CN104093279A - Printed-circuit board manufacturing method based on laser groove machining technology - Google Patents
Printed-circuit board manufacturing method based on laser groove machining technology Download PDFInfo
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- CN104093279A CN104093279A CN201410339246.1A CN201410339246A CN104093279A CN 104093279 A CN104093279 A CN 104093279A CN 201410339246 A CN201410339246 A CN 201410339246A CN 104093279 A CN104093279 A CN 104093279A
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Abstract
The invention discloses a printed-circuit board manufacturing method based on a laser groove machining technology, and belongs to the technical field of printed-circuit boards. According to the method, ablation is carried out on one side of a base material by using UV laser first, and exquisite circuit grooves and interlayer interconnection micropore grooves are machined gradually, the interlayer interconnection micropore grooves are then filled with conductive ink, and solidification is carried out; when exquisite circuit grooves are machined in the other side of the base material, black hole operation is carried out on the two sides of the base material at the same time, electrocoppering on the grooves is achieved, and subsequent manufacturing processes of a printed-circuit board are then carried out. According to the method, the problem that a board copper layer is relatively thick after the blind holes are filled with copper during conventional exquisite circuit manufacturing is solved, one-off machining of micro holes and the fine line grooves is adopted, the steps of exposure, development, etching and the like in the conventional circuit manufacturing process can be omitted, the problems of film clamping of forming of circuits and lateral etching during etching are solved, production procedures are simplified, production waste water of the technology is reduced, and manufacturing cost is lowered.
Description
Technical field
The invention belongs to Manufacturing Technology for PCB field, be specifically related to a kind of method for manufacturing printed circuit board based on laser Pocket Machining technique.
Background technology
Along with the fast development of high-density packages substrate, require that components and parts chips area and package area are corresponding to be reduced, improving packaging efficiency becomes inevitable.Meet that printed circuit board is light, thin, short, little, the feature of flexible structure, reduce the live width/line-spacing on substrate, making meticulousr circuit becomes a kind of selection.In conventional line is made, lateral erosion, long flow path, sewage disposal difficulty etc. are insurmountable problems always, and excessive lateral erosion not only affects the attractive in appearance of circuit, and severe patient even can not meet in circuit transmission the conduction requirement for high-frequency high-speed signal integrity.Long flow path not only increases fault odds in manufacturing process, has also increased the cost of making.The sewage kind producing in manufacture craft is many, and processing cost is large, also contaminated environment, and then affect the fast development of printed circuit board industry.
At present, the method for making fine-line mainly contains three kinds: subtractive process, semi-additive process and addition process.Subtractive process is to use the most general circuit manufacturing method, it is first by photochemical method or silk screen method or galvanoplastic, on the copper surface of copper-clad plate, to shift and form circuitous pattern, by the method for chemical corrosion, by forming unnecessary copper layer segment outside circuit, etch away again, leave needed circuitous pattern.But side etching phenomenon is the most serious when subtractive process is made at fine-line, the problem such as line short easily occurs, open circuit, Copper Foil is also wasted seriously.What semi-additive process adopted is on thinner copper layer, to thicken circuit by graphic plating, and with method for chemially etching, the thin copper etching of logicalnot circuit part is removed.The fine-line lateral erosion that the method is made is less, and circuit cross section is substantially rectangular.But current extra thin copper foil is because cost is higher, apply also not generally, if adopt common copper-clad plate to subtract copper, make extra thin copper foil, be difficult to guarantee the uniformity consistency of whole plate attenuate.During graphic plating, for the fine-line of the following live width of 50 μ m, guarantee that the against corrosion thin dry film of circuit resolution is difficult to the while at plating line acid and alkali-resistance, dry film dissolves and plating phenomenon more easily occurs.The people such as Chen Yuanming (electroplate and close etching, 2012, vol.34, NO.7:5-9) to point out, semi-additive process is made fine-line should select the extra thin copper foil below 5 μ m.If adopt, subtract copper and process, the more difficult control of the following thickness of 5 μ m, may cause copper seed layer to be stripped from, and the adhesion of follow-up copper plate and base material is poor.Addition process is to adopt electroless copper to be deposited on photosensitive material, directly forms circuitous pattern and hole metallization layer.In the making of multilayer circuit, copper facing thickness and hole metallization duration are variant, easily cause hole metallization problem, and the adhesion of copper layer and base material is also difficult to be guaranteed.Due to the specific (special) requirements of addition process to base material, cost of manufacture is also very high, is not temporarily also used widely.
