CN109862704A - A kind of PCB production method and PCB containing buried via hole - Google Patents
A kind of PCB production method and PCB containing buried via hole Download PDFInfo
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- CN109862704A CN109862704A CN201910262829.1A CN201910262829A CN109862704A CN 109862704 A CN109862704 A CN 109862704A CN 201910262829 A CN201910262829 A CN 201910262829A CN 109862704 A CN109862704 A CN 109862704A
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- hole
- ink
- buried via
- pcb
- dry film
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Abstract
The present invention relates to PCB technical fields, disclose a kind of PCB production method and PCB containing buried via hole.The PCB production method includes: two core plates for being located at the end positions of buried via hole to be processed, makes dry film/ink respectively at predeterminable area；It presses core plate and other core plates to form multi-layer board；Holes drilled through on multilayer boards, and remaining there is dry film/ink in the both ends periphery of the middle hole section of through-hole；It first takes off film removal dry film/ink and carries out electroless copper plating again；Alternatively, first carry out electroless copper plating, then take off film with and meanwhile remove the electroless copper plating layer on dry film/ink and its surface；Plating；Remove the upper hole section of through-hole and the hole copper of lower hole section；Consent is carried out to through-hole, so that the middle hole section of through-hole is formed as buried via hole.The embodiment of the present invention is that the buried via hole that can be made between different internal layers enormously simplifies production process compared with existing manufacture craft by one step press, improves producing efficiency, reduces the production cost, and effectively increases production precision.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields, more particularly to one kind
PCB production method and PCB containing buried via hole.
Background technique
PCB is the indispensable fundamental parts of all electronic products, is the carrier of all electronic components, is zero group of electronics
Part is in installation and main support body when interconnection.
There are three types of common PCB guide holes: through-hole, blind hole and buried via hole.Wherein, through-hole is through the via hole of entire wiring board；
Blind hole is the via hole that PCB internal layer cabling is connected with the surface layer PCB cabling, this hole does not penetrate entire wiring board；Buried via hole is by PCB
The via hole that internal layer circuit between two layers of arbitrary neighborhood or multilayer is connected.
For buried via hole, existing manufacture craft is: first passing through the mode of one step press, holes drilled through, plating and filling holes with resin
Produce through-hole；Then it is pressed again, through-hole is become into buried via hole.Using it is this by " first one step press forms through-hole, then
Second pressing forms buried via hole " buried via hole production method, need by multiple stitching operation, entire production process length, low efficiency, at
This height, and it is low to make precision.
Summary of the invention
The purpose of the present invention is to provide a kind of PCB production method and PCB containing buried via hole, overcome work existing for prior art
The defect that skill is complicated and production precision is low.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of PCB production method containing buried via hole, comprising:
According to default lamination sequence, two core plates of the end positions for being located at buried via hole to be processed, respectively at plate face
Predeterminable area makes dry film/ink；The predeterminable area corresponds to interior buried via hole to be processed in the bore position of plate face；
It is pressed after the core plate is stacked with other core plates for forming the PCB according to preset order, forms multi-layer board；
The holes drilled through on the multi-layer board, and remaining there is the dry film/oil in the both ends periphery of the middle hole section of the through-hole
Ink；
It first takes off film and removes the dry film/ink, then carry out electroless copper plating；Alternatively, first carrying out electroless copper plating, then carry out taking off film
To remove the electroless copper plating layer of the dry film/ink and the dry film/ink pellet surface simultaneously；
The hole wall of the through-hole is electroplated；
Remove the upper hole section of the through-hole and the hole copper of lower hole section；
Consent is carried out to the through-hole, so that the middle hole section of the through-hole is formed as buried via hole.
Optionally, the hole copper of the upper hole section and lower hole section of the removal through-hole, comprising:
The aperture layers of copper of the through-hole is etched into isolated orifice ring；
Pad pasting, exposure and imaging are first passed through, to expose outer-layer circuit part and through-hole, cover non-line section；It carries out again
It is tin plating and take off film, to expose non-line section, cover outer-layer circuit part and through-hole；Later, etching removal non-line section, hole
The hole copper of ring and the upper hole section and lower hole section；Tin is most retreated, outer-layer circuit part is exposed.
Optionally, the dry film/ink is removed in the film that first takes off, then after carrying out electroless copper plating, and to described logical
Before the hole wall in hole is electroplated, further includes: to the cavity formed after the dry film/ink removal, remove institute by microetch method
State the electroless copper plating layer in cavity.
