CN104244588A - Three-dimensional circuit manufacturing method and modified laser sintering powder materials - Google Patents
Three-dimensional circuit manufacturing method and modified laser sintering powder materials Download PDFInfo
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Abstract
The invention discloses a three-dimensional circuit manufacturing method. The method comprises the steps that a prototype model is generated through a selective laser sintering method, wherein modified laser sintering powder materials comprising components suitable for laser surface activation are used as the raw materials for the prototype model; preset selective scanning is carried out on the surface of the prototype model through laser, so that a surface activation area is formed; a conductive circuit is formed in the surface activation area through chemical plating. The invention further discloses the modified laser sintering powder materials used for the three-dimensional circuit manufacturing method. According to the three-dimensional circuit manufacturing method and the modified laser sintering powder materials, the limitation brought by traditional SLS processing materials on the application is overcome, meanwhile, a matrix with the complex surface is formed, and the requirements for rapid manufacturing and forming of the conductive circuit and laser activation are effectively met.
Description
Technical field
The present invention relates to circuit production field, particularly relate to a kind of manufacture method and modified laser sintered powder material of stereo circuit.
Background technology
For electronic apparatus and electronic product manufacturing process and corresponding material technology, the direction of pursuit is flexibility, environmental protection, quick, energy-conservation.Industry develops the technology being called 3D-MID (Three-dimensional moulded interconnect device or electronic assemblies), this technology is at the shaping precision of plastic surface and conductive pattern closely, electronic devices and components can directly be welded on plastic shell or inner casing, form the electronic apparatus without printed circuit board (PCB) and electromechanical integrated product.This technology is applied to the making of stereo circuit, for electric equipment products and electronic product save circuit space, the flexibility manufacture of realizing circuit.Its major domain is: the field that Communication Equipment antenna, consumer electronics, medicine equipment etc. have higher requirements to space requirement, accuracy.
The technological process of tradition 3D-MID mainly comprises three steps: step one, adopts a kind of laser plastic material injection moulding or be cast into plastic parts; Step 2, the cad file that laser equipment designs by user, scanning plastic parts, form conductive pattern, this step becomes laser treatment or laser activation; Step 3, the plastic parts chemical plating through laser treatment thickens metal level.
Tradition 3D-MID technology adopts the mode of injection moulding to manufacture circuit carrier, and be subject to the restriction of carrier profile, moulding molding time is longer simultaneously, is unfavorable for rapid processing and the test of quick MID device.
Another kind of moulding process, conventional selective laser sintered (SLS) technology mainly comprises: matrix model is by processing in slicing treatment importing equipment, laser selective agglomerating plant Layered manufacturing hierarchical model combination under hot melt state between complete layer, superposed the making of whole prototype successively.
The application of SLS technology makes complex model to realize rapid shaping, and various aspects of performance reaches moulding standard, and molded part can directly use.
But traditional SLS product can not meet the requirement of laser surface activation, also do not have can the laser equipment of effective integration SLS technique simultaneously, so cannot manufacture the inner product containing circuit of plastic parts by traditional SLS technology.
Summary of the invention
Main purpose of the present invention is to overcome the deficiencies in the prior art, provides a kind of manufacture method of new stereo circuit.
Another object is to provide the modified laser sintered powder material that a kind of manufacture method for described stereo circuit can obtain excellent effect.
For achieving the above object, the present invention is by the following technical solutions:
A manufacture method for stereo circuit, comprises the following steps:
Step one, generate prototype by selective laser sintering method, the raw material for described prototype is the modified laser sintered powder material of composition containing being applicable to laser surface activation;
Step 2, with laser, predetermined selective scanning is carried out to form surface active region to the surface of described prototype;
Step 3, by chemical plating in formation conducting wire, described surface active region.
Preferably, described modified laser sintered powder material contains plastic basis material powder and the metal complex by coated with silica, by gross mass 100 parts, described plastic basis material powder accounts for 50 ~ 95 parts, described metal complex and silicon dioxide account for 3 ~ 45 parts, surplus comprises that lubricant, look are female, one or more in compatilizer and inorganic functional fillers, and more preferably, described plastic basis material is polyamide.
