CN107841285A - Weather-resistant conductive adhesive for L ED packaging - Google Patents
Weather-resistant conductive adhesive for L ED packaging Download PDFInfo
- Publication number
- CN107841285A CN107841285A CN201711207122.8A CN201711207122A CN107841285A CN 107841285 A CN107841285 A CN 107841285A CN 201711207122 A CN201711207122 A CN 201711207122A CN 107841285 A CN107841285 A CN 107841285A
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- CN
- China
- Prior art keywords
- parts
- conducting resinl
- weatherability
- curing agent
- led encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 230000001070 adhesive effect Effects 0.000 title abstract description 9
- 239000000853 adhesive Substances 0.000 title abstract description 8
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 claims abstract description 20
- 239000003085 diluting agent Substances 0.000 claims abstract description 19
- 239000007822 coupling agent Substances 0.000 claims abstract description 18
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000004814 polyurethane Substances 0.000 claims abstract description 12
- 229920002635 polyurethane Polymers 0.000 claims abstract description 12
- 239000004926 polymethyl methacrylate Substances 0.000 claims abstract description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims abstract description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 33
- 238000005538 encapsulation Methods 0.000 claims description 20
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 17
- 239000002253 acid Substances 0.000 claims description 13
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 11
- -1 Methacryloxypropyl Chemical group 0.000 claims description 10
- 239000012948 isocyanate Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 150000002460 imidazoles Chemical class 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims 2
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 claims 1
- 241000790917 Dioxys <bee> Species 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 229930192474 thiophene Natural products 0.000 claims 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 abstract 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 abstract 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000004702 methyl esters Chemical class 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J187/00—Adhesives based on unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
- C09J187/005—Block or graft polymers not provided for in groups C09J101/00 - C09J185/04
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a L ED packaging weather-resistant conductive adhesive, which belongs to the technical field of conductive adhesives and comprises, by weight, 10-20 parts of ethyl acetate, 12-18 parts of toluene diisocyanate, 3-9 parts of polyurethane, 2-10 parts of poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid, 2-9 parts of polymethyl methacrylate, 1-3 parts of diboron trioxide, 2-10 parts of gamma- (methacryloyloxy) propyl trimethoxy silane, 0.2-1.5 parts of triethylene diamine, 1-2 parts of a reaction diluent, 0.2-1.6 parts of a curing agent, 0.3-2 parts of an accelerator and 0.5-2.0 parts of a coupling agent.
Description
Technical field
The present invention relates to a kind of LED encapsulation weatherability conducting resinl, belong to conducting resinl technical field.
Background technology
Conductivity type adhesive, abbreviation conducting resinl, be that one kind can effectively be glued various materials, but it is conductive can
Adhesive.Conducting resinl can be divided into structural type and the major class of filled-type two by its composition.Structural type refers to the height as conducting resinl matrix
Molecular material is conductive conducting resinl in itself；Filled-type refers to usual adhesive as matrix, and relies on addition conductive
Property filler makes glue have the conducting resinl of electric action.Now widely used is filled conductive glue.It is conductive in filled-type
The electroconductive stuffing added in glue, usually metal dust, it is common to use be silver powder filled conductive glue.
In the last few years, applying for LED (light emitting diode) had obtained development at full speed in lighting field, with conventional light source
Compare, LED illumination with obvious energy-conserving and environment-protective advantage, be the fields such as room lighting, Landscape Lighting, car lighting not
Carry out trend.The encapsulation technology of LED chips is one of core technology of LED devices manufacture, and traditional encapsulation technology can be fine
Ground meets the requirement of the LED devices of traditional small-power low-light level.But for emerging high light large power LED chip
Encapsulation, as the power of LED chips is increasing, and LED chips are when carrying out electro-optic conversion, about 80% electric energy change
Into heat, so the heat dissipation problem of LED chips becomes increasingly severe, its main cause is that too high working junction temperature will significantly
Its illumination effect and working life are influenceed, so as to influence the long-term use of whole LED devices.
