CN105074890A - 密封片材粘贴方法和密封片材粘贴装置 - Google Patents

密封片材粘贴方法和密封片材粘贴装置 Download PDF

Info

Publication number: CN105074890A
Authority: CN; China
Prior art keywords: seal stock; seal; sheet materials; materials portion; semiconductor substrate
Prior art date: 2013-04-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201480019189.7A

Other languages

English (en)

Chinese (zh)

Inventor

森伸一郎

山本雅之

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nitto Denko Corp

Original Assignee

Nitto Denko Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-04-08

Filing date

2014-03-17

Publication date

2015-11-18

2014-03-17 Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp

2015-11-18 Publication of CN105074890A publication Critical patent/CN105074890A/zh

Status Pending legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims description 50
239000004065 semiconductor Substances 0.000 claims abstract description 96
239000000758 substrate Substances 0.000 claims abstract description 78
238000007789 sealing Methods 0.000 claims abstract description 31
239000000463 material Substances 0.000 claims description 86
239000000565 sealant Substances 0.000 claims description 32
229920005989 resin Polymers 0.000 claims description 16
239000011347 resin Substances 0.000 claims description 16
239000000853 adhesive Substances 0.000 claims description 9
230000001070 adhesive effect Effects 0.000 claims description 9
238000002372 labelling Methods 0.000 claims description 9
238000003860 storage Methods 0.000 claims description 4
230000001351 cycling effect Effects 0.000 claims description 2
238000001035 drying Methods 0.000 claims description 2
241000283216 Phocidae Species 0.000 description 136
238000001179 sorption measurement Methods 0.000 description 6
229920001187 thermosetting polymer Polymers 0.000 description 6
238000005520 cutting process Methods 0.000 description 5
238000009833 condensation Methods 0.000 description 4
230000005494 condensation Effects 0.000 description 4
239000008393 encapsulating agent Substances 0.000 description 4
238000009740 moulding (composite fabrication) Methods 0.000 description 4
238000003825 pressing Methods 0.000 description 4
PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
238000010521 absorption reaction Methods 0.000 description 3
238000011049 filling Methods 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 3
230000037303 wrinkles Effects 0.000 description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
239000000654 additive Substances 0.000 description 2
230000000996 additive effect Effects 0.000 description 2
238000004026 adhesive bonding Methods 0.000 description 2
238000002788 crimping Methods 0.000 description 2
238000001514 detection method Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000000945 filler Substances 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
238000009434 installation Methods 0.000 description 2
238000012423 maintenance Methods 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
229920001721 polyimide Polymers 0.000 description 2
-1 such as Substances 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
229910017083 AlN Inorganic materials 0.000 description 1
PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
206010007247 Carbuncle Diseases 0.000 description 1
239000004641 Diallyl-phthalate Substances 0.000 description 1
YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
239000004640 Melamine resin Substances 0.000 description 1
229920000877 Melamine resin Polymers 0.000 description 1
239000004698 Polyethylene Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
208000037656 Respiratory Sounds Diseases 0.000 description 1
229910052581 Si3N4 Inorganic materials 0.000 description 1
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
229920001807 Urea-formaldehyde Polymers 0.000 description 1
QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
230000008602 contraction Effects 0.000 description 1
238000001816 cooling Methods 0.000 description 1
239000013078 crystal Substances 0.000 description 1
230000006837 decompression Effects 0.000 description 1
230000007423 decrease Effects 0.000 description 1
238000007791 dehumidification Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000000605 extraction Methods 0.000 description 1
239000010419 fine particle Substances 0.000 description 1
229910052731 fluorine Inorganic materials 0.000 description 1
239000011737 fluorine Substances 0.000 description 1
239000002223 garnet Substances 0.000 description 1
238000010191 image analysis Methods 0.000 description 1
239000010954 inorganic particle Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
150000004767 nitrides Chemical class 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
239000009719 polyimide resin Substances 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
229920005749 polyurethane resin Polymers 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
238000011084 recovery Methods 0.000 description 1
238000005057 refrigeration Methods 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000007711 solidification Methods 0.000 description 1
230000008023 solidification Effects 0.000 description 1
230000001360 synchronised effect Effects 0.000 description 1
239000000454 talc Substances 0.000 description 1
235000012222 talc Nutrition 0.000 description 1
229910052623 talc Inorganic materials 0.000 description 1
239000004408 titanium dioxide Substances 0.000 description 1
235000010215 titanium dioxide Nutrition 0.000 description 1
229920006337 unsaturated polyester resin Polymers 0.000 description 1
238000004804 winding Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

CN201480019189.7A 2013-04-08 2014-03-17 密封片材粘贴方法和密封片材粘贴装置 Pending CN105074890A (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2013-080603		2013-04-08
JP2013080603A JP2014204035A (ja)	2013-04-08	2013-04-08	封止シート貼付け方法および封止シート貼付け装置
PCT/JP2014/057178 WO2014167949A1 (ja)	2013-04-08	2014-03-17	封止シート貼付け方法および封止シート貼付け装置

Publications (1)

Publication Number	Publication Date
CN105074890A true CN105074890A (zh)	2015-11-18

Family

ID=51689363

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201480019189.7A Pending CN105074890A (zh)	2013-04-08	2014-03-17	密封片材粘贴方法和密封片材粘贴装置

Country Status (6)

