CN105555019A - Soft-hard combination board, terminal and soft-hard combination board manufacturing method - Google Patents
Soft-hard combination board, terminal and soft-hard combination board manufacturing method Download PDFInfo
- Publication number
- CN105555019A CN105555019A CN201610109682.9A CN201610109682A CN105555019A CN 105555019 A CN105555019 A CN 105555019A CN 201610109682 A CN201610109682 A CN 201610109682A CN 105555019 A CN105555019 A CN 105555019A
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- layer
- copper foil
- rigid
- flexible circuit
- steel reinforcement
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a soft-hard combination board, a terminal and a soft-hard combination board manufacturing method; the soft-hard combination board comprises flexible circuit substrates, hard insulating layers and steel reinforcements; each of the flexible circuit substrates comprises base material layers and copper foil layers; the copper foil layers are attached to the base material layers; the hard insulating layers are attached to the flexible circuit components, and cover parts of the copper foil layers; and the steel reinforcements are attached to certain sides, deviated from the flexible circuit components, of the hard insulating layers, and are corresponding to the hard insulating layers in size. The hard insulating layers are attached to the flexible circuit substrates, and the steel reinforcements are attached to the certain sides, deviated from the flexible circuit substrates, of the hard insulating layers, a hard board structure of the soft-hard combination board is realized; and meanwhile, by utilizing the fast heat conduction characteristic of the steel reinforcements, the heat dissipation effect of the soft-hard combination board is improved.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of Rigid Flex, terminal and Rigid Flex manufacture method.
Background technology
Along with the fast development of electronic product, the fuselage of electronic product more and more trend towards thin, lightly change, and the space layout of electronic product inside also can be more and more compacter.Because electronic product can produce heat when working and running, and the source of heat is the Rigid Flex being loaded with electronic devices and components, therefore more and more less in electronic product inner space, when topology layout is more and more compacter, intensive, thermal source on Rigid Flex cannot be spread preferably, cause electronic product inside cannot obtain good radiating effect, thus make the temperature rise of electronic product cannot meet corresponding standard value; Or electronic product is for a long time under the operating state of high temperature, can cause its reliability decrease.
Summary of the invention
In view of this, the invention provides a kind of Rigid Flex, terminal and the Rigid Flex manufacture method with better heat dissipation effect.
The invention provides a kind of Rigid Flex, wherein, described Rigid Flex comprises flexible circuit board, rigid insulation layer and steel reinforcement, described flexible circuit board comprises substrate layer and copper foil layer, described copper foil layer fits on described substrate layer, and described rigid insulation layer fits on described flexible circuit assembly, and copper foil layer described in cover part, described steel reinforcement fits in described rigid insulation layer and deviates from described flexible circuit assembly side, and corresponding with described rigid insulation layer size.
Wherein, described Rigid Flex comprises two described flexible circuit boards and two-layer described rigid insulation layer, and two-layer described rigid insulation layer is between two described flexible circuit boards, and described steel reinforcement is between two-layer described rigid insulation layer.
Wherein, described steel reinforcement is adhered between two-layer described rigid insulation layer.
Wherein, described steel reinforcement is provided with signal via, the through copper foil layer to two described flexible circuit boards of described signal via, arranges the signal conductor being electrically connected described copper foil layer in described signal via, arrange insulating cement between described signal conductor and described signal via madial wall.
Wherein, described steel reinforcement is provided with the ground connection via hole isolated with described signal via, and described ground connection via hole is through to described copper foil layer, and arrange earthing conductor in described ground connection via hole, described earthing conductor is electrically connected on described copper foil layer and described steel reinforcement.
Wherein, described flexible circuit board comprises two-layer described copper foil layer, and two-layer described copper foil layer fits in described substrate layer both sides respectively.
Wherein, the electric conductor through described substrate layer is connected with between two-layer described copper foil layer.
Wherein, described flexible PCB also comprises coverlay, and described coverlay is laminated in described substrate layer and deviates from described rigid insulation layer side, and covers described copper foil layer.
