CN104661449B - A kind of hole metallization method based on laser activation technology - Google Patents
A kind of hole metallization method based on laser activation technology Download PDFInfo
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- CN104661449B CN104661449B CN201510084206.1A CN201510084206A CN104661449B CN 104661449 B CN104661449 B CN 104661449B CN 201510084206 A CN201510084206 A CN 201510084206A CN 104661449 B CN104661449 B CN 104661449B
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- hole
- laser
- method based
- activation technology
- metallization method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Abstract
The present invention discloses a kind of hole metallization method based on laser activation technology.This method comprises: using laser drill to printed circuit board substrate, and special laser irradiation is adjusted, the hole wall drilled out is made to form nanoscale hole hole；Catalyst particle infiltration hole is adsorbed on hole wall, forms activating catalytic layer；Wall surface of the hole finally is deposited metal in using Catalytic Layer, completes the electroless plated metal of micropore hole wall.The advantages of this method is will to drill to be combined into a step with hole wall roughening process, reduces process costs, and coating binding performance is excellent, environmental-friendly.
Description
Technical field
The present invention relates to PCB Hole Metallization methods, more particularly to a kind of laser irradiation that is based on to be modified, then passes through
Chemical plating makes the method for circuit board micropore metal.
Background technique
Multilayer printed circuit board such as HDI, multilayered rigidity and flexibility board, need the mesoporous metal by through-hole, blind hole or folded hole
Change the performance for realizing in interlayer and being electrically connected, and then realizing the high positioning efficiency of circuit board high density.Hole metallization is in circuit board
It drills on dielectric material such as polyimides, epoxy resin impregnated glass colth material between copper foil, and in these insulating materials
Hole wall plates one layer of metal, realizes the conducting between two or more layers copper foil circuit.Hole metallization based on chemical plating process is
A kind of more traditional hole metallization method.
Chemical plating is a kind of method for forming homogeneous metal coating on the surface of the material, especially when material is resin, ceramics
Etc. it is nonmetallic when, these materials can not directly be electroplated to obtain desired metal coating, and chemical plating is then extraordinary selection.Chemistry
Plating is not only easy to operate, but also obtained metallic coating mass is also relatively high, and coating uniformity is good, and porosity is low.Chemical plating
It is of wide application, in printed circuit board field, for the hole metallization of through-hole, blind hole or folded hole, there are also chemical nickel gold, leachings
The processes such as silver.
Typically hole chemical plating will pass through pre-treatment (roughening), adsorb, restore these three main process, and wherein pre-treatment is to plating
The whether upper plating of layer, quality of coating have significant effect.Situation especially very smooth in hole wall surface, this when, surface was pre-
Processing just seems particularly significant.Under normal circumstances, chemical microetch processing can be used in hole wall surface roughening, is changed with reaching surface
Property, increase contact surface area, improves adhesion.But this method has more limitation, does not want simultaneously in the material of application
Different formulas is adjusted, and degree for the treatment of is not easy to control, is easily reduced material surface flatness, influences subsequent plating layer quality；
Roughening is etched to material, is easy to cause material aging, the service life is reduced；In addition, the introducing of chemicals also brings environment
The problems such as healthy.
Summary of the invention
The present invention is directed to improve circuit board micropore chemistry treatment before plating process, one kind is proposed while circuit boring
To the new process of hole wall catalytic activation, printed circuit board drilling and hole wall metal can conveniently be realized by this technique
Change, to the destruction very little of substrate itself, and high strength galvanized steel is good, is applicable in the very smooth material in surface.
Technical solution used by of the present invention is: method includes the following steps:
(1) laser positioning drills, and adjusts laser irradiation processing, and hole wall is made to form nanoscale hole hole；
(2) catalyst particle is infiltrated through into described hole, is adsorbed on the surface of drilling, form activating catalytic layer；
(3) metal forms coating on borehole wall surface by the method for chemical plating.
Further, in the step (1), while using laser drill, laser irradiation is adjusted, hole wall is made to receive
Meter level hole.
Further, in the step (2), the catalyst particle includes but is not limited to Technique of Nano Pd, nanogold, nano silver,
Nano-sized carbon.
Further, in the step (2), the activating catalytic layer is with a thickness of 20nm~200nm.
Further, in the step (2), after forming activating catalytic layer, material surface is dried.
Further, in the step (3), the chemical plating include but is not limited to electroless copper, nickel plating, it is silver-plated, gold-plated,
Nickel-plated phosphor boron.
