CN104231991A - Epoxy resin adhesive - Google Patents

Epoxy resin adhesive Download PDF

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Publication number
CN104231991A
CN104231991A CN201410435678.2A CN201410435678A CN104231991A CN 104231991 A CN104231991 A CN 104231991A CN 201410435678 A CN201410435678 A CN 201410435678A CN 104231991 A CN104231991 A CN 104231991A
Authority
CN
China
Prior art keywords
parts
epoxy resin
resin adhesive
diethylenetriamine
butadiene rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410435678.2A
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Chinese (zh)
Inventor
王寿高
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201410435678.2A priority Critical patent/CN104231991A/en
Publication of CN104231991A publication Critical patent/CN104231991A/en
Pending legal-status Critical Current

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Abstract

The invention provides an epoxy resin adhesive which is prepared from the following components in parts by weight: 80-100 parts of AG-80 epoxy resin, 10-20 parts of liquid nitrile-butadiene rubber, 8-10 parts of talcum powder, 8-12 parts of diethylenetriamine, 12-15 parts of dibutyl phthalate and 10-15 parts of curing agent. The epoxy resin adhesive is used for bonding metal, glass, ceramic and concrete and repairing cast iron parts, and has the characteristics of favorable bonding property, high resistance, oil resistance and dielectric resistance.

Description

A kind of epoxy resin adhesive
Technical field
The present invention relates to caking agent, be specifically related to a kind of epoxy resin adhesive repaired for metal, glass, pottery, concrete bonding and cast iron product.
Background technology
Take epoxy resin as the tackiness agent of base-material, the bonding various metals of energy and non-metallic material, it has good processing characteristics, excellent mechanical property, electrical property and chemical resistance.But, after unmodified epoxy resin cure, because fragility limits greatly its use.The method of modified epoxy is a lot, but to add elastomerics and thermoplastics carries out modified toughened method.But being separated of elastomerics and epoxy resin occurs elastomer-modified method in the solidification process of tackiness agent in the past, elastomerics forms disperse phase, the energy-absorbing when system is subject to impacting, thus the object reaching toughening modifying.Along with the increase of engineering adhesive demand, at present its Research Requirements is increased.
Engineering adhesive must possess good bonding strength and toughness.Some occasion also has special requirement to the elasticity of tackiness agent, operation performance, such as in the fabrication line of Vehicular lamp, tackiness agent adopts mechanical pump to carry usually, require that tackiness agent has lower viscosity, require that tackiness agent has good thixotropy in use and solidification process simultaneously, namely seldom trickle.And for the tackiness agent for muffle and metab, then requiring that tackiness agent has good elasticity, the extension at break as tackiness agent requires to reach 50% with first-class.Such tackiness agent still can not reach service requirements at present.
Summary of the invention
The object of the invention is to solve existing technological deficiency, a kind of epoxy resin adhesive is provided, have that cementability is good, patience is high, the feature of oil resistant, media-resistant.
The technical solution adopted in the present invention is: a kind of epoxy resin adhesive, be made up of the component of following weight part, AG-80 epoxy resin 80-100 part, liquid acrylonitrile butadiene rubber 10-20 part, talcum powder 8-10 part, diethylenetriamine 8-12 part, dibutyl phthalate 12-15 part, solidifying agent 10-15 part.
As a further improvement on the present invention, talcous granularity is 200 orders.
The invention has the beneficial effects as follows: epoxy resin adhesive provided by the invention compared with prior art, has that cementability is good, patience is high, the feature of oil resistant, media-resistant.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
Embodiment 1
A kind of epoxy resin adhesive, is made up of the component of following weight part, AG-80 epoxy resin 100 parts, liquid acrylonitrile butadiene rubber 10 parts, 200 order talcum powder 10 parts, diethylenetriamine 8 parts, dibutyl phthalate 12 parts, 10 parts, solidifying agent.
Embodiment 2
A kind of epoxy resin adhesive, is made up of the component of following weight part, AG-80 epoxy resin 80 parts, liquid acrylonitrile butadiene rubber 20 parts, 200 order talcum powder 8 parts, diethylenetriamine 12 parts, dibutyl phthalate 15 parts, 15 parts, solidifying agent.
Embodiment 3
A kind of epoxy resin adhesive, is made up of the component of following weight part, AG-80 epoxy resin 90 parts, liquid acrylonitrile butadiene rubber 15 parts, 200 order talcum powder 9 parts, diethylenetriamine 10 parts, dibutyl phthalate 13 parts, 13 parts, solidifying agent.
Be only the preferred embodiment of the present invention described in upper, it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle, can also make some improvement, these improvement also should be considered as protection scope of the present invention.

Claims (2)

1. an epoxy resin adhesive, it is characterized in that, be made up of the component of following weight part: AG-80 epoxy resin 80-100 part, liquid acrylonitrile butadiene rubber 10-20 part, talcum powder 8-10 part, diethylenetriamine 8-12 part, dibutyl phthalate 12-15 part, solidifying agent 10-15 part.
2. a kind of epoxy resin adhesive according to claim 1, is characterized in that: described talcous granularity is 200 orders.
CN201410435678.2A 2014-08-31 2014-08-31 Epoxy resin adhesive Pending CN104231991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410435678.2A CN104231991A (en) 2014-08-31 2014-08-31 Epoxy resin adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410435678.2A CN104231991A (en) 2014-08-31 2014-08-31 Epoxy resin adhesive

Publications (1)

Publication Number Publication Date
CN104231991A true CN104231991A (en) 2014-12-24

Family

ID=52220916

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410435678.2A Pending CN104231991A (en) 2014-08-31 2014-08-31 Epoxy resin adhesive

Country Status (1)

Country Link
CN (1) CN104231991A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106047279A (en) * 2016-05-25 2016-10-26 合肥东彩印刷科技有限公司 Epoxy adhesive for metal materials
CN109897585A (en) * 2019-03-12 2019-06-18 重庆市君豪玻璃钢有限责任公司 A kind of corrosion-resistant bonding agent of flexibility and preparation method
CN110257827A (en) * 2019-05-28 2019-09-20 西南电子技术研究所(中国电子科技集团公司第十研究所) The method of pit is filled up before metal component japanning
CN115322713A (en) * 2022-07-25 2022-11-11 烟台恒邦泵业有限公司 Bonded iron-silicon-iron and preparation process thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106047279A (en) * 2016-05-25 2016-10-26 合肥东彩印刷科技有限公司 Epoxy adhesive for metal materials
CN109897585A (en) * 2019-03-12 2019-06-18 重庆市君豪玻璃钢有限责任公司 A kind of corrosion-resistant bonding agent of flexibility and preparation method
CN110257827A (en) * 2019-05-28 2019-09-20 西南电子技术研究所(中国电子科技集团公司第十研究所) The method of pit is filled up before metal component japanning
CN115322713A (en) * 2022-07-25 2022-11-11 烟台恒邦泵业有限公司 Bonded iron-silicon-iron and preparation process thereof

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WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141224