CN105161608B - 一种led灯丝发光条及其制备方法 - Google Patents
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Abstract
一种LED灯丝发光条及其制备方法，该LED灯丝发光条包括上下两排LED芯片，下排中的各个LED芯片间隔排布，上排中的各个LED芯片分别搭接在下排中两个相邻LED芯片之间，下排LED芯片与上排LED芯片的发光面相对，上排中的各LED芯片的正电极和负电极分别与其搭接的下排中相邻两个LED芯片的负电极和正电极焊接在一起。其制备方法是在下排各个LED芯片的正电极和负电极上刷涂锡膏；加热使锡膏熔融，将对应的电极焊接，在串接芯片条的正反面包覆荧光胶并固化。本发明采用互不重叠的芯片发光面之间面面对应排布，提高了出光的均匀性，利于散热；芯片之间避免了打线串接，降低了封装成本，提高了成品的良率。
Description
技术领域
本发明涉及一种LED灯丝发光条及其制备方法，属于半导体发光器件制造技术领域。
背景技术
发光二极管（LED）以其采用恒流驱动，具有节能环保、体积小、低功耗、使用寿命长而大获发展。相比于传统白炽灯，LED发光由于其点光源和方向性的特点，使得很难直接替代传统白炽灯的使用，所以现在人们将LED通过封装制程将LED芯片制成灯丝条，接入电流电源后便可像钨丝灯一样全角度发光。其中LED灯丝灯中的LED通常以串联或并联，或串并结合和的方式固定在一起，通过连线连接，然后装配上必要的驱动电源、灯头等零件形成完整的LED灯泡，这不仅具备了常规LED灯的节能环保、寿命长的优点，还实现了常规白炽灯全角度发光的特性，深受照明市场欢迎。
LED灯丝灯虽然具备了传统白炽灯全角度发光的特性，但是目前使用的灯丝灯条仍然存在产品质量不稳定，一致性差的缺点，如LED芯片与芯片之间通过打线连接，通常容易出现虚焊导致接触不良、金球焊偏导致漏电死灯、封装步骤复杂成本居高不下，以及成品良率低等情形。另外，现有的LED灯丝芯片依附基板，单向连续分布在基板两侧，既影响了部分光线的透射，又阻碍热的散出。
中国专利文献CN103560194A公开的《一种LED灯丝芯片条的制造方法及LED灯丝》，是通过在衬底上划分长条芯片区以便于形成长条形的LED灯丝芯片条，由于LED灯丝芯片条内部的LED灯丝芯片已经串联好，在后续制作成LED灯丝时无需进行多次固晶打线工艺，从而简化工艺，降低生产成本。虽然所述灯丝芯片条省却了固晶打线工艺，但同时存在芯片集中，散热难以处理的问题。
中国专利文献CN104505453A公开的《一种无焊线LED灯丝》，灯丝基板上设有电路，LED芯片连接在电路上，电路由若干连接电路构成，连接电路包括两个导电银层，两个导电银层之间通过导电线路相连，LED芯片为倒装芯片，LED芯片设置在两相邻连接电路间，将连接电路相连通。本发明的优点是采用无焊线结构，节省费用又减小了焊线过程对LED可靠性和生产良率的影响。但灯丝预先在基板上设置电路以及连接电路上铺设导电银层，增加制备步骤影响成本的降低。
中国专利文献CN204289439U公开的《一种全周发光的LED灯丝》，包括混有荧光粉的基板，基板上设置有电极，至少一个LED芯片，以及覆盖在LED芯片上的封装胶。通过含有荧光粉的硅树脂形成的基板，免除了玻璃或蓝宝石作为基板的成本，且避免了玻璃或蓝宝石对芯片出光的影响。该灯丝虽然实现360度出光，然而含荧光粉的硅树脂形成的基板与芯片的发光取向之间必然要满足特定要求，否则最终可能出现混光不均匀现象。
相比已有的LED灯丝芯片依附基板，单向连续分布在基板两侧，基板不仅影响了光线的透射，增加成本，同时又阻碍热的散出，且芯片的分布方式影响光的均匀性，芯片的打线连接降低封装良率的可靠性。
发明内容
针对现有LED灯丝技术存在的不足，本发明提供一种出光均匀性好、利于散热的LED灯丝发光条，同时提供一种该LED灯丝发光条的制备方法。
本发明的LED灯丝发光条，采用以下技术方案：
该LED灯丝发光条，包括上下两排LED芯片，下排中的各个LED芯片间隔排布，上排中的各个LED芯片分别搭接在下排中两个相邻LED芯片之间，下排LED芯片与上排LED芯片的发光面相对，上排中的各LED芯片的正电极和负电极分别与其搭接的下排中相邻两个LED芯片的负电极和正电极焊接在一起，所有LED芯片串接成芯片条，芯片条上包覆有荧光胶层。
所述LED芯片的正电极和负电极对称分布在芯片发光面两端。
所述上排LED芯片中至少有一个LED芯片，下排LED芯片中至少有两个LED芯片。