Further, when adjusting laser irradiation, in 80-125mJ, focal height control exists for the pulse energy control of laser
50-60mm, laser frequency control are controlled in 102-120nm, beam diameter in 15- in 40-60kHz, laser pulse width control
20mm。
Further, the pulse energy can also be controlled in 100-125 mJ, and focal height can also be controlled in 50-60
Mm, laser frequency can also be controlled in 48-55 KHz, and laser pulse width control exists in 102-120nm, beam diameter control
15-20mm。
Further, the catalyst particle partial size is less than or equal to 100nm, and the catalyst particle should be uniformly suspended in liquid
Dispersion.
Further, the thickness of coating of the chemical plating can according to need adjustment bath composition and electroless plating time obtains
It arrives.
Specifically, selection needs to add the board substrate of the drilling of coating, and weaves laser input file, processes sharp
Light device location hole；
Substrate is placed in laser process equipment, using laser positioning drilling (hole drilled out is micropore), and adjusts laser
Treatment with irradiation makes hole wall form nanoscale hole hole.Specifically utilize the biggish unit area power of laser by copper foil and dielectric layer
Micropore is drilled out, while using laser irradiation hole wall, pore wall material, which absorbs energy temperature and increases rapidly, reaches fusing point (infrared laser),
Material molecule is escaped from heat affected zone in succession；Or laser energy has interrupted material molecule key, and it is (ultraviolet to swash to destroy metal lattice
Light), so that particles of material is detached from surface and is left small hole；
Surface clean can carry out surface clear since laser action can bring hole wall to vaporize spot using plasma
It is clean, other methods also can be used, for example cleaning solution ultrasound is impregnated；
According to plasma species difference, after cleaning out, material micropore often carries positive electricity or negative electricity；For
Electronegative catalyst particles are needed to be adjusted using acid/base, micropore are made to become positively charged；And it is micro- for positively charged catalyst
Grain, is needed to be adjusted using acid/base, makes negative electricity on micropore band.
The material that adjustment is finished is infiltrated into the solution containing catalysed particulate, and catalyst particle infiltration hole is adsorbed on material
Surface forms activating catalytic layer.Catalyst solution be by the stable dispersion solution system containing nano metallic colloid or ion,
Nano metallic colloid or ion form the catalytic center of the coat of metal as sequential reduction, thus need on the surface of the material compared with
Strong suction-operated, or even penetrate into inside hole, improve catalytic effect.Common catalytic metal such as colloid palladium, nano silver are received
Rice gold etc..Catalytic Layer thickness can adjust within the scope of 20nm-200nm, can also change according to actual needs；
Hole wall surface just has the basis for carrying out chemical plating after forming Catalytic Layer, usually infiltrates substrate to chemical plating fluid
In, catalytic center occurs redox reaction and forms coated metal, self-catalyzed reaction occurs again on coated metal, so that chemical plating
Process continues, and hole wall surface also forms the uniform coat of metal accordingly；
The adjustable bath concentration of thickness of coating and electroless plating time meet actual needs；
This method can be applied in printed circuit board production, can be in the case where not having to whole plate chemical plating
Graphic mask is sticked before chemical plating, is exposed by exposure development and is needed copper-plated part, and then carries out copper facing again；Or
The method that etching is reused after whole plate copper facing forms wire pattern.
The present invention completes roughing in surface pretreatment process using laser irradiation hole wall, conveniently realizes that surface is modified,
Good condition is provided for the attached body of catalyst；Due to the high efficiency of laser, batch making can be fast implemented；This technique
The destruction very little of Surface Structures, does not influence the flatness in hole, and obtained high strength galvanized steel is preferable.
Detailed description of the invention
Fig. 1 is to cover copper dual platen schematic diagram for what is do not dealt with；
Fig. 2 is the schematic diagram for carrying out laser drill to substrate and irradiating；
Fig. 3 is the schematic diagram that substrate laser irradiation leaves small hole；
Fig. 4 is the schematic diagram that this substrate surface adsorption catalyst forms activating catalytic layer；
Fig. 5 is the schematic diagram of substrate surface chemical plating；
Wherein, A is a kind of board substrate, such as polyimides, impregnated glass fiber etc.；B is copper foil；C is hole；D is
The activating catalytic layer of formation；E is mixed layer；F is the coat of metal.
Specific embodiment
As shown in Figures 1 to 5, it is described in detail below according to invented technology by specific embodiment.Implement below real
Example be intended merely to preferably by the technology of the present invention principle illustrate it is clear, do not represent the present invention can only limit using the implementation reality
Example.
Embodiment one:
It using double-sided copper-clad soft board as base material, and realizes that blind hole metallizes, achievees the purpose that electrical connection.
(1) select common in the market, machining, flexible excellent polyimides double face copper as substrate, and
It is cut into the size for being suitble to processing.
