CN207685335U - Chip sputtering jig - Google Patents
Chip sputtering jig Download PDFInfo
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- CN207685335U CN207685335U CN201721442645.6U CN201721442645U CN207685335U CN 207685335 U CN207685335 U CN 207685335U CN 201721442645 U CN201721442645 U CN 201721442645U CN 207685335 U CN207685335 U CN 207685335U
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- sputter
- glue
- sputtering jig
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Abstract
The utility model proposes chip sputtering jig include pyrolysis glue-line and upper base stock, lower base stock, when carrying out sputter using this sputtering jig, upper base stock is removed, bottom surface by chip without sputter is pasted onto on the pyrolysis glue-line, the pyrolysis glue-line can securely fix chip in room temperature and sputter, and after the completion of sputter, preset temperature is heated to the sputtering jig, the viscosity of the pyrolysis glue-line loses completely, so that chip is easy to fall off.The utility model can realize five face sputter of chip, and without positioning when adhering chip, the process for simplifying positioning chip；Meanwhile can easily be removed chip without additional stripping process after the completion of sputter, it avoids and the damage of chip may be ensure that the service life of chip, greatly reduce production cost, improves sputter efficiency.
Description
Technical field
The utility model is related to a kind of chip sputtering jigs.
Background technology
Chip, as the important composition component of the electronic equipments such as computer, mobile phone, be a kind of inside contain integrated circuit,
The silicon chip structure of small volume.Chip is mostly cube structure, and its to chip in addition to bottom surface is needed during making
Remaininging five surfaces carries out jet-plating metallization films, to protect chip, bottom surface not to need sputtering thin film as welding surface.
It with the raising of people's environmental protection consciousness, is applied on the bottom surface of chip using glue, then sputter is carried out to it
Method gradually abandoned, this department proposes a kind of sputtering jig, and having sticking base material using silica gel etc. makes, and in sputter
Through-hole is set on jig, chip is pasted onto on sputtering jig, after the completion of sputter, is controlled chip and sputter by devices such as thimbles
Tool separation, but there are still certain problems for the technology：First, chip needs to be fitted on through-hole, therefore is needed before fitting advanced
Row positioning, and need to ensure the precision of positioning so that sputtering process becomes complicated, influences sputter efficiency；Secondly, chip with splash
When plating jig separation, the base materials such as silica gel may remain in die bottom surface, to ensure the clean and tidy of chip, subsequently still need to carry out certain
Cleaning work；Again, in ejection, thimble applies an active force to chip, may be influenced in chip subsequent use
The function of chip, i.e., potential certain hidden danger, to influence the service life of chip.
Utility model content
The shortcomings that in order to overcome the prior art, the utility model provide chip sputtering jig.
Chip sputtering jig, including
It is pyrolyzed glue-line, including upper and lower surface；
Upper base stock is arranged in the upper surface of the pyrolysis glue-line；
Lower base stock is arranged in the lower surface of the pyrolysis glue-line；
Wherein, it is described pyrolysis glue-line be lost under preset temperature viscosity pyrolysis glue, and the preset temperature be higher than splash
Plate temperature.
Preferably, further include supporting layer, the supporting layer is arranged in the lower surface of the pyrolysis glue-line, and the lower base stock is set
It sets on surface of the supporting layer far from the pyrolysis glue-line.
Preferably, the supporting layer includes high temperature resistant mylar film and adhered layer, and the high temperature resistant mylar film is arranged described
It is pyrolyzed the lower surface of glue-line, the adhered layer is arranged between the high temperature resistant mylar film and the lower base stock.
Preferably, the adhered layer is removable removing glue.
The utility model advantageous effect is：The utility model can not only realize five face sputter of chip, while also have
Following advantage：
(1) when chip is affixed to sputtering jig, without being open on sputtering jig, without positioning, chip can be with
It optimizes arrangement to be pasted onto on sputtering jig surface, increases the quantity of chip on single sputtering jig, improve the effect of sputter
Rate；
(2) using the pyrolysis glue that can lose viscosity at a predetermined temperature, the process detached using thimble is eliminated so that core
The separation of piece and sputtering jig is more convenient, reduces the probability that chip may be damaged, ensure that the service life of chip；
(3) after the completion of sputter, it is not necessary that sputtering jig and chip cooling technique to room temperature, are directly heated sputtering jig and chip
To preset temperature, pyrolysis glue-line is made to lose viscosity, to which easily sputtering jig and chip be detached, save sputter when
Between.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model embodiment one；
Fig. 2 is the pyrolysis glue-line example for being pasted with chip；
Fig. 3 is the structural schematic diagram of the utility model embodiment two；
The upper base stocks of 1-；2- is pyrolyzed glue-line；Base stock under 3-；4- supporting layers；40- high temperature resistant mylar films；41- adhered layers；5- cores
Piece.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings.
Embodiment one
It please refers to Fig.1.Chip sputtering jig, including upper base stock 1, pyrolysis glue-line 2 and lower base stock 3, the pyrolysis glue-line 2 wrap
Upper and lower surface is included, the upper base stock 1 is arranged in the upper surface of the pyrolysis glue-line 2, and the lower base stock 3 is arranged described
The lower surface of glue-line 2, the upper base stock 1 and lower base stock 3 are pyrolyzed for protecting pyrolysis glue-line 2；The pyrolysis glue-line 2 is pre-
If the high/low temperature pyrolysis glue of viscosity is lost at a temperature of, and the preset temperature of the pyrolysis glue-line 2 is higher than sputter temperature, to ensure
In sputter, the pyrolysis glue-line 2 still has viscosity well.