In the manufacture of printed circuit board, the making success or failure of via directly affect the performance of electrical connection.Digital control hole drilling and laser drill are widely used in micropore making.Digital control hole drilling can bore the hole of all material, but when aperture is less than 250 μ m, boring cost is exponential growth, is not suitable for large batch of micropore and produces; CO
2laser drill can be processed apertures more than 50 μ m, and production efficiency is high, but CO
2laser is only applicable to resin medium layer, for the micropore between 50 μ m～75 μ m, and more difficult control, after boring, the residual film of dielectric material or carbide residue are more; UV laser can be processed the aperture of 25 μ m diameters, clean Non-carbonized in the hole of moulding, and the hole cost of making between 25 μ m～125 μ m is little, but adopt UV laser to make large-diameter borehole cost, is exponential growth.
Summary of the invention
Technical problem to be solved by this invention is to provide that a kind of making flow process is simple, operation is implemented easily, cost of manufacture is controlled, can improve product quality and production efficiency, the method for manufacturing printed circuit board based on laser Pocket Machining technique simultaneously.
The present invention solves the problems of the technologies described above adopted technical scheme:
A method for manufacturing printed circuit board based on laser Pocket Machining technique, comprises the following steps:
A, employing UV laser carry out ablation to the one side of base material, make fine-line groove, to carrying out the fine-line of two sides connection, on original circuit groove basis, are carrying out interconnect microvia groove between laser ablation making layer again;
B, fine-line groove and inter-level interconnects micropore groove that steps A is processed carry out desmearing processing;
C, to the inter-level interconnects micropore groove filling electrically conductive ink after step B desmearing, then solidify;
D, the base material another side after step C is solidified carry out fine-line Pocket Machining desmearing;
E, the fine-line groove on the base material two sides after step D desmearing is carried out to black holeization process, the fine-line groove after then black holeization being processed utilizes copper plating process filling copper facing;
F, the printed circuit board printing welding resistance ink after step e groove is electroplated, chemical nickel and gold and profile cutting, complete the follow-up manufacturing process of whole printed circuit board.
Further, in steps A, the thickness of described base material is 0.12mm～0.25mm, and the width of fine-line groove is 25 μ m～75 μ m, and the degree of depth of fine-line groove is 25 μ m～40 μ m.
Further, in steps A, fine-line groove and inter-level interconnects micropore groove adopt the mode in folded hole to be connected, the upper aperture of inter-level interconnects micropore groove be under fine-line groove aperture 75%～95%.
Further, in step e, described black hole process is carried out twice; It is the low acid system of high-copper that groove is electroplated the plating solution using.
The above-mentioned method for manufacturing printed circuit board based on laser Pocket Machining technique, when it is when making multilayer printed circuit board, also comprises the steps: 1) repeating step A～E, complete the making of all internal layer printed circuit boards; 2) adopt prepreg or hot-setting adhesive as adhesive, all internal layer printed circuit boards are pressed into multilayer printed circuit board; 3) repeating step A～E again makes fine-line groove and inter-level interconnects micropore groove on outermost layer base material, and the electrically conductive ink that carries out inter-level interconnects micropore groove is filled and fine-line groove is filled copper facing; 4) printing welding resistance ink, chemical nickel and gold and profile are cut, and complete the follow-up manufacturing process of whole multilayer printed circuit board.
Beneficial effect of the present invention:
Method for manufacturing printed circuit board based on laser Pocket Machining technique provided by the invention, successively forms fine-line groove and inter-level interconnects micropore groove by UV laser, can greatly reduce live width and the line-spacing of circuit; And after filled conductive ink, fine-line groove is carried out to common plating, can avoid the hole metallization problem that in conventional production, copper facing thickness and hole metallization duration difference cause; Circuit is formed in groove, can guarantee the adhesion of copper coating and base material; The disposable processing of groove circuit, has saved the operations such as exposure, development, etching, has both shortened technological process, has saved production cost, has reduced again the generation of technique waste water; Adopt fully-additive process technique, electro copper foil has obtained effective utilization, has avoided the part for Copper Foil in subtractive process, semi-additive process to waste.
