CN104661441A - Laser activation technical method for producing PCB (printed circuit board) with additive process - Google Patents
Laser activation technical method for producing PCB (printed circuit board) with additive process Download PDFInfo
- Publication number
- CN104661441A CN104661441A CN201510084225.4A CN201510084225A CN104661441A CN 104661441 A CN104661441 A CN 104661441A CN 201510084225 A CN201510084225 A CN 201510084225A CN 104661441 A CN104661441 A CN 104661441A
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- Prior art keywords
- laser
- technical method
- wiring board
- addition process
- process according
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a laser activation technical method for producing a PCB (printed circuit board) with an additive process. The method comprises steps as follows: a PCB base material is cleaned; a line rail graph is formed on the surface of the base material through laser ablation, and meanwhile, nanoscale holes are formed in the rail surface of the base material under the action of laser irradiation; catalyst particles penetrate through the holes to adsorb side walls and bottoms of grooves, and an activation catalyst layer is formed; finally, chemical copper plating is realized by the aid of the catalyst layer, filling of line rails with copper is finished, and a conductive pattern of the PCB is formed. The method is different from a traditional etching subtractive process and is simple in process and environment-friendly, and line metallization can be realized very conveniently.
Description
Technical field
The present invention relates to addition and make circuit board process, particularly relate to a kind of based on laser irradiation modification, then fill out by chemistry the method that copper makes circuit pattern.
Background technology
Printed circuit board, as the support plate of electronic product components and parts, plays important interconnected effect.In the electrical connection of circuit board, the aspect that copper conductor circuit is crucial beyond doubt.Copper cash live width line-spacing directly affects the stability of electric property, especially concerning the higher high-frequency resistance plate of request signal transmission.
Traditional PCB production technology utilizes etching method, and monoblock copper clad laminate is covered dry film after exposure imaging, then remove unwanted copper by chemical etching and form conductor line, is that one subtracts into method.The advantage of this method is that technique is very ripe, but there is material consumption, the shortcomings such as complex procedures, and due to the constraint of exposure imaging equipment, therefore wire line precision is restricted.And will experience alligatoring at Electroless Plating Procedure, absorption, the steps such as reduction, have certain influence to circuit board reliability, bring the pollution problem of chemicals simultaneously.
Summary of the invention
For the limitation of traditional handicraft, propose a kind of method that addition process makes wiring board, the method has used laser activation technology, and utilizes electroless copper to form wire pattern based on this.By this laser activation method, the alligatoring pre-treatment of chemical plating can be saved, simplify technique, improve the reliability of wiring board.
The technical solution adopted in the present invention is: the method comprises the following steps:
(1) use laser ablation to form line track figure to dielectric substrate materials surface, simultaneously under laser radiation, base material raceway surface forms nanoscale hole;
(3) catalyst particle is permeated hole, be adsorbed on material surface, form activating catalytic layer;
(3) method that metal fills out copper by chemistry fills out copper formation conductive pattern in groove.
Further, in described step (1), while using laser ablation, orbit sidewall and bottom is made to occur nanoscale hole.
Further, in described step (2), described catalyst particle includes but not limited to colloid palladium, nano-metal particle, nano-sized carbon.
Further, in described step (2), the thickness of described activating catalytic layer is 20nm-200nm.
Further, in described step (2), after nano particle absorption forms Catalytic Layer, drying is carried out to material surface.
Further, in described step (3), chemistry is filled out copper and is included but not limited to electroless copper, nickel plating, silver-plated, gold-plated, nickel plating phosphorus boron, after carry out again filling out copper.
Further, in described step (1), in laser ablation process, the pulse energy of laser controls at 80-100mJ, and focal height controls at 50-60mm, and FREQUENCY CONTROL is at 40-60 kHz, pulse width control is at 102-120nms, and beam diameter controls at 15-20mm.
Further, in described step (1), carrying out the back segment of laser ablation, the pulse energy of laser controls at 10-40mJ, and focal height controls at 50-60mm, and FREQUENCY CONTROL is at 48-60 kHz, pulse width control is at 102-120nms, and beam diameter controls at 15-20mm.
Further, the particle diameter of described catalyst particle is less than or equal to 100nm, and described catalyst particle should be uniformly suspended in liquid dispersed system.
Further, till groove should being filled up copper when chemistry fills out copper.
Particularly, the present invention selects suitable base material (non-Copper Foil), and cuts into the size of applicable circuit fabrication.
