CN108323027A - A kind of production method of circuit board, circuit board and mobile terminal - Google Patents
A kind of production method of circuit board, circuit board and mobile terminal Download PDFInfo
- Publication number
- CN108323027A CN108323027A CN201810053823.9A CN201810053823A CN108323027A CN 108323027 A CN108323027 A CN 108323027A CN 201810053823 A CN201810053823 A CN 201810053823A CN 108323027 A CN108323027 A CN 108323027A
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- China
- Prior art keywords
- conducting wire
- conductive layer
- circuit board
- substrate
- void region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
Abstract
The present invention provides a kind of production method of circuit board, circuit board and mobile terminal, and the production method includes providing an initial circuit plate, and the initial circuit plate includes conductive layer and the substrate set on the conductive layer side；According to default cabling pattern, corresponding void region is formed on the substrate；Conductive material is set in the void region, forms the first conducting wire；The second conducting wire corresponding with first conducting wire is formed on the conductive layer, obtains finished circuit board.It can increase the thickness of conducting wire in the case where not increasing circuit board integral thickness in this way, meet the needs of circuit board is to thick circuit.
Description
Technical field
The present invention relates to a kind of field of communication technology more particularly to production method of circuit board, circuit board and mobile terminals.
Background technology
As role is more and more important in user lives for the mobile terminals such as smart mobile phone, user is to mobile terminal
Performance requirement it is also higher and higher, the demand especially to the charging ability of mobile terminal and cruising ability is higher and higher.And it determines
The core component of the charging ability and cruising ability of determining mobile terminal is the battery circuit board of mobile terminal, is in particular arranged at electricity
Conducting wire on the circuit board of pond, such as line thicknesses can be effectively increased current-carrying capacity by increasing line thicknesses, and reduce electricity
The heat generated in the circuit board course of work of pond.
Currently, generally by the thickness for increasing the circuit on battery circuit board, to promote the performance of battery circuit board.And
The common method for increasing line thicknesses is increase circuit coating on the basis of original circuit, to increase the thickness of circuit；So
And increase the process of line thicknesses by electric plating method, not only complex process, of high cost, but also battery circuit board can be made
Integral thickness increases, and then needs to occupy more installation spaces, increases the difficulty that the complete machine of mobile terminal stacks.
As it can be seen that existing circuit board has that integral thickness is thicker.
Invention content
The embodiment of the present invention provides a kind of production method of circuit board, circuit board and mobile terminal, to solve existing electricity
Road plate has that integral thickness is thicker.
An embodiment of the present invention provides a kind of production methods of circuit board, including：
An initial circuit plate is provided, the initial circuit plate includes conductive layer and the substrate set on the conductive layer side；
According to default cabling pattern, corresponding void region is formed on the substrate；
Conductive material is set in the void region, forms the first conducting wire；
The second conducting wire corresponding with first conducting wire is formed on the conductive layer, obtains finished circuit
Plate.
The embodiment of the present invention additionally provides a kind of circuit board, is made of above-mentioned production method, including the circuit board is also
Include the second base of the second side set on the conductive layer, first side and the two-phase that the second side is the conductive layer
Offside, the second substrate are equipped with the second void region corresponding with the default cabling pattern, in second void region
Equipped with conductive material, and third conducting wire is formed, and the third conducting wire is electrically connected with second conducting wire.
The embodiment of the present invention additionally provides a kind of mobile terminal, including foregoing circuit plate.
