CN207835908U - A kind of flexible circuit board - Google Patents
A kind of flexible circuit board Download PDFInfo
- Publication number
- CN207835908U CN207835908U CN201820103266.2U CN201820103266U CN207835908U CN 207835908 U CN207835908 U CN 207835908U CN 201820103266 U CN201820103266 U CN 201820103266U CN 207835908 U CN207835908 U CN 207835908U
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- Prior art keywords
- layer
- circuit board
- flexible circuit
- conductive adhesive
- adhesive layer
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Abstract
The utility model discloses a kind of flexible circuit board, including insulating layer, gluing oxidant layer, conductive adhesive layer and the metal copper layer set gradually from bottom to up, and the pattern of the conductive adhesive layer is consistent with line pattern, and the pattern of the metal copper layer is consistent with line pattern.Compared to existing flexible circuit board, the utility model have many advantages, such as more slimming, it is at low cost, prepare it is simple and environmentally-friendly.
Description
Technical field
The flexible circuit board that the utility model is related to be used in a kind of electronic product.
Background technology
With the fast development of electronic industry, market major differentiation, the flexibility circuit plate material used in electronic product
It is required that increasingly slimming, multifunction, the strict demand of environmental pollution and making full use of for resource.Flexible circuit board at present
Required line pattern is first turned copper-clad plate through photosensitive dry film by the subtractive processes being etched using flexible copper-clad plate in production
Move to copper coin surface, it is developed, etch, move back film, washing, drying are fabricated to required line pattern, generated in technique a large amount of useless
Water, waste liquid pollute the environment, and since erosion amount of copper is big, is formed and are wasted to resource.
Utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies of the prior art and provide a kind of more slimming, cost
It is low, prepare simple and environmentally-friendly flexible circuit board.
In order to solve the above technical problems, the utility model uses following technical scheme：
A kind of flexible circuit board, including the insulating layer, gluing oxidant layer, conductive adhesive layer and the metallic copper that set gradually from bottom to up
Layer, the pattern of the conductive adhesive layer is consistent with line pattern, and the pattern of the metal copper layer is consistent with line pattern.
Preferably, the insulating layer is one kind in polyimide film, polyethylene terephthalate film layer.
Preferably, the thickness of the insulating layer is 5 μm~25 μm.
Preferably, the gluing oxidant layer is one kind in epoxy binder modified layer, polypropylene acid gluing oxidant layer.
Preferably, the thickness of the gluing oxidant layer is 1 μm~10 μm.
Preferably, the material of the conductive adhesive layer is one kind in conductive silver paste, electrically conductive ink.
Preferably, the thickness of the conductive adhesive layer is 1 μm~5 μm.
Preferably, the thickness of the metal copper layer is 1 μm~12 μm
Compared with prior art, the utility model has the advantage of：
The flexible circuit board of the utility model, including the insulating layer, gluing oxidant layer, the conductive adhesive layer that set gradually from bottom to up
And metal copper layer, the pattern of conductive adhesive layer is consistent with line pattern, and the pattern of metal copper layer is consistent with line pattern.By by glue
Adhesive layer is coated on surface of insulating layer through precision coating machine, again by conductive adhesive layer intaglio printing after the solidification of gluing oxidant layer drying
Line pattern is imprinted on adhesive layer side by machine, conductive adhesive layer completion of cure after drying.It will be formed with conducting resinl line map again
The film of case, in conductive adhesive layer surface deposited metal copper, the utility model can be formed after washing is dried by electroplating technology
Flexible circuit board with conducting function.Only the line electricity be connected will be needed to plate layers of copper since such method makes wiring board,
Reduce the usage amount of copper material, and multiple working procedure is saved compared with traditional circuit plate manufacture craft, due to gluing oxidant layer and insulating layer
There is good flexibility with conductive adhesive layer, bonding force is strong, and qualitative reliability is high.Simultaneously compared with traditional handicraft due to being not required to by erosion
Groove road, reduces wastewater treatment, and spent etching solution processing has better environment protecting.New manufacture craft is conducive to make more
The product of slimming meets the application demand that modern electronic product is light, thin, short, small.Simultaneously because production cost is lower, favorably
In the raising market competitiveness.
Description of the drawings
Fig. 1 is the cross-sectional view of the utility model embodiment 1.
Specific implementation mode
The utility model is further described below in conjunction with specific preferred embodiment, but does not therefore limit this reality
With novel protection domain.