Optionally, the dry film with a thickness of 50-150 microns, the ink with a thickness of 30-60 microns.
Optionally, the characteristic of the dry film/ink meets condition: 180-220 degrees Celsius of high temperature resistant, high pressure resistant 100-
400PSI, high temperature high voltage resistant duration 60-120 minutes.
It is optionally, described that the aperture layers of copper of the through-hole is etched into isolated orifice ring, comprising:
Pad pasting, exposure and imaging are first passed through, to cover the copper ring that through-hole two sides need to etch away, exposes circuit pack；Again into
Row is tin plating and takes off film, to expose non-line section, covers circuit pack；The isolated orifice ring of through-hole two sides is etched later；Finally
Move back tin.
Optionally, described that the aperture layers of copper of the through-hole is etched into isolated orifice ring, comprising: to first pass through pad pasting, exposure
And development, to expose the copper ring that through-hole two sides need to etch away；The isolated orifice ring of through-hole two sides is etched again；Then film is taken off.
Optionally, the film that takes off removes the dry film/ink, comprising: uses alkaline solution or organic solvent, dissolution is gone
Except the dry film/ink.
A kind of PCB, the PCB are made according to any of the above-described production method.
Compared with prior art, the invention has the benefit that
The embodiment of the present invention is the buried via hole that can be made between different internal layers by one step press, with existing manufacture craft phase
Than enormously simplifying production process, improving producing efficiency, reduce the production cost, and effectively increase production precision.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the PCB production method flow chart containing buried via hole that the embodiment of the present invention one provides；
Fig. 2 is the structural schematic diagram of the core plate after production dry film/ink that the embodiment of the present invention one provides；
Fig. 3 is the structural schematic diagram of the multi-layer board that provides of the embodiment of the present invention one after piercing；
Fig. 4 is structural schematic diagram of the PCB after taking off film shown in Fig. 3；
Fig. 5 is structural schematic diagram of the PCB after electroless copper plating shown in Fig. 4；
Fig. 6 is the structural schematic diagram of PCB after plating shown in Fig. 5；
Fig. 7 is structural schematic diagram of the PCB after pad pasting, exposure and imaging shown in Fig. 6；
Fig. 8 is PCB shown in Fig. 7 in structural schematic diagram tin plating and after taking off film；
Fig. 9 is structural schematic diagram of the PCB after etching and moving back tin shown in Fig. 8；
Figure 10 is structural schematic diagram of the PCB shown in Fig. 6 after using dry film sealing of hole；
Figure 11 is structural schematic diagram of the PCB after pad pasting, exposure and imaging shown in Fig. 9；
Figure 12 be Figure 11 shown in PCB it is tin plating, take off film after structural schematic diagram；
Figure 13 is structural schematic diagram of the PCB after etching and moving back tin shown in Figure 12；
Figure 14 is structural schematic diagram of the PCB after filling holes with resin shown in Figure 13；
Figure 15 is the PCB production method flow chart provided by Embodiment 2 of the present invention containing buried via hole.
Specific embodiment
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
Those of ordinary skill's all other embodiment obtained without making creative work, belongs to protection of the present invention
Range.
Embodiment one
Referring to Fig. 1, a kind of PCB production method containing buried via hole is present embodiments provided, comprising steps of
Step 101, according to default lamination sequence, two core plates of the end positions for being located at buried via hole to be processed, complete
After making at inner line figure, one layer of dry film/ink is made respectively at the predeterminable area of plate face, as shown in Figure 2.
Before making dry film/ink, according to default lamination sequence, chosen from each layer core plate to be produced for forming PCB
Positioned at core plate of two core plates as dry film/ink to be produced of buried via hole end positions to be processed.
In practical applications, the quantity of buried via hole to be processed is at least one, for the to be processed of different processing requests
Buried via hole needs the core plate for selecting corresponding dry film/ink to be produced according to its specific location respectively.It to be processed is buried for each
The specific production region of dry film/ink on core plate is arranged in the bore position of plate face according to the buried via hole to be processed in hole.To guarantee
Processing quality, each dry film/printing ink to manufacture region area need to be greater than the cross-sectional area of corresponding buried via hole to be processed, to ensure
The both ends periphery of buried via hole to be processed is remaining after subsequent drilling dry film/ink.