In this way, in the embodiment of the present invention, by providing an initial circuit plate, the initial circuit plate includes conductive layer and sets
Substrate in the conductive layer side；According to default cabling pattern, corresponding void region is formed on the substrate；Described
Conductive material is set in void region, forms the first conducting wire；It is formed and first conducting wire on the conductive layer
Corresponding second conducting wire, obtains finished circuit board.It is electrically connected in this way with the second conducting wire by being formed in substrate
First conducting wire can increase the thickness of conducting wire, meet in realization in the case where not increasing circuit board integral thickness
Demand of the circuit board to thick circuit.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without having to pay creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the flow chart of the production method for the circuit board that one embodiment of the invention provides；
Fig. 2 a are one of the production flow diagrams of circuit board that one embodiment of the invention provides；
Fig. 2 b are the two of the production flow diagram for the circuit board that one embodiment of the invention provides；
Fig. 2 c are the three of the production flow diagram for the circuit board that one embodiment of the invention provides；
Fig. 2 d are the four of the production flow diagram for the circuit board that one embodiment of the invention provides；
Fig. 3 is the flow chart of the production method for the circuit board that another embodiment of the present invention provides；
Fig. 4 is one of the structural schematic diagram of circuit board that one embodiment of the invention provides；
Fig. 5 is the second structural representation for the circuit board that one embodiment of the invention provides；
Fig. 6 is the structural schematic diagram for the circuit board that another embodiment of the present invention provides.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
It is the flow chart of the production method of circuit board provided in an embodiment of the present invention referring to Fig. 1, Fig. 1, as shown in Figure 1, packet
Include following steps：
Step 101, provide an initial circuit plate, the initial circuit plate include conductive layer and be set to the conductive layer side
Substrate.
In the step, it can make one by conventional circuit board process including conductive layer and be set to the conductive layer
The substrate of side.Specifically, as shown in Figure 2 a, the initial circuit plate include conductive layer 21 and be set to 21 side of the conductive layer
Substrate 22.
Step 102, according to default cabling pattern, form corresponding void region on the substrate.
In the step, corresponding void region can be formed on substrate, for example can pass through according to default cabling pattern
Radium art or artistic carving form void region corresponding with default cabling pattern on substrate, and on conductive layer with hollow out
Part corresponding to region is exposed in void region.Specifically, as shown in Figure 2 b, void region 221 is formed on substrate 22,
And part corresponding with void region 221 is exposed in void region 221 on conductive layer 21.
Conductive material is arranged in step 103 in the void region, forms the first conducting wire.
In the step, conductive material is arranged in the mode that laying may be used in void region, can also use plating
Mode deposits to form the first conducting wire coating in void region.Specifically, as shown in Figure 2 c, by into void region 221
Conductive material is set, the first conducting wire 23 is formed.
Step 104 forms the second conducting wire corresponding with first conducting wire on the conductive layer, obtains into
Product circuit board.
It in the step, can be made up of techniques such as exposure, development, etchings, be formed and the first conductor wire on the electrically conductive
Corresponding second conducting wire in road, obtains finished circuit board as shown in Figure 2 d.Wherein, for ensure the second conducting wire 211 with
The binding force of substrate 22, the width of the first conducting wire 23 are less than the width of the second conducting wire 211.
It should be noted that in the embodiment of the present invention, metal material may be used in the first conducting wire and the second conducting wire
Material is made, and can also be made of other conductive materials；Preferably, in conjunction with the electric conductivity and price of each metalloid material,
One conducting wire and the second conducting wire are all made of metallic copper and are made.
It should be further noted that using above-mentioned production process, the circuit board being made, relative to using existing skill
Circuit board made of the production method of art, can be with thin 30 microns, and production method provided in an embodiment of the present invention can be made
It is more regular at side wall, the smaller thick circuit board of spacing.
In this way, by forming the first conducting wire being electrically connected with the second conducting wire in substrate, can realize
In the case of not increasing circuit board integral thickness, increase the thickness of conducting wire, meets the needs of circuit board is to thick circuit.
The production method of circuit board provided in an embodiment of the present invention, by providing an initial circuit plate, the initial circuit
Plate includes conductive layer and the substrate set on the conductive layer side；According to default cabling pattern, is formed correspond on the substrate
Void region；Conductive material is set in the void region, forms the first conducting wire；On the conductive layer formed with
Corresponding second conducting wire of first conducting wire, obtains finished circuit board.In this way by being formed and second in substrate
First conducting wire of conducting wire electrical connection, can be in realization in the case where not increasing circuit board integral thickness, and increase is led
The thickness of electric line meets the needs of circuit board is to thick circuit.