Traditionally, in order to obtain good radiating effect, among the packaging technology of LED chips, it is widely used for conducting resinl
Chip and substrate bonding are got up with fixed chip, while plays a part of being conductively connected and radiates.Traditional common conductive
Glue thermal conductivity compares relatively low, and less than 10W/mK, and the cooling requirements of high light large power LED chip its thermal conductivities can
Higher than 20W/mK, thus traditional conducting resinl can not be used, so need to develop the material with more high-heat conductive efficency, than
Such as high thermal conductivity conducting resinl, while also must in terms of the combination properties such as adhesive property, electric property, application performance, unfailing performance
Even better than traditional conducting resinl must be equal to.Has there are some conducting resinl products in the country, but really can fully expire
The product of the requirement of sufficient weatherability high light large power LED chip is few.
The content of the invention
It is an object of the invention to provide a kind of LED encapsulation weatherability conducting resinl, the present invention passes through ethyl acetate, toluene two
Isocyanates, polyurethane, poly- 3,4- ethene dioxythiophenes-polystyrolsulfon acid, polymethyl methacrylate, three oxidations two
Boron, γ-（Methacryloxypropyl）Propyl trimethoxy silicane, triethylene diamine, reaction diluent, curing agent, accelerator are even
Join agent compounding, it is conductive can preferably, be especially suitable for the high-end electric component LED that becomes more meticulous conductive adhesive and
Encapsulation, and it is effectively improved the weatherability of conducting resinl.
The purpose of the present invention is achieved through the following technical solutions, and weatherability conducting resinl, its feature are used in a kind of LED encapsulation
It is, the conducting resinl is made up of each component of following parts by weight：Ethyl acetate 10-20 parts, toluene di-isocyanate(TDI) 12-18
Part, polyurethane 3-9 parts, poly- 3,4- ethene dioxythiophenes-polystyrolsulfon acid 2-10 parts, polymethyl methacrylate 2-9
Part, diboron trioxide 1-3 parts, γ-（Methacryloxypropyl）Propyl trimethoxy silicane 2-10 parts, triethylene diamine 0.2-
1.5 parts, reaction diluent 1-2 parts, curing agent 0.2-1.6 parts, accelerator 0.3-2 parts, coupling agent 0.5-2.0 parts.
Preferably, the conducting resinl is made up of each component of following parts by weight：14 parts of ethyl acetate, toluene diisocynate
15 parts of ester, 6.4 parts of polyurethane, poly- 3,4- ethene dioxythiophenes -7.6 parts of polystyrolsulfon acid, polymethyl methacrylate
5.9 parts, 1.8 parts of diboron trioxide, γ-（Methacryloxypropyl）8.7 parts of propyl trimethoxy silicane, triethylene diamine
0.9 part, 1.6 parts of reaction diluent, 1.3 parts of curing agent, 1.4 parts of accelerator, 0.9 part of coupling agent.
Preferably, the reaction diluent is aliphatic glycidyl ether epoxy resin.
Preferably, the curing agent is one kind in dicyandiamide, modified imidazole and its derivative and modified amine curing agent
It is or a variety of.
Preferably, the accelerator includes 2,4,6- tri-（Dimethylamino methyl）One kind in phenol and aminoethyl piperazine
Or two kinds.
Preferably, the coupling agent include γ-glycidyl ether oxygen propyl trimethoxy silicane and γ-（Methacryl
Oxygen）One or both of propyl trimethoxy silicane.
Compared with prior art, the invention has the advantages that：The present invention passes through ethyl acetate, toluene diisocynate
Ester, polyurethane, poly- 3,4- ethene dioxythiophenes-polystyrolsulfon acid, polymethyl methacrylate, diboron trioxide, γ-
（Methacryloxypropyl）Propyl trimethoxy silicane, triethylene diamine, reaction diluent, curing agent, accelerator, coupling agent are answered
Match somebody with somebody, it is conductive to be preferably especially suitable for the high-end electric component LED that becomes more meticulous conductive adhesive and encapsulation, and
It is effectively improved the weatherability of conducting resinl.
Embodiment
The following examples are that technical solution of the present invention is further illustrated, but present disclosure is not limited thereto.