The present invention also provides a kind of terminal, and wherein, described terminal comprises body, is located at Rigid Flex described in the mainboard of described body interior and above-mentioned any one, and described Rigid Flex is located at described body interior, and is electrically connected with described mainboard.
The present invention also provides a kind of Rigid Flex manufacture method, it is characterized in that, described Rigid Flex manufacture method comprises:
Cut the rigid insulation layer of preset shape;
Cut the steel reinforcement of preset shape, steel reinforcement is adhered on rigid insulation layer;
Shaping flexible circuit board, described flexible circuit board has substrate layer, and fits in the copper foil layer of described substrate layer;
Described flexible circuit board is adhered to described rigid insulation layer and deviates from described steel reinforcement side, described flexible circuit board covers described rigid insulation layer.
Rigid Flex of the present invention, terminal and Rigid Flex manufacture method, fit on described flexible circuit board by described rigid insulation layer, described steel reinforcement fits on described rigid insulation layer, described steel reinforcement can absorb the heat on described flexible circuit board fast, and heat is distributed in air, thus utilize the heat conduction fast characteristic of described steel reinforcement, improve the radiating effect of described Rigid Flex.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic cross-section of Rigid Flex provided by the invention;
Fig. 2 is the schematic flow sheet of Rigid Flex manufacture method provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1, a kind of Rigid Flex 100 provided by the invention, described Rigid Flex 100 comprises flexible circuit board 10, rigid insulation layer 20 and steel reinforcement 30.Described flexible circuit board 10 comprises substrate layer 11 and copper foil layer 12, and described copper foil layer 12 fits on described substrate layer 11.Described rigid insulation layer 20 fits on described flexible circuit assembly 10, and copper foil layer 12 described in cover part, described steel reinforcement 30 fits in described rigid insulation layer 20 and deviates from described flexible circuit assembly 10 side, and corresponding with described rigid insulation layer 20 size.
Fit on described flexible circuit board 10 by described rigid insulation layer 20, described steel reinforcement 30 fits in described rigid insulation layer 20 and deviates from described flexible circuit board 10 side, realize the hardboard structure of described Rigid Flex 100, and utilize the heat conduction fast characteristic of described steel reinforcement 30, improve the radiating effect of described Rigid Flex.
Described flexible circuit assembly 10 can be FPC (FlexiblePrintedCircuitboard, flexible PCB).Concrete, described substrate layer 11 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange described copper foil layer 12 on described substrate layer 11, and described substrate layer 11 can provide insulation environment for described copper foil layer 12 so that on described copper foil layer 12 etching signal cabling and ground connection cabling.Preferably, the thickness of described substrate layer 11 can be 20 μm.Described substrate layer 11 can arrange flex region 11a and the rigid district 11b in flex region, described flex region 11a is used for presenting flexibility, described Soft Bonding plate 100 is facilitated to produce deformation, and then facilitate described Rigid Flex 100 to connect external device, the rigid district 11b in described flex region can fix hard plate, thus improve the rigidity of described Soft Bonding plate 100, thus described Soft Bonding plate 100 is facilitated to be assemblied in terminal.
In present embodiment, described copper foil layer 12 is plate film being arranged Copper Foil, and the ground connection cabling on described copper foil layer 12 and signal lead are Copper Foil and form through etching technics according to prescribed route structure.Ground connection cabling on described copper foil layer 12 and signal lead can be wholely set, and the signal lead on described copper foil layer 12 realizes the conduction between electric elements, and the ground connection cabling on described copper foil layer 12 carries out ground connection.Described flexible circuit board 10 can comprise two-layer described copper foil layer 12, and two-layer described copper foil layer 12 fits in described substrate layer 11 both sides respectively.In other embodiments, described flexible circuit board 10 can also be arrange one-sided described copper foil layer 12, copper foil layer 12 described in individual layer fits on described substrate layer 11, and described rigid insulation layer 20 fits in copper foil layer 12 described in individual layer and deviates from described substrate layer 11 side; Copper foil layer 12 described in individual layer and described rigid insulation layer 20 also can be the both sides fitting in described substrate layer 11 respectively.
