CN107645829A - A kind of circuit board conductive liquid and its preparation method and application - Google Patents
A kind of circuit board conductive liquid and its preparation method and application Download PDFInfo
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- CN107645829A CN107645829A CN201710957928.2A CN201710957928A CN107645829A CN 107645829 A CN107645829 A CN 107645829A CN 201710957928 A CN201710957928 A CN 201710957928A CN 107645829 A CN107645829 A CN 107645829A
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Abstract
The invention provides a kind of circuit board conductive liquid and its preparation method and application, the circuit board conductive liquid includes blank hole liquid and nano silver wire, by in preparation method of the present invention, the circuit board conductive liquid that nano silver wire and blank hole liquid are mixed to get, greatly reduce resistance, make conduction liquid that there is more preferable through hole ability on hole wall, price is relatively low, apply in flow is routinely electroplated, can be through heat-shock, stable performance, product backlight level after plating is high, compared to other Nano silver grains, the conductive materials such as golden nanometer particle and graphene, with larger advantage.
Description
Technical field
The invention belongs to field of electroplating, and in particular to a kind of circuit board conductive liquid and its preparation method and application.
Background technology
With the development of modern electronic equipment, electronic device except itself communication, function, the people such as display pursue it always
The increment attribute of frivolous, portable, high intensity, high flexibility, i.e. flexible printing electronic device, this just needs flexible printed circuit board energy
Meet the requirement such as electric property and high-density wiring of electronic product.Wherein, hole metallization is the most important thing of circuit-board processes.
At present, the hole metallization technique of flexible printed circuit board is more with black holes flow, compared to chemical-copper-plating process, has production technology
The advantages such as simple and environmental protection.
Blank hole liquid is made up of auxiliary agents such as conductive black, dispersant, dispersant medias, is disperseed by mechanical lapping
Uniform and stable conducting nanoparticles, are attached in circuit board through-hole by absorption principle.However, the conduction due to conductive black
Property is poor, limits the application of its multi-layer flexible sheet in practice.
Nano silver wire is due to its high conductivity and extensive potential application, more and more of interest by people in the last few years, phase
Than materials such as ITO, nano silver wire has more preferable pliability, available for preparing transparent conductive film, for flexible touch screen and have
The industries such as machine light emitting diode (OLED).
Conduction liquid electric conductivity in the market is poor, the through hole poor-performing on hole wall, in flexible printed circuit board
In the defects of obvious be present.Therefore need to develop a kind of Novel circuit board conduction liquid, to solve the problems, such as presently, there are.
The content of the invention
In view of the shortcomings of the prior art, it is an object of the invention to provide a kind of circuit board conductive liquid and preparation method thereof and
Using.
To reach this goal of the invention, the present invention uses following technical scheme：
On the one hand, the present invention provides a kind of circuit board conductive liquid, and the circuit board conductive liquid includes blank hole liquid and silver nanoparticle
Line.
In the present invention, nano silver wire is added in blank hole liquid, built-up circuit plate conduction liquid.Nano silver wire is led with height
The characteristic of electric rate, the resistance of blank hole liquid is greatly reduced, make conduction liquid that integrally there is more preferable electric conductivity on hole wall；Separately
Outside, because nano silver wire has preferable pliability and special linear structure, bridging action can be played in entirety, is shortened
Conductive path, macroscopically also show to drop low-resistance characteristic, in the later stage electroplates flow, stable performance, the obtained product back of the body
Light grade is high.
In the present invention, the blank hole liquid includes the component of following mass percentage content：
Preferably, the conductive black mass percentage content is 1%-5%, for example, can be 1%, 1.5%, 2%,
2.5%th, 3%, 3.5%, 4%, 4.5% or 5%.
Preferably, the surfactant is neopelex, lauryl sodium sulfate, aliphatic alcohol polyethenoxy
Ether or one kind in nonyl phenol polyethenoxy ether or at least two combination, mass percent can be 0.5%, 1%,
1.5%th, 2%, 2.5% or 3%.
