CN107087355A - A kind of method that use screen printing technique realizes the interconnection of PCB internal layers - Google Patents
A kind of method that use screen printing technique realizes the interconnection of PCB internal layers Download PDFInfo
- Publication number
- CN107087355A CN107087355A CN201710456739.7A CN201710456739A CN107087355A CN 107087355 A CN107087355 A CN 107087355A CN 201710456739 A CN201710456739 A CN 201710456739A CN 107087355 A CN107087355 A CN 107087355A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- multilayer printed
- electrically conductive
- conductive ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Abstract
The invention discloses a kind of method that use screen printing technique realizes the interconnection of PCB internal layers, it is comprised the following steps that：A, pressing make daughter board；B, the holes drilled through on daughter board；C, preparation screen plate for screen printing；D, preparation electrically conductive ink；E, electrically conductive ink filled in the through hole of multilayer printed circuit board；F, baking；G, polishing；H, pressing make motherboard and to motherboard holes drilled through, above c is repeated after holes drilled through can complete multilayer printed circuit board finished product to g steps to make.The present invention has the advantage that：1st, filled in the through hole of multilayer printed circuit board by silk-screen printing after electrically conductive ink, baking-curing and form conductive pole to realize line conduction, can avoid using chemical medicinal liquid and electroplating liquid medicine, and then avoid liquid waste processing, environmental protection；2nd, this method fills in electrically conductive ink in the through hole specified between layers, it is to avoid there is the cavity that filler deficiency is produced when making motherboard, lifts the soldering reliability of multilayer printed circuit board.
Description
Technical field
Realized the present invention relates to multilayer printed circuit board manufacture technology field, more particularly to one kind using screen printing technique
The method of PCB internal layers interconnection.
Background technology
Making multilayer printed circuit board（PCB）When, to realize circuit turn-on between layers, after typically pressing
Multilayer printed circuit board holes drilled through, then again by electroless copper plating mode, electro-coppering mode through hole hole wall electroplate one layer of gold
Belong to copper, to realize through hole the via hole, and connect conductor line between layers.In addition, to realize multilayer printed circuit
Plate specifies circuit turn-on between layers, typically makes daughter board by first being closed to specified lamination, then drills again, chemistry sinks
Copper, electro-coppering realize the via hole, and conductor line between layers is specified in connection.
However, in actual manufacturing process, above-mentioned technique has the following disadvantages, specifically：
1st, chemical medicinal liquid used in the technique and electroplating liquid medicine can produce chemical waste fluid, it is necessary to purified treatment, processing cost is high
And there is the risk of pollution environment；
2nd, through hole between layers is specified, there can be filler deficiency when making motherboard and produce cavity, influence multilayer board
Soldering reliability.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art and providing one kind and being realized using screen printing technique in PCB
The method of layer interconnection, this realizes that the method for PCB internal layers interconnection is printed using screen printing technique in multilayer using screen printing technique
Electrically conductive ink is filled in the specified through hole between layers of circuit board processed, to realize the top-stitching of multilayer printed circuit board different layers
Road is turned on, and is had the advantage that：1st, electrically conductive ink is filled in by silk-screen printing in the through hole of multilayer printed circuit board, then
Baking-curing formation conductive pole, realizes that multilayer printed circuit board specifies line conduction between layers, can avoid using change
Liquid medicine and electroplating liquid medicine are learned, and then avoids liquid waste processing, environmental protection；2nd, this method is in the through hole specified between layers
Fill in electrically conductive ink, it is to avoid there is the cavity that filler deficiency is produced when making motherboard, the welding of lifting multilayer printed circuit board can
By property.
To reach above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of method that use screen printing technique realizes the interconnection of PCB internal layers, includes following processing step, is specially：
A, pressing make the daughter board of designated layer and layer；
B, the holes drilled through on daughter board；
C, preparation screen plate for screen printing, the lead to the hole site of half tone correspondence multilayer printed circuit board open up circular hole, Circularhole diameter ratio
The unilateral big 1-3mil of through-hole diameter；
D, preparation electrically conductive ink；
E, ready electrically conductive ink poured on half tone, and by silk-screen printing technique by circular hole of the electrically conductive ink via half tone
And fill in the through hole of multilayer printed circuit board；
F, the multilayer printed circuit board for having filled in electrically conductive ink is toasted, to realize that electrically conductive ink solidifies；
G, to completed baking multilayer printed circuit board polish, with remove multilayer printed circuit board surface overflow solidify
Electrically conductive ink；
H, pressing make motherboard and to motherboard holes drilled through, and above c is repeated after holes drilled through to g steps can complete multilayer printed circuit
Board finished product makes, and realizes that multilayer printed circuit board specifies the conducting of interlayer wire road.
