CN105567134A - Heat-resistant adhesive material - Google Patents
Heat-resistant adhesive material Download PDFInfo
- Publication number
- CN105567134A CN105567134A CN201610147319.6A CN201610147319A CN105567134A CN 105567134 A CN105567134 A CN 105567134A CN 201610147319 A CN201610147319 A CN 201610147319A CN 105567134 A CN105567134 A CN 105567134A
- Authority
- CN
- China
- Prior art keywords
- parts
- sizing material
- adhesive tape
- bisphenol
- paraffin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a heat-resistant adhesive material which is prepared from the following raw materials in parts by weight: 70-80 parts of ethylene-vinyl acetate-acrylate copolymer, 50-60 parts of polyamide resin, 25-35 parts of bisphenol A epoxy resin, 8-12 parts of aluminum hydroxide and 1-4 parts of paraffin. The adhesive material is coated on an adhesive tape. The heat-resistant adhesive material has favorable heat resistance, and can still keep the viscosity even when being used in a high-temperature environment. The adhesive tape prepared from the adhesive material can be used in a high-temperature environment, can not have a change of viscosity and can effectively keep bonding.
Description
Technical field
The present invention relates to adhesive tape and related raw material thereof and production field, particularly relate to a kind of sizing material with resistance toheat.
Background technology
Adhesive tape is the banded article of a kind of gumminess, has diversified purposes.Adhesive tape both may be used for the various product of the fixing protection of joint sealing, can provide protection in process of production again.Adhesive tape can be widely used in the framework bonding of the multiple materials such as metal, plastics, glass, pottery, as fixing, the laminated glass etc. of electronic product plastic components.Special adhesive tape can also be used for electrostatic sensitive product as anti-electrostatic adhesive tape or warning function is made in anti-electrostatic region.Existing adhesive tape resistance toheat is poor, at high temperature just can not use, and cannot be applied in particular surroundings.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of sizing material with resistance toheat, can use in high temperature environments.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of sizing material with resistance toheat, the feed composition of described sizing material comprises ethene-vinyl acetate-acrylate interpolymer, polyamide resin, bisphenol A type epoxy resin, aluminium hydroxide and paraffin, described sizing material is with parts by weight, the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 70-80 part, polyamide resin 50-60 part, bisphenol A type epoxy resin 25-35 part, aluminium hydroxide 8-12 part, paraffin 1-4 part, described sizing material is coated on adhesive tape.
In a preferred embodiment of the present invention, described in be coated with sizing material adhesive tape use at 130-150 DEG C.
In a preferred embodiment of the present invention, described sizing material is with parts by weight, and the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 75 parts, polyamide resin 55 parts, bisphenol A type epoxy resin 30 parts, 10 parts, aluminium hydroxide, 3 parts, paraffin.
In a preferred embodiment of the present invention, described sizing material is with parts by weight, and the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 70 parts, polyamide resin 60 parts, bisphenol A type epoxy resin 25 parts, 12 parts, aluminium hydroxide, 4 parts, paraffin.
The invention has the beneficial effects as follows: the sizing material with resistance toheat of the present invention, the good heat resistance of sizing material, even if use viscosity also still to keep in hot environment, the adhesive tape adopting this sizing material to obtain can use in hot environment, can not viscosity be changed, can effectively keep bonding.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one:
A kind of sizing material with resistance toheat is provided, the feed composition of described sizing material comprises ethene-vinyl acetate-acrylate interpolymer, polyamide resin, bisphenol A type epoxy resin, aluminium hydroxide and paraffin, described sizing material is with parts by weight, the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 75 parts, polyamide resin 55 parts, bisphenol A type epoxy resin 30 parts, 10 parts, aluminium hydroxide, 3 parts, paraffin, described sizing material is coated on adhesive tape.The described adhesive tape being coated with sizing material uses at 130-150 DEG C.
Embodiment two:
A kind of sizing material with resistance toheat is provided, the feed composition of described sizing material comprises ethene-vinyl acetate-acrylate interpolymer, polyamide resin, bisphenol A type epoxy resin, aluminium hydroxide and paraffin, described sizing material is with parts by weight, the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 80 parts, polyamide resin 50 parts, bisphenol A type epoxy resin 35 parts, 8 parts, aluminium hydroxide, 1 part, paraffin, described sizing material is coated on adhesive tape.The described adhesive tape being coated with sizing material uses at 130-150 DEG C.
