CN102850971A - Water-based adhesive used for fixation of electronic circuit - Google Patents
Water-based adhesive used for fixation of electronic circuit Download PDFInfo
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- CN102850971A CN102850971A CN 201210313858 CN201210313858A CN102850971A CN 102850971 A CN102850971 A CN 102850971A CN 201210313858 CN201210313858 CN 201210313858 CN 201210313858 A CN201210313858 A CN 201210313858A CN 102850971 A CN102850971 A CN 102850971A
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- electronic circuit
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- based adhesive
- aqueous adhesives
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Abstract
The invention discloses a water-based adhesive used for fixation of an electronic circuit. The water-based adhesive comprises, by weight, 20 to 30 parts of acrylic acid emulsion, 20 to 30 parts of polyvinyl alcohol, 20 to 25 parts of an inorganic filling material, 10 to 15 parts of a diester film forming auxiliary agent, 1 to 1.5 parts of a tackifier, 1.5 to 1.8 parts of a plasticizer and 1.5 to 3.0 parts of an antioxidant. The water-based adhesive prepared in the invention has good flowing performance and thixotropy, small shrinkage and excellent insulating properties and can guarantee excellent electrical performance of the electronic circuit under high frequency.
Description
Technical field
The present invention relates to a kind of for the fixing Aqueous Adhesives of electronic circuit.
Background technology
In the manufacturing processed of electronic product and instrument, adopt " glued joint the location " to solve the difficult problem in many device fabrications, especially in the installation process of the Circuits System of equipment, use the line encapsulate to carry out that circuit is fixing can to greatly reduce the probability of makeing mistakes, enhance productivity, more the maintenance and repair of equipment brought greatly convenient.The line encapsulate should possess following performance: arranged, to guarantee adjustment, debugging certain set time; Have good elasticity, higher bonding strength, through repeatedly debugging, fixed coil does not produce displacement; Solidify post-shrinkage ratio little.Require thixotropy good in the use, good leveling property, not corroding metal and plastic component.Insulating property are good, guarantee the excellent electrical under the high frequency.At present, there are the weak points such as rate of drying is slow, the glue-line drying process can discharge harmful gas, need to be heating and curing in the line encapsulate that China produces, and in a single day glue-line is difficult for peeling off between dry rear each wire, and the main dependence on import of line encapsulate commonly used makes to produce to be restricted.Therefore, prepare that a kind of performance is good, material environment friendly and low-cost line encapsulate, become an important research topic.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of for the fixing Aqueous Adhesives of electronic circuit, and its trickling property and thixotropy are good, shrinking percentage is little, material environment friendly and low price.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of for the fixing Aqueous Adhesives of electronic circuit, each component is according to following part by weight proportioning: ACRYLIC EMULSION, 20-30 part; Polyvinyl alcohol, 20-30 part; Mineral filler, 20-25 part; The dibasic acid esters film coalescence aid, 10-15 part; Tackifier, 1-1.5 part; Softening agent, 1.5-1.8 part; Anti-aging agent, 1.5-3.0 part.
Described mineral filler is one or more in silica flour, mica powder, titanium dioxide, calcium carbonate, talcum powder, aluminium hydroxide, aerosil and the silica powder, and granularity is between 600 orders-700 order.
Described tackifier are silane, Gum Rosin and derivative thereof.
Described softening agent is dibutyl phthalate (DBP) or dioctyl phthalate (DOP) (DOP).
Anti-aging agent is the aromatic amine anti-aging agent.
Beneficial effect of the present invention: the aqueous wire coating adhesive of the inventive method preparation have trickling property and thixotropy good, shrinking percentage is little, insulating property are good, guarantee the excellent electrical under the high frequency.
Embodiment
Embodiment 1
A kind of for the fixing Aqueous Adhesives of electronic circuit, each component is according to following part by weight proportioning: ACRYLIC EMULSION, 20-30 part; Polyvinyl alcohol, 20-30 part; Mineral filler, 20-25 part; The dibasic acid esters film coalescence aid, 10-15 part; Tackifier, 1-1.5 part; Softening agent, 1.5-1.8 part; Anti-aging agent, 1.5-3.0 part.
Described mineral filler is one or more in silica flour, mica powder, titanium dioxide, calcium carbonate, talcum powder, aluminium hydroxide, aerosil and the silica powder, and granularity is between 600 orders-700 order.
Described tackifier are silane, Gum Rosin and derivative thereof.
Described softening agent is dibutyl phthalate (DBP) or dioctyl phthalate (DOP) (DOP).
Anti-aging agent is the aromatic amine anti-aging agent.
Claims (5)
1. one kind is used for the fixing Aqueous Adhesives of electronic circuit, and each component is according to following part by weight proportioning: ACRYLIC EMULSION, 20-30 part; Polyvinyl alcohol, 20-30 part; Mineral filler, 20-25 part; The dibasic acid esters film coalescence aid, 10-15 part; Tackifier, 1-1.5 part; Softening agent, 1.5-1.8 part; Anti-aging agent, 1.5-3.0 part.
2. Aqueous Adhesives according to claim 1, described mineral filler is one or more in silica flour, mica powder, titanium dioxide, calcium carbonate, talcum powder, aluminium hydroxide, aerosil and the silica powder, granularity is between 600 orders-700 order.
3. Aqueous Adhesives according to claim 1, described tackifier are silane, Gum Rosin and derivative thereof.
4. Aqueous Adhesives according to claim 1, described softening agent is dibutyl phthalate (DBP) or dioctyl phthalate (DOP) (DOP).
5. aqueous wire coating adhesive according to claim 1, anti-aging agent is the aromatic amine anti-aging agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210313858 CN102850971A (en) | 2012-08-30 | 2012-08-30 | Water-based adhesive used for fixation of electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210313858 CN102850971A (en) | 2012-08-30 | 2012-08-30 | Water-based adhesive used for fixation of electronic circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102850971A true CN102850971A (en) | 2013-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210313858 Pending CN102850971A (en) | 2012-08-30 | 2012-08-30 | Water-based adhesive used for fixation of electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102850971A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103525334A (en) * | 2013-09-29 | 2014-01-22 | 苏州华周胶带有限公司 | Powerful adhesive of adhesive tape |
| CN104449479A (en) * | 2014-12-31 | 2015-03-25 | 天津市润群耐火材料科技有限公司 | High-temperature fireproof glue |
-
2012
- 2012-08-30 CN CN 201210313858 patent/CN102850971A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103525334A (en) * | 2013-09-29 | 2014-01-22 | 苏州华周胶带有限公司 | Powerful adhesive of adhesive tape |
| CN104449479A (en) * | 2014-12-31 | 2015-03-25 | 天津市润群耐火材料科技有限公司 | High-temperature fireproof glue |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130102 |