Preferably, the dispersant is aliphatic alcohol polyethenoxy sulfuric ester, 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium, polyethylene glycol or poly-
One kind or at least two combination in vinylpyrrolidone, mass percent can be 1%, 1.5%, 2%, 2.5%, 3%,
3.5%th, 4%, 4.5% or 5%.
Preferably, the pH adjusting agent is one kind in potassium carbonate, saleratus, ammoniacal liquor or monoethanolamine or at least two
Combination, mass percent can be 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5% or 5%.
Preferably, the binding agent is one kind or extremely in polyvinyl alcohol, Sodium Polyacrylate, polyacrylamide or potassium silicate
Few two kinds of combination, mass percent can be 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%,
0.9% or 1%.
Preferably, the decentralized medium be water, ethylene glycol, isopropanol or acetone in one kind or at least two combination,
Mass percent can be 81%, 83%, 85%, 88%, 90%, 92%, 94% or 96.4%.
In the present invention, the blank hole liquid is prepared by the following method：
(1) conductive black, surfactant, dispersant, pH adjusting agent, binding agent and decentralized medium are well mixed；
(2) mixture obtained in step (1) is fully ground, obtains the blank hole liquid.
Preferably, the time of step (1) described mixing is 1-2 hours, for example, can be 1 hour, 1.2 hours, it is 1.4 small
When, 1.5 hours, 1.7 hours, 1.8 hours or 2 hours.
Preferably, the time of step (2) described grinding is 2-10 hours, for example, can be 2 hours, 3 hours, 4 hours, 5
Hour, 6 hours, 7 hours, 8 hours, 9 hours or 10 hours.
The preparation method of blank hole liquid of the present invention is simple, and technique is excellent.
In the present invention, the preparing raw material of the nano silver wire includes aqueous surfactant solution and is dissolved in reduction point
Silver nitrate, dispersant and crystal seed in dispersion media.
Preferably, the mass percent concentration of the aqueous surfactant solution is 0.4%-4%, such as can be
0.4%th, 0.6%, 0.9%, 1.5%, 2%, 2.2%, 2.5%, 3%, 3.5% or 4%.
Preferably, the mass percent concentration of silver nitrate, dispersant and crystal seed is as follows in the reduction decentralized medium：
0.2%-2% silver nitrates (such as can be 0.2%, 0.8%, 1.1%, 1.4%, 1.6%, 1.8% or 2%)；0.4%-4%
Dispersant (such as can be 0.4%, 0.8%, 1%, 1.5%, 2%, 2.2%, 2.5%, 3%, 3.5% or 4%)；
0.01%-0.1% crystal seeds (such as can be 0.01%, 0.03%, 0.05%, 0.06%, 0.08%, 0.09% or 0.1%).
Preferably, the reduction decentralized medium is one kind or at least in glycerine, propane diols, ethylene glycol or diethylene glycol
Two kinds of combination.
In the present invention, reduction decentralized medium not only acts as the effect of reducing agent, the silver ion in reducing solution, also simultaneously
With peptizaiton so that solution has good stability.
Preferably, the dispersant is one kind or extremely in polyacrylamide, Sodium Polyacrylate or polyvinylpyrrolidone
Few two kinds combination.
Preferably, the crystal seed is one kind or at least two group in copper chloride, sodium chloride, iron chloride or palladium bichloride
Close.
In the present invention, it is crystal seed to add good crystal structure material, can accelerate into brilliant speed, better beneficial to being formed
Good crystal formation.
Preferably, the surfactant is polyoxyethylene alkyl ether sulfate, 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium, dodecane
One kind or at least two combination in base benzene sulfonic acid sodium salt or lauryl sodium sulfate.
In the present invention, the suspension of described nano silver wire is prepared by the following method：
(1) silver nitrate is dissolved in reduction decentralized medium, obtains silver nitrate solution A；
(2) dispersant, crystal seed are dissolved in reduction decentralized medium, obtain dispersant seed-solution B；
(3) surfactant is soluble in water, stirring obtains clear solution C；
(4) by solution B described in step (2) stirring, heating, the solution B after will heat up add to step (1) obtain it is molten
Reacted in liquid A, be incubated after reaction, then reaction solution is centrifuged, washs to obtain nano silver wire；
(5) step (4) described nano silver wire is scattered in aqueous surfactant solution C, that is, obtains the nano silver wire
Suspension.
