CN105154824A - Chip sputtering jig and sputtering method - Google Patents
Chip sputtering jig and sputtering method Download PDFInfo
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- CN105154824A CN105154824A CN201510682124.7A CN201510682124A CN105154824A CN 105154824 A CN105154824 A CN 105154824A CN 201510682124 A CN201510682124 A CN 201510682124A CN 105154824 A CN105154824 A CN 105154824A
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Abstract
The invention relates to a chip sputtering jig and a method for sputtering a chip by using the jig. The chip sputtering jig comprises a body paper layer and a double-sided adhesive layer, wherein the body paper layer comprises upper body paper and lower body paper; the double-sided adhesive layer is arranged between the upper body paper and the lower body paper; both the body paper layer and the double-sided adhesive layer are provided with square through holes; each through hole corresponds to a chip placing area; the size of each through hole corresponds to the size of the chip; and both the body paper layer and the double-sided adhesive layer are provided with positioning holes. According to the invention, during sputtering, dissolution of a metallic film is not needed, a new process of sputtering on five surfaces of the chip is realized, the production of the chip is more environment-friendly, the production cost is greatly reduced, the complex processes of cleaning the chip are avoided, and the sputtering efficiency is greatly improved.
Description
Technical field
The present invention relates to a kind of chip sputtering jig and use this tool to carry out the method for chip sputter.
Background technology
Chip, as the important composition parts of the electronics such as computer, mobile phone, is the silicon chip structure that unicircuit, small volume are contained in a kind of inside.Chip mostly is cube structure, and need to carry out jet-plating metallization film to chip all the other five surfaces except bottom surface in the process made, with protect IC, bottom surface, as face of weld, does not need sputtering thin film.
Traditional sputtering way, glue is used to spread upon on the bottom surface of chip, then sputter is carried out to it, use after crossing stove chemical by bottom surface glue remove, traditional processing method not only cost of manufacture is higher, and if to cleaning after liquid medicine effectively do not process, great pollution is caused to surrounding environment, clean after sputter, flow process is loaded down with trivial details again, and production efficiency is low.
Summary of the invention
In order to overcome the shortcoming of prior art, the invention provides chip sputtering jig and jet-plating method.
Technical solution of the present invention is as follows:
Chip sputtering jig, comprise ground paper layer and layers of two-sided, described ground paper layer comprises base stock and lower base stock, layers of two-sided is provided with between described upper base stock and lower base stock, described ground paper layer and layers of two-sided are equipped with square clear opening, the rest area of the corresponding chip of each clear opening, the dimensions of described clear opening is less than the dimensions with chip, and described ground paper layer and layers of two-sided are equipped with pilot hole.
As preferably, described layers of two-sided is made up of acrylic foamed glue.
As preferably, described layers of two-sided comprises acrylic foaming glue-line and layer of silica gel three, described acrylic foaming glue-line is made up of acrylic foamed glue, and described layer of silica gel three is made up of silica gel, is provided with high temperature resistant mylar film between described acrylic foaming glue-line and layer of silica gel three.
As preferably, described layers of two-sided comprises layer of silica gel one and layer of silica gel two, and described layer of silica gel one and layer of silica gel two are made by silica gel, is provided with high temperature resistant mylar film between described layer of silica gel one and layer of silica gel two.
Chip jet-plating method, this jet-plating method comprises the steps:
Step one, open a ground paper layer, according to pilot hole, sputtering jig was fitted on stove fixture;
Step 2, open another side ground paper layer, by SMT paster technique, by the laminating of corresponding for chip clear opening position, paste effect due to layers of two-sided, chip is fixed on sputtering jig;
Step 3, by crossing stove fixture, sputtering jig puts continuous tunnel furnace into and carries out sputter together with chip;
Step 4, by the chip after sputter, cross after stove fixture and sputtering jig together take out and place normal temperature;
Chip ejects from the bottom crossing stove fixture by step 5, use thimble, and chip and sputtering jig are separated.
