CN109195338A - Aluminium oxide ceramics circuit board manufacturing method - Google Patents
Aluminium oxide ceramics circuit board manufacturing method Download PDFInfo
- Publication number
- CN109195338A CN109195338A CN201811257820.3A CN201811257820A CN109195338A CN 109195338 A CN109195338 A CN 109195338A CN 201811257820 A CN201811257820 A CN 201811257820A CN 109195338 A CN109195338 A CN 109195338A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- plate
- aluminium oxide
- conductive copper
- copper paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of aluminium oxide ceramics circuit board manufacturing methods, it include: step 1, ultraviolet laser etching: performing etching alumina ceramic plate according to circuitous pattern using ultraviolet laser machine, to be formed and the matched groove of current-carrying part shape in the circuitous pattern；Step 2, it fills conductive copper paste: conductive copper paste being filled uniformly with into the groove with mode of printing, and is toasted；Step 3, nog plate: conductive copper paste remaining in the ceramic plane of inverter circuit figure is ground off with Plate grinder；Step 4, surface brush plating: with high speed electric brush plating pen on circuitous pattern brush plating cupro-nickel gold, highly reliable fine ceramics circuit board.The present invention can go out line groove, the conductors material such as filling conductive copper paste by laser incising on the surface of the material, thus can make highly reliable fine ceramics circuit board.
Description
Technical field
The present invention relates to circuit board production techniques field, in particular to a kind of aluminium oxide ceramics circuit board manufacturing method.
Background technique
The manufacture craft of aluminium oxide ceramics circuit board in the prior art first is that on ceramic wafer print conductive coating it is right
The shortcomings that sinter molding afterwards, this technique is that binding force is poor, and conducting wire is thick, can not produce fine circuit board.
Summary of the invention
The present invention provides a kind of aluminium oxide ceramics circuit board manufacturing methods, to solve the above technical problems.
To solve the above problems, providing a kind of aluminium oxide ceramics circuit board making side as one aspect of the present invention
Method, comprising: step 1, ultraviolet laser etching: performing etching alumina ceramic plate according to circuitous pattern using ultraviolet laser machine, with
It is formed and the matched groove of current-carrying part shape in the circuitous pattern；Step 2, conductive copper paste is filled: will with mode of printing
Conductive copper paste is filled uniformly with into the groove, and is toasted；Step 3, nog plate: with Plate grinder by the ceramic plane of inverter circuit figure
Upper remaining conductive copper paste is ground off；Step 4, surface brush plating: with high speed electric brush plating pen, brush plating cupro-nickel is golden on circuitous pattern,
Highly reliable fine ceramics circuit board.
Preferably, in the step 1, laser energy and the speed of travel are adjusted, according to the requirement of circuit board to obtain
The etching depth and line width needed, to form depth and line width on each position of circuitous pattern.
Preferably, before the step 1 further include: set working plate according to equipment process capability, availability ratio of the armor plate
Then plate is split into corresponding size by size.
Preferably, between the step 1 and step 2 further include: chemical cleaning: step a utilizes certain proportion configuration
Chemical carries out cleaning treatment to plate face, degreases, sundries etc..
Preferably, between the step 3 and step 4 further include: step b, drilling: the purpose of process is bored in plate face
Through-hole out is positioned with process after an action of the bowels and is used；And/or step c, welding resistance: according to the requirement of client, one is printed in circuit plate face
The ink of layer insulation, but the pad of plug-in unit and patch is wanted all to expose.
Preferably, after the step 4 further include: step 5, molding: using numerical control gong machine or CNC that effective unit is raw
Output is come；Step 6, it tests: utilizing testing jig, on a testing machine open circuit and the plate of short circuit are all measured, guarantee route
Electric property；Step 7, final inspection: checking product according to IPC standard or Customer Standard, and qualified plate can be packed；Step
8, packaging: being packed according to the manner of packing of customer requirement, generally there is thermoplastic packaging and two kinds of In Aluminium Foil Packing.
By adopting the above-described technical solution, the present invention can go out line groove by laser incising on the surface of the material, conductive copper is filled
The conductors materials such as slurry, thus highly reliable fine ceramics circuit board can be made.
Detailed description of the invention
Fig. 1 schematically shows process flow chart of the invention.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
Main technique of the invention includes:
(1) ultraviolet laser etches
Alumina ceramic plate is performed etching according to circuitous pattern under computer-aided using ultraviolet laser machine.The depth of etching
And line width is adjusted laser energy and the speed of travel by the particular/special requirement of circuit board, to be formed deep on each position of circuitous pattern
Degree and line width.
(2) conductive copper paste is filled
Conductive copper paste is filled uniformly with into the pit of circuitous pattern with mode of printing, and is sent to oven cooking cycle.
(3) nog plate
Conductive copper paste remaining in the ceramic plane of inverter circuit figure is ground off with Plate grinder.
(4) surface brush plating
With high speed electric brush plating pen on circuitous pattern brush plating cupro-nickel gold, highly reliable fine ceramics circuit board.
By adopting the above-described technical solution, the present invention can go out line groove by laser incising on the surface of the material, conductive copper is filled
The conductors materials such as slurry, thus highly reliable fine ceramics circuit board can be made.