In present embodiment, described substrate layer 10 also comprises coverlay 13, and described coverlay 13 is laminated in described substrate layer 11 and deviates from described rigid insulation layer 20 side, and covers described copper foil layer 12.Concrete, two-layer described copper foil layer 12 is the first copper foil layer 121 and the second copper foil layer 122 fitting in described substrate layer 11 both sides respectively.Described rigid insulation layer 20 fits on described first copper foil layer 121, and described coverlay 13 fits on described second copper foil layer 122.It is hot-forming that described coverlay 13 can adopt polyester material to carry out.Described coverlay 13 by paste adhesive on described second copper foil layer 122.More specifically, described coverlay 13 fits on described second copper foil layer 122 completely, and the signal lead covered completely on described second copper foil layer 122 and ground connection cabling, namely described coverlay 13 is corresponding with flex region 11a and the flex region rigid district 11b of described substrate layer 11, do not lost to protect signal lead and ground connection cabling on described second copper foil layer 122 or damaged, simultaneously, adopt the mode of paste adhesive, also described coverlay 13 can be made tightr with the connection of described second copper foil layer 122, described cover layer 13 is prevented to be shifted and cannot to protect the part cabling exposing described coverlay 13.In other embodiments, if described flexible circuit board 10 arranges individual layer copper foil layer 12, then described coverlay 13 can also directly fit on described substrate layer 11.
In present embodiment, described rigid insulation layer 20 adopts polyethylene material, described rigid insulation layer 20 has insulating properties characteristic, and described first copper foil layer 121 and described steel reinforcement 30 are completely cut off mutually, thus avoids described steel reinforcement 30 to the signal lead short circuit on described second copper foil layer 121.Described rigid insulation floor 20 corresponds to the rigid district 11b in flex region of described substrate layer 11.Utilize the rigidity of described rigid insulation layer 20, the intensity of described Rigid Flex 100 on the rigid district 11b in described flex region is increased, makes the rigid district 11b not easily bending in described flex region of described Rigid Flex 100, and then realize hardboard structure.Meanwhile, the circuit of described rigid insulation floor 20 to described first copper foil layer 121 11b place of rigid district in described flex region is protected, and increases the structural soundness of described Rigid Flex 100.
In present embodiment, in the form of sheets, described steel reinforcement 30 adopts punching press cutting process to take shape on described rigid insulation layer 20 in described steel reinforcement 30.Described steel reinforcement 30 shape size is identical with described rigid insulation layer 20 size shape, thus improve described steel reinforcement 30 precision, thus avoid described steel reinforcement 41 oversize, puncture described first copper foil layer 121, improve the useful life of described Rigid Flex 100.Described steel reinforcement 30 fits on described rigid insulation layer 20, thus strengthens the flex region 11a bend-resistance of described substrate layer 11 further, improves the assembly performance of described Rigid Flex 100.And it is unique soon that described steel reinforcement 30 has heat conduction, the heat of described first copper foil layer 121 and described second copper foil layer 122 can be absorbed fast, and by the side of described steel reinforcement 30 by heat diffusion, thus improve the heat dispersion of described Rigid Flex 100.
