SG11201508198XA - Method and apparatus for joining sealing sheet - Google Patents

Method and apparatus for joining sealing sheet

Info

Publication number
SG11201508198XA
SG11201508198XA SG11201508198XA SG11201508198XA SG11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA
Authority
SG
Singapore
Prior art keywords
sealing sheet
joining sealing
joining
sheet
sealing
Prior art date
Application number
SG11201508198XA
Other languages
English (en)
Inventor
Shinichirou Mori
Masayuki Yamamoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG11201508198XA publication Critical patent/SG11201508198XA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201508198XA 2013-04-08 2014-03-17 Method and apparatus for joining sealing sheet SG11201508198XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013080603A JP2014204035A (ja) 2013-04-08 2013-04-08 封止シート貼付け方法および封止シート貼付け装置
PCT/JP2014/057178 WO2014167949A1 (ja) 2013-04-08 2014-03-17 封止シート貼付け方法および封止シート貼付け装置

Publications (1)

Publication Number Publication Date
SG11201508198XA true SG11201508198XA (en) 2015-11-27

Family

ID=51689363

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508198XA SG11201508198XA (en) 2013-04-08 2014-03-17 Method and apparatus for joining sealing sheet

Country Status (6)

Country Link
JP (1) JP2014204035A (ja)
KR (1) KR20150143537A (ja)
CN (1) CN105074890A (ja)
SG (1) SG11201508198XA (ja)
TW (1) TW201448063A (ja)
WO (1) WO2014167949A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016096202A (ja) * 2014-11-13 2016-05-26 京セラケミカル株式会社 熱硬化性樹脂シートの供給方法、および熱硬化性樹脂シートの供給装置
WO2020172785A1 (en) 2019-02-26 2020-09-03 Yangtze Memory Technologies Co., Ltd. Method and device for wafer taping
WO2023017700A1 (ja) * 2021-08-11 2023-02-16 東京応化工業株式会社 貼付装置、及び貼付方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61120431A (ja) * 1984-11-15 1986-06-07 Matsushita Electric Works Ltd 半導体類パツケ−ジの製法
JPH05291319A (ja) 1992-04-07 1993-11-05 Toshiba Corp 樹脂封止型半導体装置
JPH11254642A (ja) * 1998-03-16 1999-09-21 Dainippon Printing Co Ltd 乾燥装置
JP2002324814A (ja) * 2001-04-25 2002-11-08 Nec Corp Cof半導体パッケージの樹脂封止方法および装置
JP4397837B2 (ja) * 2005-03-02 2010-01-13 日東電工株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2014204035A (ja) 2014-10-27
CN105074890A (zh) 2015-11-18
WO2014167949A1 (ja) 2014-10-16
TW201448063A (zh) 2014-12-16
KR20150143537A (ko) 2015-12-23

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