Beneficial effect of the present invention is: compared to prior art, when the present invention uses, the one side of sputtering jig was fitted on stove fixture by pilot hole, the another side laminating chip of sputtering jig, because the bottom surface of chip and sputtering jig fit, then do not need metallic film to dissolve in during sputter, achieve the novel process of chip five sputters; In the process, eliminate the use of glue and cleaning liquid medicine, make chip production more environmental protection; Greatly reduce production cost simultaneously, it also avoid the Complicated Flow of cleaning chip, substantially increase sputter efficiency.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the structural representation of the embodiment of the present invention 1.
Fig. 2 is the structural representation of the embodiment of the present invention 1.
Fig. 3 is the structural representation of the embodiment of the present invention 2.
Fig. 4 is layers of two-sided and structural representation when furnace tool is fitted excessively in the inventive method.
Fig. 5 is the inventive method chips and layers of two-sided structural representation when fitting.
Fig. 6 is the structural representation that the inventive method chips is ejected by thimble.
Wherein: 1, upper base stock; 2, layers of two-sided; 21, high temperature resistant mylar film; 22, acrylic foaming glue-line; 23, layer of silica gel one; 24, layer of silica gel two; 25, layer of silica gel three; 3, lower base stock; 4, clear opening; 5, pilot hole; 6, stove fixture is crossed; 7, chip; 8, thimble.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further detailed explanation.
Embodiment 1, consults Fig. 1.
Chip sputtering jig, comprise ground paper layer and layers of two-sided 2, described ground paper layer comprises base stock 1 and lower base stock 3, layers of two-sided 2 is provided with between described upper base stock 1 and lower base stock 3, described ground paper layer and layers of two-sided 2 are equipped with square clear opening 4, the rest area of the corresponding chip of each clear opening 4, the dimensions of described clear opening 4 is less than the dimensions with chip 7, and described ground paper layer and layers of two-sided 2 are equipped with pilot hole 5.
Described layers of two-sided 2 is made up of acrylic foamed glue.
This jet-plating method comprises the steps:
Step one, open a ground paper layer, according to pilot hole 5, the layers of two-sided 2 of sputtering jig was fitted on stove fixture 6;
Step 2, consult Fig. 4 and Fig. 5, open another side ground paper layer, by SMT paster technique, fitted in corresponding for chip 7 clear opening 4 position and acrylic foamed glue 22, paste effect due to layers of two-sided 2, chip 7 is fixed on sputtering jig;
Step 3, by crossing stove fixture 6, sputtering jig puts continuous tunnel furnace into and carries out sputter together with chip 7;
Step 4, by the chip 7 after sputter, cross after stove fixture 6 and sputtering jig together take out and place normal temperature;
Step 5, consult Fig. 6 and use thimble 8 to be ejected by chip 7 from the bottom crossing stove fixture 6, chip 7 and sputtering jig are separated.
Embodiment 2, consults Fig. 2.
Chip sputtering jig, comprise ground paper layer and layers of two-sided 2, described ground paper layer comprises base stock 1 and lower base stock 3, layers of two-sided 2 is provided with between described upper base stock 1 and lower base stock 3, described ground paper layer and layers of two-sided 2 are equipped with square clear opening 4, the rest area of the corresponding chip of each clear opening 4, the dimensions of described clear opening 4 is less than the dimensions with chip 7, and described ground paper layer and layers of two-sided 2 are equipped with pilot hole 5.
Described layers of two-sided 2 comprises acrylic foaming glue-line 22 and layer of silica gel 3 25, described acrylic foaming glue-line 22 is made up of acrylic foamed glue, described layer of silica gel 3 25 is made up of silica gel, be provided with high temperature resistant mylar film 21 between described acrylic foaming glue-line 22 and layer of silica gel 3 25, wherein high temperature resistant mylar film 21 plays the effect supporting layers of two-sided 2.