It is the flow chart of the production method of circuit board provided in an embodiment of the present invention referring to Fig. 3, Fig. 3, as shown in Fig. 2, packet
Include following steps：
Step 301, provide an initial circuit plate, the initial circuit plate include conductive layer and be set to the conductive layer side
Substrate.
In the step, it can make one by conventional circuit board process including conductive layer and be set to the conductive layer
The substrate of side.
Step 302, according to default cabling pattern, form corresponding void region on the substrate.
In the step, corresponding void region can be formed on substrate, for example can pass through according to default cabling pattern
Radium art or artistic carving form void region corresponding with default cabling pattern on substrate, and on conductive layer with hollow out
Part corresponding to region is exposed in void region.
Optionally, step 302 can also include：According to the default cabling pattern, in the base by the way of radium-shine
Corresponding void region is formed on plate.
In present embodiment, radium-shine mode may be used and form vacancy section corresponding with default cabling image on substrate
Domain.Specifically, laser laser carving trajectory parameters can be arranged first according to default cabling pattern；Then joined according to laser laser carving track
Number, the void region formed on substrate using laser makes part corresponding with void region on conductive layer be revealed in vacancy section
Domain.Wherein, laser laser carving trajectory parameters include：Frequency parameter, energy parameter, spot diameter and radium-shine speed, frequency parameter model
It encloses for 10~40 kHz；Ranging from 1~8 watt of energy parameter；Ranging from 10~100 microns of spot diameter；Radium-shine velocity interval
It is per second for 1000~3000 millimeters.
It should be noted that the choosing value range of above-mentioned laser laser carving trajectory parameters is related with the thickness of substrate, and each track
The size of parameter and the thickness of substrate are proportionate, i.e. the thickness of substrate is bigger, and the value of corresponding each trajectory parameters is also bigger.
Step 303 covers first on the peripheral surface of side and the conductive layer of the conductive layer far from the substrate
Protective film.
In the step, the first protective film can be covered on the peripheral surface of side and conductive layer of the conductive layer far from substrate,
To during forming the first conducting wire by the way of plating, will not additionally increase the thickness of conductive layer, ensure electricity
The integral thickness of road plate will not increase.
Wherein, the first protective film can be made of polyethylene terephthalate, polyethylene, photosensitive material and glue；
Specifically, the first protective film is when in use, polyethylene terephthalate and polyethylene can be stripped, and glue can be by photosensitive material
Material is bonded together, and in this way when being exposed processing to the first protective film, the part of exposure can harden.
Step 304 deposits conductive material by the way of plating in the void region, forms first conductor wire
Road.
In the step, the mode that plating may be used deposits conductive material in void region, forms the first conducting wire.
Wherein, since in step 303, the peripheral surface overlying in side and conductive layer of the conductive layer far from substrate is covered with the first protection
Film, therefore in electroplating process, will not additionally increase the thickness of conductive layer, but deposition forms coating in void region, and
Ultimately form the first conducting wire, and the part electrical connection of first conducting wire void region corresponding with the conductive layer.
It should be noted that during electroplating deposition, the thickness parameter of coating can be according to the conduction of actual demand
The thickness of circuit is chosen.Wherein, the thickness relationship of the thickness of coating and substrate can also may be used with flush relationship, the thickness of coating
It with the thickness more than or less than substrate, is not specifically limited again, is subject to actual (real) thickness demand.
Step 305 covers the second protective film in side of the substrate far from the conductive layer.
In the step, the second protective film can be covered in substrate one far from conductive layer, i.e., in corresponding first conducting wire
Covering setting the second protective film, protection conductive layer during being etched to form the second conducting wire, the first conductive layer not by
It etches away.Wherein, the second protective film polyethylene terephthalate, polyethylene, photosensitive material and glue to be made of；Specifically
, when in use, polyethylene terephthalate and polyethylene can be stripped the second protective film, and glue can glue photosensitive material
It is combined, in this way when being exposed processing to the second protective film, the part of exposure can harden.