Preferably, the concentration of solution A described in step (1) is 0.2%-2%, for example, can be 0.2%, 0.4%,
0.6%th, 0.9%, 1.1%, 1.4%, 1.7%, 1.8% or 2%.
Preferably, the concentration of solution B described in step (2) is 0.41%-4.1%, for example, can be 0.41%, 0.7%,
1.2%th, 1.6%, 1.9%, 2.2%, 2.7%, 3.1%, 3.5%, 4% or 4.1%.
Preferably, relative to the dosage of 10g surfactants, water consumption described in step (3) is 240g-2490g, such as
Can be 240g, 300g, 500g, 1000g, 1200g, 1500g, 1900g, 2200g or 2490g.
Preferably, the stir speed (S.S.) stirred described in step (4) is that 1000-2000 turns/min, such as can be 1000 turns/
Min, 1200 turns/min, 1400 turns/min, 1500 turns/min, 1700 turns/min, 1900 turns/min or 2000 turn/min.
Preferably, heating described in step (4) is is warming up to 150-200 DEG C, for example, can be 150 DEG C, 155 DEG C, 160
DEG C, 170 DEG C, 175 DEG C, 180 DEG C, 185 DEG C, 190 DEG C, 195 DEG C or 200 DEG C.
Preferably, solution B is incubated after being heated up in step (4), the time of the insulation is 10-60min, such as can
To be 10min, 20min, 30min, 40min, 50min or 60min.
Preferably, the method added described in step (4) is dropwise addition.
Preferably, the speed of the dropwise addition is 0.1mL/min-1mL/min, such as can be 0.1mL/min, 0.2mL/
Min, 0.3mL/min, 0.4mL/min, 0.5mL/min, 0.6mL/min, 0.7mL/min, 0.8mL/min, 0.9mL/min or
1mL/min。
Preferably, the time being incubated described in step (4) is 30min-180min, for example, can be 30min, 50min,
80min, 100min, 120min, 140min, 160min or 180min.
On the other hand, the present invention provides a kind of preparation method of described circuit board conductive liquid, and methods described is：By black holes
Liquid mixes with nano silver wire suspension, stirs, and obtains the circuit board conductive liquid.
Preferably, nano silver wire suspension mass fraction in blank hole liquid is 10%-30%, such as can be
10%th, 12%, 15%, 18%, 20%, 24%, 26%, 29% or 30%.
Preferably, the mixing speed be 500-1000 turn/min, such as can be 500 turns/min, 600 turns/min, 700
Turn/min, 800 turns/min, 900 turns/min or 1000 turn/min.
The preparation method of conduction liquid of the present invention is very simple, easy to operate, is easy to produce, reduces cost.
In the present invention, there is provided a kind of application of described circuit board conductive liquid in electroplating printed circuit board.
Relative to prior art, the invention has the advantages that：
Nano silver wire is added to the circuit board conductive liquid obtained in blank hole liquid by the present invention, has the characteristic of high conductivity,
Resistance is greatly reduced, another aspect nano silver wire has special linear structure, and bridging action can be played in conduction liquid,
Shorten conductive path, macroscopically also show excellent reduction resistive performance.
Nano silver wire and conductive black reduce the resistance of blank hole liquid, make it on hole wall as conductive materials in the present invention
With more preferable through hole ability.Conduction liquid with preferable flexible nano silver wire with blank hole liquid composition, electric conductivity are excellent
Good, price is relatively low, applies in routinely flow is electroplated, and can electroplate the product backlight after flow through heat-shock, stable performance
Grade is high, compared to conductive materials such as other Nano silver grains, golden nanometer particle and graphenes, has larger advantage.
Embodiment
Technical scheme is further illustrated below by embodiment.Those skilled in the art should be bright
, the embodiment be only to aid in understand the present invention, be not construed as to the present invention concrete restriction.
Embodiment 1
The present embodiment is prepared by the following method circuit board conductive liquid：
(1) preparation of blank hole liquid：
It is 2.5% conductive black, 1.5% lauryl sodium sulfate, 2.5% dodecane by mass percentage content
Base phosphate potassium, 2.5% potassium carbonate, 0.5% polyvinyl alcohol and 90.5% water mix 1.5 hours, then will be uniform
Mixture is ground 6 hours, obtains blank hole liquid.
