverlay 30 is laminated on described line layer 20, covers described flex area 21 and described non-flex area 22.
By described non-flex area 22, multiple electronic conduction line 24 is side by side set, one end of multiple described electronic conduction line 24 is utilized to be connected on described conductor wire 23, and be isolated each other, and the width arranging described electronic conduction line 24 is less than described conductor wire 23 width, thus reduce the stress of described flexible circuit board 100 in flex area, the flex area flexibility of described flexible circuit board 100 is improved.
In present embodiment, described dielectric layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that when arranging described line layer 20 on described dielectric layer 10, insulation environment can be provided, so that the etching of described line layer 20.Preferably, the thickness of described dielectric layer 10 can be 20 μm.
In present embodiment, the number of described non-flex area 22 is two, and the number of described flex area 21 is one, and two described non-flex area are positioned at the both sides that described flex area 21 is oppositely arranged.Thus the conductor wire 23 on two described non-flex area 22 to realize two electronic elements between conducting, utilize multiple described electronic conduction line 24 to be connected between two described conductor wires 23 thus ensure that the electric conductivity of described flexible circuit board 100, and improving the flexibility of described flexible circuit board 100 at described flex area 21 place.Concrete, described conductor wire 23 and described electronic conduction line 24 are Copper Foil, described conductor wire 23 and described electronic conduction line 24 form through etching technics according to prescribed route structure, described conductor wire 23 can be linearly extend, also can be extend along curve, described electronic conduction line 24 extends by straight line thus makes described line layer 20 minimum as far as possible at the width at described flex area 21 place, thus reduce the stress of described line layer 20 at described flex area 21 place, thus the flexibility of described flexible circuit board 100 is improved.The number of described conductor wire 23 can be many side by side, also can be single.The width sum of multiple described electronic conduction line 24 equals the width of described conductor wire 23, thus the impedance of single described conductor wire 23 is identical with the impedance of many described electronic conduction lines 24, thus ensure that the electric conductivity of described flexible circuit board 100.In other embodiments described, described non-flex area 22 can also be one, and described flex area 21 arranges conductive interface away from the edge of described non-flex area, and multiple described electronic conduction line 24 is connected on described conductive interface.
In the present embodiment, it is hot-forming that described coverlay 30 can adopt polyester material to carry out.The thickness of described coverlay 30 is 12 μm ~ 25 μm, and preferably, the thickness of described coverlay 30 is 20 μm.Described coverlay 30 by paste adhesive on described line layer 20; thus protect described conductor wire 23 and described electronic conduction line are not lost or damage; simultaneously; adopt the mode of paste adhesive; also described coverlay 30 can be made tightr with the connection of described line layer 20, prevent described coverlay 30 be shifted and cannot protect the conductor wire 23 or electronic conduction line 24 exposing described coverlay 30.In other embodiments, described coverlay 30 can also be adopt spraying plated film mode to carve to be plated on described line layer 20.
Further, described line layer 20 comprises the first line layer 20a and the second line layer 20b that are laminated in described dielectric layer 10 both sides, described conductor wire 23 is arranged on described first line layer 20a, corresponding described non-flex area 22 place of described second line layer 20b is provided with the electric-conductor 25 being electrically connected described conductor wire 23, multiple described electronic conduction line 24 comprises the first electronic conduction line 241 being arranged at described first line layer 20a and the second electronic conduction line 242 being arranged at described second line layer 20b, one end of described first electronic conduction line 241 is electrically connected on described conductor wire 23, one end of described second electronic conduction line 242 is electrically connected on described electric-conductor 25.