Accompanying drawing explanation
Fig. 1 is that the present invention carries out the structural representation that printed circuit board is made the base material of two-sided fine-line;
Fig. 2 is that the present invention simultaneously carries out the structural representation of fine-line groove making to base material;
Fig. 3 is the structural representation that the present invention makes interlayer interconnect microvia groove in base material;
Fig. 4 is that the present invention clogs the structural representation after electrically conductive ink to interconnect microvia groove between substrate layer;
Fig. 5 is that the present invention carries out the structural representation of fine-line groove making to base material another side;
Fig. 6 is that the present invention carries out the structural representation after electro-coppering to base material fine-line groove;
Fig. 7 is that the micropore that the present invention connects for outermost layer core material is clogged the structural representation after electrically conductive ink;
Fig. 8 is that the present invention carries out the outer structural representation of making the base material of one side fine-line of printed circuit board;
Fig. 9 is that the present invention carries out the structural representation after pressing to core material and outer base material;
Figure 10 is that the present invention carries out the structural representation of fine-line groove and the making of inter-level interconnects micropore groove to outer base material;
Figure 11 is that the present invention clogs the structural representation after electrically conductive ink to outer base material for inter-level interconnects micropore groove;
Figure 12 is that the present invention carries out the structural representation after electro-coppering to outer base material fine-line groove;
Description of symbols in figure: insulating medium layer 101, fine-line groove 2, inter-level interconnects micropore groove 3, electrically conductive ink 4, blank hole liquid 5, copper electroplating layer 6, outside insulating medium layer 102, adhesive 7.
Embodiment
As follows for implementing above-mentioned purpose the technical solution used in the present invention:
Embodiment 1
Consult shown in Fig. 1 to Fig. 6, a kind of two-layer method for manufacturing printed circuit board based on laser groove type micropore and fine rule synchronous processing be provided, comprise the following steps:
A, sawing sheet base material 101, as shown in Figure 1, adopt UV laser cutting machine to cut the one side of base material 101, produce fine-line groove 2, as shown in Figure 2, to carrying out the fine-line of two sides connection, on original circuit groove basis, carry out ablation again, produce inter-level interconnects micropore groove 3, as shown in Figure 3;
B, the groove that steps A is processed carry out desmearing processing;
C, to the inter-level interconnects micropore groove 3 filling electrically conductive inks 4 after step B desmearing, then solidify, as shown in Figure 4;
D, the base material another side after step C is solidified process fine-line groove 2 desmearing, as shown in Figure 5;
E, first at black hole line coating blank hole liquid 5 to the base material after step D desmearing, then carry out groove copper facing 6 at vertical continuous plating lines, as shown in Figure 6;
F, the printed circuit board printing welding resistance ink after step e groove is electroplated, chemical nickel and gold and profile cutting, complete the follow-up manufacturing process of two-layer printed circuit board.
In the above-mentioned course of processing, when carrying out processing of step A, the base material 101 of thickness choose to(for) the making of fine-line is 0.12mm～0.25mm, and the width of fine-line groove 2 is 25 μ m～75 μ m, and the degree of depth of fine-line groove 2 is 25 μ m～40 μ m.
Be further, in steps A, fine-line groove 2 adopts the mode in folded hole to be connected with inter-level interconnects micropore groove 3, the upper aperture of inter-level interconnects micropore groove 3 is 75%～95% of 2 times apertures of fine-line groove, and the degree of depth of inter-level interconnects micropore groove 3 is the surplus value that base material thickness deducts two sides fine-line depth of groove.
Further, in steps A, superior for guaranteeing that fine-line groove 2 is made, the parameter of UV laser cutting machine is: spot diameter 0.022mm, power 6W, cutting speed 160mm/s, laser frequency 100kHZ, Z axis height 0.7mm; For guaranteeing the making precision of inter-level interconnects micropore groove 3, the parameter of UV laser cutting machine is: spot diameter 0.020mm, power 6W, cutting speed 170mm/s, laser frequency 100kHZ, Z axis height 0.6mm.
In order to save cost of manufacture, the desmearing process in step B and step D adopts ultrasonic wave water washing can reach the dirty removing requirement of a small amount of brill; The same steps A of fine-line groove 2 cutting parameter in step D.
In order to guarantee the performance of interlayer electrical connection, in step C, only inter-level interconnects micropore groove 3 is adopted to silk screen printing vacuum filling electrically conductive ink 4, it is electrically conductive ink that electrically conductive ink is selected silver, curing temperature is 150 ℃～180 ℃, and be 45min～60min curing time.
In order to guarantee the filling effect of fine-line groove electro-coppering, in step e, black hole process carries out twice, about 10min; It is the low acid system of high-copper, wherein H that groove is electroplated the plating solution using
2sO
4mass concentration be 30g/L～45g/L, CuSO
45H
2the mass concentration of O is 190g/L～220g/L, and the mass concentration of Cl-is 5ppm～15ppm; In groove electroplating process, electroplating time is 45min～60min, and current density is 1.2A/dm
2～1.4A/dm
2.
