CN201524803U - Recycling system for copper in electroless copper waste liquid - Google Patents
Recycling system for copper in electroless copper waste liquid Download PDFInfo
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- CN201524803U CN201524803U CN201020112247XU CN201020112247U CN201524803U CN 201524803 U CN201524803 U CN 201524803U CN 201020112247X U CN201020112247X U CN 201020112247XU CN 201020112247 U CN201020112247 U CN 201020112247U CN 201524803 U CN201524803 U CN 201524803U
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Abstract
The utility model discloses a recycling system for copper in electroless copper waste liquid, which comprises an oil removing unit, a microetching unit, a preimpregnation/activating unit, an electroless copper groove and an electroless copper waste liquid recovery groove. The recycling system is characterized in that the electroless copper waste liquid recovery groove is arranged beside the electroless copper groove so as to lead electroless copper waste liquid to enter the recovery groove, copper powder which is remained after cleaning the groove at a time is then added into the recovery groove and is sufficiently reacted to frequently consume copper ions in the waste liquid so as to achieve a removing purpose, simultaneously, the waste liquid can be recycled, and after the waste liquid is clear, clear water is discharged into a waste water treatment portion to be treated. Compared with the prior art, the recycling system further treats the waste liquid in the electroless copper waste liquid recovery groove, and then leads copper content in the waste water to achieve discharge standards.
Description
Technical field
The utility model relates to the recycling system of copper in a kind of electroless copper plating waste liquid.
Background technology
It is a kind of autocatalysis redox reaction that electroless copper (Eletcroless Plating Copper) also is heavy copper or holeization (PTH) usually.At first use Treatment with activating agent, make insulating substrate surface absorption last layer activity the common usefulness of particle be the Metal Palladium particle, copper ion at first is reduced on these active Metal Palladium particles, and the metallic copper nucleus that these are reduced itself becomes the Catalytic Layer of copper ion, makes the reduction reaction of copper continue to carry out on these new copper nucleating surfaces.Electroless copper has obtained using widely in the PCB manufacturing industry, and at present maximum is the hole metallization that carries out PCB with electroless copper.The technological process of PCB hole metallization is as follows: boring → nog plate deburring → upper plate → whole hole cleaning → two washings → microetch chemical roughen → two washing → pre-preg → colloid palladium activation processing → two washings → dispergation is handled (acceleration) → two washings → heavy copper → two washing → lower plates → upper plate → pickling → one time copper → washing → lower plate → oven dry.
And in the electroless copper plating process, be accompanied by the interpolation and the discharging of material, and have a large amount of electroless copper plating waste liquids to produce, owing to contain bond EDTA or tartrate in these waste liquids, therefore need carry out contact break and handle.But the conventional treatment method for the electroless copper plating waste liquid is by entering wastewater treatment portion in conjunction with the discharge of wastewater pipeline, according to handling in conjunction with method of wastewater treatment at present.Because contain bond in the electroless copper plating waste liquid, so intractable, the higher phenomenon of copper content in the efflux wastewater appears through regular meeting.
Summary of the invention
In view of this, the purpose of this utility model is to provide the recycling system of copper in a kind of electroless copper plating waste liquid, to solve the higher problem of copper content in the present efflux wastewater.
For achieving the above object, the utility model is mainly by the following technical solutions:
The recycling system of copper in a kind of electroless copper plating waste liquid, comprise: oil removing unit, microetch unit, preimpregnation/activation unit, heavy copper groove and heavy copper waste liquid accumulator tank, wherein the oil removing unit is used to remove pcb board face greasy dirt, and pcb board hole wall base material is carried out the polarity adjustment; The microetch unit is used to remove the pcb board face oxide by after the oil removing cell processing, and the pcb board face is carried out alligatoring; Preimpregnation/activation unit is used for activating through the pcb board after the microetch cell processing, and heavy copper groove sink the copper processing to pcb board; Electroless copper plating waste liquid accumulator tank is connected with heavy copper groove, the waste liquid of the copper groove of drowning oneself to collect.
Also be provided with two or three stage countercurrent rinse unit between described oil removing unit and the microetch unit.
Also be provided with secondary countercurrent rinsing unit between described microetch unit and the preimpregnation/activation unit.
Be provided with the dispergation unit between described preimpregnation/activation unit and the heavy copper groove.
Also be connected with the washing unit on the described heavy copper groove.