Country	Link
JP (1)	JP2014204035A (ja)
KR (1)	KR20150143537A (ja)
CN (1)	CN105074890A (ja)
SG (1)	SG11201508198XA (ja)
TW (1)	TW201448063A (ja)
WO (1)	WO2014167949A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN110024102A (zh) *	2019-02-26	2019-07-16	长江存储科技有限责任公司	用于在晶圆表面贴黏胶膜的方法和装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2016096202A (ja) *	2014-11-13	2016-05-26	京セラケミカル株式会社	熱硬化性樹脂シートの供給方法、および熱硬化性樹脂シートの供給装置
WO2023017700A1 (ja) *	2021-08-11	2023-02-16	東京応化工業株式会社	貼付装置、及び貼付方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61120431A (ja) *	1984-11-15	1986-06-07	Matsushita Electric Works Ltd	半導体類パツケ−ジの製法
JPH05291319A (ja)	1992-04-07	1993-11-05	Toshiba Corp	樹脂封止型半導体装置
JPH11254642A (ja) *	1998-03-16	1999-09-21	Dainippon Printing Co Ltd	乾燥装置
JP2002324814A (ja) *	2001-04-25	2002-11-08	Nec Corp	Ｃｏｆ半導体パッケージの樹脂封止方法および装置
JP4397837B2 (ja) *	2005-03-02	2010-01-13	日東電工株式会社	半導体装置の製造方法

2013
- 2013-04-08 JP JP2013080603A patent/JP2014204035A/ja active Pending
2014
- 2014-03-17 CN CN201480019189.7A patent/CN105074890A/zh active Pending
- 2014-03-17 KR KR1020157031013A patent/KR20150143537A/ko not_active Application Discontinuation
- 2014-03-17 WO PCT/JP2014/057178 patent/WO2014167949A1/ja active Application Filing
- 2014-03-17 SG SG11201508198XA patent/SG11201508198XA/en unknown
- 2014-04-07 TW TW103112649A patent/TW201448063A/zh unknown

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN110024102A (zh) *	2019-02-26	2019-07-16	长江存储科技有限责任公司	用于在晶圆表面贴黏胶膜的方法和装置
CN110024102B (zh) *	2019-02-26	2020-10-30	长江存储科技有限责任公司	用于在晶圆表面贴黏胶膜的方法和装置
US11232969B2 (en)	2019-02-26	2022-01-25	Yangtze Memory Technologies Co., Ltd.	Method and device for wafer taping
US11694918B2 (en)	2019-02-26	2023-07-04	Yangtze Memory Technologies Co., Ltd.	Method and device for wafer taping

Also Published As

Publication number	Publication date
JP2014204035A (ja)	2014-10-27
SG11201508198XA (en)	2015-11-27
WO2014167949A1 (ja)	2014-10-16
TW201448063A (zh)	2014-12-16
KR20150143537A (ko)	2015-12-23

Legal Events

Date	Code	Title	Description
2015-11-18	C06	Publication
2015-11-18	PB01	Publication
2016-11-30	C02	Deemed withdrawal of patent application after publication (patent law 2001)
2016-11-30	WD01	Invention patent application deemed withdrawn after publication	Application publication date: 20151118

Publication	Publication Date	Title
JP4354029B2 (ja)	2009-10-28	ラミネート装置における搬送装置
CN103101283B (zh)	2015-04-01	真空层叠***及真空层叠成形方法
US7896051B2 (en)	2011-03-01	Semiconductor die bonding apparatus having multiple bonding head units
CN101901774B (zh)	2014-10-01	晶圆固定方法和晶圆固定装置
CN106170443A (zh)	2016-11-30	载带移行装置及电子零件搬送装置
CN105074890A (zh)	2015-11-18	密封片材粘贴方法和密封片材粘贴装置
TW201423876A (zh)	2014-06-16	半導體晶圓安裝方法及半導體晶圓安裝裝置
JP2007251094A (ja)	2007-09-27	半導体チップの樹脂封止成形装置
TWI600073B (zh)	2017-09-21	黏著帶貼附方法及黏著帶貼附裝置
KR101583495B1 (ko)	2016-01-11	패널의 ｃｏｆ 가본딩장치
CN103367220A (zh)	2013-10-23	保护带剥离方法和保护带剥离装置
TW201533205A (zh)	2015-09-01	黏著帶貼付方法及黏著帶貼付裝置
CN105122433A (zh)	2015-12-02	半导体装置的制造方法
CN104022012A (zh)	2014-09-03	粘合带切断方法和粘合带切断装置
CN105074891A (zh)	2015-11-18	密封片材粘贴方法和密封片材粘贴装置
CN1296978C (zh)	2007-01-24	半导体器件的制造方法及半导体制造装置
WO2014178267A1 (ja)	2014-11-06	封止シート貼付け方法および封止シート貼付け装置
US10199299B1 (en)	2019-02-05	Semiconductor mold compound transfer system and associated methods
CN105247667A (zh)	2016-01-13	密封片材粘贴方法
CN109178505B (zh)	2023-09-05	一种甘氨酸装袋设备及其使用工艺
JP3795229B2 (ja)	2006-07-12	基板へのテープ状樹脂貼着方法及び装置
KR102299021B1 (ko)	2021-09-06	대상체 라미네이팅 장치
CN104392949B (zh)	2017-11-10	一种远距离芯片传输***
TW201438162A (zh)	2014-10-01	半導體裝置之製造方法及製造裝置
WO2014178268A1 (ja)	2014-11-06	封止シート貼付け方法および封止シート貼付け装置