CN205046191U

CN205046191U - Chip sputter tool

Info

Publication number: CN205046191U
Application number: CN201520814000.5U
Authority: CN
Inventors: 姜志良
Original assignee: Rich Printing (suzhou) Co Ltd
Current assignee: Rich Printing (suzhou) Co Ltd
Priority date: 2015-10-21
Filing date: 2015-10-21
Publication date: 2016-02-24
Anticipated expiration: 2025-10-21

Abstract

The utility model relates to a chip sputter tool. Including base stock layer and double - sided adhesive layer, the base stock layer includes base stock and lower base stock, go up the base stock and be equipped with double - sided adhesive layer down between the base stock, all be equipped with square direct hole on base stock layer and the double - sided adhesive layer, the district of placing of a chip is answered to each direct pore pair, the size in direct hole is corresponding with the chip size size, all be equipped with the locating hole on base stock layer and the double - sided adhesive layer. The utility model discloses then do not need metallic film to dissolve in during the sputter, more environmental protection is produced to the chip, simultaneously greatly reduced manufacturing cost, also avoided the complicated flow of wasing the chip, improved sputter efficiency greatly.

Description

Chip sputtering jig

Technical field

The utility model relates to a kind of chip sputtering jig, and the making for SMT chips is processed.

Background technology

Chip, as the important composition parts of the electronics such as computer, mobile phone, is the silicon chip structure that unicircuit, small volume are contained in a kind of inside.Chip mostly is cube structure, and need to carry out jet-plating metallization film to chip all the other five surfaces except bottom surface in the process made, with protect IC, bottom surface, as face of weld, does not need sputtering thin film.

Traditional sputtering way, glue is used to spread upon on the bottom surface of chip, then sputter is carried out to it, use after crossing stove chemical by bottom surface glue remove, traditional processing method not only cost of manufacture is higher, and if to cleaning after liquid medicine effectively do not process, great pollution is caused to surrounding environment, clean after sputter, flow process is loaded down with trivial details again, and production efficiency is low.

Utility model content

In order to overcome the shortcoming of prior art, the utility model provides chip sputtering jig.

Technical solutions of the utility model are as follows:

Chip sputtering jig, comprise ground paper layer and layers of two-sided, described ground paper layer comprises base stock and lower base stock, layers of two-sided is provided with between described upper base stock and lower base stock, described ground paper layer and layers of two-sided are equipped with square clear opening, the rest area of the corresponding chip of each clear opening, the dimensions of described clear opening is less than the dimensions with chip, and described ground paper layer and layers of two-sided are equipped with pilot hole.

As preferably, described layers of two-sided is made up of acrylic foamed glue.

As preferably, described layers of two-sided comprises acrylic foaming glue-line and layer of silica gel three, described acrylic foaming glue-line is made up of acrylic foamed glue, and described layer of silica gel three is made up of silica gel, is provided with high temperature resistant mylar film between described acrylic foaming glue-line and layer of silica gel three.

As preferably, described layers of two-sided comprises layer of silica gel one and layer of silica gel two, and described layer of silica gel one and layer of silica gel two are made by silica gel, is provided with high temperature resistant mylar film between described layer of silica gel one and layer of silica gel two.

The utility model beneficial effect is: compared to prior art, when the utility model uses, the one side of sputtering jig was fitted on stove fixture by pilot hole, the another side laminating chip of sputtering jig, because the bottom surface of chip and sputtering jig fit, then do not need metallic film to dissolve in during sputter, achieve the novel process of chip five sputters; In the process, eliminate the use of glue and cleaning liquid medicine, make chip production more environmental protection; Greatly reduce production cost simultaneously, it also avoid the Complicated Flow of cleaning chip, substantially increase sputter efficiency.

Accompanying drawing explanation

Below in conjunction with drawings and Examples, the utility model is further illustrated.

Fig. 1 is the structural representation of the utility model embodiment 1.

Fig. 2 is the structural representation of the utility model embodiment 2.

Fig. 3 is the structural representation of the utility model embodiment 3.

Fig. 4 is layers of two-sided and structural representation when furnace tool is fitted excessively during the utility model uses.

Fig. 5 is the utility model structural representation when using chips and layers of two-sided to fit.

Fig. 6 is the structural representation that the utility model use chips is ejected by thimble.

Wherein: 1, upper base stock; 2, layers of two-sided; 21, high temperature resistant mylar film; 22, acrylic foaming glue-line; 23, layer of silica gel one; 24, layer of silica gel two; 25, layer of silica gel three; 3, lower base stock; 4, clear opening; 5, pilot hole; 6, stove fixture is crossed; 7, chip; 8, thimble.

Embodiment

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Embodiment 1, consults Fig. 1.

Chip sputtering jig, comprise ground paper layer and layers of two-sided 2, described ground paper layer comprises base stock 1 and lower base stock 3, layers of two-sided 2 is provided with between described upper base stock 1 and lower base stock 3, described ground paper layer and layers of two-sided 2 are equipped with square clear opening 4, the rest area of the corresponding chip of each clear opening 4, the dimensions of described clear opening 4 is less than the dimensions with chip 7, and described ground paper layer and layers of two-sided 2 are equipped with pilot hole 5.

Described layers of two-sided 2 is made up of acrylic foamed glue.

Embodiment 2, consults Fig. 2.

Described layers of two-sided 2 comprises acrylic foaming glue-line 22 and layer of silica gel 3 25, described acrylic foaming glue-line 22 is made up of acrylic foamed glue, described layer of silica gel 3 25 is made up of silica gel, high temperature resistant mylar film 21 is provided with between described acrylic foaming glue-line 22 and layer of silica gel 3 25, wherein high temperature resistant mylar film 21 plays the effect supporting layers of two-sided 2, during use, acrylic foaming glue-line 22 fits with chip 7, and layer of silica gel 3 25 and excessively stove fixture 6 fit.

Embodiment 3, consults Fig. 3.

Described layers of two-sided 2 comprises layer of silica gel 1 and layer of silica gel 2 24, described layer of silica gel 1 and layer of silica gel 2 24 all have silica gel to make, high temperature resistant mylar film 21 is provided with between described layer of silica gel 1 and layer of silica gel 2 24, wherein high temperature resistant mylar film 21 plays the effect supporting layers of two-sided 2, during use, layer of silica gel 1 and chip 7 fit, and layer of silica gel 2 24 and excessively stove fixture 6 fit.

The utility model uses step as follows:

Step one, open a ground paper layer, according to pilot hole 5, the layers of two-sided 2 of sputtering jig was fitted on stove fixture 6;

Step 2, consult Fig. 4 and Fig. 5, open another side ground paper layer, by SMT paster technique, fitted in corresponding for chip 7 clear opening 4 position and layers of two-sided 2, paste effect due to layers of two-sided 2, chip 7 is fixed on sputtering jig;

Step 3, by crossing stove fixture 6, sputtering jig puts continuous tunnel furnace into and carries out sputter together with chip 7;

Step 4, by the chip 7 after sputter, cross after stove fixture 6 and sputtering jig together take out and place normal temperature;

Step 5, consult Fig. 6 and use thimble 8 to be ejected by chip 7 from the bottom crossing stove fixture 6, chip 7 and sputtering jig are separated.

Above-mentioned drawings and Examples are only for illustration of the utility model, and any art those of ordinary skill to its suitable change done or modification, or is used other flower pattern instead and made this technical change, all should be considered as not departing from the utility model patent category.

Claims

1. chip sputtering jig, it is characterized in that: comprise ground paper layer and layers of two-sided (2), described ground paper layer comprises base stock (1) and lower base stock (3), layers of two-sided (2) is provided with between described upper base stock (1) and lower base stock (3), described ground paper layer and layers of two-sided (2) are equipped with square clear opening (4), the rest area of the corresponding chip (7) of each clear opening (4), the dimensions of described clear opening (4) is less than the dimensions with chip (7), and described ground paper layer and layers of two-sided (2) are equipped with pilot hole (5).

2. chip sputtering jig as claimed in claim 1, is characterized in that: described layers of two-sided (2) is made up of acrylic foamed glue.

3. chip sputtering jig as claimed in claim 1, it is characterized in that: described layers of two-sided (2) comprises acrylic foaming glue-line (22) and layer of silica gel three (25), described acrylic foaming glue-line (22) is made up of acrylic foamed glue, described layer of silica gel three (25) is made up of silica gel, is provided with high temperature resistant mylar film (21) between described acrylic foaming glue-line (22) and layer of silica gel three (25).

4. chip sputtering jig as claimed in claim 1, it is characterized in that: described layers of two-sided (2) comprises layer of silica gel one (23) and layer of silica gel two (24), described layer of silica gel one (23) and layer of silica gel two (24) are made by silica gel, are provided with high temperature resistant mylar film (21) between described layer of silica gel one (23) and layer of silica gel two (24).