CN204994089U - Biological identification module through realization of solid -state glue bond - Google Patents
Biological identification module through realization of solid -state glue bond Download PDFInfo
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- CN204994089U CN204994089U CN201520783543.5U CN201520783543U CN204994089U CN 204994089 U CN204994089 U CN 204994089U CN 201520783543 U CN201520783543 U CN 201520783543U CN 204994089 U CN204994089 U CN 204994089U
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Abstract
The utility model discloses a biological identification module through realization of solid -state glue bond, including apron, biological identification chip, softness circuit board, reinforcement piece, its characterized in that: the reinforcement piece is established at the back of softness circuit board, and biological identification chip lower surface passes through soldering tin is in the same place with the welding of softness circuit board, and the apron is glued through solid state and is binded with the front of biological identification chip. Comparing with the glue of liquid state, adopting solid -state glue as the adhesive of apron with the biological identification chip, can effectively avoid overflowing glues, uneven thickness, the bubble is remained and the inconvenient scheduling problem of production operation, and is convenient for do over again and reprocesses.
Description
Technical field
A kind of bio-identification module of the utility model, belongs to technical field of touch control.
Background technology
At present, bio-identification module has obtained applying more widely on mobile phone, simultaneously also progressively by one of standard configuration becoming mobile phone.Existing bio-identification module scheme adopts glue to carry out the full laminating of cover plate and bio-identification chip usually, because glue is liquid, comparatively harsh to the requirement of production equipment, easily there is the problems such as excessive glue, uneven thickness, gas bubbles left and production operation inconvenience simultaneously.And wherein, gas bubbles left problem causes bio-identification module in industry to produce the general restricted reason of yield especially.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, a kind of bio-identification module is provided, can be simple in production process, technology difficulty is little, under yield and the high prerequisite of production efficiency, effectively avoid excessive glue, uneven thickness and production operation inconvenience problem, and to production equipment and aid without rigors.Adopt solid-state glue can also reach as the adhesive of cover plate and bio-identification chip to be convenient to do over again and the object of reprocessing simultaneously.
The utility model realizes like this, a kind of bio-identification module realized by solid-state glue bond, comprise cover plate, bio-identification chip, flexible circuit board, reinforcing chip, it is characterized in that reinforcing chip is established at the back side of flexible circuit board, bio-identification chip lower surface is welded together by scolding tin and flexible circuit board, and cover plate is binded by the front of solid-state glue and bio-identification chip.
Further improvement, on the basis of such scheme, adds becket outside bio-identification chip and cover plate, and the lower surface of becket is bonded by conducting paste and flexible circuit board.
Further, cover plate is wider than bio-identification chip, and the cap locations boring ratio bio-identification chip position hole of becket is large, and cover plate is binded by solid-state glue and the front of bio-identification chip and the step surface of becket.
Preferably, described solid-state glue is optical cement, double faced adhesive tape.
The beneficial effects of the utility model: simple in production process, technology difficulty is little, under yield and the high prerequisite of production efficiency, glue is effectively avoided to fit problems, the problem includes: the problem such as excessive glue, uneven thickness, gas bubbles left and production operation be inconvenient, and to production equipment and aid without rigors.Adopt solid-state glue can also reach as the adhesive of cover plate and bio-identification chip to be convenient to do over again and the object of reprocessing simultaneously.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of embodiment 1.
Fig. 2 is the schematic diagram of embodiment 2.
1. cover plate 2. optical cement 3. bio-identification chip 4. scolding tin 5. flexible circuit board 6. reinforcing chip 7. becket 8. conducting paste in figure.
Embodiment
Below in conjunction with accompanying drawing, the technical scheme in the utility model embodiment is clearly and completely described.
Embodiment 1
As shown in Figure 1, a kind of bio-identification module, comprise cover plate 1, bio-identification chip 3, flexible circuit board 5, reinforcing chip 6, reinforcing chip 6 is established at the back side of flexible circuit board 5, bio-identification chip 3 lower surface is welded together by scolding tin 4 and flexible circuit board 5, and cover plate 1 is binded by the front of optical cement 2 with bio-identification chip 3.Compared to glue, because described optical cement 2 is solid-state, compared with the glue of liquid state, adopt optical cement as the adhesive of cover plate and bio-identification chip, effectively can avoid the problems such as excessive glue, uneven thickness, gas bubbles left and production operation inconvenience, and be convenient to do over again and reprocess.