The utility model is installed an electroless copper plating waste liquid accumulator tank by the next door at the electroless copper plating groove, the electroless copper plating waste liquid is entered in this accumulator tank, in accumulator tank, add residual copper powder behind each clear groove then, it is fully reacted, consume the copper ion in the waste liquid gradually, reach the purpose of removal, recyclable again waste liquid treats that after the waste liquid color becomes clearly clear liquid being entered wastewater treatment portion handles simultaneously.Compared with prior art, the utility model is done further processing to waste liquid in heavy copper waste liquid accumulator tank, makes that copper content reaches discharge standard in the waste water.
Description of drawings
Fig. 1 is a system block diagram of the present utility model.
The specific embodiment
For setting forth thought of the present utility model and purpose, the utility model is described further below in conjunction with the drawings and specific embodiments.
See also shown in Figure 1ly, Fig. 1 is a system block diagram of the present utility model.Wherein the utility model provides the recycling system of copper in a kind of electroless copper plating waste liquid, comprise: oil removing unit, microetch unit, preimpregnation/activation unit, heavy copper groove and heavy copper waste liquid accumulator tank, wherein the oil removing unit is used to remove pcb board face greasy dirt, and pcb board hole wall base material is carried out the polarity adjustment; The microetch unit is used to remove the pcb board face oxide by after the oil removing cell processing, and the pcb board face is carried out alligatoring; Preimpregnation/activation unit is used for activating through the pcb board after the microetch cell processing, and heavy copper groove is collected from the waste liquid of preimpregnation/activation unit; Electroless copper plating waste liquid accumulator tank is connected with heavy copper groove.
Wherein the oil removing unit is mainly alkaline degreasing, is used to remove plate face greasy dirt, finger mark, oxide, dust in the hole; The hole wall base material is carried out the absorption that colloid palladium in the operation of back is convenient in polarity adjustment (making hole wall be adjusted into positive charge by negative electrical charge), and to avoid heavy copper weak effect backlight, the hole wall adhesion is poor, and the oil removing of plate face is unclean, is easy to generate decortication foaming phenomenon.
Need wash processing by two or three stage countercurrent rinse unit through the plate after the oil removing cell processing, with the copper ion contaminate subsequent microetch cell processing liquid of avoiding bringing into.
The purpose of microetch unit is to remove the oxide of plate face, and alligatoring plate face guarantees at the bottom of follow-up heavy copper layer and the base material good bonding force between the copper; Make newly-generated copper face have very strong activity, can fine absorption colloid palladium; What adopt usually is chemical microetch method, handle (etch depth is the 2-3 micron) by the copper surface being carried out etch, the surface that makes the copper surface produce rough micro-rough band activity, thus guarantee between chemical plating copper layer and the Copper Foil matrix firm bond strength is arranged.
Wash by secondary countercurrent rinsing unit through the plate after the processing of microetch unit deoxidation microetch, the copper ion polluter that the plate face carries is removed, handle to carry out follow-up preimpregnation/activation unit.
Preimpregnation/activation unit: preimpregnation mainly is the pollution that protection palladium groove is avoided the pre-treatment tank liquor, prolong the service life of palladium groove, main component is consistent with palladium groove composition except that palladium bichloride, but the effective wetting hole wall is convenient to follow-up activating solution and is in time entered in the hole activation and make it to carry out enough effectively to activate; After the adjustment of pre-treatment alkaline degreasing polarity, the hole wall of positively charged can effectively adsorb the colloid palladium particle that enough has negative electrical charge, to guarantee the uniformity of follow-up heavy copper, continuity and compactness; Palladium bichloride in the activating solution exists with colloidal form, and this electronegative colloidal solid can guarantee that the stannous ion of sufficient amount and chlorion are to prevent the colloid palladium dispergation.
Also to wash after preimpregnation/activation unit, carry out the dispergation processing by the dispergation unit afterwards through secondary countercurrent rinsing unit.
Can effectively remove the stannous ion of colloid palladium particle surrounded by dispergation, palladium nuclear in the colloidal solid is come out, with directly effectively catalysis startup electroless copper plating reaction, because tin is amphotere, its salt not only is dissolved in acid but also be dissolved in alkali, so soda acid all can make degumming agent, but alkali is comparatively responsive to water quality, easily produce precipitation or suspension, very easily cause heavy copper hole broken; Hydrochloric acid and sulfuric acid are strong acid, not only unfavorable with make multi-layer sheet because strong acid can be attacked the black oxide layer of internal layer, and cause dispergation excessive easily, the colloid palladium particle is disintegrated down from hole wall plate face; The much more general fluoboric acid that use are made main degumming agent, because of its acidity a little less than, generally do not cause dispergation excessive, and experimental results show that when using fluoboric acid to make degumming agent, the adhesion and the effect backlight of heavy copper layer, compactness all is significantly improved.
