CN105451456A - Manufacturing method for non-conductive base material conductor circuit - Google Patents
Manufacturing method for non-conductive base material conductor circuit Download PDFInfo
- Publication number
- CN105451456A CN105451456A CN201510893886.1A CN201510893886A CN105451456A CN 105451456 A CN105451456 A CN 105451456A CN 201510893886 A CN201510893886 A CN 201510893886A CN 105451456 A CN105451456 A CN 105451456A
- Authority
- CN
- China
- Prior art keywords
- conductive substrate
- base material
- conductive base
- metal
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a manufacturing method for a non-conductive base material conductor circuit. The manufacturing method comprises the following steps: step 1, providing a non-conductive base material; step 2, carving the surface of the non-conductive base material by laser to form multiple micropores in the surface of the non-conductive base material; and step 3, immersing the non-conductive base material into metal accelerant activation liquid for activation to enable the metal accelerant to be embedded and adsorbed in the micropores, wherein the surface of the non-conductive base material that is not carved by laser is not activated; and finally depositing a metal layer on the surface of the non-conductive base material adsorbed with the metal accelerant by adopting a chemical plating manner or an electroplating manner, wherein the metal layer is used as the conductor circuit. The manufacturing method for the non-conductive base material conductor circuit is less in steps, short in process, less in time consumption, high in production efficiency and capable of reducing production cost.
Description
Technical field
The present invention relates to a kind of manufacture method of conductor line of non-conductive substrate.
Background technology
The antenna of current mobile device uses MID (MoldedInterconnectDevices) technology to prepare antenna, still with LDS processing procedure (LaserDirectStructuring, be called for short LDS) be the market mainstream, in development afterwards, the new technology palpus increase processing procedure station that each manufacturer releases is reached and prepare antenna on non-conductive substrate, as ETS processing procedure (EtchingforThree-dimensionalStructures, three-dimensional etching technology), LAP processing procedure (laserActivatingPlating, radium-shine chemical activation metal-plated) etc., but also therefore reduce product yield and increase production cost.
ETS processing procedure generally comprises following steps, the 1st step: provide non-conductive substrate; 2nd step: spray resin ink on non-conductive substrate; 3rd step: utilize laser engraving antenna pattern, the resin ink of burn off pattern position, exposed base material forms rough surface; 4th step: use sputter-deposited layers of copper or nickel/copper metal to make nonconductive matrix material metallization; 5th step: use damp process to divest remaining resin ink on base material, remove the metal level be deposited on resin ink; Finally, chemical plating or plating is used to thicken metal level.
Refer to Chinese invention patent and disclose LAP processing procedure disclosed by No. CN104975276, it generally comprises following steps: the 1st step, provides non-conductive substrate; 2nd step, carries out circuit radium carving at substrate surface, realizes radium carving surface coarsening; 3rd step, cleaning radium carving non-conductive substrate, the 4th step, insert again in chemical solution and carry out chemical roughen, the preferred potassium permanganate of chemical solution, the 5th step, clean and reduction non-conductive substrate, reduction utilizes hydrogen peroxide to be reduced to colourless by darkviolet by the potassium permanganate remaining in non-conductive substrate surface; 6th step, non-conductive substrate is inserted the first activator and is carried out first time activation, the 7th step, and non-conductive substrate is inserted in the second activator and carried out second time and activate, and the first activator and the second activator are the different activated solutions of employing two kinds; 8th step, non-conductive substrate is inserted chemical plating fluid and is carried out metal deposition, forms conductor line; Finally, chemical plating or plating is used to thicken metal level.
The step of ETS and LAP processing procedure is many, long flow path, and consuming time many, production efficiency is low, and production cost is high.
Summary of the invention
The object of the present invention is to provide the manufacture method of the conductor line of the non-conductive substrate that a kind of step is few, flow process is short.
For realizing aforementioned object, the present invention adopts following technical scheme: a kind of manufacture method of conductor line of non-conductive substrate, and it comprises following steps: the 1st step, provides a non-conductive substrate; 2nd step, utilizes laser engraving non-conductive substrate surface, and non-conductive substrate surface is formed with countless micropores; 3rd step, non-conductive substrate soaks in metal solvent activating solution and activates, and metal solvent is bumped into and is adsorbed in micropore, do not activated by the non-conductive substrate surface that radium is carved; And last, on the non-conductive substrate surface being adsorbed with metal solvent, utilize chemical plating or electroplating deposition metal level, this metal level is as conductor line.
The step of the manufacture method of the conductor line of non-conductive substrate of the present invention is few, and flow process is short, and consuming time few, production efficiency is high, reduces production cost.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the manufacture method of the conductor line of non-conductive substrate of the present invention.