Further, described Rigid Flex 100 comprises two described flexible circuit boards 10 and two-layer described rigid insulation layer 20.Two-layer described rigid insulation layer 20 is between two described flexible circuit boards 10, and described steel reinforcement 30 is between two-layer described rigid insulation layer 20.In present embodiment; two described flexible circuit boards 10 are arranged at described steel reinforcement 30 both sides respectively; then described Rigid Flex 100 arranges four layers of described copper foil layer 12; thus make described Rigid Flex 100 realize multi-line connection; and utilize the coverlay 13 of two described flexible circuit boards 10 to be arranged at the outermost both sides of described Rigid Flex 100 respectively; realize the protection to described copper foil layer 12, and increase the useful life of described Rigid Flex 100.Described steel reinforcement 30 both sides are arranged at respectively by two described flexible circuit boards 10, described Rigid Flex 100 can also be made easy to make, structure is simple, only can utilize and make the making that soft board technique realizes described Rigid Flex 100, after first making soft board technique, make hardboard technique, improve shaping efficiency.Concrete, first can adopt the shaping described flexible circuit assembly 10 of flexible PCB manufacture craft, then described steel reinforcement 30 is adhered between two-layer described rigid insulation layer 20, finally described flexible circuit assembly 10 is adhered on described rigid insulation layer 20, thus make described Rigid Flex 100 stabilized structure, assemble easy.
Further, described steel reinforcement 30 is provided with signal via 31, the through copper foil layer 12 to two described flexible circuit boards 10 of described signal via 31, the signal conductor 311 being electrically connected described copper foil layer 12 is set in described signal via 31, between described signal conductor 311 and described signal via 31 madial wall, insulating cement 312 is set.In present embodiment, described signal via 31 runs through described steel reinforcement 30 and two described rigid insulation layers 20.The two ends of described signal conductor 311 are connected in the signal lead of two-layer described first copper foil layer 121, thus the signal conduction on two described first copper foil layers 121, described insulating cement 312 is utilized to isolate described signal conductor 311 and described steel reinforcement 30, thus prevent the circuit of described steel reinforcement 30 to described first copper foil layer 121 from carrying out short circuit, effectively improve the fail safe of described Rigid Flex 100.
Further, described steel reinforcement 30 is provided with the ground connection via hole 32 isolated with described signal via 31, described ground connection via hole 32 is through to described copper foil layer 12, and arrange earthing conductor 321 in described ground connection via hole 32, described earthing conductor 321 is electrically connected on described copper foil layer 12 and described steel reinforcement 30.In present embodiment, described earthing conductor 321 can be conduction copper column or aluminium post, described earthing conductor 321 can be that one end is connected to described steel reinforcement 30, and the other end is connected to described first copper foil layer 121, thus realizes wherein the first copper foil layer 121 ground connection described in one deck; Described earthing conductor 321 also can be that two ends are connected to two-layer described first copper foil layer 121, and the part between two ends connects described steel reinforcement 30, thus realizes two-layer described first copper foil layer 121 all ground connection.Certainly, in other embodiments, described ground connection via hole 32 can also run through described substrate layer 11, to make described earthing conductor 321 be connected between described second copper foil layer 122 and described steel reinforcement 30, thus realizes described second copper foil layer 122 ground connection.
Further, the electric conductor 14 through described substrate layer 11 is connected with between the two-layer described copper foil layer 12 of described flexible circuit board 10.Concrete, described first copper foil layer 121 is provided with the through through hole 123 to described second copper foil layer 122, arranges the electric conductor 14 connecting described first copper foil layer 121 and described second copper foil layer 122 in described through hole 123.
In present embodiment, described first copper foil layer 121 and described second copper foil layer 122 are respectively equipped with different circuits, to increase the circuit layout space of described Rigid Flex 100, improve the electric conductivity of described Rigid Flex 100.Described through hole 123 is opened in circuit one end of described first copper foil layer 121, and the circuit towards described second copper foil layer 122 extends.Concrete, described through hole 123 also runs through described substrate layer 1, and described electric-conductor 14 is the copper post through described through hole 123.Described electric-conductor 14 realizes described first copper foil layer 121 and described second copper foil layer 122 conducting, thus ensure that the multi-line cabling requirement of described Rigid Flex 100.Described through hole 123 is opened in the flex region 11a of the relatively described substrate layer 11 of described copper foil layer 12, thus cut down the stress of described copper foil layer 12 at flex region 11a, thus make Rigid Flex 100 at flex region 11a remitted its fury, thus described steel reinforcement 30 is fixed on described flexible circuit board 10 and can covers described through hole 123 place, thus ensure the structural strength of described Rigid Flex 100, prevent the copper foil layer 10 of described Rigid Flex 100 from rupturing.In other embodiments, the number of described through hole 123 can be multiple, and described electric conductor 14 can be grounded conducting or realize signal conduction.