上述LED灯丝发光条的制备方法，包括步骤如下：
（1）排布下排LED芯片，下排中的各LED芯片间隔排布，相邻LED芯片的间距相同且小于单个LED芯片的长度；
（2）在下排各个LED芯片的正电极和负电极上刷涂锡膏；
（3）在下排LED芯片上设置上排LED芯片，上排中各LED芯片的发光面朝下，且放置在
下排中相邻LED芯片的间隔上方；上排中各LED芯片的负电极和正电极分别与下排中相邻两个LED芯片的正电极和负电极相对应；加热所有LED芯片，使锡膏熔融，将对应的电极焊接，使得上下排各个芯片之间形成电性串接，形成串接芯片条；
（4）在步骤（3）制成的串接芯片条的正反面包覆荧光胶，经过固化，制得LED灯丝发
光条。
所述步骤（3）中加热所有LED芯片的温度为220℃-300℃。
所述步骤（4）中固化的温度为135℃-150℃。
本发明采用互不重叠的芯片发光面之间面面对应排布，并将芯片与芯片之间通过锡膏熔焊，包覆荧光胶后获得LED灯丝发光条；相比较常规LED灯丝发光条结构，芯片对向分布，提高了出光的均匀性，利于散热；芯片之间避免了打线串接，不再使用固晶基板，不仅达到降低封装成本的目的，并提高成品的良率。
附图说明
图1是本发明中下排LED芯片的排布示意图。
图2 是在下排LED芯片上进行上排LED芯片排布的示意图。
图3本发明制备的LED灯丝发光条的结构示意图。
图中，1、LED芯片；2、P电极；3、N电极；4、锡膏；5荧光胶。
具体实施方式
本发明的LED灯丝发光条如图3所示，包括上下两排LED芯片，下排LED芯片排布在上排LED芯片上。下排中的各个LED芯片1之间间隔排布，上排中的各个LED芯片分别搭接在下排中相邻两个LED芯片1之间，下排LED芯片与上排LED芯片的发光面相对，上排中的LED芯片的正电极和负电极分别与下排中相邻两个LED芯片1的负电极和正电极焊接在一起，形成芯片条，在芯片条上包覆荧光胶5。
上述LED灯丝发光条的制备步骤如下：
（1）如图1所示，排布下排LED芯片，下排中的各LED芯片间隔排布，相邻LED芯片的间距相同且小于单个LED芯片的长度。下排LED芯片中至少有两个LED芯片。
单个LED芯片的P电极2（正电极）和N电极3（负电极）对称分布在芯片发光面两端。
（2）在下排各个LED芯片的P电极2和N电极3上刷涂锡膏4。
（3）如图2所示，在下排LED芯片上设置上排LED芯片，上排中各LED芯片的发光面朝下，且放置在下排中相邻LED芯片的间隔上方；上排中各LED芯片的N电极3（负电极）和P电极2（正电极）分别与对应下排中相邻两个LED芯片的P电极2（正电极）和N电极3（负电极）。在220℃-300℃加热所有LED芯片，使锡膏熔融，将上排和下排的LED芯片电极焊接，使得上下排各个芯片之间形成电性串接，形成串接芯片条。
（4）如图3所示，在步骤（3）制成的串接芯片条的正反面包覆荧光胶5，并经过135℃-150℃高温固化，制得LED灯丝发光条。
Claims (3)
1.一种LED灯丝发光条的制备方法，所述LED灯丝发光条包括上下两排LED芯片，下排中的各个LED芯片间隔排布，上排中的各个LED芯片分别搭接在下排中两个相邻LED芯片之间，下排LED芯片与上排LED芯片的发光面相对，上排中的各LED芯片的正电极和负电极分别与其搭接的下排中相邻两个LED芯片的负电极和正电极焊接在一起，所有LED芯片串接成芯片条，芯片条上包覆有荧光胶层； 其特征是，包括步骤如下：
（1）排布下排LED芯片，下排中的各LED芯片间隔排布，相邻LED芯片的间距相同且小于单个LED芯片的长度；
（2）在下排各个LED芯片的正电极和负电极上刷涂锡膏；
（3）在下排LED芯片上设置上排LED芯片，上排中各LED芯片的发光面朝下，且放置在
下排中相邻LED芯片的间隔上方；上排中各LED芯片的负电极和正电极分别与下排中相邻两个LED芯片的正电极和负电极相对应；加热所有LED芯片，使锡膏熔融，将对应的电极焊接，使得上下排各个芯片之间形成电性串接，形成串接芯片条；
（4）在步骤（3）制成的串接芯片条的正反面包覆荧光胶，经过固化，制得LED灯丝发
光条。
2.根据权利要求1所述LED灯丝发光条的制备方法，其特征是，所述步骤（3）中加热所有LED芯片的温度为220℃-300℃。
3.根据权利要求1所述LED灯丝发光条的制备方法，其特征是，所述步骤（4）中固化的温度为135℃-150℃。