Wherein, the half tone in the step c is aluminium flake half tone or stainless steel half tone.
Wherein, for the half tone in the step c, through-hole diameter list of its Circularhole diameter than multilayer printed circuit board
The big 2mil in side.
Wherein, the electrically conductive ink in the step d is thermosetting ink, and electrically conductive ink is by metal component, epoxy resin group
Into.
Wherein, in the step f, more than 120 degree of baking temperature requirement, baking time is 30-60min.
Beneficial effects of the present invention are：A kind of use screen printing technique of the present invention realizes the interconnection of PCB internal layers
Method, it includes following processing step, is specially：A, pressing make the daughter board of designated layer and layer；B, the holes drilled through on daughter board；
C, preparation screen plate for screen printing, the lead to the hole site of half tone correspondence multilayer printed circuit board open up circular hole, and Circularhole diameter compares through hole
The unilateral big 1-3mil of diameter；D, preparation electrically conductive ink；E, ready electrically conductive ink poured on half tone, and pass through silk-screen printing
Technique fills in electrically conductive ink to the through hole of multilayer printed circuit board via the circular hole of half tone；F, to having filled in electrically conductive ink
Multilayer printed circuit board toasted, with realize electrically conductive ink solidify；G, to completed baking multilayer printed circuit board enter
Row polishing, to remove the electrically conductive ink that solidification is overflowed on multilayer printed circuit board surface；H, pressing make motherboard and motherboard are drilled through
Above c is repeated after hole, holes drilled through can complete multilayer printed circuit board finished product to g steps to make, and realize multilayer printed circuit
Plate specifies the conducting of interlayer wire road.Designed by above-mentioned processing step, this realizes the side of PCB internal layers interconnection using screen printing technique
Method fills in electrically conductive ink using screen printing technique in the specified through hole between layers of multilayer printed circuit board, to realize
Line conduction between multilayer printed circuit board different layers, and have the advantage that：1st, lead in the through hole of multilayer printed circuit board
Cross screen printing brush plug and enter electrically conductive ink, then baking-curing formation conductive pole, realize multilayer printed circuit board designated layer and layer it
Between line conduction, can avoid using chemical medicinal liquid and electroplating liquid medicine, and then avoid liquid waste processing, environmental protection；2nd, should
Method fills in electrically conductive ink in the through hole specified between layers, it is to avoid there is the sky that filler deficiency is produced when making motherboard
Hole, lifts the soldering reliability of multilayer printed circuit board.
Brief description of the drawings
The present invention is further detailed below with accompanying drawing, but the embodiment in accompanying drawing is not constituted to this hair
Bright any limitation.
Fig. 1 makes the schematic diagram of L3-L6 straton plates for pressing.
Fig. 2 is the schematic diagram of the holes drilled through on L3-L6 straton plates.
Fig. 3 is the schematic diagram of L3-L6 straton board finished products.
Fig. 4 makes the schematic diagram of L1-L8 layers of motherboard for pressing.
Fig. 5 is the schematic diagram of the holes drilled through on L1-L8 layers of motherboard.
Fig. 6 is the schematic diagram of 8 layers of printed circuit board finished product.
Embodiment
With reference to specific embodiment, the present invention will be described.
A kind of method that use screen printing technique realizes the interconnection of PCB internal layers, includes following processing step, is specially：
A, pressing make the daughter board of designated layer and layer；
B, the holes drilled through on daughter board；
C, preparation screen plate for screen printing, the lead to the hole site of half tone correspondence multilayer printed circuit board open up circular hole, Circularhole diameter ratio
The unilateral big 1-3mil of through-hole diameter；
D, preparation electrically conductive ink, electrically conductive ink is thermosetting ink, and electrically conductive ink is made up of metal component, epoxy resin；
E, ready electrically conductive ink poured on half tone, and by silk-screen printing technique by circular hole of the electrically conductive ink via half tone
And fill in the through hole of multilayer printed circuit board；
F, the multilayer printed circuit board for having filled in electrically conductive ink is toasted, to realize that electrically conductive ink solidifies, baking temperature will
More than 120 degree are asked, baking time is 30-60min；
G, to completed baking multilayer printed circuit board polish, with remove multilayer printed circuit board surface overflow solidify
Electrically conductive ink；
H, pressing make motherboard and to motherboard holes drilled through, and above c is repeated after holes drilled through to g steps can complete multilayer printed circuit
Board finished product makes, and realizes that multilayer printed circuit board specifies the conducting of interlayer wire road.