The present invention also provides a kind of terminal (not shown), described terminal comprises body (not shown), is located at the mainboard (not shown) of described body interior and described Rigid Flex 100, described Rigid Flex 100 is located at described body interior, and is electrically connected with described mainboard.Described terminal can be mobile phone, computer, flat board, handheld device or media player etc.
Refer to Fig. 2, the present invention also provides a kind of Rigid Flex manufacture method, comprising:
S01: the rigid insulation layer 20 cutting preset shape.
The polymorphic structure that this preset shape can be rectangle, circle or polygon or extend along curve.Described rigid insulation layer 20 can adopt polypropylene or polyethylene material.
S02: the steel reinforcement 30 cutting preset shape, is adhered to steel reinforcement 30 on rigid insulation layer 20.
The shape of described steel reinforcement 30 is identical with described rigid insulation layer 20, improves the structural stability of described Rigid Flex 100, avoids described steel reinforcement 30 and the layering of described rigid insulation layer 20.In present embodiment, the two sides of described rigid insulation layer 20 is all bonded with described steel reinforcement 30.
S03: shaping flexible circuit board 10, described flexible circuit board 10 has substrate layer 11, and fits in the copper foil layer 12 of described substrate layer 11.In present embodiment, adopt and make flexible circuit board 10 described in FPC technological forming, the both sides of described substrate layer 11 have all etched described copper foil layer 12, wherein copper foil layer 12 described in one deck are gone back Vacuum Deposition and establish coverlay 13.
S04: described flexible circuit board 10 is adhered to described insulating rigid 20 layers and deviates from described steel reinforcement 30 side, described flexible circuit layer 10 groups covers described rigid insulation layer 20.In present embodiment, first copper foil layer 121 of flexible circuit board 10 described in two groups is adhered on described rigid insulation layer 20, thus make flexible circuit board 10 described in two groups clamp described rigid insulation layer 20 and described steel reinforcement 30, thus obtain described Rigid Flex 100.
Be understandable that, the sequence of steps of Rigid Flex manufacture method provided by the present invention is also unrestricted.
Rigid Flex of the present invention, terminal and Rigid Flex manufacture method, fit on described flexible circuit board by described rigid insulation layer, described steel reinforcement fits in described rigid insulation layer and deviates from described flexible circuit board side, realize the hardboard structure of described Rigid Flex, and utilize the heat conduction fast characteristic of described steel reinforcement, improve the radiating effect of described Rigid Flex.
Be more than the preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a Rigid Flex, it is characterized in that, described Rigid Flex comprises flexible circuit board, rigid insulation layer and steel reinforcement, described flexible circuit board comprises substrate layer and copper foil layer, described copper foil layer fits on described substrate layer, described rigid insulation layer fits on described flexible circuit assembly, and copper foil layer described in cover part, described steel reinforcement fits on described rigid insulation layer, be positioned at side opposing with described flexible circuit board, the orthographic projection region of described steel reinforcement on described rigid insulation layer and described rigid insulation layer coincide.
2. Rigid Flex according to claim 1, it is characterized in that, described Rigid Flex comprises flexible circuit board described in two groups and two-layer described rigid insulation layer, two-layer described rigid insulation layer is between two described flexible circuit boards, and described steel reinforcement is between two-layer described rigid insulation layer.
3. Rigid Flex according to claim 2, is characterized in that, described steel reinforcement is adhered between two-layer described rigid insulation layer.
4. Rigid Flex according to claim 2, it is characterized in that, described steel reinforcement is provided with signal via, the through copper foil layer to flexible circuit board described in two groups of described signal via, the signal conductor being electrically connected described copper foil layer is set in described signal via, between described signal conductor and described signal via madial wall, insulating cement is set.
