CN105199642A - Electronic chip glue - Google Patents
Electronic chip glue Download PDFInfo
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- CN105199642A CN105199642A CN201510701591.XA CN201510701591A CN105199642A CN 105199642 A CN105199642 A CN 105199642A CN 201510701591 A CN201510701591 A CN 201510701591A CN 105199642 A CN105199642 A CN 105199642A
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- electronic chip
- rubber
- chip glue
- resin
- glue according
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Abstract
The invention relates to electronic chip glue which comprises, by weight, 5-9 parts of synthetic resin, 3-7 parts of rubber, 2-5 parts of a flexibilizer, 1-3 parts of a natural high-molecular compound, 1-3 parts of a curing agent, 3-5 parts of a filling material and 4-7 parts of a modifier. The electronic chip glue provided by the invention can be rapidly solidified and can be used to enhance production efficiency of electronic products.
Description
Technical field
The present invention relates to electronic applications, be specifically related to a kind of electronic chip glue.
Background technology
Electronic chip glue is a single component, low-temperature fast-curing tube core glue, develops specially for the bonding of high speed production process.Unique characteristic: low elastic modulus, reduces distortion during bonding different expansion material.But there is following defect in electronic chip at present: can not fast setting.
Summary of the invention
In sum, technical problem to be solved by this invention is to provide a kind of electronic chip glue, can fast setting.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of electronic chip glue, comprises the component of following parts by weight: synthetic resins 5-9 part, rubber 3-7 part, toughner 2-5 part, natural high moleculer eompound 1-3 part, solidifying agent 1-3 part, filler 3-5 part and properties-correcting agent 4-7 part.
Further, described synthetic resins is the wherein one in epoxy resin, acrylic resin, urethane resin, polyvinyl acetate resins, polyvinyl alcohol resin, urea-formaldehyde resin, resol or silicone resin.
Further, described rubber is the one of natural rubber, polyisoprene rubber, cis-1,4-polybutadiene rubber, ethylene-propylene rubber(EPR), styrene-butadiene rubber(SBR) or paracril
Further, described natural high moleculer eompound is the wherein one in vegetable jelly, starch or modified starch.
Further, described solidifying agent is the wherein one in quadrol, isophorone diamine, substituted urea, phenolic aldehyde amine, polymeric amide or acid anhydrides.
Further, described filler is the wherein one in stone flour, kaolin, calcium carbonate, white carbon black, Calucium Silicate powder or sodium silicoaluminate.
Further, described properties-correcting agent is the wherein one in tackifying resin, coupling agent, emulsifying agent, stablizer, oxidation inhibitor or pigment.
The invention has the beneficial effects as follows: a kind of electronic chip glue provided by the invention, can fast setting, improve the efficiency of electronic product production technique.
Embodiment
Be described principle of the present invention and feature below in conjunction with specific examples, example, only for explaining the present invention, is not intended to limit scope of the present invention.
A kind of electronic chip glue, comprises the component of following parts by weight: synthetic resins 5-9 part, rubber 3-7 part, toughner 2-5 part, natural high moleculer eompound 1-3 part, solidifying agent 1-3 part, filler 3-5 part and properties-correcting agent 4-7 part.
Preferably, described synthetic resins is the wherein one in epoxy resin, acrylic resin, urethane resin, polyvinyl acetate resins, polyvinyl alcohol resin, urea-formaldehyde resin, resol or silicone resin.
Preferably, described rubber is the one of natural rubber, polyisoprene rubber, cis-1,4-polybutadiene rubber, ethylene-propylene rubber(EPR), styrene-butadiene rubber(SBR) or paracril
Preferably, described natural high moleculer eompound is the wherein one in vegetable jelly, starch or modified starch.
Preferably, described solidifying agent is the wherein one in quadrol, isophorone diamine, substituted urea, phenolic aldehyde amine, polymeric amide or acid anhydrides.
Preferably, described filler is the wherein one in stone flour, kaolin, calcium carbonate, white carbon black, Calucium Silicate powder or sodium silicoaluminate.
Preferably, described properties-correcting agent is the wherein one in tackifying resin, coupling agent, emulsifying agent, stablizer, oxidation inhibitor or pigment.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. an electronic chip glue, is characterized in that, comprises the component of following parts by weight: synthetic resins 5-9 part, rubber 3-7 part, toughner 2-5 part, natural high moleculer eompound 1-3 part, solidifying agent 1-3 part, filler 3-5 part and properties-correcting agent 4-7 part.
2. a kind of electronic chip glue according to claim 1, it is characterized in that, described synthetic resins is the wherein one in epoxy resin, acrylic resin, urethane resin, polyvinyl acetate resins, polyvinyl alcohol resin, urea-formaldehyde resin, resol or silicone resin.
3. a kind of electronic chip glue according to claim 1, is characterized in that, described rubber is the one of natural rubber, polyisoprene rubber, cis-1,4-polybutadiene rubber, ethylene-propylene rubber(EPR), styrene-butadiene rubber(SBR) or paracril.
4. a kind of electronic chip glue according to claim 1, is characterized in that, described natural high moleculer eompound is the wherein one in vegetable jelly, starch or modified starch.
5. a kind of electronic chip glue according to claim 1, is characterized in that, described solidifying agent is the wherein one in quadrol, isophorone diamine, substituted urea, phenolic aldehyde amine, polymeric amide or acid anhydrides.
6. a kind of electronic chip glue according to claim 1, is characterized in that, described filler is the wherein one in stone flour, kaolin, calcium carbonate, white carbon black, Calucium Silicate powder or sodium silicoaluminate.