Wherein, the half tone in the step c is aluminium flake half tone or stainless steel half tone；It is preferred that, in the step c
Half tone for, its Circularhole diameter big 2mil more unilateral than the through-hole diameter of multilayer printed circuit board.
Next by taking 8 layers of printed circuit board as an example below the present invention will be described in detail, as shown in fig. 6, this 8 layers printing electricity
Road plate requires L3 floor to L6 floor circuit turn-ons, L1 to L8 layers of circuit turn-on, specifically：
The first step：Pressing makes L3-L6 straton plates（As shown in Figure 1）；
Second step：The holes drilled through on L3-L6 straton plates（As shown in Figure 2）；
3rd step：In L3-L6 straton plate through hole Screen-printed conductive ink, L3 to L6 layers of circuit turn-on, toasted, polishing are realized
L3-L6 straton board finished products are formed afterwards（As shown in Figure 3）；
4th step：Pressing makes L1-L8 layers of motherboard（As shown in Figure 4）；
5th step：The holes drilled through on L1-L8 layers of motherboard（As shown in Figure 5）；
6th step：In L1-L8 layers of motherboard through hole Screen-printed conductive ink, realize L1 to L8 layers of circuit turn-on, and it is toasted, beat
8 layers of printed circuit board finished product are formed after mill（As shown in Figure 6）.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's
Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention
Limitation.
Claims (5)
1. a kind of method that use screen printing technique realizes the interconnection of PCB internal layers, it is characterised in that include following technique step
Suddenly, it is specially：
A, pressing make the daughter board of designated layer and layer；
B, the holes drilled through on daughter board；
C, preparation screen plate for screen printing, the lead to the hole site of half tone correspondence multilayer printed circuit board open up circular hole, Circularhole diameter ratio
The unilateral big 1-3mil of through-hole diameter；
D, preparation electrically conductive ink；
E, ready electrically conductive ink poured on half tone, and by silk-screen printing technique by circular hole of the electrically conductive ink via half tone
And fill in the through hole of multilayer printed circuit board；
F, the multilayer printed circuit board for having filled in electrically conductive ink is toasted, to realize that electrically conductive ink solidifies；
G, to completed baking multilayer printed circuit board polish, with remove multilayer printed circuit board surface overflow solidify
Electrically conductive ink；
H, pressing make motherboard and to motherboard holes drilled through, and above c is repeated after holes drilled through to g steps can complete multilayer printed circuit
Board finished product makes, and realizes that multilayer printed circuit board specifies the conducting of interlayer wire road.
2. the method that a kind of use screen printing technique according to claim 1 realizes the interconnection of PCB internal layers, its feature exists
In：Half tone in the step c is aluminium flake half tone or stainless steel half tone.
3. the method that a kind of use screen printing technique according to claim 2 realizes the interconnection of PCB internal layers, its feature exists
In：For the half tone in the step c, its Circularhole diameter big 2mil more unilateral than the through-hole diameter of multilayer printed circuit board.
4. the method that a kind of use screen printing technique according to claim 1 realizes the interconnection of PCB internal layers, its feature exists
In：Electrically conductive ink in the step d is thermosetting ink, and electrically conductive ink is made up of metal component, epoxy resin.