Preferably, described metal complex is the complex compound of copper, aluminium, zinc or nickel, and described plastic basis material particle diameters is 20 μm ~ 120 μm, and the average diameter of the metal complex powder particle of described Silica-coated is 1.2 μm.
Preferably, in described step one, wavelength is adopted to be 10.6 μm, power is that the carbon dioxide infrared laser of 30W carries out selective laser sintering, wherein laser scan rate 5m/s, spot diameter 0.5mm, X, Y, Z axis processing shrinkage-compensating rate X is 2.85 ~ 3.82%, Y is 2.85 ~ 3.82%, Z (0) is 2.10 ~ 3.22%, Z (300) is 1.47 ~ 2.44%, wherein Z (0) refers to the shrinkage-compensating rate in Z axis coordinate 0mm position, Z (300) refers to the shrinkage-compensating rate in Z axis coordinate 300mm position, Z-direction remainder layer shrinkage is according to Z (0), the linearly rule distribution of Z (300) value, laser facula compensating parameter is 0.15 ~ 0.35mm.
The ultraviolet laser device that preferably, in described step 2, the near-infrared laser equipment that employing power is 10 ~ 40W, wavelength is 1060 ~ 1064nm or power are 3 ~ 10W, wavelength is 355nm carries out laser scanning, and line width is 0.08 ~ 0.12mm; Minimum spacing is 0.15 ~ 0.25mm, and surface laser activation remains on 20 ~ 25 μm to the recession thickness on described prototype surface.。
Preferably, described laser equipment has X/Y scanning galvanometer and is arranged on the Z axis perpendicular to surface to be activated varifocal.
Preferably, in described step 3, also comprised before carrying out chemical plating and carry out oil removing and soak stablizing process to the surface of described prototype, more preferably, the aqueous solution processing and adopt containing 10% formaldehyde is stablized in described immersion, at room temperature soaks 1min.
Preferably, described oil removing adopts following deoil formula, wherein NaOH 100g/L, tertiary sodium phosphate 166.6g/L, sodium carbonate 100g/L, and washing agent 16.6g/L.
Preferably, chemical plating adopts following electroplate liquid formulation, wherein containing copper sulphate 10g/L, potassium sodium tartrate 50g/L, NaOH 10 ~ 12g/L, sodium carbonate 5g/L, nickel chloride 1g/L, and formaldehyde 10 ~ 15ml/L.
A kind of modified laser sintered powder material of the manufacture method for described stereo circuit, described modified laser sintered powder material contains plastic basis material powder and the metal complex by coated with silica, by gross mass 100 parts, described plastic basis material powder accounts for 50 ~ 95 parts, described metal complex and silicon dioxide account for 3 ~ 45 parts, and surplus comprises that lubricant, look are female, one or more in compatilizer and inorganic functional fillers.
Beneficial effect of the present invention:
The present invention with containing be applicable to laser surface activation composition modified laser sintered powder material for raw material, prototype is generated by selective laser sintering method, and by laser to prototype surface active, through chemical plating, complete stereo circuit to make, this manufacture method effectively improves the deficiency of traditional MID and SLS technique.Utilize this modification SLS dusty material for raw material realize SLS prototype surface with laser activation, overcome traditional SLS rapidoprint to applying the restriction brought, effectively meet laser activation and conducting wire forming requirements, meet the demand of part for conduction, heat conductivility.Particularly, the present invention is formed on the basis of prototype in SLS technique and realizes laser activation, extends the range of application of existing SLS technology, has both overcome the restriction of SLS technology on material, overcomes again the restriction of traditional MID technology in processing profile and on shaping speed.On the one hand, the present invention SLS technique can replace traditional MID Shooting Technique and obtains better rapid processing molding effect, on the other hand, the present invention is by changing traditional SLS rapidoprint, overcome the shortcoming of the limited and MID injection moulding of traditional SLS technologic material, stereo circuit is applied to more extensive, and realizes the surface metalation of prototype fast.The advantage of present invention process is embodied in: the quick Fabrication of (1) stereo circuit, and fabrication cycle is short; (2) matrix realizing surface complicated is shaping, does not limit by profile.
The present invention makes the advantage that stereo circuit has traditional MID technology and SLS rapid shaping technique, but turn eliminate respective defect, industry can be reduced and popularize cost, and make the end product quality of three-dimensional circuit manufacturing process can optimization and have superiority of effectiveness, will greatly promote the development of rapid laser-shaping technique.As new stereo circuit manufacture craft, the present invention provides the manufacture method of environmental protection, environmental friendliness, flexible intelligent for optical, mechanical and electronic integration product, can be widely used in the electronic circuit production in the fields such as automobile, Aero-Space, Industry Control.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method embodiment of stereo circuit of the present invention.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are elaborated.It is emphasized that following explanation is only exemplary, instead of in order to limit the scope of the invention and apply.
In some embodiments, a kind of manufacture method of stereo circuit as shown in Figure 1, comprises the following steps.
step one, by selective laser sintering (SLS) method generate prototype.
Adopt the modification SLS powder stock being applicable to laser surface activation, wherein plastic basis material can be selected polyamide (Polyamide) (i.e. nylon), the nylon base that concrete available PA66, PA12 etc. are conventional on the market, be added with metal complex in above-mentioned base material, metal complex compound adopts coated with silica simultaneously.In a preferred embodiment, modification SLS powder stock total amount calculates by 100 mass parts, and plastic basis material accounts for 50 ~ 95, and metal complex and silicon dioxide account for 3 ~ 45, and remaining ratio is the auxiliary agents such as lubricant, look mother, compatilizer and inorganic functional fillers.Within the scope of this, different synthetic ratios can be selected according to the concrete purposes of modified powder and performance requirement.In subsequent process, the material being removed coated metal complex compound by laser surface activation can make metal ion become free state, then generates surface conductive layer with chemical plating solution.Metal complex adopts above-mentioned preferred content, can optimize metal deposition rates in plating process (the higher metal deposition rates that will make of content is slack-off).
In a preferred embodiment, the nylon powder particle diameter in modified powder raw material is preferably 20 ~ 120 μm, and average diameter can be 60 μm, the metal complex particle diameters of Silica-coated 1.2 μm.Metal complex can be the complex compound of copper, aluminium, zinc, nickel etc.
In a preferred embodiment, use mixer first metal complex and auxiliary agent to be mixed with equivalent nylon base, then mix with residue nylon base, powdered-metal complex compound distributing homogeneity can be improved.
In sintering process, adopt laser selective sintering (SLS) equipment sintering processing prototype matrix, form the section file of prototype, realize successively manufacturing by lf selection area according to section path, finally additive fusion completes the matrix manufacture of appointing arbitrary shape between layers.
In a preferred embodiment, the technological parameter of laser selective sintering preparation prototype is as follows:
Wavelength is adopted to be 10.6 μm, power is that the carbon dioxide infrared laser of 30W carries out selective laser sintering, wherein laser scan rate 5m/s, spot diameter 0.5mm, X, Y, Z axis processing shrinkage-compensating rate X is 2.85 ~ 3.82%, Y is 2.85 ~ 3.82%, Z (0) is 2.10 ~ 3.22%, Z (300) is 1.47 ~ 2.44%, wherein Z (0) refers to the shrinkage-compensating rate in Z axis coordinate 0mm position, Z (300) refers to the shrinkage-compensating rate in Z axis coordinate 300mm position, Z-direction remainder layer shrinkage is according to Z (0), the linearly rule distribution of Z (300) value, laser facula compensating parameter is 0.15 ~ 0.35mm.SLS equipment is under this machined parameters, and mismachining tolerance can reach ± 0.1mm, effectively improves the accurate to dimension of prototype, improves the consistency of prototype and MID processing model.
After prototype machines, by the powder of the post processing mode such as sandblasting, water mill cleaning prototype surface attachment.
step 2, with laser to prototype surface carry out predetermined selective scanning to form surface active region.
The technological parameter of laser equipment and laser scanning prototype is as follows:
Near-infrared laser equipment or ultraviolet laser device can be adopted, the near-infrared laser machine of preferred power 10 ~ 40W, wavelength 1060 ~ 1064nm, or power 3 ~ 10W, wavelength 355nm Ultra-Violet Laser machine.Preferably, line width 0.08 ~ 0.12, minimum spacing 0.15 ~ 0.25mm.Surface laser activation remains on 20 ~ 25 μm to the ablation depth on prototype surface.By this configuration, laser instantaneous energy, higher than in superficial layer during metal complex pyrolysis threshold value, makes metal complex decompose and produces metal ion, as reducing agent during subsequent chemistry copper facing.Produce micro-roughened surface, during making plating, metallized copper can embed, and ensures good binding force of cladding material simultaneously.
Preferably, laser machine possesses Z axis zoom function, adapts to plastic surface rough feature, automatically adjusts, make spot size and circularity constant.
In preferred embodiment, laser chemistry equipment adopts X/Y vibration mirror scanning, has rotatable platform pedestal, has laser Z axis zoom function, complete the selective area surface active to three-dimensional prototype part rapidly and accurately.
After laser surface activation processing, prototype surface completes alligatoring, occurs metal complex thin layer on prototype surface.
step 3, by chemical plating circuit moulding process, in formation conducting wire, described surface active region.
Producing conductive copper layer by changing depositing process, through oil removing, stable, plating process, finally forming the conductive copper layer of 10 ~ 20 μm of thickness.Copper layer thickness is had to the situation of particular/special requirement, according to the duration of reality adjustmentization plating, or conductive layer can be thickeied subsequently through the mode of plating.
(1) oil removing: preferably slough prototype surface grease with the formula that deoils shown in table 1, reduce its surface tension, give its surface hydrophilicity;
Table 1 prototype surface alkalinty deoils formula
| Component | Content |
| NaOH | 100g/L |
| Tertiary sodium phosphate | 166.6g/L |
| Sodium carbonate | 100g/L |
| Washing agent | 16.6g/L |
(2) immersion is stable: because the powder stock of prototype contains metal complex, therefore without the need to traditional sensitization, activation processing.Change plating front to prototype immersion treatment, the preparation before completing plating.
Table 2 prototype stablizes treatment formulations
| Component | Temperature | Time |
| Formaldehyde 10% aqueous solution | Room temperature | 1min |
(3) electroless copper: preferably with the formula of chemical plating shown in table 3, by chemical reaction, forms conductive copper layer on the surface of prototype activating area.Preferably, reaction temperature is 20 ~ 25 DEG C, and the reaction time is 45 ~ 60nin.
Table 3 prototype electroless copper treatment formulations
| Component | Content |
| Copper sulphate | 10g/L |
| Potassium sodium tartrate | 50g/L |
| NaOH | 10～12g/L |
| Sodium carbonate | 5g/L |
| Nickel chloride | 1g/L |
| Formaldehyde | 10～15ml/L |
step 4, surperficial reprocessing.
Through the link of chemical plating, prototype surface forming surface conductance circuit.According to circuit performance requirement separately, circuit validity test can be carried out to it.Can carry out surperficial reprocessing by the prototype of test, cleaning line layer surface impurity, reduces its surface roughness.Not easily be destroyed in order to protection circuit and prevent the oxidation of surperficial copper clad layers, preferably at prototype copper plate surface spraying diaphragm, finally completing the making of MID device.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a manufacture method for stereo circuit, is characterized in that, comprises the following steps:
Step one, generate prototype by selective laser sintering method, the raw material for described prototype is the modified laser sintered powder material of composition containing being applicable to laser surface activation;
Step 2, with laser, predetermined selective scanning is carried out to form surface active region to the surface of described prototype;
Step 3, by chemical plating in formation conducting wire, described surface active region.
2. the manufacture method of stereo circuit as claimed in claim 1, it is characterized in that, described modified laser sintered powder material contains plastic basis material powder and the metal complex by coated with silica, by gross mass 100 parts, described plastic basis material powder accounts for 50 ~ 95 parts, and described metal complex and silicon dioxide account for 3 ~ 45 parts, and surplus comprises that lubricant, look are female, one or more in compatilizer and inorganic functional fillers, preferably, described plastic basis material is polyamide.
3. the manufacture method of stereo circuit as claimed in claim 1, it is characterized in that, described metal complex is the complex compound of copper, aluminium, zinc or nickel, described plastic basis material particle diameters is 20 ~ 120 μm, and the average diameter of the metal complex powder particle of described Silica-coated is 1.2 μm.
4. the manufacture method as described in any one of claims 1 to 3, it is characterized in that, in described step one, wavelength is adopted to be 10.6 μm, power is that the carbon dioxide infrared laser of 30W carries out selective laser sintering, wherein laser scan rate 5m/s, spot diameter 0.5mm, X, Y, Z axis processing shrinkage-compensating rate X is 2.85 ~ 3.82%, Y is 2.85 ~ 3.82%, Z (0) is 2.10 ~ 3.22%, Z (300) is 1.47 ~ 2.44%, wherein Z (0) refers to the shrinkage-compensating rate in Z axis coordinate 0mm position, Z (300) refers to the shrinkage-compensating rate in Z axis coordinate 300mm position, Z-direction remainder layer shrinkage is according to Z (0), the linearly rule distribution of Z (300) value, laser facula compensating parameter is 0.15 ~ 0.35mm.
5. the manufacture method as described in any one of claims 1 to 3, it is characterized in that, in described step 2, the ultraviolet laser device that the near-infrared laser equipment that employing power is 10 ~ 40W, wavelength is 1060 ~ 1064nm or power are 3 ~ 10W, wavelength is 355nm carries out laser scanning, and line width is 0.08 ~ 0.12mm; Minimum spacing is 0.15 ~ 0.25mm, and surface laser activation remains on 20 ~ 25 μm to the recession thickness on described prototype surface.
6. manufacture method as claimed in claim 5, it is characterized in that, in described step 2, described laser equipment has X/Y scanning galvanometer and is arranged on the Z axis perpendicular to surface to be activated varifocal.
7. the manufacture method as described in any one of claim 1 to 6, it is characterized in that, in described step 3, also comprised before carrying out chemical plating and carry out oil removing and soak stablizing process to the surface of described prototype, preferably, described immersion is stablized process and is adopted the aqueous solution containing 10% formaldehyde, at room temperature soaks 1min.
8. manufacture method as claimed in claim 7, is characterized in that, described oil removing adopts following deoil formula, wherein NaOH 100g/L, tertiary sodium phosphate 166.6g/L, sodium carbonate 100g/L, and washing agent 16.6g/L.
9. the manufacture method as described in any one of claim 1 to 6, is characterized in that, chemical plating adopts following electroplate liquid formulation, wherein containing copper sulphate 10g/L, potassium sodium tartrate 50g/L, NaOH 10 ~ 12g/L, sodium carbonate 5g/L, nickel chloride 1g/L, and formaldehyde 10 ~ 15ml/L.