(2) place the material in laser process equipment, after equipment inputs laser operations file, laser drilling is carried out to copper-clad plate
Hole (hole hereinafter referred to as drilled out is micropore, and embodiment two is same), while laser irradiation is adjusted, so that surface is formed nanoscale hole hole.Swash
Light irradiates pulse energy control in 60-70mJ, and focal height control swashs in 1.8 mm, laser frequency control in 50-60 kHz
Light impulse length control is controlled in 102-120 nm, beam diameter in 15-20 mm.
(3) substrate after drilling is put into plasma cleaning equipment, the small hole of copper foil surface and hole wall is carried out
Cleaning, is conducive to the absorption of catalysed particulate.
(4) according to plasma species difference, after cleaning out, micropore hole wall often carries positive electricity or negative electricity；
It for electronegative catalyst particles, needs to adjust using acid/base, poromerics surface is made to become positively charged；And just for band
The catalyst particles of electricity, are needed to be adjusted using acid/base, poromerics surface are made to take negative electricity.
(5) substrate for having adjusted charge needs to be immersed into catalyst solution, and the catalyst solution that this example uses is quotient
Industry palladium colloidal solution.Bath temperature is controlled at 40 DEG C or so, Immersion time 5min, can be washed away using water flow mode to plate face,
So that catalyst component is sufficiently combined with micropore hole wall surface.
(6) it is dried up under the conditions of 40 DEG C of hot wind after pore wall material adsoption catalysis particle, dry temperature and time is unsuitable
Excessively, in order to avoid destroying Catalytic Layer composition, cause catalytic effect to reduce and even fail.
(7) baseplate material is immersed in chemical copper plating solution, the business copper plating solution of copper plating bath, that is, common.Temperature control exists
30 DEG C, the time controls in 10min, so that hole wall is uniformly plated layers of copper, copper layer thickness can according to need and adjust at 4 μm or so
It is whole.
(8) after whole plate is dry, one layer of dry film, and exposure development are pasted on copper foil, leaves layer pattern against corrosion.
(9) after etching and removing the etchant resist in plate face, the baseplate material with circuit copper wire pattern is obtained.
Embodiment two:
It using glass fibre known to dipping as base material, and realizes that blind hole metallizes, reaches the mesh of electrical connection
's.
(1) selection is common in the market, and the excellent FR4 of mechanical performance is cut into the size for being suitble to processing as substrate.
(2) place the material in laser process equipment, after equipment inputs laser operations file, laser drilling is carried out to copper-clad plate
Hole, while laser irradiation is adjusted, so that surface is formed nanoscale hole hole.Laser irradiation table pulse energy is controlled in 100-125 mJ,
Focal height control is in 10-30 mm, and in 48-60 kHz, laser pulse width is controlled in 102-120 nm for laser frequency control,
Beam diameter is controlled in 15-20 mm.
(3) substrate after drilling is put into plasma cleaning equipment, the small hole of copper foil surface and hole wall is carried out
Cleaning, is conducive to the absorption of catalysed particulate.
(4) according to plasma species difference, after cleaning out, micropore hole wall often carries positive electricity or negative electricity；
It for electronegative catalyst particles, needs to adjust using acid/base, poromerics surface is made to become positively charged；And just for band
The catalyst particles of electricity, are needed to be adjusted using acid/base, poromerics surface are made to take negative electricity.
(5) substrate for having adjusted charge needs to be immersed into catalyst solution, and the catalyst solution that this example uses is quotient
Industry palladium colloidal solution.Bath temperature is controlled at 40 DEG C or so, Immersion time 8min, can be washed away using water flow mode to plate face,
So that catalyst component is sufficiently combined with micropore hole wall surface.
(6) it is dried up under the conditions of 40 DEG C of hot wind after pore wall material adsoption catalysis particle, dry temperature and time is unsuitable
Excessively, in order to avoid destroying Catalytic Layer composition, cause catalytic effect to reduce and even fail.
(7) baseplate material is immersed in chemical copper plating solution, the business copper plating solution of copper plating bath, that is, common.Temperature control exists
30 DEG C, the time controls in 15min, so that hole wall is uniformly plated layers of copper, copper layer thickness can according to need and adjust at 6 μm or so
It is whole.
(8) after whole plate is dry, one layer of dry film, and exposure development are pasted on copper foil, leaves layer pattern against corrosion.
(9) after etching and removing the etchant resist in plate face, the baseplate material with circuit copper wire pattern is obtained.
Above-mentioned two example can be seen that can be many using the substrate type of the method for the present invention, including but not limited to often
The various soft or hard copper-clad plates seen.The coat of metal can be copper facing, silver-plated, nickel plating or other coating.