7. a kind of electronic chip glue according to claim 1, is characterized in that, described properties-correcting agent is the wherein one in tackifying resin, coupling agent, emulsifying agent, stablizer, oxidation inhibitor or pigment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510701591.XA CN105199642A (en) | 2015-10-26 | 2015-10-26 | Electronic chip glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510701591.XA CN105199642A (en) | 2015-10-26 | 2015-10-26 | Electronic chip glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105199642A true CN105199642A (en) | 2015-12-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510701591.XA Pending CN105199642A (en) | 2015-10-26 | 2015-10-26 | Electronic chip glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105199642A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105567134A (en) * | 2016-03-16 | 2016-05-11 | 苏州华周胶带有限公司 | Heat-resistant adhesive material |
| CN105602461A (en) * | 2016-03-11 | 2016-05-25 | 安徽枫华电气有限公司 | LED lamp circuit board adhesive and preparation method thereof |
| CN106244064A (en) * | 2016-08-29 | 2016-12-21 | 龙利得包装印刷股份有限公司 | A kind of wrapping paper adhesive and preparation method thereof |
| CN106633796A (en) * | 2016-11-30 | 2017-05-10 | 华蓥旗邦微电子有限公司 | Microelectronic chip packaging treatment material |
| CN106753112A (en) * | 2016-11-29 | 2017-05-31 | 广西大学 | A kind of epoxy construction structure glue |
| CN107418484A (en) * | 2017-05-31 | 2017-12-01 | 江苏精盾节能科技有限公司 | A kind of glass adhesive and preparation method thereof |
| CN107674616A (en) * | 2017-11-10 | 2018-02-09 | 明光市海港凹坭矿业有限公司 | A kind of preparation method of concave convex rod wlding adhesive specially |
| CN107699166A (en) * | 2017-10-25 | 2018-02-16 | 浙江星丰科技有限公司 | A kind of high temperature resistant adhesive and preparation method thereof |
| CN107936897A (en) * | 2017-11-23 | 2018-04-20 | 安徽清龙泉印刷科技股份有限公司 | A kind of resistance to preparation method for freezing adhesive sticker adhesive of acid and alkali-resistance |
| CN108795333A (en) * | 2018-07-03 | 2018-11-13 | 佛山市影腾科技有限公司 | A kind of antistatic adhesive agent of gas sensor chip adherency |
| CN109251719A (en) * | 2018-09-06 | 2019-01-22 | 安徽英美达新材料科技有限公司 | A kind of EPE pearl wool special bonding agent |
| CN110372258A (en) * | 2019-07-08 | 2019-10-25 | 杭州三耐环保科技股份有限公司 | A kind of stirred tank and preparation method thereof |
| CN110484186A (en) * | 2019-08-28 | 2019-11-22 | 深圳市优威高乐技术有限公司 | A kind of high/low temperature environment-protective adhesive of electronic product |
| CN111410438A (en) * | 2020-04-27 | 2020-07-14 | 东莞市嘉镁光学电子有限公司 | Wear-resisting vehicle-mounted glass outer screen |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104962224A (en) * | 2015-07-06 | 2015-10-07 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
-
2015
- 2015-10-26 CN CN201510701591.XA patent/CN105199642A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104962224A (en) * | 2015-07-06 | 2015-10-07 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105602461A (en) * | 2016-03-11 | 2016-05-25 | 安徽枫华电气有限公司 | LED lamp circuit board adhesive and preparation method thereof |
| CN105567134A (en) * | 2016-03-16 | 2016-05-11 | 苏州华周胶带有限公司 | Heat-resistant adhesive material |
| CN106244064A (en) * | 2016-08-29 | 2016-12-21 | 龙利得包装印刷股份有限公司 | A kind of wrapping paper adhesive and preparation method thereof |
| CN106753112A (en) * | 2016-11-29 | 2017-05-31 | 广西大学 | A kind of epoxy construction structure glue |
| CN106633796A (en) * | 2016-11-30 | 2017-05-10 | 华蓥旗邦微电子有限公司 | Microelectronic chip packaging treatment material |
| CN107418484A (en) * | 2017-05-31 | 2017-12-01 | 江苏精盾节能科技有限公司 | A kind of glass adhesive and preparation method thereof |
| CN107699166A (en) * | 2017-10-25 | 2018-02-16 | 浙江星丰科技有限公司 | A kind of high temperature resistant adhesive and preparation method thereof |
| CN107674616A (en) * | 2017-11-10 | 2018-02-09 | 明光市海港凹坭矿业有限公司 | A kind of preparation method of concave convex rod wlding adhesive specially |
| CN107936897A (en) * | 2017-11-23 | 2018-04-20 | 安徽清龙泉印刷科技股份有限公司 | A kind of resistance to preparation method for freezing adhesive sticker adhesive of acid and alkali-resistance |
| CN108795333A (en) * | 2018-07-03 | 2018-11-13 | 佛山市影腾科技有限公司 | A kind of antistatic adhesive agent of gas sensor chip adherency |
| CN109251719A (en) * | 2018-09-06 | 2019-01-22 | 安徽英美达新材料科技有限公司 | A kind of EPE pearl wool special bonding agent |
| CN110372258A (en) * | 2019-07-08 | 2019-10-25 | 杭州三耐环保科技股份有限公司 | A kind of stirred tank and preparation method thereof |
| CN110484186A (en) * | 2019-08-28 | 2019-11-22 | 深圳市优威高乐技术有限公司 | A kind of high/low temperature environment-protective adhesive of electronic product |
| CN111410438A (en) * | 2020-04-27 | 2020-07-14 | 东莞市嘉镁光学电子有限公司 | Wear-resisting vehicle-mounted glass outer screen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151230 |
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| RJ01 | Rejection of invention patent application after publication |