5. the method that a kind of use screen printing technique according to claim 1 realizes the interconnection of PCB internal layers, its feature exists
In：In the step f, more than 120 degree of baking temperature requirement, baking time is 30-60min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710456739.7A CN107087355A (en) | 2017-06-16 | 2017-06-16 | A kind of method that use screen printing technique realizes the interconnection of PCB internal layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710456739.7A CN107087355A (en) | 2017-06-16 | 2017-06-16 | A kind of method that use screen printing technique realizes the interconnection of PCB internal layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107087355A true CN107087355A (en) | 2017-08-22 |
Family
ID=59606982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710456739.7A Pending CN107087355A (en) | 2017-06-16 | 2017-06-16 | A kind of method that use screen printing technique realizes the interconnection of PCB internal layers |
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| CN (1) | CN107087355A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110324990A (en) * | 2019-07-03 | 2019-10-11 | 景旺电子科技(龙川)有限公司 | A kind of method of electrically-conductive backing plate blind hole print plug electroconductive resin |
| CN111567150A (en) * | 2017-11-10 | 2020-08-21 | 雷神公司 | Helical antenna and related manufacturing techniques |
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|---|---|---|---|---|
| US5277787A (en) * | 1992-01-30 | 1994-01-11 | Nippon Cmk Corp. | Method of manufacturing printed wiring board |
| CN1243416A (en) * | 1992-05-06 | 2000-02-02 | 松下电器产业株式会社 | Method for producing multilayer cicuit board and multilayer circuitboard produced by said method |
| CN1361655A (en) * | 2000-12-26 | 2002-07-31 | 株式会社电装 | Printing circuit board and method for producing printing circuit board |
| CN1671268A (en) * | 2004-03-19 | 2005-09-21 | 松下电器产业株式会社 | Flexible substrate, multilayer flexible substrate and process for producing the same |
| CN102124824A (en) * | 2008-08-14 | 2011-07-13 | 动态细节有限公司 | Additional functionality single lammination stacked via with plated through holes for multilayer printed circuit boards |
| CN103813640A (en) * | 2012-11-12 | 2014-05-21 | 北大方正集团有限公司 | All printed circuit board and manufacturing method thereof |
| CN104093279A (en) * | 2014-07-16 | 2014-10-08 | 电子科技大学 | Printed-circuit board manufacturing method based on laser groove machining technology |
| CN104135830A (en) * | 2014-08-08 | 2014-11-05 | 中国电子科技集团公司第二十九研究所 | Method and device for filling raw ceramic through holes with metal paste |
| CN105722327A (en) * | 2016-03-31 | 2016-06-29 | 东莞美维电路有限公司 | Process for filling resin in blind groove of printed circuit board (PCB) |
| CN206024253U (en) * | 2016-09-19 | 2017-03-15 | 苏州纳格光电科技有限公司 | Multi-layer flexible circuit board |
-
2017
- 2017-06-16 CN CN201710456739.7A patent/CN107087355A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5277787A (en) * | 1992-01-30 | 1994-01-11 | Nippon Cmk Corp. | Method of manufacturing printed wiring board |
| CN1243416A (en) * | 1992-05-06 | 2000-02-02 | 松下电器产业株式会社 | Method for producing multilayer cicuit board and multilayer circuitboard produced by said method |
| CN1361655A (en) * | 2000-12-26 | 2002-07-31 | 株式会社电装 | Printing circuit board and method for producing printing circuit board |
| CN1671268A (en) * | 2004-03-19 | 2005-09-21 | 松下电器产业株式会社 | Flexible substrate, multilayer flexible substrate and process for producing the same |
| CN102124824A (en) * | 2008-08-14 | 2011-07-13 | 动态细节有限公司 | Additional functionality single lammination stacked via with plated through holes for multilayer printed circuit boards |
| CN103813640A (en) * | 2012-11-12 | 2014-05-21 | 北大方正集团有限公司 | All printed circuit board and manufacturing method thereof |
| CN104093279A (en) * | 2014-07-16 | 2014-10-08 | 电子科技大学 | Printed-circuit board manufacturing method based on laser groove machining technology |
| CN104135830A (en) * | 2014-08-08 | 2014-11-05 | 中国电子科技集团公司第二十九研究所 | Method and device for filling raw ceramic through holes with metal paste |
| CN105722327A (en) * | 2016-03-31 | 2016-06-29 | 东莞美维电路有限公司 | Process for filling resin in blind groove of printed circuit board (PCB) |
| CN206024253U (en) * | 2016-09-19 | 2017-03-15 | 苏州纳格光电科技有限公司 | Multi-layer flexible circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111567150A (en) * | 2017-11-10 | 2020-08-21 | 雷神公司 | Helical antenna and related manufacturing techniques |
| CN110324990A (en) * | 2019-07-03 | 2019-10-11 | 景旺电子科技(龙川)有限公司 | A kind of method of electrically-conductive backing plate blind hole print plug electroconductive resin |
| CN110324990B (en) * | 2019-07-03 | 2022-02-22 | 景旺电子科技(龙川)有限公司 | Method for printing conductive resin in blind hole of conductive substrate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170822 |
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| RJ01 | Rejection of invention patent application after publication |