KR20150111928A - 반도체 장치의 제조 방법 및 제조 장치 - Google Patents

반도체 장치의 제조 방법 및 제조 장치 Download PDF

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Publication number
KR20150111928A
KR20150111928A KR1020157020255A KR20157020255A KR20150111928A KR 20150111928 A KR20150111928 A KR 20150111928A KR 1020157020255 A KR1020157020255 A KR 1020157020255A KR 20157020255 A KR20157020255 A KR 20157020255A KR 20150111928 A KR20150111928 A KR 20150111928A
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KR
South Korea
Prior art keywords
sealing sheet
sealing
semiconductor
semiconductor device
manufacturing
Prior art date
Application number
KR1020157020255A
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English (en)
Korean (ko)
Inventor
다카오 마츠시타
신이치로 모리
Original Assignee
닛토덴코 가부시키가이샤
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Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20150111928A publication Critical patent/KR20150111928A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020157020255A 2013-01-29 2014-01-22 반도체 장치의 제조 방법 및 제조 장치 KR20150111928A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013014668 2013-01-29
JPJP-P-2013-014668 2013-01-29
JP2013053628A JP2014168028A (ja) 2013-01-29 2013-03-15 半導体装置の製造方法および製造装置
JPJP-P-2013-053628 2013-03-15
PCT/JP2014/051232 WO2014119445A1 (ja) 2013-01-29 2014-01-22 半導体装置の製造方法および製造装置

Publications (1)

Publication Number Publication Date
KR20150111928A true KR20150111928A (ko) 2015-10-06

Family

ID=51262158

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157020255A KR20150111928A (ko) 2013-01-29 2014-01-22 반도체 장치의 제조 방법 및 제조 장치

Country Status (6)

Country Link
JP (1) JP2014168028A (ja)
KR (1) KR20150111928A (ja)
CN (1) CN104956470A (ja)
SG (1) SG11201505565QA (ja)
TW (1) TW201438162A (ja)
WO (1) WO2014119445A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112621891B (zh) * 2019-09-24 2022-10-14 泰州隆基乐叶光伏科技有限公司 导电金属箔冲压方法及冲压装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5242947B2 (ja) * 2007-05-15 2013-07-24 リンテック株式会社 シート貼付装置及び貼付方法
JP5378666B2 (ja) * 2007-09-03 2013-12-25 日東電工株式会社 光半導体装置の製造方法
JP5333056B2 (ja) * 2009-08-26 2013-11-06 富士通セミコンダクター株式会社 半導体装置の製造方法
JP5156033B2 (ja) * 2010-01-12 2013-03-06 リンテック株式会社 樹脂封止型半導体装置の製造方法
JP5775375B2 (ja) * 2010-07-27 2015-09-09 日東電工株式会社 発光ダイオード装置の製造方法
KR101253586B1 (ko) * 2010-08-25 2013-04-11 삼성전자주식회사 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지
US8823186B2 (en) * 2010-12-27 2014-09-02 Shin-Etsu Chemical Co., Ltd. Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus

Also Published As

Publication number Publication date
JP2014168028A (ja) 2014-09-11
WO2014119445A1 (ja) 2014-08-07
SG11201505565QA (en) 2015-09-29
CN104956470A (zh) 2015-09-30
TW201438162A (zh) 2014-10-01

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