CN101511150B - Gold plating technique for secondary line of PCB board - Google Patents
Gold plating technique for secondary line of PCB board Download PDFInfo
- Publication number
- CN101511150B CN101511150B CN2009101059938A CN200910105993A CN101511150B CN 101511150 B CN101511150 B CN 101511150B CN 2009101059938 A CN2009101059938 A CN 2009101059938A CN 200910105993 A CN200910105993 A CN 200910105993A CN 101511150 B CN101511150 B CN 101511150B
- Authority
- CN
- China
- Prior art keywords
- gold
- plated
- pcb board
- gold plating
- gilding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a PCB quadric line gilding technique which includes steps as follows: A. first gilding: forming a first gilding layer to the line passing first figure transferring on the PCB surface; B. adhering film: adhering anti-gild film on the first gilding layer for exposing the position that does not reach the gilding thickness requirement; C. quadric gilding: gilding the PCB afteradhering film for making above exposing position, namely the position that the gilding layer thickness does not reach requirement, reaching the thickness requirement. Compared with the prior art, thetechnique provided by the invention avoids problem that the prior gilding art uses the maximun thickness region as a base for making the whole PCB having same and maximum gilding thickness. The technique provided by the invention reduces gold waste greatly, reduces producing cost for preparing PCB.
Description
Technical field:
The present invention relates to the pcb board gold plating technique for secondary line.
Background technology:
PCB (Printed Circuit Board), Chinese is a printed wiring board, is called for short printed board, is one of vitals of electronics industry.Every kind of electronic equipment almost arrives computer greatly for a short time to electronic watch, calculator, the communication electronic equipment, and military armament systems as long as electronic devices and components such as integrated circuit are arranged, for the electric interconnection between them, all will use printed board.In relatively large electronic product research process, the most basic success factor is design, documentation and the manufacturing of the printed board of this product.The design of printed board and workmanship directly have influence on the quality and the cost of entire product, even cause the success or failure of commercial competition.
And plating is the important process in the pcb board manufacture process, especially gold-plated for often needing on some precision instruments such as the pcb boards such as computer CPU, memory bar, this mainly is because gold utensil has characteristics such as good solderability, oxidative resistance, corrosion stability and contact resistance are little, resistance to wear is good; By purpose gold-plated on pcb board is for anti-oxidation.
Pcb board is gold-plated according to different requirements at present, the gold-plated thickness of zones of different requires different sometimes on the plate, especially require gold plating thickness to require different situations for zones of different in the same circuit, adopt present conventional PCB craft of gilding also can't realize, generally run into this situation, all be to adopt Zone Full to satisfy the gold plating thickness in thick zone to require to carry out gold-plated, will cause waste like this, cause production cost seriously to rise.
Summary of the invention:
Can't realize the problem that the zones of different gold plating thickness is different for solving in the prior art, the invention provides a kind of pcb board gold plating technique for secondary line,, avoid causing waste, reduce production cost, satisfy design and quality requirements simultaneously again to improve the utilance of gold.
For achieving the above object, the present invention is mainly by the following technical solutions:
A kind of pcb board gold plating technique for secondary line may further comprise the steps:
A, for the first time gold-plated: carry out gold-plated coating by the circuit of electroplating the pcb board surface process figure transfer first time, form first Gold plated Layer;
B, pad pasting: on first Gold plated Layer, paste anti-plated film, the position that does not reach the gold plating thickness requirement is exposed;
C, for the second time gold-plated: the pcb board behind the pad pasting is carried out once more gold-plated, make the gold plating thickness at the not enough place of above-mentioned exposed locations gold plating thickness reach requirement.
Wherein step B specifically comprises:
B1, by laminator pad pasting on pcb board first Gold plated Layer;
B2, by the UV ultraviolet light pcb board of pad pasting is exposed, the anti-plated film that makes gold plating thickness on the pcb board reach the requirement position carries out photocuring, and the anti-plated film that gold plating thickness does not reach the requirement position then is not cured;
B3, chemical development is sprayed the above-mentioned anti-plated film that has sticked on first Gold plated Layer, do not make, expose the position that gold plating thickness does not reach requirement by the anti-plated film dissolving of photocuring.
Wherein in for the first time gold-plated back pcb board being carried out cleaning, drying handles.
Wherein said anti-plated film is the photoresist dry film.
Wherein also comprise after the step C: soak in the sodium hydroxide solution with the pcb board immersion 5～10% after for the second time gold-plated and cleaned in 1 minute, remove anti-plated film.
The method that the present invention is gold-plated by gradation and the employing selectivity is covered the pcb board subregion, make the gold plating thickness difference of zones of different part on the pcb board, compared with prior art, the present invention has avoided in the past, and gold plating thickness is a benchmark to require the thickest zone, make the same and the thickest problem of whole pcb board gold plating thickness, reduce golden waste greatly, reduced the production cost of making in the PCB process.
