JP2017537355A - 屋外で使用できるよう構成された屋内用smd型led - Google Patents
屋外で使用できるよう構成された屋内用smd型led Download PDFInfo
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- JP2017537355A JP2017537355A JP2017543869A JP2017543869A JP2017537355A JP 2017537355 A JP2017537355 A JP 2017537355A JP 2017543869 A JP2017543869 A JP 2017543869A JP 2017543869 A JP2017543869 A JP 2017543869A JP 2017537355 A JP2017537355 A JP 2017537355A
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- 238000013022 venting Methods 0.000 claims abstract description 5
- 238000007666 vacuum forming Methods 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 2
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0707—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/78—Moulding material on one side only of the preformed part
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
- G06K7/10356—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers using a plurality of antennas, e.g. configurations including means to resolve interference between the plurality of antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/20—Inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Health & Medical Sciences (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- General Engineering & Computer Science (AREA)
Abstract
Description
Claims (7)
- 屋内用SMD型LEDと、
カバーと
を備える屋外用SMD型LEDであって、
前記カバーは、該カバーと前記屋内用SMD型LEDとの間の空気を抜くことにより前記屋内用SMD型LEDを覆うように適所に保持されている、屋外用SMD型LED。 - 前記カバーが、真空形成によるカバー又は被覆成形によるカバーである、請求項1に記載の屋外用SMD型LED。
- 前記カバーがプラスチック又はシリコーンから作られている、請求項2に記載の屋外用SMD型LED。
- 印刷回路基板と、
前記印刷回路基板の同一の面に取り付けられた複数のLEDであって、前記印刷回路基板と協働して屋内用LEDディスプレイを形成する複数のLEDと、
前記印刷回路基板の前記面上における前記複数のLEDを覆うように配置された真空形成による及び/又は被覆成形によるカバーであって、前記カバーと前記印刷回路基板上における前記複数のLEDとの間の空間の空気を抜くことにより前記印刷回路基板上における前記複数のLEDを覆うように適所に保持され、前記屋内用LEDディスプレイの保護を形成して屋外使用を可能とするカバーと
を備える屋外用SMD型LEDディスプレイ。 - 前記真空形成による及び/又は被覆成形によるカバーがプラスチック又はシリコーンから作られている、請求項4に記載の屋外用SMD型LEDディスプレイ。
- 屋内用SMD型LEDを用意することと、
前記屋内用SMD型LED上にカバーを真空形成及び/又は被覆成形し、もって屋外使用のために前記屋内用SMD型LEDを保護することと
を含む、屋外使用のための屋内用SMD型LEDを設ける方法。 - 前記カバーがプラスチック又はシリコーンから作られる、請求項6に記載の屋外使用のための屋内用SMD型LEDを設ける方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462077044P | 2014-11-07 | 2014-11-07 | |
US62/077,044 | 2014-11-07 | ||
PCT/CN2015/093989 WO2016070844A1 (en) | 2014-11-07 | 2015-11-06 | Indoor smd led equipped for outdoor usage |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017537355A true JP2017537355A (ja) | 2017-12-14 |
Family
ID=55578213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017543869A Pending JP2017537355A (ja) | 2014-11-07 | 2015-11-06 | 屋外で使用できるよう構成された屋内用smd型led |
Country Status (4)
Country | Link |
---|---|
US (2) | US20160131328A1 (ja) |
JP (1) | JP2017537355A (ja) |
CN (2) | CN105575270A (ja) |
WO (1) | WO2016070844A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US20160131328A1 (en) * | 2014-11-07 | 2016-05-12 | Lighthouse Technologies Limited | Indoor smd led equipped for outdoor usage |
JP1541784S (ja) * | 2015-01-08 | 2016-01-18 | ||
US20200232623A1 (en) * | 2015-09-29 | 2020-07-23 | Osram Sylvania Inc. | Formed cellular lighting elements and lighting devices including the same |
JP6846877B2 (ja) * | 2016-05-16 | 2021-03-24 | 三菱電機株式会社 | 表示ユニット装置及び表示装置 |
EP3519841A1 (en) * | 2016-09-29 | 2019-08-07 | Koninklijke Philips N.V. | Wireless magnetic resonance energy harvesting and coil detuning |
EP3388979B1 (en) * | 2017-04-14 | 2020-07-22 | Nxp B.V. | Rfid integrated circuit |
JP6948182B2 (ja) * | 2017-08-04 | 2021-10-13 | 株式会社アドバンテスト | 磁気センサ試験装置 |
JP7428871B2 (ja) * | 2018-11-08 | 2024-02-07 | 株式会社デンソーウェーブ | 無線タグシステム |
US11043729B2 (en) * | 2019-02-05 | 2021-06-22 | Best Medical Canada Ltd. | Flexible antenna for a wireless radiation dosimeter |
US11604290B2 (en) | 2019-09-26 | 2023-03-14 | Best Theratronics, Ltd. | Low power dual-sensitivity FG-MOSFET sensor for a wireless radiation dosimeter |
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- 2015-11-06 JP JP2017543869A patent/JP2017537355A/ja active Pending
- 2015-11-06 CN CN201510753207.0A patent/CN105575270A/zh active Pending
- 2015-11-06 WO PCT/CN2015/093989 patent/WO2016070844A1/en active Application Filing
- 2015-11-06 CN CN201520884054.9U patent/CN205122632U/zh not_active Expired - Fee Related
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2018
- 2018-02-07 US US15/890,526 patent/US10152667B2/en active Active
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US20180165561A1 (en) | 2018-06-14 |
CN105575270A (zh) | 2016-05-11 |
US20160131328A1 (en) | 2016-05-12 |
CN205122632U (zh) | 2016-03-30 |
WO2016070844A1 (en) | 2016-05-12 |
US10152667B2 (en) | 2018-12-11 |
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