M435039 五、新型說明： 【新型所屬之技術領域】 本創作係-削絲貼片，特別制於晶圓或面板@定在治具上 進行加工使用。 【先前技術】 隨著半導體與聽技術的進步，微機電元件或光電元件等微元件 的製作也由早期的晶片級封裝邁入晶圓級封裝的階段，以達到降低成 # 本和輕、薄、短、小的目的。 -般而言’ Μ級封裝製程會在完成晶圓上的元件製作之後，將 晶圓翻面配置於-載具上，並使載具與晶圓上之每—晶片的元件區域 接合’以在齡以及每―晶片之間形成_賴空間。之後，再由晶圓 的背面對晶圓進行切割的動作，以將晶片分離。 但是由於晶圓之二面係為平滑面，且其整體係為較薄、質輕及易 脆之物體’因此’當晶圓設置於—工作平面上進行後製加謂，並不 釀適合以機械式夾具進行m定，因為機械式夾具之夾持力量較大，所以 在杈強之外力操作下’會造成晶Hi損傷，而由於晶祕屬精密度較高 之物體，就算輕微之破裂及污損仍會導致其特性之極大影響。 因此，-般進行後製加工時，係直接將晶圓設置於工作平面上進 行施工，但由於晶圓之二面係為平滑面，所以在卫作平面上之摩擦力 較小，在進行加X處理時亦產生有滑動之情形，而在_晶圓的過程 中’也可能因為晶圓相對於治具滑移，而導致切割時產生誤差，間接 破壞了載具與各別的晶片之間的密閉狀態，失去對晶片表面元件的保 3 護^果，如此-來，縣致刀具在_晶_，有相當大的機率會損 及曰曰片上的TL件或線路，使晶片上的元件受到切_之冷卻液、材料 微粒或後續製簡賴，導致“失效，影響整體的製程良率。， 由前述分析得知’習知晶圓在治具之固定制上，仍具有容易典 動，導致製作良率較低之缺失；有#於此，本賴作人本著精益求^ 之精神，對上述缺失進行研究改良’希雜_作出__齡貼片， 讓加工物在治具上進行加玉過程中，不會相對治具而有所滑移，進而 提升整體製程之良率。 【新型内容】 本創作之主要目的係解決以往加工物在治具上進行加工時因加 工物表面祕光滑，導致加讀杨謂財，姆治具產生滑移， 而降低製程良率之缺失。 為了達成上述之目的，本創作係指一種耐熱黏貼片，其包括： 一财熱層； 一黏貼層，該黏貼層係佈設於耐熱層的任—側端面； 藉此’透過該黏貼層之黏性黏貼加工物，使加工物黏固於对熱黏 貼片上，並藉由治具的真空吸附对熱黏貼片，讓加工物在進行加工過 程中不會有所滑移 本創作「耐熱點貼片」更包括下列技術特徵： 1.另。又有一田懷貼層佈言狄财熱層一側，該副黏貼層與黏貼層位 於耐熱層兩側且相互對應。 2·該黏貼層與副黏貼層於表面分別貼附有—剝離層。 3·該耐熱層係為鐵氟龍、四氟乙稀一全氟烷氧基乙烯基醚共聚物 (Polyfluoroalkoxy)、聚苯謎醚調(Polyether Ether Ketone)、聚苯 醚醚酮-含玻纖、聚苯醚醚酮-含碳纖、聚醚醯亞胺（Polymide Imide)、 聚苯硫醚(Polyphenylene Sulfide Ether)、聚苯硫醚-含玻纖、聚醚 (Polyether Sulfone)、聚醯胺醯（P〇lyetherimide) ' 聚碾 (Polysulfone)、聚醯亞胺(Polyimide)。 4.該黏貼層與副黏貼層的厚度係小於耐熱層厚度。 5·該黏貼扁係為矽膠或絕緣膠。 6_該剝離層係為塑膠或薄膜。 本創作之耐熱黏貼片，其係透過黏貼層來黏固加工物，使加工物 不致產生滑移，目前在市場上並無相關類似之產品，因此，推出後將 可在市場上掀起一^股熱潮。 【實施方式】 本創作係有關於一種耐熱黏貼片，有關其功效及特點，以下搭配 相關圖式作一簡單實施例說明。 请參閱第一圖並搭配第三圖所示’於本創作耐熱黏貼片1實施例 中’其包括有一耐熱層11 ’且該耐熱層11係鐵氟龍、四氟乙烯—全氟 烧氧基乙婦基鍵共聚物（?〇以丨111〇1*〇&11^(^丫）、聚苯韃_酮(?〇^6"(：116]：· Ether Ketone)、聚苯醚醚酮-含玻纖、聚苯醚醚酮_含碳纖、聚醚醯亞 胺(Polymide Imide)、聚苯硫輕(Polyphenylene Sulfide Ether)、聚 苯硫輕-含玻纖、聚醚（p〇lyether Sulfone)、聚醯胺醯 (Polyetherimide)、聚硬(p〇iysuifone)、聚醯亞胺（p〇iyimide); — 黏貼層！2 ’而該獅層12佈設於該耐熱層n上任一側端面，該黏貼_ 層11係為郷n輯，且雜貼層12厚度係小於雜層^厚度。 藉此，透過該黏闕12之黏性點貼加工物2，使加工物2黏固於 耐熱黏貼片1上，並藉由治具3的真空吸_熱黏貼片1，讓加工物2 在進行加工過程中不會有所滑移（前述為本創作主實施例之主要技術 特徵，其對應本案tff專鄕圍第—項㈣容，得轉知本創作之目 的”貫施、而其餘附屬申請專利範圍所述的技術特徵是為對申請 專利範彻容的詳述細加技術舰，·而刺嫌制巾請專利_ 範圍第-獅界定細，應知本”請專利翻第—項不必要一定包 含其餘附屬申請專利範圍所述的技術特徵）。 除了使用單-耐熱層n以及單一黏貼層12以外，請參閱第二圖 所不’其係為本創作第二實施例剖面之說明，其在該副黏貼I i2i與 黏貼層12於财熱層U兩側且相互對應，該副黏貼層ΐ2ι係為石夕膠或 絕緣膠’且制黏貼層121厚度係小於耐熱層U厚度，而在該黏貼層 12與副黏貼層121於相對佈設於耐熱層叫目反端之表面分別貼附有一鲁 亲j離層13 ’該剝離層13係為塑膠或薄膜，且其係依照剝離層、副 黏貼層12卜对熱層11、點貼層12及剝離層13依序排列。 凊參閱第三®及第四圖’其㈣係為本創作使用示意及使用剖面 示意之說明，此時，請一併參照第二圖，先取财熱黏貼片1，並撕去該 耐熱黏貼片1 -端之娜層13 ’而讓該獅層12顯露，再藉由黏貼層 12之祕’使对熱黏貼片丨與加工物2進行黏合，而待耐熱黏貼片】 與加工物2黏固後，再撕去該耐熱黏貼片j另一端之剝離層i3(即該耐 M435039 熱黏貼片1與加工物2黏合之另-端），而將該耐熱點貼片^一面之 副黏貼層121顯露，再藉由副黏貼層121本身之點性，去與治具3進 行黏合，透過黏貼層12與副黏貼層121使加工物2及治具3能相互黏 固，讓加工物2在進行加工過程中，不會相對治具3而有所滑移而 此實施例所指之加讀2係可為晶_面板，其以三_第四圖中 之加工物2係以晶圓來進行說明。 值得-提的是，因應麟技術在半導體產業中應用非常廣泛，因 此，本創作之耐熱黏貼片1’其亦可應用於濺鍍製程中，藉此，透過本 創作之财熱黏貼以’增加晶圓於親製程中之穩固性，以避免晶圓表 面過於光滑而產生義，有效防止賴t程良輪低之神發生有 關其應用於職製程之使用制，請參閱第五圖，錢為本創作將加 工物2無於濺職置4制示意之制，請—併參照第—圖至第四 圖之圖式說明，根據同樣實施方式將耐熱黏貼片（—面與加工物2與 進行黏固’而將雜黏貼片i另一面黏固於減鍍裝置4，藉此，防止濺 鑛製程良率較低之情事發生。 由上所述者僅用以解釋本創作之較佳實施例，並非企圖具以對本 創作作任何形式上之_，是以，凡有在相同之創作精神下所做有關 本創作之任何修飾紐更者’㈣應包括在本創作意·護之範奪内。 综上所述，本創作「耐熱黏貼片」其實用性及成本效益上，確實 是π王符合產業上發展所需，_^所揭露之結構創作亦是具有前所未有 的創新構造’所以其具有「新難」應紐慮，又本創作可較習用之 結構更具功效之增進，因此亦具有「進步性」，其完全符合我國專利法 7 M435039 有關新型專利之申請要件的規定，乃依法提起專利申請，並敬請 局早曰審查，並給予肯定。 【圖式簡單說明】 第一圖係為本創作第一實施例剖面示意圖。 第二圖係為本創作第二實施例剖面示意圖。 第三圖係為本創作使用示意圖。 第四圖係為本創作使用剖面示意圖。 第五圖係為本創作將加工物黏貼於濺鍍裝置使用示意圖。 