Base material is placed in laser process equipment, after input laser pattern file, surfacial pattern ablation is carried out to base material, and control laser parameter in the end of term in ablation week, utilize laser again to irradiate the groove surfaces of ablation one-tenth, make groove inner face form nano aperture.Specific practice is, in the laser ablation cycle, utilize high energy laser beam irradiate substrate surface, surface need formed wire pattern partially absorb energy, rapid temperature increases vaporize; In the end of term in laser ablation week, reduce laser power, when making laser irradiate base material groove, base material organic principle is unlikely vaporizes completely, but components vaporize, and form nanoscale hole at inwall whereby.
Whole plate cleaning, because laser action can bring substrate surface and rail groove inwall vaporization spot, utilizes plasma or other chemical microetch methods to clean.
Different according to clean type, after cleaning out, inwall is nanometer level microporous often carries positive electricity or negative electricity; For electronegative catalyst particles, need to carry out electric charge adjustment, micropore is become positively charged; And for the catalyst particles of positively charged, then to adjust negative electricity on micropore band.
Infiltrate in the solution containing catalysed particulate by the complete base material of adjustment, catalyst particle infiltration hole is adsorbed on track interior walls, forms activating catalytic layer.Catalyst solution is by the stable dispersion solution system containing nano metallic colloid or ion, nano metallic colloid or particulate form the catalytic center of the coat of metal as sequential reduction, so need stronger suction-operated at inwall, even penetrate into hole inside, improve catalytic effect.Conventional catalytic metal as colloid palladium, nano-metal particle, nano-sized carbon etc.Catalytic Layer thickness can adjust, and changes according to actual needs.
Just have after track inner surface formation Catalytic Layer and carried out the basis that chemistry fills out copper, usually material is infiltrated in chemical plating fluid, catalytic center generation redox reaction forms coated metal, there is self-catalyzed reaction again in coated metal, plating process is proceeded, finally make metal fill up groove, form circuit lead.
The present invention utilizes laser ablation to realize filling out the activation of copper part simultaneously, and then chemistry fills out copper formation conductive copper wire, physical modification and chemical action are combined, irradiate material by laser and complete material surface alligatoring pretreatment process, conveniently realize surface modification, for the attached body of catalyst provides good condition, and the copper conductor obtained is better linear.
Accompanying drawing explanation
Fig. 1 is the base material schematic diagram do not dealt with;
Fig. 2 is schematic diagram substrate being carried out to laser-induced thermal etching;
Fig. 3 is that the irradiation of substrate laser leaves small hole schematic diagram;
Fig. 4 is the schematic diagram that rail groove inner surface adsorption catalyst forms activating catalytic layer;
Fig. 5 is the schematic diagram that substrate surface chemistry fills out copper;
Fig. 6 fills out copper to complete schematic diagram; Wherein, A is a kind of base material, as resin material FR-4, and liquid crystal high polymer material LCP etc.; B is active layer; C is Catalytic Layer; D is mixed layer; E is metal level; F is conductor line.
Embodiment
As shown in Figures 1 to 6, described in detail by embodiment according to invented technology below.Following embodiment just in order to better by clear for the explaination of the technology of the present invention principle, do not represent the present invention and can only limit this embodiment of use.
embodiment one:
(1) utilize polymeric liquid crystal copolymer (LCP) as base material, and realize ablation at this material surface and fill out copper, form conductive pattern.
(2) select machining, the polymeric liquid crystal copolymer (LCP) of hot property excellence as base material A, and cuts into the size being applicable to processing.
(3) base material of well cutting carries out pickling once, washes three times and dries, and the dirt of removing substrate surface is greasy, ensures post laser uniformity for the treatment of.
(4) base material is placed in laser process equipment, after input laser pattern file, surfacial pattern ablation is carried out to base material, and control laser parameter in the end of term in ablation week, utilize laser again to irradiate the groove surfaces of ablation one-tenth, make groove inner face form nano aperture.Specific practice is, in the laser ablation cycle, pulsed laser energy controls at 70-90mJ, and focal height controls at 0-10mm, and laser frequency controls at 50-60kHz, and laser pulse width controls at 102-120nms, and beam diameter controls at 15-20mm; In the end of term in laser ablation week, reduce laser power, pulsed laser energy controls at 40-50mJ, focal height controls at 0-5mm, and laser frequency controls at 60-70kHz, and laser pulse width controls at 102-120nm, beam diameter controls at 15-20mm, when making laser irradiate base material groove, base material organic principle is unlikely vaporizes completely, but components vaporize, and form nanoscale hole at inwall whereby.