Please refer to Fig. 2.The upper surface of the pyrolysis glue-line 2 is for being arranged chip 5, since pyrolysis glue-line 2 has at normal temperatures
There is good viscosity, chip 5 can be enable to be pasted onto securely on pyrolysis glue-line 2, what chip 5 can be neat is arranged in heat
On the surface for solving glue-line 2, as shown in Fig. 2, in other embodiments, it is preferred that chip 5 can be according to the arrangement mode of optimization
It is pasted onto on pyrolysis glue-line, the surface in pyrolysis glue-line 2 that refers to of the arrangement mode of the optimization can arrange maximum number
The chip 5 of amount.
Embodiment two
Please refer to Fig. 3.In the present embodiment and embodiment one the difference is that：Chip sputtering jig further includes supporting layer 4,
The support 4 is arranged between the pyrolysis glue-line 2 and the lower base stock 3, i.e., the described supporting layer 4 is arranged in the pyrolysis glue
The lower surface of layer 2, the lower base stock 3 are arranged in one side of the supporting layer 4 far from the pyrolysis glue-line 2.
The supporting layer 4 includes high temperature resistant mylar film 40 and adhered layer 41, wherein the high temperature resistant mylar film 40 is arranged
It is used to support and protects pyrolysis glue-line 2 and chip 5 with good heat resistance in the lower surface of the pyrolysis glue-line 2,
The adhered layer 41 is arranged between the high temperature resistant mylar film 40 and the lower base stock 3, is used for sputtering jig and crosses stove
Jig is bonded.
The step of carrying out sputter using the sputtering jig of the utility model is as follows：
Step 1: opening base stock 1, chip 5 is arranged on the upper surface of pyrolysis glue-line 2, at this point, the pyrolysis glue-line
2 have very strong viscosity, therefore chip 5 is fixed on sputtering jig；
Step 2: opening lower base stock 3, sputtering jig was fitted on furnace tool, in embodiment one by being pyrolyzed glue-line 2
Lower surface fitting, embodiment two by adhered layer 41 by sputtering jig with mistake furnace tool be bonded；
Sputter, the pyrolysis glue-line 2 are carried out Step 3: stove fixture, sputtering jig and chip 5 will be crossed and put continuous tunnel furnace into together
Also there is very strong viscosity at a temperature of sputter, therefore chip 5 also can securely be pasted in sputtering process with sputtering jig；
Step 4: chip 5, stove fixture and the sputtering jig excessively after sputter are taken out together；
Step 5: the sputtering jig for being stained with chip 5 is heated to preset temperature, the pyrolysis glue-line 2 is made to lose viscosity,
To make chip 5 be detached with sputtering jig.
Wherein, it in step 4, by chip 5, crosses after furnace tool and sputtering jig take out, for a kind of structure of embodiment,
Chip 5, excessively furnace tool and sputtering jig are heated to preset temperature together, realized the separation of furnace tool and sputtering jig, with
And the separation of chip 5 and sputtering jig；For the structure of embodiment two, furnace tool is detached with sputtering jig first, is then led to
The sputtering jig that heating is stained with chip 5 is crossed, so that pyrolysis glue-line 2 is lost viscosity, to make chip 5 be detached with sputtering jig.
Above-mentioned accompanying drawings and embodiments are merely to illustrate the utility model, and any technical field those of ordinary skill is to it
The appropriate changes or modifications done, or use other flower pattern instead and make this technical change, it all should be regarded as not departing from this practicality newly
Type patent category.
Claims (4)
1. chip sputtering jig, which is characterized in that including
It is pyrolyzed glue-line, including upper and lower surface；
Upper base stock is arranged in the upper surface of the pyrolysis glue-line；
Lower base stock is arranged in the lower surface of the pyrolysis glue-line；
Wherein, the pyrolysis glue-line is the pyrolysis glue of viscosity to be lost under preset temperature, and the preset temperature is higher than sputter temperature
Degree.
2. chip sputtering jig according to claim 1, which is characterized in that further include supporting layer, the supporting layer setting
In the lower surface of the pyrolysis glue-line, the lower base stock is arranged on surface of the supporting layer far from the pyrolysis glue-line.
3. chip sputtering jig according to claim 2, which is characterized in that the supporting layer include high temperature resistant mylar film and
Adhered layer, the high temperature resistant mylar film are arranged in the lower surface of the pyrolysis glue-line, and the adhered layer is arranged in the high temperature resistant
Between mylar film and the lower base stock.
4. chip sputtering jig according to claim 3, which is characterized in that the adhered layer is removable removing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721442645.6U CN207685335U (en) | 2017-11-02 | 2017-11-02 | Chip sputtering jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721442645.6U CN207685335U (en) | 2017-11-02 | 2017-11-02 | Chip sputtering jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207685335U true CN207685335U (en) | 2018-08-03 |
Family
ID=62989384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721442645.6U Active CN207685335U (en) | 2017-11-02 | 2017-11-02 | Chip sputtering jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207685335U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111519136A (en) * | 2020-03-23 | 2020-08-11 | 深圳市海铭德科技有限公司 | Sputtering jig for semiconductor chip |
| CN113135011A (en) * | 2021-04-12 | 2021-07-20 | 睿惢思工业科技（苏州）有限公司 | Semiconductor chip high-temperature bearing jig and processing technology thereof |
-
2017
- 2017-11-02 CN CN201721442645.6U patent/CN207685335U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111519136A (en) * | 2020-03-23 | 2020-08-11 | 深圳市海铭德科技有限公司 | Sputtering jig for semiconductor chip |
| CN111519136B (en) * | 2020-03-23 | 2021-11-16 | 深圳市海铭德科技有限公司 | Sputtering jig for semiconductor chip |
| CN113135011A (en) * | 2021-04-12 | 2021-07-20 | 睿惢思工业科技（苏州）有限公司 | Semiconductor chip high-temperature bearing jig and processing technology thereof |
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