Embodiment 2
Consult shown in Fig. 1 to Figure 12, a kind of four layers of method for manufacturing printed circuit board based on laser groove type micropore and fine rule synchronous processing be provided, comprise the following steps:
A, sawing sheet base material 101, as shown in Figure 1, adopt UV laser cutting machine to cut the one side of base material 101, produce fine-line groove 2, as shown in Figure 2, to carrying out the fine-line of two sides connection, on original circuit groove basis, carry out ablation again, produce inter-level interconnects micropore groove 3, as shown in Figure 3;
B, the groove that steps A is processed carry out desmearing processing;
C, to the inter-level interconnects micropore groove 3 filling electrically conductive inks 4 after step B desmearing, then solidify, as shown in Figure 4;
D, the base material another side after step C is solidified process fine-line groove 2 desmearing, as shown in Figure 5;
E, first at black hole line coating blank hole liquid 5 to the base material after step D desmearing, then carry out groove copper facing 6 at vertical continuous plating lines, as shown in Figure 6;
F, the base material after step e is electroplated adopt the ablation of UV laser cutting machine to go out outermost layer for inter-level interconnects micropore groove, after desmearing, adopt silk screen printing filling electrically conductive ink 4, and solidify, as shown in Figure 7, complete the making of internal layer printed circuit board (central layer);
G, the outer base material 102 of sawing sheet in advance, as shown in Figure 8, carry out pressing by completing the central layer that internal layer makes in step F with base material 102 employing adhesives 7, obtains four layers of printed circuit plate structure, as shown in Figure 9;
H, printed circuit board after pressing in step G is adopted to UV laser cutting machine, ablation goes out outermost fine-line groove 2 and inter-level interconnects micropore groove 3, as shown in figure 10;
I, will in step H, complete the printed circuit board desmearing made of outermost layer groove, then inter-level interconnects micropore groove is adopted to silk screen printing filling electrically conductive ink 4, then solidifies, as shown in figure 11;
J, will complete in step I curing printed circuit board first apply blank hole liquid 5 at black hole line, then carry out groove copper facing 6 at vertical continuous plating lines, as shown in figure 12;
K, the printed circuit board printing welding resistance ink after step J further groove is electroplated, chemical nickel and gold and profile cutting, complete the follow-up manufacturing process of four layers of printed circuit board.
In the above-mentioned course of processing, when carrying out steps A and G processing, the core material base material 101 of thickness choose to(for) the making of fine-line is 0.12mm～0.25mm, the thickness of outermost layer substrate 102 is 0.12mm～0.2mm, the width of fine-line groove 2 is 25 μ m～75 μ m, and the degree of depth of fine-line groove 2 is 25 μ m～40 μ m.
Further, in steps A and H, fine-line groove 2 adopts the mode in folded hole to be connected with inter-level interconnects micropore groove 3, and the upper aperture of inter-level interconnects micropore groove 3 is 75%～95% of 2 times apertures of fine-line groove; In steps A, the ablation depth of interlayer interconnect microvia groove 3 is the surplus value that base material thickness deducts two sides fine-line depth of groove, and in step H, the ablation depth of interlayer interconnect microvia groove 3 is that outermost layer fine-line groove is to the distance of core material.
Further, in steps A, D and H, superior for guaranteeing that fine-line groove 2 is made, the parameter of UV laser cutting machine is: spot diameter 0.022mm, power 6W, cutting speed 160mm/s, laser frequency 100kHZ, Z axis height 0.7mm; Superior for guaranteeing that inter-level interconnects micropore groove 3 is made, the parameter of UV laser cutting machine is: spot diameter 0.020mm, power 6W, cutting speed 170mm/s, laser frequency 100kHZ, Z axis height 0.6mm.
In order to save cost of manufacture, the desmearing process in step B, D and H adopts ultrasonic wave water washing can reach the dirty removing requirement of a small amount of brill.
In order to guarantee the performance of interlayer electrical connection, in step C, F and I, only inter-level interconnects micropore groove 3 is adopted to silk screen printing vacuum filling electrically conductive ink 4, it is electrically conductive ink that electrically conductive ink is selected silver, curing temperature is 150 ℃～180 ℃, and be 45min～60min curing time; In step F, the part in the micropore hole that to be follow-up outermost layer connect for interlayer, adopts electrically conductive ink to carry out full packing.
For the effect that guarantees that groove plating is filled, in step e and J, black hole process carries out twice, about 10min; It is the low acid system of high-copper, wherein H that groove is electroplated the plating solution using
2sO
4mass concentration be 30g/L～45g/L, CuSO
45H
2the mass concentration of O is 190g/L～220g/L, and the mass concentration of Cl-is 5ppm～15ppm; In groove electroplating process, electroplating time is 45min～60min, and current density is 1.2A/dm
2～1.4A/dm
2.