Embodiment 1
Weatherability conducting resinl is used in a kind of LED encapsulation, is made up of by weight percentage following component：10 parts of ethyl acetate, toluene two
18 parts of isocyanates, 3 parts of polyurethane, poly- 3,4- ethene dioxythiophenes -10 parts of polystyrolsulfon acid, polymethylacrylic acid
2 parts of methyl esters, 3 parts of diboron trioxide, γ-（Methacryloxypropyl）2 parts of propyl trimethoxy silicane, triethylene diamine 1.5
Part, 1 part of reaction diluent, 1.6 parts of curing agent, 0.3 part of accelerator, 2.0 parts of coupling agent.
Reaction diluent is aliphatic glycidyl ether epoxy resin.Curing agent is dicyandiamide, modified imidazole and its derivative
One or more in thing and modified amine curing agent.Accelerator includes 2,4,6- tri-（Dimethylamino methyl）Phenol and ammonia second
One or both of base piperazine.Coupling agent include γ-glycidyl ether oxygen propyl trimethoxy silicane and γ-（Metering system
Acyl-oxygen）One or both of propyl trimethoxy silicane.
Embodiment 2
Weatherability conducting resinl is used in a kind of LED encapsulation, is made up of by weight percentage following component：20 parts of ethyl acetate, toluene two
12 parts of isocyanates, 9 parts of polyurethane, poly- 3,4- ethene dioxythiophenes -2 parts of polystyrolsulfon acid, poly-methyl methacrylate
9 parts of ester, 1 part of diboron trioxide, γ-（Methacryloxypropyl）10 parts of propyl trimethoxy silicane, triethylene diamine 0.2
Part, 2 parts of reaction diluent, 0.2 part of curing agent, 2 parts of accelerator, 0.5 part of coupling agent.
Reaction diluent, curing agent, accelerator, coupling agent are the same as embodiment 1.
Embodiment 3
Weatherability conducting resinl is used in a kind of LED encapsulation, is made up of by weight percentage following component：14 parts of ethyl acetate, toluene two
15 parts of isocyanates, 6.4 parts of polyurethane, poly- 3,4- ethene dioxythiophenes -7.6 parts of polystyrolsulfon acid, polymethyl
Sour 5.9 parts of methyl esters, 1.8 parts of diboron trioxide, γ-（Methacryloxypropyl）8.7 parts of propyl trimethoxy silicane, triethylene
0.9 part of diamines, 1.6 parts of reaction diluent, 1.3 parts of curing agent, 1.4 parts of accelerator, 0.9 part of coupling agent.
Reaction diluent, curing agent, accelerator, coupling agent are the same as embodiment 1.
Embodiment 4
Weatherability conducting resinl is used in a kind of LED encapsulation, is made up of by weight percentage following component：12 parts of ethyl acetate, toluene two
12.8 parts of isocyanates, 4.2 parts of polyurethane, poly- 3,4- ethene dioxythiophenes -3.9 parts of polystyrolsulfon acid, poly- methyl-prop
3.8 parts of e pioic acid methyl ester, 1.6 parts of diboron trioxide, γ-（Methacryloxypropyl）4.2 parts of propyl trimethoxy silicane, three second
0.5 part of alkene diamines, 1.3 parts of reaction diluent, 0.7 part of curing agent, 0.7 part of accelerator, 0.7 part of coupling agent.
Reaction diluent, curing agent, accelerator, coupling agent are the same as embodiment 1.
Embodiment 5
Weatherability conducting resinl is used in a kind of LED encapsulation, is made up of by weight percentage following component：18.6 parts of ethyl acetate, toluene
16.6 parts of diisocyanate, 7.6 parts of polyurethane, poly- 3,4- ethene dioxythiophenes -8.6 parts of polystyrolsulfon acid, poly- methyl
7.7 parts of methyl acrylate, 2.7 parts of diboron trioxide, γ-（Methacryloxypropyl）8.4 parts of propyl trimethoxy silicane, three
1.2 parts of ethylene diamine, 1.7 parts of reaction diluent, 1.3 parts of curing agent, 1.6 parts of accelerator, 1.6 parts of coupling agent.