Dry film can be made by conventional dry film method, and ink is made by conventional welding resistance silk-screen mode.It is making
When dry film/ink, preferably high temperature high voltage resistant (180-220 degrees Celsius of high temperature resistant, high pressure resistant 100-400PSI, divide by time 60-120
Clock) dry film/ink, can guarantee in subsequent lamination bonding processes dry film/ink in this way without decomposing and carbonization, and then after ensuring
It is continuous to take off film effect, improve product quality.
Above-mentioned production by two core plates of dry film/ink and is formed other core plates of PCB according to default by step 102
Sequence presses after stacking, and forms multi-layer board.
Specifically, corresponding inner line figure production need to be respectively completed to other core plates before pressing；In pressing,
Prepreg need to be stacked between adjacent each layer core plate, core plate is overlapped with core plate or be stacked in the outer surface of outer layer core plate
Copper foil takes high temperature and pressure mode pressing plate, so that each section combines together, forms multi-layer board.
Step 103, in multiple-plate predeterminated position holes drilled through, and the middle hole section of through-hole both ends periphery it is remaining have it is dry
Film/ink, as shown in Figure 3.
After drilling, while running through each layer core plate, through-hole can pass through corresponding two dry films/printing ink to manufacture region, position
Through-hole is divided into upper hole section, middle hole section and lower hole section along its axial direction in two parts dry film/ink of different layers；Together
When, since dry film/printing ink to manufacture region area is greater than the cross-sectional area of via hole, thus the both ends periphery of the middle hole section of through-hole
Dry film/ink can still have been remained.
Step 104 carries out taking off membrane operations, to remove the remaining dry film/ink in the both ends periphery of middle hole section of through-hole, such as
Shown in Fig. 4.
Specifically, alkaline solution or organic solvent can be used, dry film/ink is completely dissolved removal, thus in through-hole
The both ends periphery of middle hole section be respectively formed the cavity of a specific shape.
Step 105 carries out electroless copper plating to multi-layer board, and it is heavy to deposit a stratification in the hole wall of multiple-plate surface layer and through-hole
Layers of copper, as shown in Figure 5.
It, will be one layer 0.1-1.0 microns thick on hole wall and superficial deposit by autocatalyzed oxidation reduction reaction in this step
The fine and close thin copper layer of degree, layers of copper is conductive, so as to by hole wall and surface layer connection.
During electroless copper plating, the empty cavity position formed after dry film/ink is removed at step 104, since liquid medicine is handed over
Change insufficient, the corner location in cavity can not almost sink layers of copper, or the layers of copper of deposition is thinner than normal electroless copper plating layer,
Substantially at 0.2 micron or less.
It, can also will be in cavity by quick microetch method to further ensure that hole wall layers of copper can be fully disconnected in designated position
Electroless copper plating layer removal, retain hole wall other positions electroless copper plating layer.
So far, copper can not be sunk due to being formed in the cavity at the middle hole section both ends of through-hole, the middle hole section of through-hole exists
It can realize that heavy layers of copper disconnects with the adjacent position of upper hole section and lower hole section.
In follow-up process, middle hole section is formed into buried via hole, therefore the hole copper of middle hole section can be known as by the present embodiment
The effective hole copper for needing to retain, and the invalid hole copper that the hole copper of upper hole section and lower hole section referred to as needs to remove.
In addition, the thickness of dry film is preferably 50-150 microns, the thickness of ink when making dry film/ink in a step 101
Preferably 30-60 microns, this is because: the cavity of formation is too small if thickness is too small, the heavy layers of copper of cavity upper and lower side is easily connected,
Lead to not disconnect；If thickness is too big, the cavity of formation is too big, and liquid medicine can smoothly exchange in cavity, and it is continuous heavy to be formed
Layers of copper, also resulting in can not disconnect.
The hole wall of through-hole is electroplated in step 106, so that hole wall layers of copper thickeies, as shown in Figure 6.
Since the both ends periphery of the middle hole section of through-hole is formed with cavity, and cavity does not have electroless copper plating layer, thus in electricity
During plating, empty cavity position will be unable to that layers of copper is electroplated, so that the hole wall layers of copper of through-hole is each turned off at two cavitys.
The invalid hole copper of step 107, the upper hole section for removing through-hole and lower hole section.
In this step, outer-layer circuit figure can be made while removing invalid hole copper, is specifically included:
(1) two sides of through-hole are etched into isolated orifice ring.