Embodiment
Refer to shown in Fig. 1, the manufacture method of the conductor line of non-conductive substrate of the present invention, comprises following steps:
1st step, provides a non-conductive substrate 10, and material adopts industry conventional material, includes but not limited to PC, PC, ABS or nylon etc.
2nd step, utilizes laser engraving (radium carving) non-conductive substrate 10 surface, is formed with countless micropores, is not radium-shinely limited by specific or single wavelength on non-conductive substrate 100 surface, select between 353nm ~ 1064nm.
3rd step, non-conductive substrate 10 soaks in metal solvent activating solution and activates, metal solvent 20 is bumped into be adsorbed in micropore, is not activated by non-conductive substrate 10 surface that radium is carved, metal solvent 20 be chosen as the metals such as palladium, gold, silver, copper, nickel or tin.The present invention preferentially adopts Technique of Nano Pd catalyst, and how the domain size distribution of rice palladium catalyst is between 100nm ~ 1000nm.
Finally, on non-conductive substrate 10 surface being adsorbed with metal solvent 20, utilize chemical plating or electroplating deposition metal level 30, this metal level 30 is as conductor line.
The conventional catalyst of industry is tin palladium colloid, needs speedization detin step again after immersion, and of the present inventionization treatment before plating, for soaking how rice palladium catalyst, directly can change plating after immersion, without the need to speed detin.
The step of the manufacture method of the conductor line of non-conductive substrate of the present invention is few, and flow process is short, and consuming time few, production efficiency is high, reduces production cost.
Although be example object, disclose the preferred embodiment of the present invention, but those of ordinary skill in the art will recognize, when not departing from scope and spirit of the present invention disclosed in appending claims, various improvement, increase and replacement are possible.
Claims (4)
1. a manufacture method for the conductor line of non-conductive substrate, it comprises following steps:
1st step, provides a non-conductive substrate;
2nd step, utilizes laser engraving non-conductive substrate surface, and non-conductive substrate surface is formed with countless micropores;
3rd step, non-conductive substrate soaks in metal solvent activating solution and activates, and metal solvent is bumped into and is adsorbed in micropore, do not activated by the non-conductive substrate surface that radium is carved; And
Finally, on the non-conductive substrate surface being adsorbed with metal solvent, utilize chemical plating or electroplating deposition metal level, this metal level is as conductor line.
2. manufacture method according to claim 1, is characterized in that: described metal solvent be chosen as palladium, gold, silver, copper, nickel or tin.
3. manufacture method according to claim 1, is characterized in that: described metal solvent be chosen as Technique of Nano Pd catalyst, the domain size distribution of Technique of Nano Pd catalyst is between 100nm ~ 1000nm.
4. manufacture method according to claim 1, is characterized in that: described radium-shine wavelength is 353nm ~ 1064nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510893886.1A CN105451456A (en) | 2015-12-08 | 2015-12-08 | Manufacturing method for non-conductive base material conductor circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510893886.1A CN105451456A (en) | 2015-12-08 | 2015-12-08 | Manufacturing method for non-conductive base material conductor circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105451456A true CN105451456A (en) | 2016-03-30 |
Family
ID=55561111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510893886.1A Pending CN105451456A (en) | 2015-12-08 | 2015-12-08 | Manufacturing method for non-conductive base material conductor circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105451456A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106532240A (en) * | 2016-12-26 | 2017-03-22 | 青岛伟林电子有限公司 | Mobile phone antenna and electroless plating technology thereof |
| CN107104091A (en) * | 2017-05-27 | 2017-08-29 | 华进半导体封装先导技术研发中心有限公司 | A kind of half embedment circuit substrate structure and its manufacture method |
| CN110499500A (en) * | 2019-08-29 | 2019-11-26 | 讯创(天津)电子有限公司 | A kind of production method of inorganic non-metallic material 5G three-dimensional laser carving antenna for mobile phone |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1582095A (en) * | 2003-08-06 | 2005-02-16 | 中国科学院福建物质结构研究所二部 | Mask-free ceramic base board interconnecting lead manufacturing technique |
| CN101808462A (en) * | 2009-02-13 | 2010-08-18 | 欣兴电子股份有限公司 | Wiring board and preparation method thereof |
| CN102695368A (en) * | 2011-03-23 | 2012-09-26 | 欣兴电子股份有限公司 | Manufacturing method of embedded circuit structure of circuit board |
| CN103281871A (en) * | 2013-06-09 | 2013-09-04 | 上海安费诺永亿通讯电子有限公司 | Electronic circuit manufacturing method |
| CN103442518A (en) * | 2013-08-02 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Manufacturing method of electronic circuit |
