CN104956470A - 半导体装置的制造方法以及制造装置 - Google Patents
半导体装置的制造方法以及制造装置 Download PDFInfo
- Publication number
- CN104956470A CN104956470A CN201480006560.6A CN201480006560A CN104956470A CN 104956470 A CN104956470 A CN 104956470A CN 201480006560 A CN201480006560 A CN 201480006560A CN 104956470 A CN104956470 A CN 104956470A
- Authority
- CN
- China
- Prior art keywords
- diaphragm seal
- semiconductor element
- semiconductor
- sealing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
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- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013014668 | 2013-01-29 | ||
| JP2013-014668 | 2013-01-29 | ||
| JP2013053628A JP2014168028A (ja) | 2013-01-29 | 2013-03-15 | 半導体装置の製造方法および製造装置 |
| JP2013-053628 | 2013-03-15 | ||
| PCT/JP2014/051232 WO2014119445A1 (ja) | 2013-01-29 | 2014-01-22 | 半導体装置の製造方法および製造装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104956470A true CN104956470A (zh) | 2015-09-30 |
Family
ID=51262158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480006560.6A Pending CN104956470A (zh) | 2013-01-29 | 2014-01-22 | 半导体装置的制造方法以及制造装置 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP2014168028A (ja) |
| KR (1) | KR20150111928A (ja) |
| CN (1) | CN104956470A (ja) |
| SG (1) | SG11201505565QA (ja) |
| TW (1) | TW201438162A (ja) |
| WO (1) | WO2014119445A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112621891A (zh) * | 2019-09-24 | 2021-04-09 | 泰州隆基乐叶光伏科技有限公司 | 导电金属箔冲压方法及冲压装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101383295A (zh) * | 2007-09-03 | 2009-03-11 | 日东电工株式会社 | 光学半导体装置的生产工艺和该工艺中使用的片 |
| CN102347403A (zh) * | 2010-07-27 | 2012-02-08 | 日东电工株式会社 | 发光二极管装置的制造方法 |
| US20120052608A1 (en) * | 2010-08-25 | 2012-03-01 | Yoo Cheol-Jun | Phosphor film, method of forming the same, and method of coating phosphor layer on led chips |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5242947B2 (ja) * | 2007-05-15 | 2013-07-24 | リンテック株式会社 | シート貼付装置及び貼付方法 |
| JP5333056B2 (ja) * | 2009-08-26 | 2013-11-06 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| JP5156033B2 (ja) * | 2010-01-12 | 2013-03-06 | リンテック株式会社 | 樹脂封止型半導体装置の製造方法 |
| US8823186B2 (en) * | 2010-12-27 | 2014-09-02 | Shin-Etsu Chemical Co., Ltd. | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus |
-
2013
- 2013-03-15 JP JP2013053628A patent/JP2014168028A/ja not_active Withdrawn
-
2014
- 2014-01-22 WO PCT/JP2014/051232 patent/WO2014119445A1/ja active Application Filing
- 2014-01-22 KR KR1020157020255A patent/KR20150111928A/ko not_active Application Discontinuation
- 2014-01-22 CN CN201480006560.6A patent/CN104956470A/zh active Pending
- 2014-01-22 SG SG11201505565QA patent/SG11201505565QA/en unknown
- 2014-01-28 TW TW103103160A patent/TW201438162A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101383295A (zh) * | 2007-09-03 | 2009-03-11 | 日东电工株式会社 | 光学半导体装置的生产工艺和该工艺中使用的片 |
| CN102347403A (zh) * | 2010-07-27 | 2012-02-08 | 日东电工株式会社 | 发光二极管装置的制造方法 |
| US20120052608A1 (en) * | 2010-08-25 | 2012-03-01 | Yoo Cheol-Jun | Phosphor film, method of forming the same, and method of coating phosphor layer on led chips |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112621891A (zh) * | 2019-09-24 | 2021-04-09 | 泰州隆基乐叶光伏科技有限公司 | 导电金属箔冲压方法及冲压装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014168028A (ja) | 2014-09-11 |
| WO2014119445A1 (ja) | 2014-08-07 |
| SG11201505565QA (en) | 2015-09-29 |
| KR20150111928A (ko) | 2015-10-06 |
| TW201438162A (zh) | 2014-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150930 |
|
| WD01 | Invention patent application deemed withdrawn after publication |