CN105428273B - 半导体制造装置 - Google Patents

半导体制造装置 Download PDF

Info

Publication number: CN105428273B
Authority: CN; China
Prior art keywords: collet; salient pole; semiconductor chip; elastomer; face
Prior art date: 2014-09-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN201510100817.0A

Other languages

English (en)

Chinese (zh)

Other versions

CN105428273A (zh

Inventor

深山真哉

尾山幸史

三浦正幸

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kioxia Corp

Original Assignee

Toshiba Memory Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-09-17

Filing date

2015-03-06

Publication date

2018-07-10

2015-03-06 Application filed by Toshiba Memory Corp filed Critical Toshiba Memory Corp

2016-03-23 Publication of CN105428273A publication Critical patent/CN105428273A/zh

2018-07-10 Application granted granted Critical

2018-07-10 Publication of CN105428273B publication Critical patent/CN105428273B/zh

Status Active legal-status Critical Current

2035-03-06 Anticipated expiration legal-status Critical

Links

Landscapes

Wire Bonding (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

CN201510100817.0A 2014-09-17 2015-03-06 半导体制造装置 Active CN105428273B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2014188528A JP6212011B2 (ja)	2014-09-17	2014-09-17	半導体製造装置
JP2014-188528		2014-09-17

Publications (2)

Publication Number	Publication Date
CN105428273A CN105428273A (zh)	2016-03-23
CN105428273B true CN105428273B (zh)	2018-07-10

Family

ID=55506384

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201510100817.0A Active CN105428273B (zh)	2014-09-17	2015-03-06	半导体制造装置

Country Status (3)

Country	Link
JP (1)	JP6212011B2 (ja)
CN (1)	CN105428273B (ja)
TW (1)	TWI581363B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6593405B2 (ja) *	2017-08-31	2019-10-23	日亜化学工業株式会社	半導体装置の製造方法
JP7372107B2 (ja) *	2019-10-15	2023-10-31	株式会社岡本工作機械製作所	ウェーハ研磨用ヘッド

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1890678A (zh) *	2003-12-05	2007-01-03	日立化成工业株式会社	电子装置的制造方法
CN101356643A (zh) *	2006-09-13	2009-01-28	住友电木株式会社	半导体器件
CN103035541A (zh) *	2011-10-03	2013-04-10	松下电器产业株式会社	半导体元件的安装方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57140742U (ja) *	1981-02-27	1982-09-03
JPS5955031A (ja) *	1982-09-22	1984-03-29	Fujitsu Ltd	真空コレツト
JPH09321097A (ja) *	1996-06-03	1997-12-12	Matsushita Electric Ind Co Ltd	バンプ付きワークの押圧装置
JPH11288997A (ja) *	1998-04-03	1999-10-19	Citizen Watch Co Ltd	Ｉｃ吸着コレット
JP3092585B2 (ja) *	1998-04-17	2000-09-25	日本電気株式会社	半導体チップ吸着用ツール及び該ツールを用いた半導体装置の製造方法
JP2008300508A (ja) *	2007-05-30	2008-12-11	Mitsubishi Electric Corp	圧着装置および電子装置の製造方法
JP2009141269A (ja) *	2007-12-10	2009-06-25	Sony Chemical & Information Device Corp	電気部品の実装方法及び実装装置
JP5558073B2 (ja) *	2009-10-14	2014-07-23	キヤノンマシナリー株式会社	ボンディング装置
KR101801264B1 (ko) *	2011-06-13	2017-11-27	삼성전자주식회사	반도체 제조 장치 및 이를 이용한 반도체 패키지 방법
JP5936968B2 (ja) *	2011-09-22	2016-06-22	株式会社東芝	半導体装置とその製造方法
JP2015053418A (ja) *	2013-09-09	2015-03-19	株式会社東芝	半導体製造装置

2014
- 2014-09-17 JP JP2014188528A patent/JP6212011B2/ja active Active
2015
- 2015-03-03 TW TW104106722A patent/TWI581363B/zh active
- 2015-03-06 CN CN201510100817.0A patent/CN105428273B/zh active Active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1890678A (zh) *	2003-12-05	2007-01-03	日立化成工业株式会社	电子装置的制造方法
CN101356643A (zh) *	2006-09-13	2009-01-28	住友电木株式会社	半导体器件
CN103035541A (zh) *	2011-10-03	2013-04-10	松下电器产业株式会社	半导体元件的安装方法

Also Published As

Publication number	Publication date
TW201613025A (en)	2016-04-01
JP2016063014A (ja)	2016-04-25
TWI581363B (zh)	2017-05-01
JP6212011B2 (ja)	2017-10-11
CN105428273A (zh)	2016-03-23

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Legal Events

Date	Code	Title	Description
2016-03-23	C06	Publication
2016-03-23	PB01	Publication
2016-04-20	C10	Entry into substantive examination
2016-04-20	SE01	Entry into force of request for substantive examination
2017-08-29	TA01	Transfer of patent application right	Effective date of registration: 20170810 Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Toshiba Corp.
2017-08-29	TA01	Transfer of patent application right
2018-07-10	GR01	Patent grant
2018-07-10	GR01	Patent grant
2022-02-11	CP01	Change in the name or title of a patent holder	Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd.
2022-02-11	CP01	Change in the name or title of a patent holder
2022-02-11	TR01	Transfer of patent right	Effective date of registration: 20220126 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp.
2022-02-11	TR01	Transfer of patent right