Embodiment 2
As shown in Figure 2, a kind of bio-identification module, comprise cover plate 1, bio-identification chip 3, flexible circuit board 5, reinforcing chip 6, becket 7, reinforcing chip 6 is established at the back side of flexible circuit board 5, bio-identification chip 3 lower surface is welded together by scolding tin 4 and flexible circuit board 5, described becket 7 to be pasted on flexible circuit board 5 by conducting paste 8 and to wrap up cover plate 1, optical cement 2, bio-identification chip 3 and scolding tin 4, cover plate 1 is wider than bio-identification chip 3, the cap locations boring ratio bio-identification chip position hole of becket 7 is large, cover plate 1 is binded by optical cement 2 and the front of bio-identification chip 3 and the step surface of becket 7.
By becket 7 cover sheet 1, optical cement 2, bio-identification chip 3 and scolding tin 4, make bio-identification module more firm, and effectively can prevent excessive glue problem.
Optical cement 2 described in the utility model also can replace with double faced adhesive tape or other solid-state glue.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection range of the present utility model.
Claims (4)
1. the bio-identification module realized by solid-state glue bond, comprise cover plate, bio-identification chip, flexible circuit board, reinforcing chip, it is characterized in that: reinforcing chip is established at the back side of flexible circuit board, bio-identification chip lower surface is welded together by scolding tin and flexible circuit board, and cover plate is binded by the front of solid-state glue and bio-identification chip.
2. the bio-identification module realized by solid-state glue bond according to claim 1, be is characterized in that: also outside bio-identification chip and cover plate, add becket, and the lower surface of becket is bonded by conducting paste and flexible circuit board.
3. the bio-identification module realized by solid-state glue bond according to claim 2, it is characterized in that: cover plate is wider than bio-identification chip, the cap locations boring ratio bio-identification chip position hole of becket is large, and cover plate is binded by solid-state glue and the front of bio-identification chip and the step surface of becket.
4. the bio-identification module realized by solid-state glue bond according to claim 1,2 or 3, be is characterized in that: described solid-state glue is optical cement or double faced adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520783543.5U CN204994089U (en) | 2015-10-10 | 2015-10-10 | Biological identification module through realization of solid -state glue bond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520783543.5U CN204994089U (en) | 2015-10-10 | 2015-10-10 | Biological identification module through realization of solid -state glue bond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204994089U true CN204994089U (en) | 2016-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520783543.5U Active CN204994089U (en) | 2015-10-10 | 2015-10-10 | Biological identification module through realization of solid -state glue bond |
Country Status (1)
| Country | Link |
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| CN (1) | CN204994089U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105868736A (en) * | 2016-04-26 | 2016-08-17 | 广东欧珀移动通信有限公司 | Sensing chip, fingerprint recognition module, manufacturing method of fingerprint recognition module and mobile terminal |
| CN106778483A (en) * | 2016-11-16 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of bio-identification module with keypress function and its manufacture method |
| CN107451579A (en) * | 2017-08-23 | 2017-12-08 | 江西合力泰科技有限公司 | A kind of bio-identification module for being embedded in panel and its production technology |
| CN108108681A (en) * | 2017-12-14 | 2018-06-01 | 江西合力泰科技有限公司 | With high bio-identification module for resisting external force ability and preparation method thereof |
-
2015
- 2015-10-10 CN CN201520783543.5U patent/CN204994089U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105868736A (en) * | 2016-04-26 | 2016-08-17 | 广东欧珀移动通信有限公司 | Sensing chip, fingerprint recognition module, manufacturing method of fingerprint recognition module and mobile terminal |
| CN106778483A (en) * | 2016-11-16 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of bio-identification module with keypress function and its manufacture method |
| CN106778483B (en) * | 2016-11-16 | 2023-08-22 | 江西合力泰科技有限公司 | Biological recognition module with key function and manufacturing method thereof |
| CN107451579A (en) * | 2017-08-23 | 2017-12-08 | 江西合力泰科技有限公司 | A kind of bio-identification module for being embedded in panel and its production technology |
| CN108108681A (en) * | 2017-12-14 | 2018-06-01 | 江西合力泰科技有限公司 | With high bio-identification module for resisting external force ability and preparation method thereof |
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