Step 306 is exposed place to the initial circuit plate for being covered with first protective film and second protective film
Reason, and according to the default cabling pattern, form exposure area and non-exposed areas.
In the step, the film equipped with default cabling pattern can be set to and be covered with first protective film and described the
On the initial circuit plate of two protective films, and exposure-processed is carried out, then can obtain exposure area corresponding with default cabling pattern
The non-exposed areas and.Wherein, the exposure area includes side of the substrate far from the conductive layer and the void region
Corresponding first area and in side of the conductive layer far from substrate second area corresponding with the void region.
It should be noted that ensure the binding force of the second conducting wire and substrate, what the corresponding second area was formed
The width of second conducting wire is more than the width for the first conducting wire that the corresponding void region is formed.
Step 307 carries out development treatment to the first protective film set on side of the conductive layer far from the substrate, goes
Except the first protective film of the non-exposed areas.
In the step, the first protection of the weakly alkaline solutions such as sodium carbonate or potassium carbonate removal non-exposed areas may be used
Film.
Step 308, using chemical etching liquor, remove conduction material corresponding with the non-exposed areas on the conductive layer
Material, to form second conducting wire on the conductive layer.
In the step, can use etching solution removal conductive layer on conductive material corresponding with non-exposed areas, and
Conduction presents to form the second conducting wire.
For example, when conductive material is metallic copper, may be used the liquid medicine of etch copper, remove on conductive layer with non-exposed area
The corresponding metallic copper in domain.
Step 309, the first protective film and the second protective film for removing the exposure area, obtain the finished circuit board.
In the step, the first guarantor of the strong alkali solutions such as sodium hydroxide or potassium hydroxide removal exposure area may be used
Cuticula and the second protective film, and obtain finished circuit board.
It should be noted that in the embodiment of the present invention, metal material may be used in the first conducting wire and the second conducting wire
Material is made, and can also be made of other conductive materials；Preferably, in conjunction with the electric conductivity and price of each metalloid material,
One conducting wire and the second conducting wire are all made of metallic copper and are made.
It should be further noted that using above-mentioned production process, the circuit board being made, relative to using existing skill
Circuit board made of the production method of art, can be with thin 30 microns, and production method provided in an embodiment of the present invention can be made
It is more regular at side wall, the smaller thick circuit board of spacing.
The production method of circuit board provided in an embodiment of the present invention, by providing an initial circuit plate, the initial circuit
Plate includes conductive layer and the substrate set on the conductive layer side；According to default cabling pattern, is formed correspond on the substrate
Void region；The first protection of covering on the peripheral surface of side and the conductive layer of the conductive layer far from the substrate
Film；Conductive material is set in the void region, forms the first conducting wire；The substrate far from the conductive layer one
Side covers the second protective film；Initial circuit plate to being covered with first protective film and second protective film is exposed place
Reason, and according to the default cabling pattern, form exposure area and non-exposed areas；To being set to the conductive layer far from the base
First protective film of the side of plate carries out development treatment, removes the first protective film of the non-exposed areas；Using chemical etching
Liquid removes conductive material corresponding with the non-exposed areas on the conductive layer；Remove the first protection of the exposure area
Film and the second protective film, obtain the finished circuit board.It is electrically connected in this way with the second conducting wire by being formed in substrate
First conducting wire can increase the thickness of conducting wire, meet in realization in the case where not increasing circuit board integral thickness
Demand of the circuit board to thick circuit.
It should be added that the embodiment of the present invention also provides a kind of production method of circuit board, specifically, providing one
Initial circuit plate, the initial circuit plate include the first conducting wire and the first substrate set on first conducting wire both sides
And second substrate, i.e., described first conducting wire are set between the first substrate and the second substrate；Corresponding described first
The cabling pattern of conducting wire carries out radium-shine processing to the first substrate and the second substrate, and in the first substrate
It is upper to form the first void region corresponding with the cabling pattern of the first conducting wire, and formed on the second substrate
The second void region corresponding with the cabling pattern of the first conducting wire；Conductive material is set in the first void region,
The second conducting wire is formed, conductive material is set in second void region, third conducting wire is formed, to obtain into
Product circuit board.The line thicknesses that circuit board can be further increased in this way, meet the needs of circuit board is to thick circuit.