This jet-plating method comprises the steps:
Step one, open a ground paper layer, according to pilot hole 5, the layer of silica gel 3 25 of sputtering jig was fitted on stove fixture 6;
Step 2, consult Fig. 4 and Fig. 5, open another side ground paper layer, by SMT paster technique, the glue-line 22 that foamed in corresponding for chip 7 clear opening 4 position and acrylic fits, and pastes effect due to layers of two-sided 2, and chip 7 is fixed on sputtering jig;
Step 3, by crossing stove fixture 6, sputtering jig puts continuous tunnel furnace into and carries out sputter together with chip 7;
Step 4, by the chip 7 after sputter, cross after stove fixture 6 and sputtering jig together take out and place normal temperature;
Step 5, consult Fig. 6 and use thimble 8 to be ejected by chip 7 from the bottom crossing stove fixture 6, chip 7 and sputtering jig are separated.
Embodiment 3, consults Fig. 3.
Chip sputtering jig, comprise ground paper layer and layers of two-sided 2, described ground paper layer comprises base stock 1 and lower base stock 3, layers of two-sided 2 is provided with between described upper base stock 1 and lower base stock 3, described ground paper layer and layers of two-sided 2 are equipped with square clear opening 4, the rest area of the corresponding chip of each clear opening 4, the dimensions of described clear opening 4 is less than the dimensions with chip 7, and described ground paper layer and layers of two-sided 2 are equipped with pilot hole 5.
Described layers of two-sided 2 comprises layer of silica gel 1 and layer of silica gel 2 24, described layer of silica gel 1 and layer of silica gel 2 24 all have silica gel to make, be provided with high temperature resistant mylar film 21 between described layer of silica gel 1 and layer of silica gel 2 24, wherein high temperature resistant mylar film 21 plays the effect supporting layers of two-sided 2.
This jet-plating method comprises the steps:
Step one, open a ground paper layer, according to pilot hole 5, the layer of silica gel 1 of sputtering jig was fitted on stove fixture 6;
Step 2, consult Fig. 4 and Fig. 5, open another side ground paper layer, by SMT paster technique, fitted in corresponding for chip 7 clear opening 4 position and layer of silica gel 2 24, paste effect due to layers of two-sided 2, chip 7 is fixed on sputtering jig;
Step 3, by crossing stove fixture 6, sputtering jig puts continuous tunnel furnace into and carries out sputter together with chip 7;
Step 4, by the chip 7 after sputter, cross after stove fixture 6 and sputtering jig together take out and place normal temperature;
Step 5, consult Fig. 6 and use thimble 8 to be ejected by chip 7 from the bottom crossing stove fixture 6, chip 7 and sputtering jig are separated.
Above-mentioned drawings and Examples are only for illustration of the present invention, and any art those of ordinary skill to its suitable change done or modification, or is used other flower pattern instead and made this technical change, all should be considered as not departing from patent category of the present invention.
Claims (5)
1. chip sputtering jig, it is characterized in that: comprise ground paper layer and layers of two-sided (2), described ground paper layer comprises base stock (1) and lower base stock (3), layers of two-sided (2) is provided with between described upper base stock (1) and lower base stock (3), described ground paper layer and layers of two-sided (2) are equipped with square clear opening (4), the rest area of the corresponding chip (7) of each clear opening (4), the dimensions of described clear opening (4) is less than the dimensions with chip (7), and described ground paper layer and layers of two-sided (2) are equipped with pilot hole (5).
2. chip sputtering jig as claimed in claim 1, is characterized in that: described layers of two-sided (2) is made up of acrylic foamed glue.
3. chip sputtering jig as claimed in claim 1, it is characterized in that: described layers of two-sided (2) comprises acrylic foaming glue-line (22) and layer of silica gel three (25), described acrylic foaming glue-line (22) is made up of acrylic foamed glue, described layer of silica gel three (25) is made up of silica gel, is provided with high temperature resistant mylar film (21) between described acrylic foaming glue-line (22) and layer of silica gel three (25).
4. chip sputtering jig as claimed in claim 1, it is characterized in that: described layers of two-sided (2) comprises layer of silica gel one (23) and layer of silica gel two (24), described layer of silica gel one (23) and layer of silica gel two (24) are made by silica gel, are provided with high temperature resistant mylar film (21) between described layer of silica gel one (23) and layer of silica gel two (24).