Specifically, tin plating method can be used to realize: by pad pasting, exposure and imaging step, covering through-hole two sides needs to etch
The copper ring fallen, remaining circuit pack expose, as shown in Figure 7；Copper facing is carried out again, this step requires optional do or not according to copper thickness
It does；Then tin plating and take off film, to expose non-line section, circuit pack is covered, as shown in Figure 8；Through-hole two is etched later
The isolated orifice ring of side；Tin is most retreated, as shown in Figure 9.
Alternatively, being realized using dry film method of pore sealing: as shown in Figure 10, in pad pasting, exposure and imaging, (exposing through-hole two sides is needed
The copper ring etched away, rest part cover) after, the isolated orifice ring of through-hole two sides is etched, takes off film, as shown in Figure 9.
(2) using addition process make outer-layer circuit figure: first carry out pad pasting, exposure and imaging, with expose circuit pack and
The through-hole of metallization covers non-line section, as shown in figure 11；Carry out again copper facing (this step according to copper thickness require it is optional do or
Person does not do)；Then it carries out tin plating and takes off film, to expose non-line section, tin layers cover the through-hole of circuit pack and metallization, such as
Shown in Figure 12；Etching removal non-line section and invalid hole copper later；Tin is most retreated, exposes outer-layer circuit part, such as Figure 13 institute
Show.
Step 108 uses filling holes with resin to the upper hole section and lower hole section of through-hole, so that the middle hole section of through-hole
Buried via hole is formed, as shown in figure 14.
To sum up, the present embodiment can be made into any number of buried via hole by one step press, compared with existing manufacture craft, greatly
Production process is simplified greatly, producing efficiency is improved, reduces the production cost, and effectively increases production precision.
Embodiment two
Figure 15 is please referred to, the production method for present embodiments providing PCB of the another kind containing buried via hole, comprising steps of
Step 201 is identical to step 103 as the step 101 in embodiment one to step 203, and details are not described herein again.
Step 204 carries out electroless copper plating to multi-layer board, and it is heavy to deposit a stratification in the hole wall of multiple-plate surface layer and through-hole
Layers of copper.
It, will be one layer 0.1-1.0 microns thick on hole wall and superficial deposit by autocatalyzed oxidation reduction reaction in this step
The fine and close thin copper layer of degree, layers of copper is conductive, so as to be convenient for subsequent hole wall and surface layer simultaneously for hole wall and surface layer connection
Layers of copper in plating.
Step 205 carries out taking off membrane operations, to remove dry film/ink and dry film/ink pellet surface electroless copper plating simultaneously
Layer.
In taking off membrane process, since the consistency of the electroless copper plating layer on the hole wall surface layer of through-hole is insufficient, alkaline solution or
Organic solvent can penetrate into the inside of electroless copper plating layer, dry film/ink of inside is completely dissolved removal, while being attached to dry
Film/ink pellet surface electroless copper plating layer can also be fallen together, to be respectively formed one in the both ends periphery of the middle hole section of through-hole
The cavity of specific shape.
The hole wall of through-hole is electroplated in step 206, so that hole wall layers of copper thickeies.
Since the both ends periphery of the middle hole section of through-hole is formed with cavity, and cavity does not have electroless copper plating layer, thus in electricity
During plating, empty cavity position will be unable to that layers of copper is electroplated, so that the hole wall layers of copper of through-hole disconnects at two cavitys.
The invalid hole copper of step 207, the upper hole section for removing through-hole and lower hole section.
Step 208 uses filling holes with resin to the upper hole section and lower hole section of through-hole, so that the middle hole section of through-hole
Form buried via hole.
To sum up, the mode of electroless copper plating and microetch is different again from film is first taken off in embodiment one, and the present embodiment two, which uses, first to be changed
Learning the processing mode that heavy copper takes off film again can be realized effective hole of through-hole although the principle of two ways is slightly different
Copper is efficiently separated with invalid hole copper, provides precondition for the removal operation of subsequent invalid hole copper.