(2) preparation of nano silver wire：
Silver nitrate is dissolved in ethylene glycol, obtains the silver nitrate solution A of silver nitrate mass percent concentration 1%；By poly- third
Acrylamide and sodium chloride are dissolved in ethylene glycol, and it is that 2.2% and crystal seed mass percent are dense to obtain dispersant mass percent concentration
Spend the dispersant seed-solution B for 0.05%；10g 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium is dissolved in 490g water, obtains mass percent
Concentration is 2% aqueous surfactant solution C.
Above-mentioned solution B is stirred with 1000 turns/min, 180 DEG C is warming up to, 30min is incubated after heating, then will be molten
Liquid B is added drop-wise in solution A with 0.5mL/min speed to be reacted, and is incubated 100min after reaction again, reaction solution carry out from
The heart, washing obtain nano silver wire, and suspension is scattered in solution C, obtains nano silver wire suspension.
(3) preparation of circuit board conductive liquid：
The blank hole liquid being prepared as described above is mixed with nano silver wire, is stirred, obtained with 500 turns/min speed
The circuit board conductive liquid that mass fraction is 15% in blank hole liquid to nano silver wire suspension.
Embodiment 2
The present embodiment is prepared by the following method circuit board conductive liquid：
(1) preparation of blank hole liquid：
The conductive black, 0.5% AEO, 1% poly- second two for being 1% by mass percentage content
Alcohol, 1% saleratus, 0.1% Sodium Polyacrylate and 96.4% water mix 2 hours, then grind uniform mixture
Mill 10 hours, obtains blank hole liquid.
(2) preparation of nano silver wire：
Silver nitrate is dissolved in glycerine, obtains the silver nitrate solution A of silver nitrate mass percent concentration 0.2%；Will be poly-
Acrylamide and sodium chloride are dissolved in glycerine, and it is that 4% and crystal seed mass percent are dense to obtain dispersant mass percent concentration
Spend the dispersant seed-solution B for 0.1%；10g lauryl sodium sulfate is dissolved in 240g water, obtains mass percent concentration
For 4% aqueous surfactant solution C.
Above-mentioned solution B is stirred with 1000 turns/min, 200 DEG C is warming up to, 10min is incubated after heating, then will be molten
Liquid B is added drop-wise in solution A with 1mL/min speed to be reacted, and is incubated 30min after reaction again, and reaction solution is centrifuged, washed
Wash to obtain nano silver wire, nano silver wire is scattered in solution C, obtain nano silver wire suspension.
(3) preparation of circuit board conductive liquid：
The blank hole liquid being prepared as described above is mixed with nano silver wire, stirred with 1000 turns/min speed,
Obtain the circuit board conductive liquid that nano silver wire suspension mass fraction in blank hole liquid is 30%.
Embodiment 3
The present embodiment is prepared by the following method circuit board conductive liquid：
(1) preparation of blank hole liquid：
By conductive black, 3% neopelex and the nonyl phenol polyoxy second that mass percentage content is 5%
Alkene ether, 5% polyvinylpyrrolidone and aliphatic alcohol polyethenoxy sulfuric ester, 5% monoethanolamine, 1% Sodium Polyacrylate with
Potassium silicate and 81% water mix 1 hour, then grind uniform mixture 2 hours, obtain blank hole liquid.
(2) preparation of nano silver wire：
Silver nitrate is dissolved in acetone, obtains the silver nitrate solution A of silver nitrate mass percent concentration 2%；By polyethylene
Pyrrolidones, polyacrylamide and iron chloride are dissolved in acetone, and it is 0.4% and crystal seed quality to obtain dust dispersion quality percent concentration
Percent concentration is 0.01% dispersant seed-solution B；10g 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium is dissolved in 2490g water, obtains matter
Measure the aqueous surfactant solution C that percent concentration is 0.4%.
