CN103999343B - 功率转换装置 - Google Patents
功率转换装置 Download PDFInfo
- Publication number
- CN103999343B CN103999343B CN201280061309.0A CN201280061309A CN103999343B CN 103999343 B CN103999343 B CN 103999343B CN 201280061309 A CN201280061309 A CN 201280061309A CN 103999343 B CN103999343 B CN 103999343B
- Authority
- CN
- China
- Prior art keywords
- semi
- power module
- heat
- substrate
- power conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-005490 | 2012-01-13 | ||
JP2012005490 | 2012-01-13 | ||
PCT/JP2012/007310 WO2013105166A1 (ja) | 2012-01-13 | 2012-11-14 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103999343A CN103999343A (zh) | 2014-08-20 |
CN103999343B true CN103999343B (zh) | 2017-05-10 |
Family
ID=48781145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280061309.0A Expired - Fee Related CN103999343B (zh) | 2012-01-13 | 2012-11-14 | 功率转换装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103999343B (ja) |
WO (1) | WO2013105166A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10964622B2 (en) * | 2017-05-24 | 2021-03-30 | Mitsubishi Electric Corporation | Semiconductor package |
US11343942B2 (en) * | 2018-05-14 | 2022-05-24 | Mitsubishi Electric Corporation | Power conversion device including cooling components |
CN112236929B (zh) * | 2018-06-12 | 2024-01-16 | 东芝三菱电机产业***株式会社 | 半导体装置 |
JP7036092B2 (ja) * | 2018-08-10 | 2022-03-15 | 株式会社デンソー | 電力変換装置 |
JP7208757B2 (ja) * | 2018-10-03 | 2023-01-19 | 川崎重工業株式会社 | 制御装置 |
CN110518814A (zh) * | 2019-09-19 | 2019-11-29 | 江西精骏电控技术有限公司 | 一种用于车载逆变器的双面冷却结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004134542A (ja) * | 2002-10-10 | 2004-04-30 | Hitachi Ltd | 電力変換装置 |
JP2004282804A (ja) * | 2003-03-12 | 2004-10-07 | Toshiba Corp | インバータ装置 |
CN101064289A (zh) * | 2006-04-27 | 2007-10-31 | 株式会社日立制作所 | 电力变换装置 |
JP2009094175A (ja) * | 2007-10-05 | 2009-04-30 | Hitachi Ltd | 制御装置 |
JP2009240023A (ja) * | 2008-03-26 | 2009-10-15 | Nidec Shibaura Corp | モータ制御装置、ブラシレスモータ及び電動工具 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000174180A (ja) * | 1998-12-02 | 2000-06-23 | Shibafu Engineering Kk | 半導体装置 |
JP2005032912A (ja) * | 2003-07-10 | 2005-02-03 | Hitachi Industrial Equipment Systems Co Ltd | 電力変換装置 |
JP5157431B2 (ja) * | 2007-12-27 | 2013-03-06 | 株式会社デンソー | 電力変換装置 |
-
2012
- 2012-11-14 WO PCT/JP2012/007310 patent/WO2013105166A1/ja active Application Filing
- 2012-11-14 CN CN201280061309.0A patent/CN103999343B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004134542A (ja) * | 2002-10-10 | 2004-04-30 | Hitachi Ltd | 電力変換装置 |
JP2004282804A (ja) * | 2003-03-12 | 2004-10-07 | Toshiba Corp | インバータ装置 |
CN101064289A (zh) * | 2006-04-27 | 2007-10-31 | 株式会社日立制作所 | 电力变换装置 |
JP2009094175A (ja) * | 2007-10-05 | 2009-04-30 | Hitachi Ltd | 制御装置 |
JP2009240023A (ja) * | 2008-03-26 | 2009-10-15 | Nidec Shibaura Corp | モータ制御装置、ブラシレスモータ及び電動工具 |
Also Published As
Publication number | Publication date |
---|---|
WO2013105166A1 (ja) | 2013-07-18 |
CN103999343A (zh) | 2014-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170510 Termination date: 20191114 |
|
CF01 | Termination of patent right due to non-payment of annual fee |