Embodiment:
Core concept of the present invention is: at first make pcb board by the figure conversion process, and this pcb board circuit carried out overgild, form first Gold plated Layer on the circuit, the thickness of first Gold plated Layer is benchmark to require gold-plated minimal thickness on the pcb board, by cleaning machine pcb board being carried out cleaning, drying then handles, and on pcb board first Gold plated Layer, paste anti-plated film by laminator, carry out photocuring to pasting anti-coating film area then, here only gold plating thickness is met the requirements of the zone carries out photocuring, photocuring is not then carried out in the zone that does not reach the gold plating thickness requirement, to there be the anti-plated film development of the position of photocuring to remove and make it exposed after this, it is gold-plated to carry out the second time, makes the golden layer thickness of exposed region reach requirement.
For setting forth thought of the present invention and principle, the present invention is described further below in conjunction with specific embodiment.
The invention provides a kind of pcb board gold plating technique for secondary line, zones of different requires the different problem of gold plating thickness on the present pcb board to solve, and to avoid the waste of gold in the gold-plated process, reduces gold-plated cost.
The present invention specifically adopts step as follows:
A, for the first time gold-plated: by electroplating the pcb board surface lines is carried out gold-plated coating, form first Gold plated Layer;
Before for the first time gold-plated, be covered with Copper Foil on the PCB substrate, make the PCB figure by figure transfer, contain pad pasting, exposure, development in the process, the PCB figure that figure transfer is produced carries out carrying out in the immersion plating liquid electrolytic gold plating, make the circuit surface form first Gold plated Layer, purpose is in order to prevent circuit copper layer oxidation on the pcb board.
Because the plated thickness of zones of different has different requirements on the pcb board, for the plated thickness that guarantees the zones of different position reaches requirement, and the while is not wasted gold, therefore carry out photocuring and cover by pasting zone that anti-plated film will meet the requirements of plated thickness once more, and the anti-plated film that this moment, plated thickness did not meet the requirements of the position is not developed removal by photocuring, is exposed, and plated thickness does not meet the requirements of the position and carries out once more gold-plated.
After gold-plated finishing for the first time, also need the surface of pcb board is handled in addition, clean up by cleaning machine, and dry, enter step B then by the oven dry section that cleaning machine itself carries.
B, pad pasting: on first Gold plated Layer, paste anti-plated film, the position that does not reach the gold plating thickness requirement is exposed;
After the cleaning, drying processing, on pcb board first Gold plated Layer, carry out pad pasting by laminator, the anti-plated film here is preferably the photoresist dry film, wherein pad pasting adopts special-purpose laminator, at first pcb board was transmitted between the upper and lower silica gel pinch roller of laminator, control temperature and pressure simultaneously, anti-plated film is sticked on the pcb board face.
Make the plate making egative film then, comprise white portion and black region two parts here on the plate making egative film, wherein white portion is mainly corresponding to the satisfactory zone of gold plating thickness on the pcb board; The black region part does not then reach the zone of requirement corresponding to gold plating thickness on the pcb board, then the plate making egative film is sticked on the pcb board that is coated with anti-plated film.
Then, by UV ultraviolet photo-curing machine pcb board is carried out photocuring, make the anti-plated film that is pasted with plate making egative film white portion position carry out photocuring, plate making egative film black hides the anti-plated film of part then not by photocuring.
On through the pcb board behind the photocuring, spray chemical development, then unaffected by the zone of photocuring, then can not dissolved by the anti-plated film of photocuring, expose the position that gold plating thickness on the pcb board does not reach requirement.
C, for the second time gold-plated: the pcb board behind the pad pasting is carried out once more gold-plated, making above-mentioned exposed locations is that the gold plating thickness that plated thickness does not meet the requirements of the position reaches requirement.
When gold plating thickness on the pcb board do not reach the position of requirement exposed after, this pcb board activated to carry out the second time more gold-plated, gold-plated process is for the second time: at first with in the pcb board immersion plating liquid, electroplate, make the gold layer continuation of exposed part gold-plated, and finally reach the gold plating thickness requirement.
After gold-plated the finishing, satisfied the different plated thickness requirements of zones of different for the second time, then needed this moment to soak in the sodium hydroxide solution with pcb board immersion 5～10% and cleaned in 1 minute, to remove anti-plated film.
As can be seen from the above description, the present invention passes through gold plating technique for secondary line, solved that plated thickness differs in the prior art, the problem that the gold waste is serious, the present invention is divided into for the technique effect that the solution prior art produces: realized that plated thickness is made on request on the pcb board, reduce golden waste, improved golden utilance, saved production cost.
More than pcb board gold plating technique for secondary line provided by the present invention is described in detail, used specific case herein principle of the present invention and implementation method have been set forth, more than implemented an explanation of example and just be used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change on specific implementation method and range of application, in sum, this description should not be construed as limitation of the present invention.
Claims (5)
1. pcb board gold plating technique for secondary line is characterized in that may further comprise the steps:
A, for the first time gold-plated: carry out gold-plated coating by the circuit of electroplating the pcb board surface process figure transfer first time, form first Gold plated Layer;
B, pad pasting: on first Gold plated Layer, paste anti-plated film, the position that does not reach the gold plating thickness requirement is exposed;
C, for the second time gold-plated: the pcb board behind the pad pasting is carried out once more gold-plated, make the gold plating thickness at the not enough place of above-mentioned exposed locations gold plating thickness reach requirement.