Above-mentioned solution B is stirred with 2000 turns/min, 150 DEG C is warming up to, 60min is incubated after heating, then will be molten
Liquid B is added drop-wise in solution A with 0.1mL/min speed to be reacted, and is incubated 180min after reaction again, reaction solution carry out from
The heart, washing obtain nano silver wire, and nano silver wire is scattered in solution C, obtains nano silver wire suspension.
(3) preparation of circuit board conductive liquid：
The blank hole liquid being prepared as described above is mixed with nano silver wire, is stirred, obtained with 700 turns/min speed
The circuit board conductive liquid that mass fraction is 10% in blank hole liquid to nano silver wire suspension.
Embodiment 4
The present embodiment is prepared by the following method circuit board conductive liquid：
(1) preparation of blank hole liquid：
By conductive black of the mass percentage content for 4%, 2% neopelex and dodecyl sulphate
Sodium, 2% polyvinylpyrrolidone and polyethylene glycol, 4% potassium carbonate and saleratus, 0.6% polyacrylamide and silicon
Sour potassium and 87.4% water mix 1.4 hours with isopropanol, then grind uniform mixture 7 hours, obtain blank hole liquid.
(2) preparation of nano silver wire：
Silver nitrate is dissolved in diethylene glycol, obtains the silver nitrate solution A of silver nitrate mass percent concentration 1.6%；Will
Polyvinylpyrrolidone, Sodium Polyacrylate and sodium chloride, palladium bichloride are dissolved in diethylene glycol, obtain dust dispersion quality percent concentration
For 3% and crystal seed mass percent concentration be 0.06% dispersant seed-solution B；By 10g AEO sulfuric acid
Ester is dissolved in 1990g water, obtains the aqueous surfactant solution C that mass percent concentration is 0.5%.
Above-mentioned solution B is stirred with 1700 turns/min, 170 DEG C is warming up to, 40min is incubated after heating, then will be molten
Liquid B is added drop-wise in solution A with 0.6mL/min speed to be reacted, and is incubated 140min after reaction again, reaction solution carry out from
The heart, washing obtain nano silver wire, and nano silver wire is scattered in solution C, obtains nano silver wire suspension.
(3) preparation of circuit board conductive liquid：
The blank hole liquid being prepared as described above is mixed with nano silver wire, is stirred, obtained with 600 turns/min speed
The circuit board conductive liquid that mass fraction is 21% in blank hole liquid to nano silver wire suspension.
Embodiment 5
The present embodiment is prepared by the following method circuit board conductive liquid：
(1) preparation of blank hole liquid：
By conductive black, 2% lauryl sodium sulfate and the aliphatic alcohol polyethenoxy that mass percentage content is 2%
Ether, 2% 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium and polyvinylpyrrolidone, 2% monoethanolamine and ammoniacal liquor, 0.7% polyvinyl alcohol and
91.3% water mixes 1.3 hours, then grinds uniform mixture 4 hours, obtains blank hole liquid.
(2) preparation of nano silver wire：
Silver nitrate is dissolved in propane diols and in glycerine, the silver nitrate for obtaining silver nitrate mass percent concentration 1.6% is molten
Liquid A；Polyacrylamide, Sodium Polyacrylate and copper chloride are dissolved in propane diols and glycerine, obtain dispersant mass percent
The dispersant seed-solution B that concentration is 3% and crystal seed mass percent concentration is 0.04%；By 10g lauryl sodium sulfate with
Neopelex is dissolved in 990g water, obtains the aqueous surfactant solution C that mass percent concentration is 1%.
Above-mentioned solution B is stirred with 1000 turns/min, 160 DEG C is warming up to, 20min is incubated after heating, then will be molten
Liquid B is added drop-wise in solution A with 0.7mL/min speed to be reacted, and is incubated 80min after reaction again, reaction solution centrifuged,
Washing obtains nano silver wire, and nano silver wire is scattered in solution C, obtains nano silver wire suspension.
(3) preparation of circuit board conductive liquid：
The blank hole liquid being prepared as described above is mixed with nano silver wire, is stirred, obtained with 600 turns/min speed
The circuit board conductive liquid that mass fraction is 22% in blank hole liquid to nano silver wire suspension.