【主要元件符號說明】 而才熱黏貼片1 财熱層 11 黏貼層 1 2 副黏貼層 12 1 剝離層 1 3 加工物 2 治具 3 濺鍍裝置 4M435039 V. New description: [New technical field] This creation department - shredded patch, specially made on wafer or panel, is processed on the fixture. [Prior Art] With the advancement of semiconductor and audio technology, the fabrication of micro-electro-mechanical components or optoelectronic components and other micro-components has also moved from the early wafer-level packaging to the wafer-level packaging stage to achieve a reduction in lightness and lightness. Short, small purpose. In general, the Μ-level packaging process will flip the wafer onto the carrier after the component fabrication on the wafer is completed, and the carrier will be bonded to the component area of each wafer on the wafer. A space is formed between the age and each of the wafers. Thereafter, the wafer is diced by the back side of the wafer to separate the wafer. However, since the two sides of the wafer are smooth surfaces, and the whole is a thin, light, and brittle object, 'it' is not suitable for the wafer to be placed on the working plane for post-processing. The mechanical fixture is used for m-setting. Because the clamping force of the mechanical clamp is large, it will cause crystal Hi damage under the force of external force operation, and the crystal is damaged due to the high precision of the crystal. Defacement still has a significant impact on its characteristics. Therefore, in the case of post-production processing, the wafer is directly placed on the working plane for construction, but since the two sides of the wafer are smooth surfaces, the friction on the plane of the wafer is small, and the addition is performed. There is also a sliding condition in the X process, and during the process of the wafer, it may also cause an error in the cutting due to the slip of the wafer relative to the jig, which indirectly destroys the relationship between the carrier and the respective wafer. The closed state, the loss of the surface of the wafer surface protection, so - the county-made tool in the _ crystal _, there is a considerable probability that the TL piece or line on the 曰曰 piece will be damaged, so that the components on the wafer The cooling liquid, the material particles or the subsequent manufacturing process are caused by the failure, which affects the overall process yield. It is known from the above analysis that the conventional wafer is still easy to circulate on the fixed system of the fixture, resulting in The lack of production yield is low; there is ##, this Lai Zuo people in the spirit of lean and seek to improve the above-mentioned missing 'Xi Mis_ make __ age patch, let the processing on the fixture In the process of adding jade, there will be no relative fixtures. Slip, which improves the overall process yield. [New content] The main purpose of this creation is to solve the problem that the surface of the processed object is smooth when the processed object is processed on the jig, which leads to the addition of Yang. Slip, and reduce the lack of process yield. In order to achieve the above purpose, the present invention refers to a heat-resistant adhesive sheet comprising: a heat layer; an adhesive layer, the adhesive layer is disposed on any side of the heat-resistant layer The end face; thereby, through the adhesive bonding of the adhesive layer, the processed object is adhered to the heat-adhesive patch, and the hot-adhesive patch is applied by vacuum adsorption of the jig, so that the processed object does not undergo processing Slippage The creation of "Hot-Resistant Spot Patch" includes the following technical features: 1. Another. There is also a layer of enamel layer on the side of the heat layer of the Di Cai. The sub-adhesive layer and the adhesive layer are located on both sides of the heat-resistant layer and correspond to each other. 2. The adhesive layer and the secondary adhesive layer are respectively attached with a peeling layer on the surface. 