SG11201508198XA - Method and apparatus for joining sealing sheet - Google Patents
Method and apparatus for joining sealing sheetInfo
- Publication number
- SG11201508198XA SG11201508198XA SG11201508198XA SG11201508198XA SG11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA SG 11201508198X A SG11201508198X A SG 11201508198XA
- Authority
- SG
- Singapore
- Prior art keywords
- sealing sheet
- joining sealing
- joining
- sheet
- sealing
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013080603A JP2014204035A (ja) | 2013-04-08 | 2013-04-08 | 封止シート貼付け方法および封止シート貼付け装置 |
PCT/JP2014/057178 WO2014167949A1 (ja) | 2013-04-08 | 2014-03-17 | 封止シート貼付け方法および封止シート貼付け装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201508198XA true SG11201508198XA (en) | 2015-11-27 |
Family
ID=51689363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201508198XA SG11201508198XA (en) | 2013-04-08 | 2014-03-17 | Method and apparatus for joining sealing sheet |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2014204035A (ja) |
KR (1) | KR20150143537A (ja) |
CN (1) | CN105074890A (ja) |
SG (1) | SG11201508198XA (ja) |
TW (1) | TW201448063A (ja) |
WO (1) | WO2014167949A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016096202A (ja) * | 2014-11-13 | 2016-05-26 | 京セラケミカル株式会社 | 熱硬化性樹脂シートの供給方法、および熱硬化性樹脂シートの供給装置 |
WO2020172785A1 (en) | 2019-02-26 | 2020-09-03 | Yangtze Memory Technologies Co., Ltd. | Method and device for wafer taping |
WO2023017700A1 (ja) * | 2021-08-11 | 2023-02-16 | 東京応化工業株式会社 | 貼付装置、及び貼付方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61120431A (ja) * | 1984-11-15 | 1986-06-07 | Matsushita Electric Works Ltd | 半導体類パツケ−ジの製法 |
JPH05291319A (ja) | 1992-04-07 | 1993-11-05 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH11254642A (ja) * | 1998-03-16 | 1999-09-21 | Dainippon Printing Co Ltd | 乾燥装置 |
JP2002324814A (ja) * | 2001-04-25 | 2002-11-08 | Nec Corp | Cof半導体パッケージの樹脂封止方法および装置 |
JP4397837B2 (ja) * | 2005-03-02 | 2010-01-13 | 日東電工株式会社 | 半導体装置の製造方法 |
-
2013
- 2013-04-08 JP JP2013080603A patent/JP2014204035A/ja active Pending
-
2014
- 2014-03-17 CN CN201480019189.7A patent/CN105074890A/zh active Pending
- 2014-03-17 KR KR1020157031013A patent/KR20150143537A/ko not_active Application Discontinuation
- 2014-03-17 WO PCT/JP2014/057178 patent/WO2014167949A1/ja active Application Filing
- 2014-03-17 SG SG11201508198XA patent/SG11201508198XA/en unknown
- 2014-04-07 TW TW103112649A patent/TW201448063A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014204035A (ja) | 2014-10-27 |
CN105074890A (zh) | 2015-11-18 |
WO2014167949A1 (ja) | 2014-10-16 |
TW201448063A (zh) | 2014-12-16 |
KR20150143537A (ko) | 2015-12-23 |
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