(5) substrate after cutting is put into plasma cleaning equipment, substrate surface and the small hole of groove inner face are cleaned, is conducive to the absorption of catalysed particulate.
(6) different according to clean type, after cleaning out, inwall is nanometer level microporous often carries positive electricity or negative electricity; For electronegative catalyst particles, need to carry out electric charge adjustment, micropore is become positively charged; And for the catalyst particles of positively charged, then to adjust negative electricity on micropore band.
(7) regulated the baseplate material of electric charge to need to be immersed in catalyst solution, the catalyst solution that this example uses is nano-graphite solution.Submergence temperature controls at about 40 DEG C, Immersion time 5 ~ 10min, can add rocking equipment, so that catalyst component is fully combined with substrate surface at submergence equipment.
(8) dry up under the hot blast condition of 40 DEG C after base material absorption carbon particulate, dry temperature and time is not easily too much, affects catalyst layer structure and composition, preferably adds Buchholz protection.
(9) baseplate material of adsorption catalyst is immersed in chemical copper plating solution, copper plating bath and common business copper plating solution.Temperature controls at 25 DEG C, and time controling, at 20min, makes groove inner surface plate layers of copper uniformly, and continues to fill out copper until form circuit lead.
embodiment two:
(1) utilize polyimides (PI) as base material, and realize ablation at this material surface and fill out copper, form conductive pattern.
(2) select polyimides (PI) as base material A, polyimide film thickness 25 microns, and cut into the size being applicable to processing.
(3) base material of well cutting carries out pickling once, washes three times and dries, and the dirt of removing substrate surface is greasy, ensures post laser uniformity for the treatment of.
(4) base material of well cutting carries out pickling once, washes three times and dries, and the dirt of removing substrate surface is greasy, ensures post laser uniformity for the treatment of.
(5) base material is placed in laser process equipment, after input laser pattern file, surfacial pattern ablation is carried out to base material, and control laser parameter in the end of term in ablation week, utilize laser again to irradiate the groove surfaces of ablation one-tenth, make groove inner face form nano aperture.Specific practice is, in the laser ablation cycle, pulsed laser energy controls at 50-60mJ, and focal height controls at 0-10mm, and laser frequency controls at 50-60kHz, and laser pulse width controls at 102-120 nm, and beam diameter controls at 15-20mm; In the end of term in laser ablation week, reduce laser power, pulsed laser energy controls at 30-40mJ, focal height controls at 0-5mm, and laser frequency controls at 60-70kHz, and laser pulse width controls at 102nms-120nm, beam diameter controls at 15-20mm, when making laser irradiate base material groove, base material organic principle is unlikely vaporizes completely, but components vaporize, and form nanoscale hole at inwall whereby.
(6) substrate after cutting is put into plasma cleaning equipment, substrate surface and the small hole of groove inner face are cleaned, is conducive to the absorption of catalysed particulate.
(7) different according to clean type, after cleaning out, inwall is nanometer level microporous often carries positive electricity or negative electricity; For electronegative catalyst particles, need to carry out electric charge adjustment, micropore is become positively charged; And for the catalyst particles of positively charged, then to adjust negative electricity on micropore band.
(8) regulated the baseplate material of electric charge to need to be immersed in catalyst solution, the catalyst solution that this example uses is business nano-silver catalyst solution.Submergence temperature controls at about 40 DEG C, Immersion time 5min, can add rocking equipment, so that catalyst component is fully combined with substrate surface at submergence equipment.
(9) dry up under the hot blast condition of 40 DEG C after base material absorption Silver nanoparticles, dry temperature and time is not easily too much, prevents from affecting catalyst layer structure and composition, and adds Buchholz protection.
(10) baseplate material of adsorption catalyst is immersed in chemical copper plating solution, copper plating bath and common business copper plating solution.Temperature controls at 25 DEG C, and time controling, at 20min, makes groove inner surface plate layers of copper uniformly, and continues to fill out copper until form circuit lead.
Part sheet material may need nog plate, microetch, obtains the circuit board of smooth copper cash.
Above-mentioned two examples can be found out, the base material kind can applying the inventive method is a lot, includes but not limited to thermosetting resin, thermoplastic resin or both blends.