It is one of the structural schematic diagram of circuit board that one embodiment of the invention provides referring to Fig. 4-5, Fig. 4；Fig. 5 is the present invention
The second structural representation for the circuit board that one embodiment provides.
As shown in Figure 4 and Figure 5, the embodiment of the present invention also provides a kind of circuit board 400, including substrate 42 and setting with it is described
The conductive layer 41 of 42 side of substrate, the substrate 42 are equipped with void region 421 corresponding with default cabling pattern, the vacancy section
It is provided with conductive material in domain 421, and forms the first conducting wire 43, is formed on the conductive layer 41 and is led with described first
43 corresponding second conducting wire 411 of electric line, and first conducting wire 43 is electrically connected with second conducting wire 411
It connects.
In the embodiment of the present invention, the production method that Fig. 1 to Fig. 3 may be used in circuit board 400 is made, in substrate 42
First conducting wire 43 is set in void region 421, and being electrically connected by the first conducting wire 43 and the second conducting wire 411
Connect, come increase circuit board conducting wire thickness, and then improve circuit board performance, meet need of the circuit board to thick circuit
It asks.
Optionally, in order to ensure that the binding force of the second conducting wire 411 and substrate 42, the width of the first conducting wire 43 are small
In the width of the second conducting wire 411.
It should be noted that in present embodiment, gold may be used in the first conducting wire 43 and the second conducting wire 411
Category is made；Preferably, in conjunction with the electric conductivity and price of each metalloid, the first conducting wire 43 and the second conducting wire 411 are
It is made of metallic copper.
It is the structural schematic diagram for the circuit board that another embodiment of the present invention provides referring to Fig. 6, Fig. 6.
As shown in fig. 6, the embodiment of the present invention also provide a kind of circuit board 600, including first substrate 61, second substrate 62 with
And the first conducting wire 63 between the first substrate 61 and the second substrate 62, and the first substrate 61, institute
It states the first conducting wire 63 and the second substrate 62 and is bonded setting successively；Wherein, the first substrate 61 corresponds to described first
The line pattern of conducting wire 63 is equipped with the first void region, and is provided with conductive material in first void region, is formed
Second conducting wire 64；The line pattern that the second substrate 62 corresponds to first conducting wire 63 is equipped with the second vacancy section
Domain, and conductive material is provided in second void region, form third conducting wire 65.
The embodiment of the present invention also provides a kind of mobile terminal, including foregoing circuit plate.
Wherein, which can be mobile phone, tablet computer, personal digital assistant (PersonalDigital
Assistant, PDA), E-book reader, MP3 (dynamic image expert's compression standard audio level 3, Moving Picture
Experts Group Audio Layer III) player, MP4 (dynamic image expert's compression standard audio levels 4, Moving
Picture Experts Group Audio Layer IV) player, pocket computer on knee, vehicle-mounted computer, desk-top meter
Calculation machine, set-top box, intelligent TV set, wearable device etc..
It should be noted that the realization method of foregoing circuit plate embodiment is equally applicable to the embodiment of the mobile terminal
In, and identical technique effect can be reached, details are not described herein.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of production method of circuit board, which is characterized in that including：
An initial circuit plate is provided, the initial circuit plate includes conductive layer and the substrate set on the conductive layer side；
According to default cabling pattern, void region is formed on the substrate；
Conductive material is set in the void region, forms the first conducting wire；
The second conducting wire corresponding with first conducting wire is formed on the conductive layer, obtains finished circuit board.
2. according to the method described in claim 1, it is characterized in that, described be arranged conductive material, shape in the void region
Before the step of the first conducting wire, the method further includes：
The first protective film is covered on the peripheral surface of side and the conductive layer of the conductive layer far from the substrate.