Claims (5)
1. the method for manufacturing printed circuit board based on laser Pocket Machining technique, comprises the following steps:
A, employing UV laser carry out ablation to the one side of base material, make fine-line groove, to carrying out the fine-line of two sides connection, on original circuit groove basis, are carrying out interconnect microvia groove between laser ablation making layer again;
B, fine-line groove and inter-level interconnects micropore groove that steps A is processed carry out desmearing processing;
C, to the inter-level interconnects micropore groove filling electrically conductive ink after step B desmearing, then solidify;
D, the base material another side after step C is solidified carry out fine-line Pocket Machining desmearing;
E, the fine-line groove on the base material two sides after step D desmearing is carried out to black holeization process, the fine-line groove after then black holeization being processed utilizes copper plating process filling copper facing;
F, the printed circuit board printing welding resistance ink after step e groove is electroplated, chemical nickel and gold and profile cutting, complete the follow-up manufacturing process of whole printed circuit board.
2. the method for manufacturing printed circuit board based on laser Pocket Machining technique according to claim 1, it is characterized in that, the thickness of base material described in steps A is 0.12mm～0.25mm, the width of described fine-line groove is 25 μ m～75 μ m, and the degree of depth of described fine-line groove is 25 μ m～40 μ m.
3. the method for manufacturing printed circuit board based on laser Pocket Machining technique according to claim 2, it is characterized in that, in steps A, fine-line groove and inter-level interconnects micropore groove adopt the mode in folded hole to be connected, the upper aperture of inter-level interconnects micropore groove be under fine-line groove aperture 75%～95%.
4. according to the method for manufacturing printed circuit board based on laser Pocket Machining technique described in claim 1,2 or 3, it is characterized in that, the process of black hole described in step e is carried out twice; The plating solution that groove electro-coppering is used is the low acid system of high-copper.
5. according to the method for manufacturing printed circuit board based on laser Pocket Machining technique described in claim 1,2 or 3, it is characterized in that, when the described method for manufacturing printed circuit board based on laser Pocket Machining technique is used for making multilayer printed circuit board, also comprise the steps: 1) repeating step A～E, complete the making of all internal layer printed circuit boards; 2) adopt prepreg or hot-setting adhesive as adhesive, all internal layer printed circuit boards are pressed into multilayer printed circuit board; 3) repeating step A～E again makes fine-line groove and inter-level interconnects micropore groove on outermost layer base material, and the electrically conductive ink that carries out inter-level interconnects micropore groove is filled and fine-line groove is filled copper facing; 4) printing welding resistance ink, chemical nickel and gold and profile are cut, and complete the follow-up manufacturing process of whole multilayer printed circuit board.
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| CN106385768A (en) * | 2016-04-26 | 2017-02-08 | 深圳市环基实业有限公司 | Transparent medium circuit board and manufacturing method therefor |
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| CN107087355A (en) * | 2017-06-16 | 2017-08-22 | 东莞职业技术学院 | A kind of method that use screen printing technique realizes the interconnection of PCB internal layers |
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| CN108901149A (en) * | 2018-08-28 | 2018-11-27 | 上海美维科技有限公司 | It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord |
| CN110324991A (en) * | 2019-07-10 | 2019-10-11 | 广东工业大学 | A kind of preparation method of composite circuit board |
| CN112654148A (en) * | 2019-10-09 | 2021-04-13 | 无锡深南电路有限公司 | Manufacturing method of printed circuit board |
| CN112654148B (en) * | 2019-10-09 | 2022-08-05 | 无锡深南电路有限公司 | Manufacturing method of printed circuit board |
| CN110944467A (en) * | 2019-12-06 | 2020-03-31 | 北京万物皆媒科技有限公司 | Double-layer transparent circuit substrate and preparation method thereof |
| CN114126224A (en) * | 2020-08-28 | 2022-03-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN113860925A (en) * | 2021-08-27 | 2021-12-31 | 中国电子科技集团公司第十三研究所 | Ceramic shell and surface pattern processing method thereof |
| CN114071886A (en) * | 2021-12-24 | 2022-02-18 | 深圳市百柔新材料技术有限公司 | Manufacturing method of Mini-LED substrate precision circuit |
| CN114071886B (en) * | 2021-12-24 | 2024-04-26 | 深圳市百柔新材料技术有限公司 | Manufacturing method of Mini-LED substrate precise circuit |
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