5. Rigid Flex according to claim 1, it is characterized in that, described steel reinforcement is provided with the ground connection via hole isolated with described signal via, described ground connection via hole is through to described copper foil layer, arrange earthing conductor in described ground connection via hole, described earthing conductor is electrically connected on described copper foil layer and described steel reinforcement.
6. Rigid Flex according to claim 1, is characterized in that, described flexible circuit board comprises two-layer described copper foil layer, and two-layer described copper foil layer fits in described substrate layer both sides respectively.
7. Rigid Flex according to claim 6, is characterized in that, is connected with the electric conductor through described substrate layer between two-layer described copper foil layer.
8. Rigid Flex according to claim 1, is characterized in that, described flexible PCB also comprises coverlay, and described cover layer is fixed on described substrate layer, is positioned at and the described opposing side of rigid insulation layer, and covers described copper foil layer.
9. a terminal, is characterized in that, described terminal comprises body, is located at the mainboard of described body interior and Rigid Flex as described in claim 1 ~ 8 any one, and described Rigid Flex is located at described body interior, and is electrically connected with described mainboard.
10. a Rigid Flex manufacture method, is characterized in that, described Rigid Flex manufacture method comprises:
Cut the rigid insulation layer of preset shape;
Cut the steel reinforcement of preset shape, steel reinforcement is adhered on rigid insulation layer;
Shaping flexible circuit board, described flexible circuit board has substrate layer, and fits in the copper foil layer of described substrate layer;
Described flexible circuit board is adhered to described rigid insulation layer and deviates from described steel reinforcement side, described flexible circuit board covers described rigid insulation layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610109682.9A CN105555019B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex, terminal and Rigid Flex production method |
| CN201810952919.9A CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610109682.9A CN105555019B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex, terminal and Rigid Flex production method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810952919.9A Division CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
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| CN105555019A true CN105555019A (en) | 2016-05-04 |
| CN105555019B CN105555019B (en) | 2018-09-04 |
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| CN201610109682.9A Active CN105555019B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex, terminal and Rigid Flex production method |
| CN201810952919.9A Expired - Fee Related CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
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| CN201810952919.9A Expired - Fee Related CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107318225A (en) * | 2017-08-02 | 2017-11-03 | 常熟东南相互电子有限公司 | Combined type multilayer circuit board |
| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid-flexible combined board structure |
| CN109688708A (en) * | 2018-05-23 | 2019-04-26 | 华普通用技术研究（广州）有限公司 | A kind of production method of flexible printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
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| US20030151902A1 (en) * | 2002-01-07 | 2003-08-14 | Achilles Corporation | Flexible printed circuit board |
| CN202535639U (en) * | 2012-07-17 | 2012-11-14 | 深圳唯一科技股份有限公司 | Flexible circuit board applied to capacitive touch screen |
| CN104885578A (en) * | 2013-02-26 | 2015-09-02 | 大自达电线股份有限公司 | Reinforcing member for flexible printed wiring substrate, flexible printed wiring substrate, and shield printed wiring substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid-flexible combined board structure |
| CN107318225A (en) * | 2017-08-02 | 2017-11-03 | 常熟东南相互电子有限公司 | Combined type multilayer circuit board |
| CN107318225B (en) * | 2017-08-02 | 2019-12-17 | 常熟东南相互电子有限公司 | Composite multilayer circuit board |
| CN109688708A (en) * | 2018-05-23 | 2019-04-26 | 华普通用技术研究（广州）有限公司 | A kind of production method of flexible printed circuit board |
| CN109688708B (en) * | 2018-05-23 | 2020-02-07 | 邑升顺电子(深圳)有限公司 | Manufacturing method of flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109041405B (en) | 2020-07-10 |
| CN109041405A (en) | 2018-12-18 |
| CN105555019B (en) | 2018-09-04 |
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