In the following, with a specific embodiment, it is more highly preferred to and more specifically one embodiment, carries out to of the invention
Detailed description:
Step 1, sawing sheet: the size of working plate is set according to equipment process capability, availability ratio of the armor plate, then opens plate
At corresponding size.
Step 2, laser ablation: alumina ceramic plate is carried out according to circuitous pattern under computer-aided using ultraviolet laser machine
Etching.
Step 3, chemical cleaning: the chemical configured using certain proportion is carried out cleaning treatment to plate face, goes oil removing
Dirt, sundries etc..
Step 4, copper slurry printing: conductive copper paste is filled uniformly with to the pit into circuitous pattern using grenadine mode of printing
In.
Step 5, baking sheet: oven cooking cycle is used, filled conductive copper paste is solidified.
Step 6, nog plate: conductive copper paste remaining in the ceramic plane of inverter circuit figure is ground off using Plate grinder.
Step 7, drilling: the purpose of process is that through-hole is drilled out in plate face, is positioned and is used with process after an action of the bowels.
Step 8, welding resistance: according to the requirement of client, the ink of one layer of insulation is printed in circuit plate face, but wants plug-in unit and patch
The pad of piece all exposes.
Step 9, surface brush plating: using high speed electric brush plating pen, brush plating cupro-nickel is golden on circuitous pattern.
Step 10, molding: effective cellular manufacture is come out using numerical control gong machine or CNC.Quality main points: outer dimension is necessary
It meets the requirements.
Step 11, test: utilizing testing jig, on a testing machine open circuit and the plate of short circuit is all measured, guarantees route
Electric property.
Step 12, final inspection: checking product according to IPC standard or Customer Standard, and qualified plate can be packed.
Step 13, packaging: being packed according to the manner of packing of customer requirement, generally there is thermoplastic packaging and In Aluminium Foil Packing two
Kind.
The present invention makes conductor wire mode using groove filling conductive copper paste, and binding force is more preferable between conducting wire and substrate；And
Using laser ablation, conducting wire is finer.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of aluminium oxide ceramics circuit board manufacturing method characterized by comprising
Step 1, ultraviolet laser etches: being performed etching to alumina ceramic plate according to circuitous pattern using ultraviolet laser machine, to be formed
With the matched groove of current-carrying part shape in the circuitous pattern；
Step 2, it fills conductive copper paste: conductive copper paste being filled uniformly with into the groove with mode of printing, and is toasted；
Step 3, nog plate: conductive copper paste remaining in the ceramic plane of inverter circuit figure is ground off with Plate grinder；
Step 4, surface brush plating: with high speed electric brush plating pen on circuitous pattern brush plating cupro-nickel gold, highly reliable fine ceramics electricity
Road plate.
2. aluminium oxide ceramics circuit board manufacturing method according to claim 1, which is characterized in that in the step 1, according to
The requirement of circuit board adjusts laser energy and the speed of travel, to obtain required etching depth and line width, to form circuit
Depth and line width on each position of figure.
3. aluminium oxide ceramics circuit board manufacturing method according to claim 1, which is characterized in that before the step 1 also
Include: the size for setting working plate according to equipment process capability, availability ratio of the armor plate, plate is then split into corresponding size.
4. aluminium oxide ceramics circuit board manufacturing method according to claim 1, which is characterized in that in the step 1 and step
Between rapid 2 further include:
Step a, chemical cleaning: the chemical configured using certain proportion is carried out cleaning treatment to plate face, degreased,
Sundries etc..
5. according to claim 1 to aluminium oxide ceramics circuit board manufacturing method described in 4, which is characterized in that the step 3 with
Between step 4 further include:
Step b, drilling: the purpose of process is that through-hole is drilled out in plate face, is positioned and is used with process after an action of the bowels；And/or
Step c, welding resistance: according to the requirement of client, printing the ink of one layer of insulation in circuit plate face, but wants plug-in unit and patch
Pad all exposes.