Above-mentioned two kinds of examples to invention has been detailed description, but do not mean that the present invention is only confined to this two kinds of examples.When not departing from the technology of the present invention principle, making improvements and being out of shape within the claims in the present invention and technology, also should belong to protection scope of the present invention.
Claims (10)
1. addition process makes a laser activation technical method for wiring board, and it is characterized in that, the method comprises the following steps:
(1) use laser ablation to form line track figure to dielectric substrate materials surface, simultaneously under laser radiation, base material raceway surface forms nanoscale hole;
(2) catalyst particle is permeated hole, be adsorbed on material surface, form activating catalytic layer;
(3) method that metal fills out copper by chemistry fills out copper formation conductive pattern in groove.
2. a kind of addition process according to claim 1 makes the laser activation technical method of wiring board, it is characterized in that: in described step (1), while using laser ablation, makes orbit sidewall and bottom occur nanoscale hole.
3. a kind of addition process according to claim 1 makes the laser activation technical method of wiring board, it is characterized in that: in described step (2), described catalyst particle includes but not limited to colloid palladium, nano-metal particle, nano-sized carbon.
4. a kind of addition process according to claim 1 makes the laser activation technical method of wiring board, and it is characterized in that: in described step (2), the thickness of described activating catalytic layer is 20nm-200nm.
5. a kind of addition process according to claim 1 makes the laser activation technical method of wiring board, it is characterized in that: in described step (2), after nano particle absorption forms Catalytic Layer, carries out drying to material surface.
6. a kind of addition process according to claim 1 makes the laser activation technical method of wiring board, and it is characterized in that: in described step (3), chemistry is filled out copper and included but not limited to electroless copper, nickel plating, silver-plated, gold-plated, nickel plating phosphorus boron, after carry out again filling out copper.
7. a kind of addition process according to claim 1 makes the laser activation technical method of wiring board, it is characterized in that: in described step (1), in laser ablation process, the pulse energy of laser controls at 80-100mJ, focal height controls at 50-60mm, FREQUENCY CONTROL is at 40-60 kHz, and pulse width control is at 102-120nms, and beam diameter controls at 15-20mm.
8. a kind of addition process according to claim 7 makes the laser activation technical method of wiring board, it is characterized in that: in described step (1), carrying out the back segment of laser ablation, the pulse energy of laser controls at 10-40mJ, focal height controls at 50-60mm, FREQUENCY CONTROL is at 48-60 kHz, and pulse width control is at 102-120nms, and beam diameter controls at 15-20mm.
9. a kind of addition process according to claim 1 makes the laser activation technical method of wiring board, and it is characterized in that: the particle diameter of described catalyst particle is less than or equal to 100nm, described catalyst particle should be uniformly suspended in liquid dispersed system.
10. a kind of addition process according to claim 6 makes the laser activation technical method of wiring board, it is characterized in that: till groove should being filled up copper when chemistry fills out copper.
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| CN201510084225.4A CN104661441B (en) | 2015-02-16 | 2015-02-16 | A kind of addition process makes the laser activation technical method of wiring board |
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| CN201510084225.4A CN104661441B (en) | 2015-02-16 | 2015-02-16 | A kind of addition process makes the laser activation technical method of wiring board |
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| CN104661441B CN104661441B (en) | 2018-06-01 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105451456A (en) * | 2015-12-08 | 2016-03-30 | 昆山联滔电子有限公司 | Manufacturing method for non-conductive base material conductor circuit |
| CN107403692A (en) * | 2016-05-18 | 2017-11-28 | 中山因塞施特电子科技有限公司 | A kind of chip inductor and preparation method thereof |
| CN109195338A (en) * | 2018-10-26 | 2019-01-11 | 恩达电路(深圳)有限公司 | Aluminium oxide ceramics circuit board manufacturing method |
| CN109618487A (en) * | 2019-01-22 | 2019-04-12 | 张雯蕾 | With the interior three-dimensional substrate and preparation method thereof for burying circuit |
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| Publication number | Publication date |
|---|---|
| CN104661441B (en) | 2018-06-01 |
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Address after: No.17, Xianggong Road, Hongwan Industrial Zone, Xiangzhou District, Zhuhai City, Guangdong Province, 519000 Patentee after: Zhuhai Zhongjing Yuansheng Electronic Technology Co.,Ltd. Address before: No. 17, Xianggong Road, Hongwan Industrial Zone, Nanping, Xiangzhou District, Zhuhai City, Guangdong Province, 519060 Patentee before: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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