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| US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11028970B2 (en) | 2014-09-28 | 2021-06-08 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb having organosilicon-modified polyimide resin composition filament base layer |
| US10784428B2 (en) | 2014-09-28 | 2020-09-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11168844B2 (en) | 2015-08-17 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with segmented light conversion layer |
| US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
| CN107170733B (zh) * | 2015-12-19 | 2021-08-13 | 嘉兴山蒲照明电器有限公司 | Led灯丝及其led球泡灯 |
| DE102016109665A1 (de) | 2016-05-25 | 2017-11-30 | Osram Opto Semiconductors Gmbh | Filament und leuchtvorrichtung |
| CN106531731A (zh) * | 2016-12-07 | 2017-03-22 | 鸿利智汇集团股份有限公司 | 一种无支架led封装结构及其制造方法 |
| TWI678495B (zh) * | 2017-03-31 | 2019-12-01 | 液光固態照明股份有限公司 | 發光二極體燈具 |
| US10790419B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| CN214332357U (zh) | 2017-12-26 | 2021-10-01 | 嘉兴山蒲照明电器有限公司 | 发光二极管灯丝及发光二极管球泡灯 |
| CN108417568B (zh) * | 2018-03-05 | 2020-04-21 | 上海昭关照明实业有限公司 | 一种led照明用面光源 |
| CN110081323B (zh) * | 2018-05-23 | 2021-08-31 | 浙江山蒲照明电器有限公司 | Led灯丝及led球泡灯 |
| CN109461724A (zh) * | 2018-11-14 | 2019-03-12 | 佛山市国星半导体技术有限公司 | 一种多晶串高压led芯片 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201860515U (zh) * | 2010-10-21 | 2011-06-08 | 王定锋 | 焊接连接导通的双面led电路板及组件 |
| CN102644879A (zh) * | 2012-03-30 | 2012-08-22 | 深圳市华星光电技术有限公司 | 发光二极管灯条构造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7973332B2 (en) * | 2008-05-26 | 2011-07-05 | Rohm Co., Ltd. | Lamp and method of making the same |
-
2015
- 2015-07-03 CN CN201510383172.6A patent/CN105161608B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201860515U (zh) * | 2010-10-21 | 2011-06-08 | 王定锋 | 焊接连接导通的双面led电路板及组件 |
| CN102644879A (zh) * | 2012-03-30 | 2012-08-22 | 深圳市华星光电技术有限公司 | 发光二极管灯条构造 |
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