Embodiment three
A kind of PCB is present embodiments provided, which is made according to method described in embodiment one or embodiment two, tool
Body production method repeats no more.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of PCB production method containing buried via hole, which is characterized in that the PCB production method includes:
According to default lamination sequence, two core plates of the end positions for being located at buried via hole to be processed, respectively at the default of plate face
Region makes dry film/ink；The predeterminable area corresponds to interior buried via hole to be processed in the bore position of plate face；
It is pressed after the core plate is stacked with other core plates for forming the PCB according to preset order, forms multi-layer board；
The holes drilled through on the multi-layer board, and remaining there is the dry film/ink in the both ends periphery of the middle hole section of the through-hole；
It first takes off film and removes the dry film/ink, then carry out electroless copper plating；Alternatively, first carrying out electroless copper plating, then take off film with same
When remove the electroless copper plating layer of the dry film/ink and the dry film/ink pellet surface；
The hole wall of the through-hole is electroplated；
Remove the upper hole section of the through-hole and the hole copper of lower hole section；
Consent is carried out to the through-hole, so that the middle hole section of the through-hole is formed as buried via hole.
2. the PCB production method according to claim 1 containing buried via hole, which is characterized in that described to remove the upper of the through-hole
The hole copper of portion's hole section and lower hole section, comprising:
The aperture layers of copper of the through-hole is etched into isolated orifice ring；
Pad pasting, exposure and imaging are first passed through, to expose outer-layer circuit part and through-hole, cover non-line section；It carries out again tin plating
With take off film, to expose non-line section, cover outer-layer circuit part and through-hole；Later, etching removal non-line section, orifice ring with
And the hole copper of the upper hole section and lower hole section；Tin is most retreated, outer-layer circuit part is exposed.
3. the PCB production method according to claim 1 containing buried via hole, which is characterized in that first taken off described in film removal described
Dry film/ink, then after carrying out electroless copper plating, and before the hole wall of the through-hole is electroplated, further includes: to described dry
The cavity formed after film/ink removal, the electroless copper plating layer in the cavity is removed by microetch method.
4. the PCB production method according to claim 1 containing buried via hole, which is characterized in that the dry film with a thickness of 50-
150 microns.
5. the PCB production method according to claim 1 containing buried via hole, which is characterized in that the ink with a thickness of 30-60
Micron.
6. the PCB production method according to claim 1 containing buried via hole, which is characterized in that the characteristic of the dry film/ink is full
Sufficient condition: 180-220 degrees Celsius of high temperature resistant, high pressure resistant 100-400PSI, high temperature high voltage resistant duration 60-120 minutes.
7. the PCB production method according to claim 2 containing buried via hole, which is characterized in that the aperture by the through-hole
Layers of copper is etched into isolated orifice ring, comprising:
Pad pasting, exposure and imaging are first passed through, to cover the copper ring that through-hole two sides need to etch away, exposes circuit pack；It is plated again
Tin and film is taken off, to expose non-line section, covers circuit pack；The isolated orifice ring of through-hole two sides is etched later；Most retreat tin.
8. the PCB production method according to claim 2 containing buried via hole, which is characterized in that the aperture by the through-hole
Layers of copper is etched into isolated orifice ring, comprising: pad pasting, exposure and imaging is first passed through, to expose the copper ring that through-hole two sides need to etch away；
The isolated orifice ring of through-hole two sides is etched again；Then film is taken off.
9. the PCB production method according to claim 1 containing buried via hole, which is characterized in that it is described take off film remove the dry film/
Ink, comprising: use alkaline solution or organic solvent, dissolution removes the dry film/ink.
10. a kind of PCB, which is characterized in that the PCB is made to 9 any production methods according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910262829.1A CN109862704A (en) | 2019-04-02 | 2019-04-02 | A kind of PCB production method and PCB containing buried via hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910262829.1A CN109862704A (en) | 2019-04-02 | 2019-04-02 | A kind of PCB production method and PCB containing buried via hole |
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| Publication Number | Publication Date |
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| CN109862704A true CN109862704A (en) | 2019-06-07 |
Family
ID=66902992
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|---|---|---|---|
| CN201910262829.1A Pending CN109862704A (en) | 2019-04-02 | 2019-04-02 | A kind of PCB production method and PCB containing buried via hole |
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| CN110636718A (en) * | 2019-10-30 | 2019-12-31 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111132475A (en) * | 2019-12-27 | 2020-05-08 | 生益电子股份有限公司 | Buried hole manufacturing method |
| CN114302578A (en) * | 2021-12-14 | 2022-04-08 | 生益电子股份有限公司 | PCB preparation method and PCB |
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| CN114302578A (en) * | 2021-12-14 | 2022-04-08 | 生益电子股份有限公司 | PCB preparation method and PCB |
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Application publication date: 20190607 |