The present invention is described in detail in above two example, but does not mean that the present invention is limited only to both
Example.In the case where not departing from the technology of the present invention principle, makes improvements and deform in the claims in the present invention and technology
Within, it also should belong to protection scope of the present invention.
Claims (6)
1. a kind of hole metallization method based on laser activation technology, which is characterized in that method includes the following steps:
(1) laser positioning drills, and adjusts laser irradiation processing, and hole wall is made to form nanoscale hole hole；Use the same of laser drill
When, laser irradiation is adjusted, hole wall is made nanoscale hole hole occur；When adjusting laser irradiation, the pulse energy of laser is controlled in 80-
125mJ, focal height control are controlled in 40-60kHz, laser pulse width in 102- in 50-60mm, laser frequency control
120nm, beam diameter are controlled in 15-20mm；
(2) catalyst particle is infiltrated through into described hole, is adsorbed on the surface of drilling, form activating catalytic layer；The catalyst particle
For Technique of Nano Pd, nanogold, nano silver or nano-sized carbon；The activating catalytic layer is with a thickness of 20nm~200nm；
(3) metal forms coating on borehole wall surface by the method for chemical plating.
2. a kind of hole metallization method based on laser activation technology according to claim 1, it is characterised in that: the step
Suddenly in (2), after forming activating catalytic layer, material surface is dried.
3. a kind of hole metallization method based on laser activation technology according to claim 1, it is characterised in that: the step
Suddenly in (3), the chemical plating is electroless copper, nickel plating, silver-plated, gold-plated or nickel-plated phosphor boron.
4. a kind of hole metallization method based on laser activation technology according to claim 1, it is characterised in that: the arteries and veins
Energy hole is rushed in 100-125 mJ, focal height control is controlled in 50-60 mm, laser frequency in 48-55 KHz, laser arteries and veins
Width control is rushed in 102-120nm, beam diameter is controlled in 15-20mm.
5. a kind of hole metallization method based on laser activation technology according to claim 1, it is characterised in that: described to urge
Change particle diameter and be less than or equal to 100nm, the catalyst particle is uniformly suspended in liquid dispersed system.
6. a kind of hole metallization method based on laser activation technology according to claim 1, it is characterised in that: describedization
The thickness of coating for learning plating adjusts bath composition as needed and electroless plating time obtains.
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| CN105198491B (en) * | 2015-09-14 | 2017-10-31 | 武汉利之达科技有限公司 | A kind of ceramic substrate preparation method containing conduction copper column |
| CN105451456A (en) * | 2015-12-08 | 2016-03-30 | 昆山联滔电子有限公司 | Manufacturing method for non-conductive base material conductor circuit |
| CN107403692A (en) * | 2016-05-18 | 2017-11-28 | 中山因塞施特电子科技有限公司 | A kind of chip inductor and preparation method thereof |
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| CN101873766A (en) * | 2010-06-02 | 2010-10-27 | 上海律图表面处理有限公司 | Method for manufacturing conductor track structure |
| CN102806789A (en) * | 2011-06-03 | 2012-12-05 | 上海安费诺永亿通讯电子有限公司 | Method for forming metal pattern on surface of insulator |
| CN103188877A (en) * | 2013-03-05 | 2013-07-03 | 深圳光韵达光电科技股份有限公司 | Quick high-flexibility manufacturing method for ceramic circuit board |
| JP2013540368A (en) * | 2010-10-20 | 2013-10-31 | エルジー イノテック カンパニー リミテッド | Printed circuit board and manufacturing method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1582095A (en) * | 2003-08-06 | 2005-02-16 | 中国科学院福建物质结构研究所二部 | Mask-free ceramic base board interconnecting lead manufacturing technique |
| CN101873766A (en) * | 2010-06-02 | 2010-10-27 | 上海律图表面处理有限公司 | Method for manufacturing conductor track structure |
| JP2013540368A (en) * | 2010-10-20 | 2013-10-31 | エルジー イノテック カンパニー リミテッド | Printed circuit board and manufacturing method thereof |
| CN102806789A (en) * | 2011-06-03 | 2012-12-05 | 上海安费诺永亿通讯电子有限公司 | Method for forming metal pattern on surface of insulator |
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Address after: No.17, Xianggong Road, Hongwan Industrial Zone, Xiangzhou District, Zhuhai City, Guangdong Province, 519000 Patentee after: Zhuhai Zhongjing Yuansheng Electronic Technology Co.,Ltd. Address before: No. 17, Xianggong Road, Hongwan Industrial Zone, Nanping, Xiangzhou District, Zhuhai City, Guangdong Province, 519060 Patentee before: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY Co.,Ltd. |