Embodiment 1：
As shown in Figure 1, a kind of flexible circuit board of the utility model, including the insulating layer 4, the glue that set gradually from bottom to up
Adhesive layer 3, conductive adhesive layer 2 and metal copper layer 1, the pattern of conductive adhesive layer 2 is consistent with line pattern, the pattern of metal copper layer 1 with
Line pattern is consistent.Insulating layer 4 is PI (polyimides) film, and thickness is 7 μm, and gluing oxidant layer 3 is epoxy binder modified, thickness
It it is 3 μm, conductive adhesive layer 2 is conductive silver paste, and thickness is 1 μm, and metal copper layer 1, thickness is 5 μm.
The preparation process of the flexible circuit board of the present embodiment, includes the following steps：
(1) it first passes through and adhesive is coated on 4 surface of insulating layer through precision coating machine, obtained after the solidification of adhesive drying
Gluing oxidant layer 3.
(2) line pattern is imprinted on 3 surface of gluing oxidant layer by conducting resinl with intaglio press again, conducting resinl is solid after drying
Change obtains conductive adhesive layer 2 completely.
(3) film for being formed with conducting resinl line pattern is finally deposited into gold by electroplating technology on 3 surface of conductive adhesive layer
Belong to copper, form metal copper layer 1, the flexible circuit board with conducting function of the utility model is obtained after washing is dried.
Embodiment 2：
A kind of flexible circuit board of the utility model, including set gradually from bottom to up insulating layer 4, gluing oxidant layer 3, lead
Electric glue-line 2 and metal copper layer 1, the pattern of conductive adhesive layer 2 is consistent with line pattern, pattern and the line pattern one of metal copper layer 1
It causes.Insulating layer 4 be PET (polyethylene terephthalate) film, thickness be 25 μm, gluing oxidant layer 3 be it is epoxy binder modified,
Thickness is 3 μm, and conductive adhesive layer 2 is conductive silver paste, and thickness is 1 μm, and 1 thickness of metal copper layer is 12 μm.
The preparation method of the flexible circuit board of the present embodiment is identical as embodiment.
It is it is necessary to described herein finally：Above example is served only for making the technical solution of the utility model further
It explains in detail, should not be understood as the limitation to scope of protection of the utility model, those skilled in the art is new according to this practicality
Some nonessential modifications and adaptations that the above of type is made belong to the scope of protection of the utility model.Finally it is necessary to
It is described herein to be：Above example is served only for being described in more detail the technical solution of the utility model, Bu Nengli
Solution is the limitation to scope of protection of the utility model, and those skilled in the art's the above according to the present utility model is made
Some nonessential modifications and adaptations belong to the scope of protection of the utility model.
Claims (8)
1. a kind of flexible circuit board, which is characterized in that including set gradually from bottom to up insulating layer (4), gluing oxidant layer (3),
The pattern of conductive adhesive layer (2) and metal copper layer (1), the conductive adhesive layer (2) is consistent with line pattern, the metal copper layer (1)
Pattern it is consistent with line pattern.
2. flexible circuit board according to claim 1, which is characterized in that the insulating layer (4) is polyimide film, gathers
One kind in ethylene glycol terephthalate film layer.
3. flexible circuit board according to claim 2, which is characterized in that the thickness of the insulating layer (4) is 5 μm~25 μ
m。
4. flexible circuit board according to claim 1, which is characterized in that the gluing oxidant layer (3) is modified epoxy gluing
One kind in oxidant layer, polypropylene acid gluing oxidant layer.
5. flexible circuit board according to claim 4, which is characterized in that the thickness of the gluing oxidant layer (3) is 1 μm~10
μm。
6. according to Claims 1 to 5 any one of them flexible circuit board, which is characterized in that the material of the conductive adhesive layer (2)
For one kind in conductive silver paste, electrically conductive ink.
7. flexible circuit board according to claim 6, which is characterized in that the thickness of the conductive adhesive layer (2) is 1 μm~5 μ
m。
8. flexible circuit board according to claim 7, which is characterized in that the thickness of the metal copper layer (1) is 1 μm~12
μm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820103266.2U CN207835908U (en) | 2018-01-22 | 2018-01-22 | A kind of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820103266.2U CN207835908U (en) | 2018-01-22 | 2018-01-22 | A kind of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207835908U true CN207835908U (en) | 2018-09-07 |
Family
ID=63394055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820103266.2U Active CN207835908U (en) | 2018-01-22 | 2018-01-22 | A kind of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207835908U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195346A (en) * | 2018-10-15 | 2019-01-11 | 安徽银点电子科技有限公司 | A kind of preparation method of printed circuit board |
-
2018
- 2018-01-22 CN CN201820103266.2U patent/CN207835908U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195346A (en) * | 2018-10-15 | 2019-01-11 | 安徽银点电子科技有限公司 | A kind of preparation method of printed circuit board |
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