5. use the jet-plating method of chip sputtering jig as claimed in claim 1, it is characterized in that, this jet-plating method comprises the steps:
Step one, open a ground paper layer, according to pilot hole (5), sputtering jig was fitted on stove fixture (6);
Step 2, open another side ground paper layer, by SMT paster technique, fitted chip (7) corresponding clear opening (4) position, paste effect due to layers of two-sided (2), chip (7) is fixed on sputtering jig;
Step 3, stove fixture (6), sputtering jig are put into continuous tunnel furnace and carried out sputter together with chip (7);
Step 4, by the chip (7) after sputter, cross stove fixture (6) and sputtering jig together take out after place normal temperature;
Chip (7) ejects from the bottom crossing stove fixture (6) by step 5, use thimble (8), and chip (7) and sputtering jig are separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510682124.7A CN105154824B (en) | 2015-10-21 | 2015-10-21 | Chip sputtering jig and method for sputtering |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510682124.7A CN105154824B (en) | 2015-10-21 | 2015-10-21 | Chip sputtering jig and method for sputtering |
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| CN105154824A true CN105154824A (en) | 2015-12-16 |
| CN105154824B CN105154824B (en) | 2018-02-16 |
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| CN201510682124.7A Active CN105154824B (en) | 2015-10-21 | 2015-10-21 | Chip sputtering jig and method for sputtering |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107779819A (en) * | 2017-11-02 | 2018-03-09 | 丰盛印刷（苏州）有限公司 | Chip sputtering jig and method for sputtering |
| CN108364875A (en) * | 2017-12-29 | 2018-08-03 | 合肥通富微电子有限公司 | The anti-plated processing method of QFN package bottoms |
| CN111519136A (en) * | 2020-03-23 | 2020-08-11 | 深圳市海铭德科技有限公司 | Sputtering jig for semiconductor chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0231682A (en) * | 1988-01-25 | 1990-02-01 | Juzo Udaka | Production of human egf |
| CN101479356A (en) * | 2007-08-03 | 2009-07-08 | 东丽世韩株式会社 | Heat-resistant adhesive sheet |
| TWM435039U (en) * | 2012-03-21 | 2012-08-01 | Ming Kun Technologies Co Ltd | A heat resistant adhesive sheet |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN205046191U (en) * | 2015-10-21 | 2016-02-24 | 丰盛印刷（苏州）有限公司 | Chip sputter tool |
-
2015
- 2015-10-21 CN CN201510682124.7A patent/CN105154824B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0231682A (en) * | 1988-01-25 | 1990-02-01 | Juzo Udaka | Production of human egf |
| CN101479356A (en) * | 2007-08-03 | 2009-07-08 | 东丽世韩株式会社 | Heat-resistant adhesive sheet |
| TWM435039U (en) * | 2012-03-21 | 2012-08-01 | Ming Kun Technologies Co Ltd | A heat resistant adhesive sheet |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN205046191U (en) * | 2015-10-21 | 2016-02-24 | 丰盛印刷（苏州）有限公司 | Chip sputter tool |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107779819A (en) * | 2017-11-02 | 2018-03-09 | 丰盛印刷（苏州）有限公司 | Chip sputtering jig and method for sputtering |
| CN108364875A (en) * | 2017-12-29 | 2018-08-03 | 合肥通富微电子有限公司 | The anti-plated processing method of QFN package bottoms |
| CN111519136A (en) * | 2020-03-23 | 2020-08-11 | 深圳市海铭德科技有限公司 | Sputtering jig for semiconductor chip |
| CN111519148A (en) * | 2020-03-23 | 2020-08-11 | 深圳市海铭德科技有限公司 | Sputtering method of semiconductor chip |
| WO2021196291A1 (en) * | 2020-03-23 | 2021-10-07 | 深圳市海铭德科技有限公司 | Sputtering method for semiconductor chip |
| CN111519136B (en) * | 2020-03-23 | 2021-11-16 | 深圳市海铭德科技有限公司 | Sputtering jig for semiconductor chip |
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| CN105154824B (en) | 2018-02-16 |
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