10. the modified laser sintered powder material for the manufacture method of the stereo circuit described in any one of claim 1-9, it is characterized in that, described modified laser sintered powder material contains plastic basis material powder and the metal complex by coated with silica, by gross mass 100 parts, described plastic basis material powder accounts for 50 ~ 95 parts, described metal complex and silicon dioxide account for 3 ~ 45 parts, and surplus comprises that lubricant, look are female, one or more in compatilizer and inorganic functional fillers.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661441A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Laser activation technical method for producing PCB (printed circuit board) with additive process |
| CN106862564A (en) * | 2017-01-12 | 2017-06-20 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on selective laser sintering technology |
| CN106903310A (en) * | 2017-01-12 | 2017-06-30 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on Stereo Lithography forming technique |
| TWI606876B (en) * | 2016-03-16 | 2017-12-01 | 華邦電子股份有限公司 | Method of forming metal line structure |
| CN115023059A (en) * | 2022-08-08 | 2022-09-06 | 华中科技大学 | Manufacturing method of conformal conductive circuit on surface of dielectric material |
| CN115512919A (en) * | 2022-08-18 | 2022-12-23 | 中国电子科技集团公司第二十九研究所 | Preparation method of curved surface thin film resistor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101859613A (en) * | 2009-04-09 | 2010-10-13 | 湖南美纳科技有限公司 | Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method |
| CN102094209A (en) * | 2009-12-14 | 2011-06-15 | 徐冰 | Surface treatment cleaning solution |
| CN102153576A (en) * | 2011-01-28 | 2011-08-17 | 阜阳师范学院 | Rare earth complex coated with silicon dioxide and preparation method of rare earth complex |
| CN102400115A (en) * | 2011-10-20 | 2012-04-04 | 复旦大学 | Preparation method of flexible copper electrode pattern in micron level wire width |
| CN102776492A (en) * | 2011-05-13 | 2012-11-14 | 比亚迪股份有限公司 | Selective metallization method of surface of ceramic, and ceramic and its application |
| CN103405788A (en) * | 2013-08-26 | 2013-11-27 | 中国科学技术大学 | Contrast agent as well as preparation method and application thereof |
-
2014
- 2014-04-30 CN CN201410182087.9A patent/CN104244588B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101859613A (en) * | 2009-04-09 | 2010-10-13 | 湖南美纳科技有限公司 | Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method |
| CN102094209A (en) * | 2009-12-14 | 2011-06-15 | 徐冰 | Surface treatment cleaning solution |
| CN102153576A (en) * | 2011-01-28 | 2011-08-17 | 阜阳师范学院 | Rare earth complex coated with silicon dioxide and preparation method of rare earth complex |
| CN102776492A (en) * | 2011-05-13 | 2012-11-14 | 比亚迪股份有限公司 | Selective metallization method of surface of ceramic, and ceramic and its application |
| CN102400115A (en) * | 2011-10-20 | 2012-04-04 | 复旦大学 | Preparation method of flexible copper electrode pattern in micron level wire width |
| CN103405788A (en) * | 2013-08-26 | 2013-11-27 | 中国科学技术大学 | Contrast agent as well as preparation method and application thereof |
Non-Patent Citations (2)
| Title |
|---|
| 张俊萍: "OLED用喹啉类金属配合物发光材料表面改性研究", 《中国优秀硕士学位论文全文数据库（工程科技I辑）》 * |
| 韩霞、杨恩源: "《快速成型技术与应用》", 31 March 2012, 机械工业出版社 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661441A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Laser activation technical method for producing PCB (printed circuit board) with additive process |
| CN104661441B (en) * | 2015-02-16 | 2018-06-01 | 珠海元盛电子科技股份有限公司 | A kind of addition process makes the laser activation technical method of wiring board |
| TWI606876B (en) * | 2016-03-16 | 2017-12-01 | 華邦電子股份有限公司 | Method of forming metal line structure |
| CN106862564A (en) * | 2017-01-12 | 2017-06-20 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on selective laser sintering technology |
| CN106903310A (en) * | 2017-01-12 | 2017-06-30 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on Stereo Lithography forming technique |
| CN106903310B (en) * | 2017-01-12 | 2019-05-03 | 南京航空航天大学 | The production method of structural circuit unitary member based on Stereo Lithography forming technique |
| CN106862564B (en) * | 2017-01-12 | 2019-11-12 | 南京航空航天大学 | The production method of structural circuit unitary member based on selective laser sintering technology |
| CN115023059A (en) * | 2022-08-08 | 2022-09-06 | 华中科技大学 | Manufacturing method of conformal conductive circuit on surface of dielectric material |
| CN115023059B (en) * | 2022-08-08 | 2022-10-28 | 华中科技大学 | Manufacturing method of conformal conductive circuit on surface of dielectric material |
| CN115512919A (en) * | 2022-08-18 | 2022-12-23 | 中国电子科技集团公司第二十九研究所 | Preparation method of curved surface thin film resistor |
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