In present embodiment, described dielectric layer 10 comprises the first side 11 and the second side 12 be oppositely arranged.Described first line layer 20a fits on described first side 11, and described second line layer 20b fits on described second side 12.Described conductor wire 23 is arranged at non-flex area 22 place of described first line layer 20a.One end of described conductor wire 23 connects described electric-conductor 25, and the other end is in order to be electrically connected electronic devices and components.Described first electronic conduction line 241 and described conductor wire 23 are positioned at the same side of described dielectric layer 10.The two ends of described first electronic conduction line 241 are electrically connected on one end that two described conductor wires 23 connect described electric-conductor 25 respectively.The two ends of described second electronic conduction line 242 are connected to two described electric-conductors 25 away from described conductor wire 23 one end.Described electric-conductor 25 is through described dielectric layer 10, namely described first line layer 20a offers the via hole (sign) running through described dielectric layer 10 and described second line layer 20b, described electric-conductor 25 is arranged in described via hole, and namely described electric-conductor 25 is successively through described first line layer 20a, dielectric layer 10 and described second line layer 20b.Utilize described second electronic conduction line to be arranged on described second line layer 20b, thus the width of described flexible circuit board 100 in described flex area 22 can be reduced further, thus improve the flexibility of described flexible circuit board 100 further.In other embodiments, the number of described dielectric layer 10 can also be multiple, and the both sides of dielectric layer 10 described in each are provided with described line layer 20.
Further, the number of described first electronic conduction line 241 is multiple, and the number of described second electronic conduction line 242 is multiple.Multiple described first electronic conduction line 241 is arranged on described first line layer 20a, linearly extends.Multiple described second electronic conduction line 242 is arranged on described second line layer 20b, linearly extends.Thus the width of described second electronic conduction line 242 is reduced further, thus improve the flexibility of described flexible circuit board 100 further.
Further, described coverlay 30 comprises the first coverlay 30a fitting in described first line layer 20a and the second coverlay 30b fitting in described second line layer 20b.Described first coverlay 30a covers described flex area 21 and described non-flex area 22; described second coverlay 30b correspondence covers described flex area 21; thus described first coverlay 30a protects described conductor wire 23 and described first electronic conduction line 241; described second coverlay 30b protects described second electronic conduction line 242; thus reduce the consumption of described coverlay 30, thus reduce the production cost of described flexible circuit board 100.
Further, described line layer 20 arranges slotted eye 26 at described flex area 21 place, and the length direction of described slotted eye 26 parallels with the length direction of described electronic conduction line 24, and described slotted eye 26 is positioned at described electronic conduction line 24 side.The number of described slotted eye 26 can be multiple, and multiple described slotted eye 26 is arranged at intervals between multiple described electronic conduction line 24.Described slotted eye 26 runs through described first line layer 20a, dielectric layer 10 and described second line layer 20b.By arranging multiple described slotted eye 26 in the flex area 21 of described flexible circuit board 100, thus described flexible circuit board 100 is reduced at the stress of bending part, thus the bending improving described flexible circuit board 100 is flexible.In other embodiment, described slotted eye 26 can also be circular port, and multiple described slotted eye 26 is at described flex area place array.
Further, described coverlay 30 by paste adhesive on described line layer 20.Concrete, described first coverlay 30a is pasted on described first line layer 20a, and described second coverlay 30b is pasted on described second line layer 20b.Adopting aforesaid way, making described coverlay 30 more easy when being attached at described line layer 20, instead of the uneven and discontinuous problem of signal lead that is that cause of the existing employing brushing that brushing silver slurry layer likely occurs on described line layer 20.Meanwhile, owing to adopting in the method for paste, make processing staff to add man-hour more easy, operation is also more simple, is convenient to processing staff's operation.In addition, because coverlay 30 is without noiseproof feature, thus one deck screened film (sign) that can also be sticked again on described coverlay 30, thus improve the interference free performance of described flexible circuit board 100.
Flexible circuit board provided by the invention is by arranging multiple electronic conduction line side by side in described non-flex area, one end of multiple described electronic conduction line is utilized to be connected on described conductor wire, and be isolated each other, and the width arranging described electronic conduction line is less than described conductor wire width, thus reduce the stress of described flexible circuit board in flex area, the flex area flexibility of described flexible circuit board is improved.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a flexible circuit board, it is characterized in that: described flexible circuit board comprises dielectric layer, line layer and coverlay, described line layer is located on described dielectric layer, described line layer comprises flex area and the non-flex area being connected described flex area side, described line layer is provided with at least one conductor wire in described non-flex area, and the many electronic conduction lines be arranged side by side are provided with in described flex area, one end of many described electronic conduction lines is all connected on described conductor wire, and many described electronic conduction lines completely cut off mutually, the width of described electronic conduction line is less than the width of described conductor wire, described coverlay is laminated on described line layer, cover described flex area and described non-flex area.