6. aluminium oxide ceramics circuit board manufacturing method according to claim 1, which is characterized in that after the step 4
Further include:
Step 5, it forms: effective cellular manufacture being come out using numerical control gong machine or CNC；
Step 6, it tests: utilizing testing jig, on a testing machine open circuit and the plate of short circuit are all measured, guarantee the electrical of route
Performance；
Step 7, final inspection: checking product according to IPC standard or Customer Standard, and qualified plate can be packed；
Step 8, it packs: being packed according to the manner of packing of customer requirement, generally there is thermoplastic packaging and two kinds of In Aluminium Foil Packing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811257820.3A CN109195338A (en) | 2018-10-26 | 2018-10-26 | Aluminium oxide ceramics circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811257820.3A CN109195338A (en) | 2018-10-26 | 2018-10-26 | Aluminium oxide ceramics circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195338A true CN109195338A (en) | 2019-01-11 |
Family
ID=64943737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811257820.3A Pending CN109195338A (en) | 2018-10-26 | 2018-10-26 | Aluminium oxide ceramics circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109195338A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112643899A (en) * | 2020-12-16 | 2021-04-13 | 南京缔邦新材料科技有限公司 | Fine circuit cutting method for ceramic copper-clad plate |
| CN113133208A (en) * | 2021-04-13 | 2021-07-16 | 深圳市三维电路科技有限公司 | Circuit processing method based on laser etching |
| CN114710949A (en) * | 2022-05-05 | 2022-07-05 | 信丰利裕达电子科技有限公司 | Method for manufacturing PCB (printed Circuit Board) with traceability |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101002515A (en) * | 2004-07-28 | 2007-07-18 | 埃托特克德国有限公司 | Method of manufacturing an electronic circuit assembly using direct write techniques |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN102806789A (en) * | 2011-06-03 | 2012-12-05 | 上海安费诺永亿通讯电子有限公司 | Method for forming metal pattern on surface of insulator |
| CN103188877A (en) * | 2013-03-05 | 2013-07-03 | 深圳光韵达光电科技股份有限公司 | Quick high-flexibility manufacturing method for ceramic circuit board |
| CN103931277A (en) * | 2011-11-16 | 2014-07-16 | 陶瓷技术有限责任公司 | Embedded metal structures in ceramic substrates |
| CN104661441A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Laser activation technical method for producing PCB (printed circuit board) with additive process |
-
2018
- 2018-10-26 CN CN201811257820.3A patent/CN109195338A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101002515A (en) * | 2004-07-28 | 2007-07-18 | 埃托特克德国有限公司 | Method of manufacturing an electronic circuit assembly using direct write techniques |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN102806789A (en) * | 2011-06-03 | 2012-12-05 | 上海安费诺永亿通讯电子有限公司 | Method for forming metal pattern on surface of insulator |
| CN103931277A (en) * | 2011-11-16 | 2014-07-16 | 陶瓷技术有限责任公司 | Embedded metal structures in ceramic substrates |
| CN103188877A (en) * | 2013-03-05 | 2013-07-03 | 深圳光韵达光电科技股份有限公司 | Quick high-flexibility manufacturing method for ceramic circuit board |
| CN104661441A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Laser activation technical method for producing PCB (printed circuit board) with additive process |
Non-Patent Citations (1)
| Title |
|---|
| 刘延飞: "《电工电子技术工程实践训练教程》", 30 September 2014 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112643899A (en) * | 2020-12-16 | 2021-04-13 | 南京缔邦新材料科技有限公司 | Fine circuit cutting method for ceramic copper-clad plate |
| CN113133208A (en) * | 2021-04-13 | 2021-07-16 | 深圳市三维电路科技有限公司 | Circuit processing method based on laser etching |
| CN114710949A (en) * | 2022-05-05 | 2022-07-05 | 信丰利裕达电子科技有限公司 | Method for manufacturing PCB (printed Circuit Board) with traceability |
| CN114710949B (en) * | 2022-05-05 | 2024-05-31 | 信丰利裕达电子科技有限公司 | Manufacturing method of PCB (printed circuit board) with traceability |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109195338A (en) | Aluminium oxide ceramics circuit board manufacturing method | |
| US8240027B2 (en) | Method of making circuitized substrates having film resistors as part thereof | |
| CN103378068A (en) | Circuit module and method of manufacturing the same | |
| ATE250806T1 (en) | METHOD FOR THE VERTICAL INTEGRATION OF ELECTRICAL COMPONENTS USING BACK SIDE CONTACTING | |
| JP5108433B2 (en) | Wiring board for electronic component inspection equipment | |
| CN104797083B (en) | The method and its printed circuit board of embedding resistance in printed circuit board | |
| CN105578778A (en) | Manufacturing method of single-face local thick-gold plated PCB | |
| US20120229160A1 (en) | Wiring board for electronic parts inspecting device and its manufacturing method | |
| CN104320909B (en) | Ladder copper circuit board high and preparation method thereof | |
| CN106455366A (en) | Method for electroplating copper taphole in PCB | |
| CN110366307A (en) | Double-faced flexible wiring board and preparation method | |
| CN107734877B (en) | Flexible circuit board and laser preparation process thereof | |
| CN107920424A (en) | The manufacture method of circuit board | |
| CN101594740A (en) | Be embedded into the circuit board and the method thereof of electronic device | |
| CN103632778B (en) | chip type arrangement resistor | |
| US8981237B2 (en) | Wiring board for electronic parts inspecting device and its manufacturing method | |
| CN209544334U (en) | High current carrying capacity multilayer ceramic substrate | |
| CN105359633A (en) | Method for contacting and rewiring an electronic component embedded into a printed circuit board | |
| CN103281869B (en) | The manufacture method of wiring board | |
| CN107484358B (en) | It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling | |
| CN115460773A (en) | Method, software and equipment for manufacturing circuit board by laser manufacturing opening transfer material | |
| CN105407628A (en) | Microwave digital apparatus and processing method therefor | |
| CN105228349B (en) | A method of improve without golden on copper hole | |
| JP6420088B2 (en) | Manufacturing method of ceramic multilayer wiring board | |
| JP6322066B2 (en) | Wiring board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190111 |
|
| RJ01 | Rejection of invention patent application after publication |