CN105074890A - 密封片材粘贴方法和密封片材粘贴装置 - Google Patents
密封片材粘贴方法和密封片材粘贴装置 Download PDFInfo
- Publication number
- CN105074890A CN105074890A CN201480019189.7A CN201480019189A CN105074890A CN 105074890 A CN105074890 A CN 105074890A CN 201480019189 A CN201480019189 A CN 201480019189A CN 105074890 A CN105074890 A CN 105074890A
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Links
- 238000000034 method Methods 0.000 title claims description 50
- 239000004065 semiconductor Substances 0.000 claims abstract description 96
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims description 86
- 239000000565 sealant Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000002372 labelling Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 4
- 230000001351 cycling effect Effects 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 241000283216 Phocidae Species 0.000 description 136
- 238000001179 sorption measurement Methods 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 238000009740 moulding (composite fabrication) Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 such as Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 206010007247 Carbuncle Diseases 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-080603 | 2013-04-08 | ||
JP2013080603A JP2014204035A (ja) | 2013-04-08 | 2013-04-08 | 封止シート貼付け方法および封止シート貼付け装置 |
PCT/JP2014/057178 WO2014167949A1 (ja) | 2013-04-08 | 2014-03-17 | 封止シート貼付け方法および封止シート貼付け装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105074890A true CN105074890A (zh) | 2015-11-18 |
Family
ID=51689363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480019189.7A Pending CN105074890A (zh) | 2013-04-08 | 2014-03-17 | 密封片材粘贴方法和密封片材粘贴装置 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2014204035A (ja) |
KR (1) | KR20150143537A (ja) |
CN (1) | CN105074890A (ja) |
SG (1) | SG11201508198XA (ja) |
TW (1) | TW201448063A (ja) |
WO (1) | WO2014167949A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110024102A (zh) * | 2019-02-26 | 2019-07-16 | 长江存储科技有限责任公司 | 用于在晶圆表面贴黏胶膜的方法和装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016096202A (ja) * | 2014-11-13 | 2016-05-26 | 京セラケミカル株式会社 | 熱硬化性樹脂シートの供給方法、および熱硬化性樹脂シートの供給装置 |
WO2023017700A1 (ja) * | 2021-08-11 | 2023-02-16 | 東京応化工業株式会社 | 貼付装置、及び貼付方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61120431A (ja) * | 1984-11-15 | 1986-06-07 | Matsushita Electric Works Ltd | 半導体類パツケ−ジの製法 |
JPH05291319A (ja) | 1992-04-07 | 1993-11-05 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH11254642A (ja) * | 1998-03-16 | 1999-09-21 | Dainippon Printing Co Ltd | 乾燥装置 |
JP2002324814A (ja) * | 2001-04-25 | 2002-11-08 | Nec Corp | Cof半導体パッケージの樹脂封止方法および装置 |
JP4397837B2 (ja) * | 2005-03-02 | 2010-01-13 | 日東電工株式会社 | 半導体装置の製造方法 |
-
2013
- 2013-04-08 JP JP2013080603A patent/JP2014204035A/ja active Pending
-
2014
- 2014-03-17 CN CN201480019189.7A patent/CN105074890A/zh active Pending
- 2014-03-17 KR KR1020157031013A patent/KR20150143537A/ko not_active Application Discontinuation
- 2014-03-17 WO PCT/JP2014/057178 patent/WO2014167949A1/ja active Application Filing
- 2014-03-17 SG SG11201508198XA patent/SG11201508198XA/en unknown
- 2014-04-07 TW TW103112649A patent/TW201448063A/zh unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110024102A (zh) * | 2019-02-26 | 2019-07-16 | 长江存储科技有限责任公司 | 用于在晶圆表面贴黏胶膜的方法和装置 |
CN110024102B (zh) * | 2019-02-26 | 2020-10-30 | 长江存储科技有限责任公司 | 用于在晶圆表面贴黏胶膜的方法和装置 |
US11232969B2 (en) | 2019-02-26 | 2022-01-25 | Yangtze Memory Technologies Co., Ltd. | Method and device for wafer taping |
US11694918B2 (en) | 2019-02-26 | 2023-07-04 | Yangtze Memory Technologies Co., Ltd. | Method and device for wafer taping |
Also Published As
Publication number | Publication date |
---|---|
JP2014204035A (ja) | 2014-10-27 |
SG11201508198XA (en) | 2015-11-27 |
WO2014167949A1 (ja) | 2014-10-16 |
TW201448063A (zh) | 2014-12-16 |
KR20150143537A (ko) | 2015-12-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151118 |