Comparative example 1
This comparative example difference from Example 1 is, only containing the blank hole liquid prepared in embodiment 1, does not contain Yin Na
Rice noodles.
Comparative example 2
This comparative example and embodiment 1 only difference is that, mass fraction of the nano silver wire in blank hole liquid is 9%.
Comparative example 3
This comparative example and embodiment 1 only difference is that, mass fraction of the nano silver wire in blank hole liquid is 32%.
Above-described embodiment 1-5 and comparative example 1-3 is subjected to testing research, handled by carbon pores, test circuit plate hole resistance
Value, concrete outcome such as table 1 below：
Table 1
It can be concluded that by the experimental result of upper table 1, compared to like product, conduction liquid resistance of the invention is (small
In 2k Ω) it is significantly less than like product resistance；In the conduction liquid of nano silver wire is not contained, its resistance value differs with like product
Very few, effect is poor；When containing nano silver wire, but nano silver wire mass fraction is not in nano silver wire mass fraction of the present invention
When within 10%-30%, although resistance is still below like product, mass fraction is above as 10%-30% nano silver wires
Conduction liquid resistance.Therefore, the present invention contains the blank hole liquid circuit board conductive liquid that mass fraction is 10%-30% nano silver wires, tool
There is very excellent electric conductivity.
Above-described embodiment 1-5 and comparative example 1-3 is subjected to thermal shock experiment test, every group of experiment carries out 5 thermal shocks, tool
Body experimental result such as table 2 below：
Table 2
It can be concluded that by the experimental result of above-mentioned table 2, the present invention adds certain mass concentration in blank hole liquid
Nano silver wire, serve good stablizing effect, thermal shock can be withstood；And do not contain the conduction liquid of nano silver wire then without
Method is subjected to 5 thermal shock experiments, occurs and base material segregation phenomenon.
Above-described embodiment 1-5 and comparative example 1-3 is subjected to conventional plating, sample has been obtained and has been tested, as a result such as following table
3：
Table 3
It can be concluded that by the above-mentioned result of table 3, the circuit board conductive liquid prepared in the present invention is applied in conventional electricity
In plating, obtained product backlight level is high, stable performance.
Applicant states that the present invention illustrates a kind of circuit board conductive liquid of the present invention and its preparation by above-described embodiment
Methods and applications, but the invention is not limited in above-mentioned processing step, that is, do not mean that the present invention has to rely on above-mentioned technique step
Suddenly could implement.Person of ordinary skill in the field is it will be clearly understood that any improvement in the present invention, to former selected by the present invention
The equivalence replacement of material and the addition of auxiliary element, the selection of concrete mode etc., all fall within protection scope of the present invention and open model
Within enclosing.
Claims (10)
1. a kind of circuit board conductive liquid, it is characterised in that the circuit board conductive liquid includes blank hole liquid and nano silver wire.
2. circuit board conductive liquid according to claim 1, it is characterised in that the blank hole liquid includes following mass percent
The component of content：
3. circuit board conductive liquid according to claim 1 or 2, it is characterised in that the surfactant is dodecyl
Benzene sulfonic acid sodium salt, lauryl sodium sulfate, AEO or one kind in nonyl phenol polyethenoxy ether or at least two
The combination of kind；
Preferably, the dispersant is aliphatic alcohol polyethenoxy sulfuric ester, 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium, polyethylene glycol or polyethylene
One kind or at least two combination in pyrrolidones；
Preferably, the pH adjusting agent is one kind or at least two group in potassium carbonate, saleratus, ammoniacal liquor or monoethanolamine
Close；
Preferably, the binding agent is one kind or at least two in polyvinyl alcohol, Sodium Polyacrylate, polyacrylamide or potassium silicate
The combination of kind；
Preferably, the decentralized medium is one kind in water, ethylene glycol, isopropanol or acetone or at least two combination.
4. according to the circuit board conductive liquid described in claim any one of 1-3, it is characterised in that the blank hole liquid is by following methods
It is prepared：
(1) conductive black, surfactant, dispersant, pH adjusting agent, binding agent and decentralized medium are well mixed；
(2) mixture obtained in step (1) is fully ground, obtains the blank hole liquid.