2. flexible circuit board as claimed in claim 1, it is characterized in that: described line layer comprises the first line layer and the second line layer that are laminated in described dielectric layer both sides, described conductor wire is arranged on described first line layer, described second line layer is provided with the electric-conductor of the described conductor wire of corresponding electrical connection at described flex area place, multiple described electronic conduction line comprises the first electronic conduction line being arranged at described first line layer and the second electronic conduction line being arranged at described second line layer, one end of described first electronic conduction line is electrically connected on described conductor wire, one end of described second electronic conduction line is electrically connected on described electric-conductor.
3. flexible circuit board as claimed in claim 2, it is characterized in that: the number of described first electronic conduction line is multiple, the number of described second electronic conduction line is multiple.
4. flexible circuit board as claimed in claim 2, is characterized in that: described coverlay comprises the first coverlay fitting in described first line layer and the second coverlay fitting in described second line layer.
5. flexible circuit board as claimed in claim 1, it is characterized in that: described line layer arranges slotted eye at described flex area place, the length direction of described slotted eye parallels with the length direction of described electronic conduction line, and described slotted eye is positioned at described electronic conduction line side.
6. flexible circuit board as claimed in claim 1, is characterized in that: described coverlay is adhered on described line layer by viscose glue.
7. flexible circuit board as claimed in claim 1, is characterized in that: described conductor wire and described electronic conduction line are Copper Foil.
8. flexible circuit board as claimed in claim 1, is characterized in that: the width sum of multiple described electronic conduction line equals the width of described conductor wire.
9. flexible circuit board as claimed in claim 1, it is characterized in that, the thickness of described coverlay is 12 μm ~ 25 μm.
10. a mobile terminal, it is characterized in that: described mobile terminal comprises apparatus body, is located at the mainboard of described apparatus body inside and flexible circuit board as described in claim 1 ~ 9 any one, it is inner that described flexible circuit board is located at described apparatus body, and be electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027990.9A CN105430886B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027990.9A CN105430886B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430886A true CN105430886A (en) | 2016-03-23 |
| CN105430886B CN105430886B (en) | 2019-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511027990.9A Active CN105430886B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
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| Country | Link |
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| CN (1) | CN105430886B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801295A (en) * | 2017-10-16 | 2018-03-13 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
| CN110248502A (en) * | 2019-07-02 | 2019-09-17 | 高德（无锡）电子有限公司 | A kind of processing technology of the Rigid Flex of multilayer soft board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020092675A1 (en) * | 2001-01-16 | 2002-07-18 | Alps Electric Co., Ltd. | Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| CN2805301Y (en) * | 2005-03-22 | 2006-08-09 | 比亚迪股份有限公司 | Wiring structure of pliancy and flexibility printed circuit board |
| CN103957657A (en) * | 2014-04-25 | 2014-07-30 | 华为机器有限公司 | Flexible circuit board and optical module with flexible circuit board |
| CN204887687U (en) * | 2015-09-10 | 2015-12-16 | 上海卓易科技股份有限公司 | Flexible circuit board and electronic product |
-
2015
- 2015-12-29 CN CN201511027990.9A patent/CN105430886B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020092675A1 (en) * | 2001-01-16 | 2002-07-18 | Alps Electric Co., Ltd. | Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| CN2805301Y (en) * | 2005-03-22 | 2006-08-09 | 比亚迪股份有限公司 | Wiring structure of pliancy and flexibility printed circuit board |
| CN103957657A (en) * | 2014-04-25 | 2014-07-30 | 华为机器有限公司 | Flexible circuit board and optical module with flexible circuit board |
| CN204887687U (en) * | 2015-09-10 | 2015-12-16 | 上海卓易科技股份有限公司 | Flexible circuit board and electronic product |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801295A (en) * | 2017-10-16 | 2018-03-13 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
| CN110248502A (en) * | 2019-07-02 | 2019-09-17 | 高德（无锡）电子有限公司 | A kind of processing technology of the Rigid Flex of multilayer soft board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105430886B (en) | 2019-02-22 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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