Embodiment three:
A kind of sizing material with resistance toheat is provided, the feed composition of described sizing material comprises ethene-vinyl acetate-acrylate interpolymer, polyamide resin, bisphenol A type epoxy resin, aluminium hydroxide and paraffin, described sizing material is with parts by weight, the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 70 parts, polyamide resin 60 parts, bisphenol A type epoxy resin 25 parts, 12 parts, aluminium hydroxide, 4 parts, paraffin, described sizing material is coated on adhesive tape.The described adhesive tape being coated with sizing material uses at 130-150 DEG C.
The invention has the beneficial effects as follows:
One, the good heat resistance of described sizing material, even if use viscosity also still to keep in hot environment;
Two, the adhesive tape adopting this sizing material to obtain can use in hot environment, can not change viscosity, can effectively keep bonding.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. one kind has the sizing material of resistance toheat, it is characterized in that, the feed composition of described sizing material comprises ethene-vinyl acetate-acrylate interpolymer, polyamide resin, bisphenol A type epoxy resin, aluminium hydroxide and paraffin, described sizing material is with parts by weight, the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 70-80 part, polyamide resin 50-60 part, bisphenol A type epoxy resin 25-35 part, aluminium hydroxide 8-12 part, paraffin 1-4 part, described sizing material is coated on adhesive tape.
2. the sizing material with resistance toheat according to claim 1, is characterized in that, described in be coated with sizing material adhesive tape use at 130-150 DEG C.
3. the sizing material with resistance toheat according to claim 1, it is characterized in that, described sizing material is with parts by weight, and the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 75 parts, polyamide resin 55 parts, bisphenol A type epoxy resin 30 parts, 10 parts, aluminium hydroxide, 3 parts, paraffin.
4. the sizing material with resistance toheat according to claim 1, it is characterized in that, described sizing material is with parts by weight, and the feed composition comprised is: ethene-vinyl acetate-acrylate interpolymer 70 parts, polyamide resin 60 parts, bisphenol A type epoxy resin 25 parts, 12 parts, aluminium hydroxide, 4 parts, paraffin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610147319.6A CN105567134A (en) | 2016-03-16 | 2016-03-16 | Heat-resistant adhesive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610147319.6A CN105567134A (en) | 2016-03-16 | 2016-03-16 | Heat-resistant adhesive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105567134A true CN105567134A (en) | 2016-05-11 |
Family
ID=55877792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610147319.6A Pending CN105567134A (en) | 2016-03-16 | 2016-03-16 | Heat-resistant adhesive material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105567134A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114672277A (en) * | 2022-05-07 | 2022-06-28 | 常州亚龙电子科技有限公司 | Dust catching glue for dust-free workshop and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101210157A (en) * | 2006-12-31 | 2008-07-02 | 郑旷宇 | Micron nano material composite modified water-based adhesive |
| CN102876240A (en) * | 2012-09-20 | 2013-01-16 | 吴江市天源塑胶有限公司 | High-performance building adhesive |
| CN103965796A (en) * | 2013-09-04 | 2014-08-06 | 杨学荣 | Formaldehyde-free wood adhesive film |
| CN104745109A (en) * | 2015-04-16 | 2015-07-01 | 中天光伏材料有限公司 | White EVA adhesive film for photovoltaic module encapsulation |
| CN105199642A (en) * | 2015-10-26 | 2015-12-30 | 马国才 | Electronic chip glue |
-
2016
- 2016-03-16 CN CN201610147319.6A patent/CN105567134A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101210157A (en) * | 2006-12-31 | 2008-07-02 | 郑旷宇 | Micron nano material composite modified water-based adhesive |
| CN102876240A (en) * | 2012-09-20 | 2013-01-16 | 吴江市天源塑胶有限公司 | High-performance building adhesive |
| CN103965796A (en) * | 2013-09-04 | 2014-08-06 | 杨学荣 | Formaldehyde-free wood adhesive film |
| CN104745109A (en) * | 2015-04-16 | 2015-07-01 | 中天光伏材料有限公司 | White EVA adhesive film for photovoltaic module encapsulation |
| CN105199642A (en) * | 2015-10-26 | 2015-12-30 | 马国才 | Electronic chip glue |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114672277A (en) * | 2022-05-07 | 2022-06-28 | 常州亚龙电子科技有限公司 | Dust catching glue for dust-free workshop and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160511 |