Wash through secondary countercurrent rinsing unit behind the dispergation, and will wash the back plate and be put into and sink copper in the heavy copper groove, its main process is to bring out the electroless copper plating self-catalyzed reaction by the activation of palladium nuclear, newly-generated chemical copper and byproduct of reaction hydrogen can be as the catalysts catalytic reactions, heavy copper reaction is constantly carried out, by can on plate face or hole wall, depositing one deck chemical copper after this step process.
Behind the heavy copper with discharging of waste liquid in electroless copper plating waste liquid accumulator tank, in accumulator tank, add residual copper powder behind each clear groove then, it is fully reacted, consume the copper ion in the waste liquid gradually, reach the purpose of removal, recyclable again waste liquid treats that after the waste liquid color becomes clearly clear liquid being entered wastewater treatment portion handles simultaneously.
More than be that recycling system to copper in a kind of electroless copper plating waste liquid provided by the utility model is described in detail, used specific case herein structural principle of the present utility model and embodiment are set forth, above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (5)
1. the recycling system of copper in the electroless copper plating waste liquid, it is characterized in that comprising: oil removing unit, microetch unit, preimpregnation/activation unit, heavy copper groove and heavy copper waste liquid accumulator tank, wherein the oil removing unit is used to remove pcb board face greasy dirt, and pcb board hole wall base material is carried out the polarity adjustment; The microetch unit is used to remove the pcb board face oxide by after the oil removing cell processing, and the pcb board face is carried out alligatoring; Preimpregnation/activation unit is used for activating through the pcb board after the microetch cell processing, and heavy copper groove sink the copper processing to pcb board; Electroless copper plating waste liquid accumulator tank is connected with heavy copper groove, the waste liquid of the copper groove of drowning oneself to collect.
2. the recycling system of copper in the electroless copper plating waste liquid according to claim 1 is characterized in that also being provided with between described oil removing unit and the microetch unit two or three stage countercurrent rinse unit.
3. the recycling system of copper in the electroless copper plating waste liquid according to claim 1 is characterized in that also being provided with between described microetch unit and the preimpregnation/activation unit secondary countercurrent rinsing unit.
4. the recycling system of copper in the electroless copper plating waste liquid according to claim 1 is characterized in that being provided with the dispergation unit between described preimpregnation/activation unit and the heavy copper groove.
5. the recycling system of copper in the electroless copper plating waste liquid according to claim 1 is characterized in that also being connected with the washing unit on the described heavy copper groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020112247XU CN201524803U (en) | 2010-02-04 | 2010-02-04 | Recycling system for copper in electroless copper waste liquid |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020112247XU CN201524803U (en) | 2010-02-04 | 2010-02-04 | Recycling system for copper in electroless copper waste liquid |
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| CN201524803U true CN201524803U (en) | 2010-07-14 |
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| CN201020112247XU Expired - Fee Related CN201524803U (en) | 2010-02-04 | 2010-02-04 | Recycling system for copper in electroless copper waste liquid |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN103243316A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Preservation method of recycled copper deposition liquid |
| CN104152875A (en) * | 2014-08-25 | 2014-11-19 | 志超科技（遂宁）有限公司 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
| CN104519670A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Production process of curved circuit board |
| CN106572608A (en) * | 2016-10-31 | 2017-04-19 | 芜湖赋兴光电有限公司 | Electroless plating copper technology for flexible circuit board of camera module group |
-
2010
- 2010-02-04 CN CN201020112247XU patent/CN201524803U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN103243316A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Preservation method of recycled copper deposition liquid |
| CN103243316B (en) * | 2013-04-22 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | A kind of store method reclaiming heavy copper liquid |
| CN104152875A (en) * | 2014-08-25 | 2014-11-19 | 志超科技（遂宁）有限公司 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
| CN104519670A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Production process of curved circuit board |
| CN104519670B (en) * | 2014-12-18 | 2019-11-29 | 深圳市五株科技股份有限公司 | Curved surface process for manufacturing circuit board |
| CN106572608A (en) * | 2016-10-31 | 2017-04-19 | 芜湖赋兴光电有限公司 | Electroless plating copper technology for flexible circuit board of camera module group |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100714 Termination date: 20150204 |
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| EXPY | Termination of patent right or utility model |