CN105154824B - Chip sputtering jig and method for sputtering - Google Patents
Chip sputtering jig and method for sputtering Download PDFInfo
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- CN105154824B CN105154824B CN201510682124.7A CN201510682124A CN105154824B CN 105154824 B CN105154824 B CN 105154824B CN 201510682124 A CN201510682124 A CN 201510682124A CN 105154824 B CN105154824 B CN 105154824B
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Abstract
A kind of method that chip sputter is carried out the present invention relates to chip sputtering jig and using the tool.Including ground paper layer and layers of two-sided, the ground paper layer includes upper base stock and lower base stock, layers of two-sided is provided between the upper base stock and lower base stock, square clear opening is equipped with the ground paper layer and layers of two-sided, the rest area of the corresponding chip of each clear opening, the size of the clear opening is corresponding with chip size size, and positioning hole is equipped with the ground paper layer and layers of two-sided.Then do not need metallic film to dissolve in during sputter of the present invention, realize the new technology of the face sputter of chip five, chip production is more environmentally friendly, while greatly reduces production cost, it also avoid cleaning the Complicated Flow of chip, substantially increases sputter efficiency.
Description
Technical field
A kind of method that chip sputter is carried out the present invention relates to chip sputtering jig and using the tool.
Background technology
Chip, as the important composition part of the electronic equipments such as computer, mobile phone, be inside one kind containing integrated circuit,
The silicon chip structure of small volume.Chip is mostly cube structure, is needed during making to its in addition to bottom surface of chip
Remaininging five surfaces carries out jet-plating metallization films, and to protect chip, bottom surface is as solder side, it is not necessary to sputtering thin film.
Traditional sputtering way, is applied on the bottom surface of chip using glue, and sputter is then carried out to it, is used after crossing stove
Chemical removes bottom surface glue, and not only cost of manufacture is higher for traditional process, and if to the liquid medicine after cleaning not
Effectively processing, causes greatly to pollute to surrounding environment, is cleaned again after sputter, flow is cumbersome, and production efficiency is low.
The content of the invention
The shortcomings that in order to overcome prior art, the invention provides chip sputtering jig and method for sputtering.
Technical solution of the present invention is as follows：
Chip sputtering jig, including ground paper layer and layers of two-sided, the ground paper layer include upper base stock and lower base stock, it is described on
Layers of two-sided is provided between base stock and lower base stock, square clear opening is equipped with the ground paper layer and layers of two-sided, each
The rest area of the corresponding chip of clear opening, the dimensions of the clear opening are less than the dimensions with chip, the base stock
Positioning hole is equipped with layer and layers of two-sided.
As preferable, the layers of two-sided is made up of acrylic foamed glue.
As preferable, the layers of two-sided includes acrylic foaming glue-line and layer of silica gel three, the acrylic foamed glue
Layer is made up of acrylic foamed glue, and the layer of silica gel three is made up of silica gel, between the acrylic foaming glue-line and layer of silica gel three
Provided with high temperature resistant mylar film.
As preferable, the layers of two-sided includes layer of silica gel one and layer of silica gel two, the layer of silica gel one and layer of silica gel two
It is made by silica gel, high temperature resistant mylar film is provided between the layer of silica gel one and layer of silica gel two.
Chip method for sputtering, the method for sputtering comprise the following steps：
Step 1: opening a face ground paper layer, sputtering jig was fitted on stove fixture according to positioning hole；
Step 2: opening another side ground paper layer, by SMT paster techniques, chip is correspondingly led directly to hole site fitting, due to
Layers of two-sided pastes effect, and chip is fixed on sputtering jig；
Sputter is carried out Step 3: stove fixture, sputtering jig and chip will be crossed and put continuous tunnel furnace into together；
Step 4: place normal temperature after the chip after sputter, excessively stove fixture and sputtering jig are together taken out；
Step 5: being ejected chip from the bottom for crossing stove fixture using thimble, chip is separated with sputtering jig.
Beneficial effect of the present invention is：Compared to prior art, the present invention determines in use, the one side of sputtering jig is passed through
Position hole was fitted on stove fixture, the another side fitting chip of sputtering jig, because bottom surface and the sputtering jig of chip fit,
Then do not need metallic film to dissolve in during sputter, realize the new technology of the face sputter of chip five；In the process, eliminate glue with
And the use of cleaning liquid medicine so that chip production is more environmentally friendly；Production cost is greatly reduced simultaneously, it also avoid cleaning chip
Complicated Flow, substantially increase sputter efficiency.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of the embodiment of the present invention 1.
Fig. 2 is the structural representation of the embodiment of the present invention 1.
Fig. 3 is the structural representation of the embodiment of the present invention 2.
Fig. 4 is layers of two-sided and structural representation when furnace tool is bonded excessively in the inventive method.
Fig. 5 is structural representation when the inventive method chips are bonded with layers of two-sided.
Fig. 6 is the structural representation that the inventive method chips are ejected by thimble.
Wherein：1st, upper base stock；2nd, layers of two-sided；21st, high temperature resistant mylar film；22nd, acrylic foaming glue-line；23rd, layer of silica gel
One；24th, layer of silica gel two；25th, layer of silica gel three；3rd, lower base stock；4th, clear opening；5th, positioning hole；6th, stove fixture is crossed；7th, chip；8th, push up
Pin.
Embodiment
The invention will now be described in further detail with reference to the accompanying drawings.
Embodiment 1, refering to Fig. 1.
Chip sputtering jig, including ground paper layer and layers of two-sided 2, the ground paper layer include upper base stock 1 and lower base stock 3, institute
State and layers of two-sided 2 is provided between base stock 1 and lower base stock 3, square clear opening is equipped with the ground paper layer and layers of two-sided 2
4, the rest area of the corresponding chip of each clear opening 4, the dimensions of the clear opening 4 is less than advises with the size of chip 7
Positioning hole 5 is equipped with lattice, the ground paper layer and layers of two-sided 2.
The layers of two-sided 2 is made up of acrylic foamed glue.
The method for sputtering comprises the following steps：
Step 1: opening a face ground paper layer, the layers of two-sided 2 of sputtering jig was fitted in by stove fixture 6 according to positioning hole 5
On；
Step 2: referring to Fig. 4 and Fig. 5, another side ground paper layer is opened, it is by SMT paster techniques, chip 7 is corresponding straight-through
The position of hole 4 fits with acrylic foamed glue 22, and due to the effect of pasting of layers of two-sided 2, chip 7 is fixed on sputtering jig
On；
Sputter is carried out Step 3: stove fixture 6, sputtering jig and chip 7 will be crossed and put continuous tunnel furnace into together；
Step 4: place normal temperature after the chip 7 after sputter, excessively stove fixture 6 and sputtering jig are together taken out；
Step 5: chip 7 is ejected from the bottom for crossing stove fixture 6 using thimble 8 refering to Fig. 6, chip 7 and sputtering jig phase
Separation.
Embodiment 2, refering to Fig. 2.
Chip sputtering jig, including ground paper layer and layers of two-sided 2, the ground paper layer include upper base stock 1 and lower base stock 3, institute
State and layers of two-sided 2 is provided between base stock 1 and lower base stock 3, square clear opening is equipped with the ground paper layer and layers of two-sided 2
4, the rest area of the corresponding chip of each clear opening 4, the dimensions of the clear opening 4 is less than advises with the size of chip 7
Positioning hole 5 is equipped with lattice, the ground paper layer and layers of two-sided 2.
The layers of two-sided 2 includes acrylic foaming glue-line 22 and layer of silica gel 3 25, the acrylic foaming glue-line 22 by
Acrylic foamed glue is made, and the layer of silica gel 3 25 is made up of silica gel, acrylic foaming glue-line 22 and layer of silica gel 3 25 it
Between be provided with high temperature resistant mylar film 21, wherein high temperature resistant mylar film 21 plays a part of supporting layers of two-sided 2.
The method for sputtering comprises the following steps：
Step 1: opening a face ground paper layer, the layer of silica gel 3 25 of sputtering jig was fitted in by stove fixture according to positioning hole 5
On 6；
Step 2: referring to Fig. 4 and Fig. 5, another side ground paper layer is opened, it is by SMT paster techniques, chip 7 is corresponding straight-through
The position of hole 4 fits with acrylic foaming glue-line 22, and due to the effect of pasting of layers of two-sided 2, chip 7 is fixed on sputtering jig
On；
Sputter is carried out Step 3: stove fixture 6, sputtering jig and chip 7 will be crossed and put continuous tunnel furnace into together；
Step 4: place normal temperature after the chip 7 after sputter, excessively stove fixture 6 and sputtering jig are together taken out；
Step 5: chip 7 is ejected from the bottom for crossing stove fixture 6 using thimble 8 refering to Fig. 6, chip 7 and sputtering jig phase
Separation.
Embodiment 3, refering to Fig. 3.
Chip sputtering jig, including ground paper layer and layers of two-sided 2, the ground paper layer include upper base stock 1 and lower base stock 3, institute
State and layers of two-sided 2 is provided between base stock 1 and lower base stock 3, square clear opening is equipped with the ground paper layer and layers of two-sided 2
4, the rest area of the corresponding chip of each clear opening 4, the dimensions of the clear opening 4 is less than advises with the size of chip 7
Positioning hole 5 is equipped with lattice, the ground paper layer and layers of two-sided 2.
The layers of two-sided 2 includes layer of silica gel 1 and layer of silica gel 2 24, and the layer of silica gel 1 and layer of silica gel 2 24 are equal
There is silica gel to be made, high temperature resistant mylar film 21, wherein high temperature resistant mylar film are provided between the layer of silica gel 1 and layer of silica gel 2 24
21 play a part of supporting layers of two-sided 2.
The method for sputtering comprises the following steps：
Step 1: opening a face ground paper layer, the layer of silica gel 1 of sputtering jig was fitted in by stove fixture according to positioning hole 5
On 6；
Step 2: referring to Fig. 4 and Fig. 5, another side ground paper layer is opened, it is by SMT paster techniques, chip 7 is corresponding straight-through
The position of hole 4 is fitted with layer of silica gel 2 24, and due to the effect of pasting of layers of two-sided 2, chip 7 is fixed on sputtering jig；
Sputter is carried out Step 3: stove fixture 6, sputtering jig and chip 7 will be crossed and put continuous tunnel furnace into together；
Step 4: place normal temperature after the chip 7 after sputter, excessively stove fixture 6 and sputtering jig are together taken out；
Step 5: chip 7 is ejected from the bottom for crossing stove fixture 6 using thimble 8 refering to Fig. 6, chip 7 and sputtering jig phase
Separation.
Above-mentioned drawings and Examples are merely to illustrate the present invention, and any art those of ordinary skill is done to it
Appropriate change or modification, or use other flower pattern instead and make this technical change, all should be regarded as not departing from patent model of the present invention
Farmland.
Claims (5)
1. chip sputtering jig, it is characterised in that：Including ground paper layer and layers of two-sided（2）, the ground paper layer includes upper base stock（1）
With lower base stock（3）, the upper base stock（1）With lower base stock（3）Between be provided with layers of two-sided（2）, the ground paper layer and layers of two-sided
（2）On be equipped with square clear opening（4）, each clear opening（4）A corresponding chip（7）Rest area, the clear opening
（4）Dimensions be less than and chip（7）Dimensions, the ground paper layer and layers of two-sided（2）On be equipped with positioning hole
（5）.
2. chip sputtering jig as claimed in claim 1, it is characterised in that：The layers of two-sided（2）By acrylic foamed glue
It is made.
3. chip sputtering jig as claimed in claim 1, it is characterised in that：The layers of two-sided（2）Foamed including acrylic
Glue-line（22）With layer of silica gel three（25）, the acrylic foaming glue-line（22）It is made up of acrylic foamed glue, the layer of silica gel three
（25）It is made up of silica gel, the acrylic foaming glue-line（22）With layer of silica gel three（25）Between be provided with high temperature resistant mylar film（21）.
4. chip sputtering jig as claimed in claim 1, it is characterised in that：The layers of two-sided（2）Including layer of silica gel one
（23）With layer of silica gel two（24）, the layer of silica gel one（23）With layer of silica gel two（24）It is made by silica gel, the layer of silica gel one
（23）With layer of silica gel two（24）Between be provided with high temperature resistant mylar film（21）.
5. use the method for sputtering of chip sputtering jig as claimed in claim 1, it is characterised in that the method for sputtering is included such as
Lower step：
Step 1: a face ground paper layer is opened, according to positioning hole（5）Sputtering jig was fitted in into stove fixture（6）On；
Step 2: another side ground paper layer is opened, by SMT paster techniques, by chip（7）Corresponding clear opening（4）Position is bonded, by
In layers of two-sided（2）Paste effect, chip（7）It is fixed on sputtering jig；
Step 3: by stove fixture（6）, sputtering jig and chip（7）Put continuous tunnel furnace into together and carry out sputter；
Step 4: by the chip after sputter（7）, cross stove fixture（6）Normal temperature is placed after together being taken out with sputtering jig；
Step 5: use thimble（8）From stove fixture excessively（6）Bottom by chip（7）Ejection, chip（7）With sputtering jig phase point
From.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510682124.7A CN105154824B (en) | 2015-10-21 | 2015-10-21 | Chip sputtering jig and method for sputtering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510682124.7A CN105154824B (en) | 2015-10-21 | 2015-10-21 | Chip sputtering jig and method for sputtering |
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| Publication Number | Publication Date |
|---|---|
| CN105154824A CN105154824A (en) | 2015-12-16 |
| CN105154824B true CN105154824B (en) | 2018-02-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510682124.7A Active CN105154824B (en) | 2015-10-21 | 2015-10-21 | Chip sputtering jig and method for sputtering |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107779819A (en) * | 2017-11-02 | 2018-03-09 | 丰盛印刷（苏州）有限公司 | Chip sputtering jig and method for sputtering |
| CN108364875A (en) * | 2017-12-29 | 2018-08-03 | 合肥通富微电子有限公司 | The anti-plated processing method of QFN package bottoms |
| CN111519148B (en) * | 2020-03-23 | 2021-11-16 | 深圳市海铭德科技有限公司 | Sputtering method of semiconductor chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479356A (en) * | 2007-08-03 | 2009-07-08 | 东丽世韩株式会社 | Heat-resistant adhesive sheet |
| TWM435039U (en) * | 2012-03-21 | 2012-08-01 | Ming Kun Technologies Co Ltd | A heat resistant adhesive sheet |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN205046191U (en) * | 2015-10-21 | 2016-02-24 | 丰盛印刷（苏州）有限公司 | Chip sputter tool |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0326046A3 (en) * | 1988-01-25 | 1990-06-13 | Takeda Chemical Industries, Ltd. | Production of human epidermal growth factor |
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2015
- 2015-10-21 CN CN201510682124.7A patent/CN105154824B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479356A (en) * | 2007-08-03 | 2009-07-08 | 东丽世韩株式会社 | Heat-resistant adhesive sheet |
| TWM435039U (en) * | 2012-03-21 | 2012-08-01 | Ming Kun Technologies Co Ltd | A heat resistant adhesive sheet |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN205046191U (en) * | 2015-10-21 | 2016-02-24 | 丰盛印刷（苏州）有限公司 | Chip sputter tool |
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