3. The heat-resistant layer is Teflon, Polyfluoroalkoxy, Polyether Ether Ketone, Poly(phenylene ether ether ketone)-containing glass fiber , poly(phenylene ether ether ketone)-carbon fiber, polymethylene imide (Polymide Imide), polyphenylene sulfide (Ether), polyphenylene sulfide-containing glass fiber, polyether (Polyether Sulfone), polyamidoxime (P〇lyetherimide) 'Polysulfone, Polyimide. 4. The thickness of the adhesive layer and the secondary adhesive layer is less than the thickness of the heat resistant layer. 5. The adhesive flat is made of silicone or insulating glue. 6_ The peeling layer is a plastic or a film. The heat-resistant adhesive sheet of the present invention adheres to the processed material through the adhesive layer, so that the processed product does not cause slippage. Currently, there is no similar product in the market, so after the launch, it will be able to set off a market in the market. upsurge. [Embodiment] The present invention relates to a heat-resistant adhesive sheet, and its function and characteristics are described below with reference to a related embodiment. Please refer to the first figure and in conjunction with the third embodiment, in the embodiment of the present heat-resistant adhesive sheet 1, which comprises a heat-resistant layer 11' and the heat-resistant layer 11 is Teflon, tetrafluoroethylene-perfluoroalkoxy. Ethyl-based bond copolymer (? 〇111〇1*〇&11^(^丫), polyphenylhydrazine-ketone (?〇^6"(:116):· Ether Ketone), polyphenylene ether ether Ketone-containing glass fiber, poly(phenylene ether ether ketone) _ carbon-containing fiber, polymide imide, polyphenylene Sulfide Ether, polyphenylene sulfide light-containing glass fiber, polyether (p〇lyether Sulfone), Polyetherimide, p〇iysuifone, p〇iyimide; — Adhesive layer! 2' and the lion layer 12 is disposed on either side of the heat-resistant layer n The adhesive layer _ layer 11 is a 郷n series, and the thickness of the miscellaneous layer 12 is less than the thickness of the hybrid layer. Thereby, the viscous point of the adhesive 12 is applied to the workpiece 2 to adhere the workpiece 2 to heat resistance. On the adhesive sheet 1, and by the vacuum suction-heat adhesive patch 1 of the jig 3, the workpiece 2 is not slipped during the processing (the foregoing is the main technical feature of the main embodiment of the creation, and the pair In this case, the tff specializes in the first item (fourth), and can be transferred to the purpose of the creation, and the technical features described in the scope of the remaining sub-applications are for the detailed description of the patent application. · The patent for the thorns of the towel _ Scope - the lion is defined fine, it should be noted that the "request of the patent - the item does not necessarily contain the technical features described in the scope of the remaining subsidiary patents." In addition to the use of a single heat-resistant layer n and In addition to the single adhesive layer 12, please refer to the second figure, which is a description of the cross section of the second embodiment of the present invention, in which the secondary adhesive I i2i and the adhesive layer 12 are on both sides of the thermal layer U and correspond to each other. The secondary adhesive layer ΐ2ι is made of Shishijiao or insulating rubber' and the thickness of the adhesive layer 121 is smaller than the thickness of the heat-resistant layer U, and the surface of the adhesive layer 12 and the secondary adhesive layer 121 are oppositely disposed on the opposite end of the heat-resistant layer. The release layer 13 is attached to the plastic layer or the film, and is sequentially arranged according to the release layer, the secondary adhesive layer 12, the thermal layer 