5. circuit board conductive liquid according to claim 4, it is characterised in that the time of step (1) described mixing is that 1-2 is small
When；
Preferably, the time of step (2) described grinding is 2-10 hours.
6. circuit board conductive liquid according to claim 1, it is characterised in that the preparing raw material of the nano silver wire includes table
Face aqueous surfactant solutions and silver nitrate, dispersant and the crystal seed being dissolved in reduction decentralized medium；
The mass percent concentration of the aqueous surfactant solution is 0.4%-4%；Silver nitrate in the reduction decentralized medium,
The mass percent concentration of dispersant and crystal seed is as follows：0.2%-2% silver nitrates, 0.4%-4% dispersants, 0.01%-0.1%
Crystal seed.
7. circuit board conductive liquid according to claim 6, it is characterised in that the reduction decentralized medium is glycerine, third
One kind or at least two combination in glycol, ethylene glycol or diethylene glycol；
Preferably, the dispersant is one kind or at least two in polyacrylamide, Sodium Polyacrylate or polyvinylpyrrolidone
The combination of kind；
Preferably, the crystal seed is one kind in copper chloride, sodium chloride, iron chloride or palladium bichloride or at least two combination；
Preferably, the surfactant is polyoxyethylene alkyl ether sulfate, 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium, detergent alkylate
One kind or at least two combination in sodium sulfonate or lauryl sodium sulfate.
8. the circuit board conductive liquid according to claim 6 or 7, it is characterised in that the suspension of described nano silver wire by
Following methods are prepared：
(1) silver nitrate is dissolved in reduction decentralized medium, obtains silver nitrate solution A；
(2) dispersant, crystal seed are dissolved in reduction decentralized medium, obtain dispersant seed-solution B；
(3) surfactant is soluble in water, stirring obtains clear solution C；
(4) by the stirring of solution B described in step (2), heating, the solution B after will heat up adds the solution A obtained to step (1)
In reacted, be incubated after reaction, then reaction solution centrifuged, washs to obtain nano silver wire；
(5) step (4) described nano silver wire is scattered in aqueous surfactant solution C, that is, obtains nano silver wire suspension；
Preferably, the concentration of solution A described in step (1) is 0.2%-2%；
Preferably, the concentration of solution B described in step (2) is 0.41%-4.1%；
Preferably, relative to the dosage of 10g surfactants, water consumption described in step (3) is 240g-2490g；
Preferably, the stir speed (S.S.) stirred described in step (4) is that 1000-2000 turns/min；
Preferably, heating described in step (4) is to be warming up to 150-200 DEG C；
Preferably, solution B is incubated after being heated up in step (4), the time of the insulation is 10-60min；
Preferably, the method added described in step (4) is dropwise addition；
Preferably, the speed of the dropwise addition is 0.1mL/min-1mL/min；
Preferably, the time being incubated described in step (4) is 30min-180min.
9. the preparation method of the circuit board conductive liquid according to claim any one of 1-8, it is characterised in that methods described
For：Blank hole liquid is mixed with nano silver wire suspension, stirred, obtains the circuit board conductive liquid；
Preferably, nano silver wire suspension mass fraction in blank hole liquid is 10%-30%；
Preferably, the mixing speed is that 500-1000 turns/min.
10. application of the circuit board conductive liquid according to claim any one of 1-8 in electroplating printed circuit board.
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| CN108342128A (en) * | 2018-02-11 | 2018-07-31 | 深圳清华大学研究院 | A kind of preparation method of low haze electrically conducting transparent conductor |
| CN108822974A (en) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | A kind of flexible electric circuit board conditioner |
| CN110923771A (en) * | 2019-12-16 | 2020-03-27 | 电子科技大学 | Through hole electroplating method of printed circuit board |
| CN112159997A (en) * | 2020-09-21 | 2021-01-01 | 广东硕成科技有限公司 | Metal-containing/carbon nanoparticle composition for rigid plate hole metallization |
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| CN115594171A (en) * | 2022-07-29 | 2023-01-13 | 广东利尔化学有限公司（Cn） | Carbon pore process nano graphite dispersion liquid and preparation method thereof |
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