3. according to the method described in claim 2, it is characterized in that, described be arranged conductive material, shape in the void region
The step of at the first conducting wire, including：
Conductive material is deposited in the void region by the way of plating, forms first conducting wire.
4. according to the method described in claim 2, it is characterized in that, described form and first conduction on the conductive layer
Corresponding second conducting wire of circuit, the step of obtaining finished circuit board, including：
Second conducting wire corresponding with first conducting wire is formed on the conductive layer by the way of etching,
Obtain the finished circuit board.
5. according to the method described in claim 4, it is characterized in that, described formed by the way of etching on the conductive layer
Second conducting wire corresponding with first conducting wire, the step of obtaining the finished circuit board, including：
The second protective film is covered in side of the substrate far from the conductive layer；
Initial circuit plate to being covered with first protective film and second protective film is exposed processing, and according to described
Default cabling pattern, forms exposure area and non-exposed areas, is led far from described wherein the exposure area includes the substrate
The side of electric layer first area corresponding with the void region and side of the conductive layer far from the substrate with it is described
The corresponding second area in void region；
Development treatment is carried out to the first protective film set on side of the conductive layer far from the substrate, removal is described non-exposed
First protective film in region；
Using chemical etching liquor, conductive material corresponding with the non-exposed areas on the conductive layer is removed, to be led described
Second conducting wire is formed in electric layer；
The first protective film and the second protective film for removing the exposure area, obtain the finished circuit board.
6. it is the method according to any one of claims 1 to 5, it is characterized in that, described according to default cabling pattern, in institute
The step of corresponding void region is formed on substrate is stated, including：
According to the default cabling pattern, corresponding void region is formed on the substrate by the way of radium-shine.
7. according to the method described in claim 6, it is characterized in that, it is described by the way of radium-shine on the substrate formed with
The step of default cabling pattern corresponding void region, including：
According to the default cabling pattern, laser laser carving trajectory parameters are set；
According to the laser laser carving trajectory parameters, formed on the substrate using laser corresponding with the default cabling pattern
Void region.
8. a kind of circuit board, which is characterized in that it is made of the production method as described in any one of claim 1 to 7, including
Conductive layer and the first base set on the first side of the conductive layer, the first substrate are equipped with corresponding with default cabling pattern
First void region is provided with conductive material in first void region, and forms the first conducting wire, in the conductive layer
On be formed with the second conducting wire corresponding with first conducting wire, and first conducting wire and described second conductive
Circuit is electrically connected.
9. circuit board according to claim 8, which is characterized in that the circuit board further includes set on the of the conductive layer
Second base of two sides, first side are equipped with the two opposite sides that the second side is the conductive layer, the second substrate
The second void region corresponding with the default cabling pattern is equipped with conductive material in second void region, and forms the
Three conducting wires, and the third conducting wire is electrically connected with second conducting wire.
10. a kind of mobile terminal, which is characterized in that including circuit board as claimed in claim 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053823.9A CN108323027A (en) | 2018-01-19 | 2018-01-19 | A kind of production method of circuit board, circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053823.9A CN108323027A (en) | 2018-01-19 | 2018-01-19 | A kind of production method of circuit board, circuit board and mobile terminal |
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| CN108323027A true CN108323027A (en) | 2018-07-24 |
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| CN201810053823.9A Pending CN108323027A (en) | 2018-01-19 | 2018-01-19 | A kind of production method of circuit board, circuit board and mobile terminal |
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| CN113453420A (en) * | 2020-03-25 | 2021-09-28 | 华为技术有限公司 | Circuit board, manufacturing method thereof and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN109743846B (en) * | 2018-09-27 | 2021-08-20 | 常州市武进三维电子有限公司 | Manufacturing process of hollow flexible circuit board of new energy automobile |
| CN113453420A (en) * | 2020-03-25 | 2021-09-28 | 华为技术有限公司 | Circuit board, manufacturing method thereof and electronic equipment |
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Application publication date: 20180724 |