| CN103517570A (en) * | 2012-06-28 | 2014-01-15 | 贝尔罗斯(广州)电子部件有限公司 | Electronic circuit manufacturing method and shell body |
| CN104025724A (en) * | 2011-08-19 | 2014-09-03 | 全球第一电路技术公司 | Method of forming a conductive image on a non-conductive surface |
| CN104661441A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Laser activation technical method for producing PCB (printed circuit board) with additive process |
| CN104661449A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Hole metallization method based on laser activation technology |
-
2015
- 2015-12-08 CN CN201510893886.1A patent/CN105451456A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1582095A (en) * | 2003-08-06 | 2005-02-16 | 中国科学院福建物质结构研究所二部 | Mask-free ceramic base board interconnecting lead manufacturing technique |
| CN101808462A (en) * | 2009-02-13 | 2010-08-18 | 欣兴电子股份有限公司 | Wiring board and preparation method thereof |
| CN102695368A (en) * | 2011-03-23 | 2012-09-26 | 欣兴电子股份有限公司 | Manufacturing method of embedded circuit structure of circuit board |
| CN104025724A (en) * | 2011-08-19 | 2014-09-03 | 全球第一电路技术公司 | Method of forming a conductive image on a non-conductive surface |
| CN103517570A (en) * | 2012-06-28 | 2014-01-15 | 贝尔罗斯(广州)电子部件有限公司 | Electronic circuit manufacturing method and shell body |
| CN103281871A (en) * | 2013-06-09 | 2013-09-04 | 上海安费诺永亿通讯电子有限公司 | Electronic circuit manufacturing method |
| CN103442518A (en) * | 2013-08-02 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Manufacturing method of electronic circuit |
| CN104661441A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Laser activation technical method for producing PCB (printed circuit board) with additive process |
| CN104661449A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Hole metallization method based on laser activation technology |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106532240A (en) * | 2016-12-26 | 2017-03-22 | 青岛伟林电子有限公司 | Mobile phone antenna and electroless plating technology thereof |
| CN106532240B (en) * | 2016-12-26 | 2023-09-26 | 青岛伟林电子有限公司 | Mobile phone antenna and chemical plating process thereof |
| CN107104091A (en) * | 2017-05-27 | 2017-08-29 | 华进半导体封装先导技术研发中心有限公司 | A kind of half embedment circuit substrate structure and its manufacture method |
| CN107104091B (en) * | 2017-05-27 | 2019-07-05 | 华进半导体封装先导技术研发中心有限公司 | A kind of half is embedded to circuit substrate structure and its manufacturing method |
| CN110499500A (en) * | 2019-08-29 | 2019-11-26 | 讯创(天津)电子有限公司 | A kind of production method of inorganic non-metallic material 5G three-dimensional laser carving antenna for mobile phone |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI445474B (en) | Manufacturing method of plastic metallized three - dimensional line | |
| KR101940467B1 (en) | Resin substrate having metal film pattern formed thereon | |
| CN105451456A (en) | Manufacturing method for non-conductive base material conductor circuit | |
| KR101250932B1 (en) | An antenna for mobile electronics and the producing method thereof | |
| JP2014089689A (en) | Touch panel and method of manufacturing the same | |
| US20090308645A1 (en) | Printed circuit board and manufacturing method thereof | |
| KR20150086811A (en) | Method for metal plating on synthetic resin product | |
| JP6250903B2 (en) | Manufacturing method of three-dimensional conductive pattern structure and three-dimensional molding material used therefor | |
| RU2017124202A (en) | ELECTRIC WIRING SPLITTER AND WAYS OF ITS PRODUCTION AND APPLICATION | |
| CN104419916A (en) | Manufacturing method of chemical nickel palladium gold plating plated with thick palladium | |
| JP5584676B2 (en) | Manufacturing method of plastic metallized solid wiring | |
| KR20150118173A (en) | Method for depositing a first metallic layer onto non-conductive polymers | |
| JP2007305982A (en) | Method of producing printed board for formation of fine circuit | |
| CN115023059B (en) | Manufacturing method of conformal conductive circuit on surface of dielectric material | |
| TWI423751B (en) | Method of manufacturing three - dimensional circuit | |
| JP3925724B2 (en) | Surface treatment method for non-conductive materials | |
| KR20220116955A (en) | Ink composition for plating and manufacturing method of printed circuit board using same | |
| WO2002099163A2 (en) | Autocatalytic coating method | |
| CN217241029U (en) | Multilayer electronic circuit | |
| CN104470235A (en) | Method for manufacturing antenna circuit | |
| KR101557276B1 (en) | Antenna for mobile device and the manufacturing method thereof | |
| KR20190109940A (en) | Method for manufacturing plastic electicity parts having electric circuit by multi resin materials print | |
| CN106255324A (en) | A kind of method improving metal-base printed wiring board electrosilvering surface brightness | |
| US9520644B2 (en) | Antenna and communication apparatus as well as manufacturing method for antenna | |
| KR20160142764A (en) | Plating method for printed layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160330 |
|
| WD01 | Invention patent application deemed withdrawn after publication |