Reaction diluent, curing agent, accelerator, coupling agent are the same as embodiment 1.
Claims (6)
1. weatherability conducting resinl is used in a kind of LED encapsulation, it is characterised in that the conducting resinl by following parts by weight each component group
Into：Ethyl acetate 10-20 parts, toluene di-isocyanate(TDI) 12-18 parts, polyurethane 3-9 parts, poly- 3,4- ethene dioxythiophenes-
Polystyrolsulfon acid 2-10 parts, polymethyl methacrylate 2-9 parts, diboron trioxide 1-3 parts, γ-（Methacryl
Oxygen）Propyl trimethoxy silicane 2-10 parts, triethylene diamine 0.2-1.5 parts, reaction diluent 1-2 parts, curing agent 0.2-
1.6 parts, accelerator 0.3-2 parts, coupling agent 0.5-2.0 parts.
2. weatherability conducting resinl is used in a kind of LED encapsulation according to claim 1, it is characterised in that the conducting resinl by with
The each component composition of lower parts by weight：14 parts of ethyl acetate, 15 parts of toluene di-isocyanate(TDI), 6.4 parts of polyurethane, poly- 3,4- second
Alkene dioxy thiophene -7.6 parts of polystyrolsulfon acid, 5.9 parts of polymethyl methacrylate, 1.8 parts of diboron trioxide, γ -
（Methacryloxypropyl）8.7 parts of propyl trimethoxy silicane, 0.9 part of triethylene diamine, 1.6 parts of reaction diluent, curing agent
1.3 parts, 1.4 parts of accelerator, 0.9 part of coupling agent.
3. weatherability conducting resinl is used in a kind of LED encapsulation according to claim 1, it is characterised in that the reaction diluent
For aliphatic glycidyl ether epoxy resin.
4. weatherability conducting resinl is used in a kind of LED encapsulation according to claim 1, it is characterised in that the curing agent is double
One or more in cyanamide, modified imidazole and its derivative and modified amine curing agent.
5. weatherability conducting resinl is used in a kind of LED encapsulation according to claim 1, it is characterised in that the accelerator includes
2,4,6- tri-（Dimethylamino methyl）One or both of phenol and aminoethyl piperazine.
6. weatherability conducting resinl is used in a kind of LED encapsulation according to claim 1, it is characterised in that the coupling agent includes
γ-glycidyl ether oxygen propyl trimethoxy silicane and γ-（Methacryloxypropyl）One kind in propyl trimethoxy silicane or
Two kinds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711207122.8A CN107841285A (en) | 2017-11-27 | 2017-11-27 | Weather-resistant conductive adhesive for L ED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711207122.8A CN107841285A (en) | 2017-11-27 | 2017-11-27 | Weather-resistant conductive adhesive for L ED packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107841285A true CN107841285A (en) | 2018-03-27 |
Family
ID=61680397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711207122.8A Withdrawn CN107841285A (en) | 2017-11-27 | 2017-11-27 | Weather-resistant conductive adhesive for L ED packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107841285A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109796768A (en) * | 2019-01-28 | 2019-05-24 | 湖南七纬科技有限公司 | A kind of LED encapsulation material and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102942884A (en) * | 2012-11-20 | 2013-02-27 | 东莞市松山湖微电子材料研发中心 | Conductive adhesive containing semisolid formed copper-based filler |
-
2017
- 2017-11-27 CN CN201711207122.8A patent/CN107841285A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102942884A (en) * | 2012-11-20 | 2013-02-27 | 东莞市松山湖微电子材料研发中心 | Conductive adhesive containing semisolid formed copper-based filler |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109796768A (en) * | 2019-01-28 | 2019-05-24 | 湖南七纬科技有限公司 | A kind of LED encapsulation material and preparation method thereof |
| CN109796768B (en) * | 2019-01-28 | 2021-12-07 | 湖南七纬科技有限公司 | LED packaging material and preparation method thereof |
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Application publication date: 20180327 |