11, the dot layer 12 and the release layer 13. Refer to the third and fourth figures '(4) for the use of this creation And use the schematic description of the profile. At this time, please refer to the second figure together, first take the hot adhesive patch 1 and tear off the heat-resistant adhesive patch 1 - end of the layer 13 ' and let the lion layer 12 reveal, then borrow The adhesive layer 12 is bonded to the workpiece 2, and the heat-resistant adhesive sheet is adhered to the workpiece 2, and then the peeling layer i3 at the other end of the heat-resistant adhesive sheet j is peeled off (ie, The M435039 heat-adhesive patch 1 is adhered to the other end of the workpiece 2, and the sub-adhesive layer 121 of the heat-resistant dot patch is exposed, and then the fixture is adhered to the fixture. 3, bonding, through the adhesive layer 12 and the secondary adhesive layer 121, the workpiece 2 and the jig 3 can be adhered to each other, so that the workpiece 2 does not slip relative to the jig 3 during the processing. The addition 2 system referred to in the example may be a crystal plate, and the workpiece 2 in the third to fourth drawing will be described as a wafer. It is worth mentioning that, due to the wide application of Yinglin technology in the semiconductor industry, the heat-resistant adhesive sheet 1' of this creation can also be applied to the sputtering process, thereby increasing the heat paste through the creation. The stability of the wafer in the pro-process, to avoid the wafer surface is too smooth and the meaning of the wafer, to effectively prevent the god of the low-turning gods from happening in the application process, please refer to the fifth picture, Qian-based creation The workpiece 2 is not in the form of a splash screen, please - and refer to the drawings in the first to fourth figures, according to the same embodiment, the heat-resistant adhesive sheet (the surface and the workpiece 2 are adhered) 'The other side of the miscellaneous patch i is adhered to the deplating device 4, thereby preventing the occurrence of a low yield of the sputtering process. The above description is only used to explain the preferred embodiment of the creation, not The attempt to make any form of the creation of the creation is that any modification of the creation of the creation in the same creative spirit should be included in the creative meaning of this creation. As mentioned above, this creation "heat-resistant adhesive The practicality and cost-effectiveness of the film is indeed that π Wang meets the needs of industrial development, and the structural creation revealed by _^ is also an unprecedented innovation structure. Therefore, it has the "new difficulty" and the creation. It can be more effective than the conventional structure, so it is also "progressive". It fully complies with the requirements of the application requirements for new patents in China's Patent Law 7 M435039. It is a patent application filed in accordance with the law, and please review it earlier. The first figure is a schematic cross-sectional view of the first embodiment of the creation. The second figure is a schematic cross-sectional view of the second embodiment of the creation. The third figure is a schematic diagram of the use of the creation. The figure is a schematic diagram of the cross-section of the creation. The fifth figure is a schematic diagram of the application of the workpiece to the sputtering device. [Main component symbol description] Only the thermal adhesive patch 1 The thermal layer 11 Adhesive layer 1 2 Adhesive layer 12 1 peeling layer 1 3 processing object 2 fixture 3 sputtering device 4