TW201613025A - Semiconductor manufacturing device - Google Patents

Semiconductor manufacturing device

Info

Publication number
TW201613025A
TW201613025A TW104106722A TW104106722A TW201613025A TW 201613025 A TW201613025 A TW 201613025A TW 104106722 A TW104106722 A TW 104106722A TW 104106722 A TW104106722 A TW 104106722A TW 201613025 A TW201613025 A TW 201613025A
Authority
TW
Taiwan
Prior art keywords
clamp
semiconductor chip
elastomeric
bump
connected part
Prior art date
Application number
TW104106722A
Other languages
Chinese (zh)
Other versions
TWI581363B (en
Inventor
Shinya Fukayama
Yukifumi Oyama
Masayuki Miura
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW201613025A publication Critical patent/TW201613025A/en
Application granted granted Critical
Publication of TWI581363B publication Critical patent/TWI581363B/en

Links

Landscapes

  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A semiconductor manufacturing device 1 of the present invention can improve bump connectivity of a semiconductor chip and includes: a joint head 2 comprising an elastomeric clamp 5 and a clamp holder 6, wherein the elastomeric clamp 5 abuts against and sucks a surface of a semiconductor chip 4 having two surfaces provided with bump electrodes 42, 44, and the clamp holder 6 holds the elastomeric clamp 5; a platform 3 carrying a connected part 7, wherein the connected part 7 has a connected electrode 72 corresponding to the bump electrode 44; and a driving mechanism for making the joint head 2 move relatively to the platform 3 so as to move the semiconductor chip 4 onto the connected part 7 and apply loads on the semiconductor chip 4. A contact surface of at least one of the elastomeric clamp 5 and the clamp holder 6 has a protrusion portion 62 at a position right above a forming region comprising the bump electrode 44.
TW104106722A 2014-09-17 2015-03-03 Semiconductor manufacturing device TWI581363B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014188528A JP6212011B2 (en) 2014-09-17 2014-09-17 Semiconductor manufacturing equipment

Publications (2)

Publication Number Publication Date
TW201613025A true TW201613025A (en) 2016-04-01
TWI581363B TWI581363B (en) 2017-05-01

Family

ID=55506384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106722A TWI581363B (en) 2014-09-17 2015-03-03 Semiconductor manufacturing device

Country Status (3)

Country Link
JP (1) JP6212011B2 (en)
CN (1) CN105428273B (en)
TW (1) TWI581363B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6593405B2 (en) * 2017-08-31 2019-10-23 日亜化学工業株式会社 Manufacturing method of semiconductor device
JP7372107B2 (en) * 2019-10-15 2023-10-31 株式会社岡本工作機械製作所 Wafer polishing head

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57140742U (en) * 1981-02-27 1982-09-03
JPS5955031A (en) * 1982-09-22 1984-03-29 Fujitsu Ltd Vacuum collet
JPH09321097A (en) * 1996-06-03 1997-12-12 Matsushita Electric Ind Co Ltd Depressing equipment of work provided with bumps
JPH11288997A (en) * 1998-04-03 1999-10-19 Citizen Watch Co Ltd Ic suction collet
JP3092585B2 (en) * 1998-04-17 2000-09-25 日本電気株式会社 Semiconductor chip suction tool and semiconductor device manufacturing method using the tool
EP1830309A4 (en) * 2003-12-05 2009-05-13 Hitachi Chemical Co Ltd Electronic device manufacturing method
US8008767B2 (en) * 2006-09-13 2011-08-30 Sumitomo Bakelight Co., Ltd. Semiconductor device
JP2008300508A (en) * 2007-05-30 2008-12-11 Mitsubishi Electric Corp Press-bonding device, and manufacturing method of electronic device
JP2009141269A (en) * 2007-12-10 2009-06-25 Sony Chemical & Information Device Corp Packaging method and apparatus of electrical component
JP5558073B2 (en) * 2009-10-14 2014-07-23 キヤノンマシナリー株式会社 Bonding equipment
KR101801264B1 (en) * 2011-06-13 2017-11-27 삼성전자주식회사 Apparatus of manufacturing semiconductor and Method for packaging semiconductor using the same
JP5936968B2 (en) * 2011-09-22 2016-06-22 株式会社東芝 Semiconductor device and manufacturing method thereof
JP5870261B2 (en) * 2011-10-03 2016-02-24 パナソニックＩｐマネジメント株式会社 Mounting method of semiconductor element
JP2015053418A (en) * 2013-09-09 2015-03-19 株式会社東芝 Semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP2016063014A (en) 2016-04-25
TWI581363B (en) 2017-05-01
CN105428273B (en) 2018-07-10
JP6212011B2 (en) 2017-10-11
CN105428273A (en) 2016-03-23

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