2. pcb board gold plating technique for secondary line according to claim 1 is characterized in that step B specifically comprises:
B1, by laminator pad pasting on pcb board first Gold plated Layer;
B2, by the UV ultraviolet light pcb board of pad pasting is exposed, the anti-plated film that makes gold plating thickness on the pcb board reach the requirement position carries out photocuring, and the anti-plated film that gold plating thickness does not reach the requirement position then is not cured;
B3, chemical development is sprayed the above-mentioned anti-plated film that has sticked on first Gold plated Layer, do not make, expose the position that gold plating thickness does not reach requirement by the anti-plated film dissolving of photocuring.
3. pcb board gold plating technique for secondary line according to claim 1 is characterized in that in for the first time gold-plated back pcb board being carried out cleaning, drying handles.
4. pcb board gold plating technique for secondary line according to claim 1 and 2 is characterized in that described anti-plated film is the photoresist dry film.
5. pcb board gold plating technique for secondary line according to claim 1 is characterized in that also comprising after the step C: soak in the sodium hydroxide solution with the pcb board immersion 5～10% after for the second time gold-plated and cleaned in 1 minute, remove anti-plated film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101059938A CN101511150B (en) | 2009-03-12 | 2009-03-12 | Gold plating technique for secondary line of PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101059938A CN101511150B (en) | 2009-03-12 | 2009-03-12 | Gold plating technique for secondary line of PCB board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101511150A CN101511150A (en) | 2009-08-19 |
| CN101511150B true CN101511150B (en) | 2011-03-16 |
Family
ID=41003367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101059938A Active CN101511150B (en) | 2009-03-12 | 2009-03-12 | Gold plating technique for secondary line of PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101511150B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002666B (en) * | 2011-09-08 | 2017-07-18 | 深圳市励高表面处理材料有限公司 | A kind of method for washing of printed circuit board acidic plating nickel gold |
| CN103068177A (en) * | 2011-10-19 | 2013-04-24 | 上海嘉捷通信息科技有限公司 | Printed-board selective thick gold plating manufacturing method |
| CN102586765B (en) * | 2012-03-20 | 2014-09-10 | 深圳市景旺电子股份有限公司 | Method for chemical nickel-plating and gold immersion on FPC (Flexible Printed Circuit) |
| CN104470233A (en) * | 2014-11-21 | 2015-03-25 | 广州杰赛科技股份有限公司 | Printed wiring board containing gold at different thicknesses and manufacturing method thereof |
| CN109831880A (en) * | 2019-03-11 | 2019-05-31 | 厦门华天华电子有限公司 | A kind of processing technology of FPC electroplated layer |
| CN110257806A (en) * | 2019-06-26 | 2019-09-20 | 捷奈斯科技（深圳）有限公司 | A kind of layering gold plating method for micromotor pcb board |
-
2009
- 2009-03-12 CN CN2009101059938A patent/CN101511150B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101511150A (en) | 2009-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101511150B (en) | Gold plating technique for secondary line of PCB board | |
| CN107567196B (en) | Method for manufacturing top nickel-palladium-gold and bottom hard gold plate | |
| CN101702869B (en) | Method for directly producing circuit boards from insulated substrate without cladding copper | |
| CN110536564B (en) | Method for manufacturing circuit board with boss as bonding pad | |
| CN103582304A (en) | Transparent printed circuit board and manufacturing method thereof | |
| CN101594743A (en) | Method with manufacturing outer graphics of electronic circuit board by encapsulation | |
| CN111065214B (en) | Circuit board cover film laminating process | |
| CN104582319A (en) | Metallized semi-hole forming method and printed circuit board manufacturing method | |
| TWI529068B (en) | Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby | |
| CN114222434B (en) | Manufacturing method of ladder circuit and circuit board | |
| CN104812171A (en) | Printed circuit board and processing method thereof | |
| WO2015182881A1 (en) | Directly-plated conductive thin film material and method for manufacturing same | |
| CN105704948A (en) | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN101534608B (en) | Manufacturing method of flexible circuit board | |
| CN102480844B (en) | Process for manufacturing diffusion coating prevention PCB (printed circuit board) gold-plated board | |
| KR20110009790A (en) | Flexible printed circuit board and method for manufacturing the same | |
| KR100852406B1 (en) | a PCB manufacturing method | |
| CN110572952A (en) | Film covering method of ultrathin 5G copper-clad plate and preparation method of copper-clad plate | |
| KR101596098B1 (en) | The manufacturing method of printed circuit board | |
| KR102275538B1 (en) | Surface Treatment Method of Stainless Steel Plate for Using FPCB Reinforcement | |
| CN103717015B (en) | Flexible printed circuit board manufacture method | |
| KR20110110664A (en) | Manufacturing method of double-sided printed circuit board | |
| CN102223764A (en) | Manufacturing method of flexible circuit boards | |
| CN103607849A (en) | Method for manufacturing metal base stepped slot | |
| CN114375097B (en) | Processing technology of packaging substrate for sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |