CN103999343B - 功率转换装置 - Google Patents

功率转换装置 Download PDF

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Publication number
CN103999343B
CN103999343B CN201280061309.0A CN201280061309A CN103999343B CN 103999343 B CN103999343 B CN 103999343B CN 201280061309 A CN201280061309 A CN 201280061309A CN 103999343 B CN103999343 B CN 103999343B
Authority
CN
China
Prior art keywords
semi
power module
heat
substrate
power conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280061309.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN103999343A (zh
Inventor
田中泰仁
柴田美里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN103999343A publication Critical patent/CN103999343A/zh
Application granted granted Critical
Publication of CN103999343B publication Critical patent/CN103999343B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201280061309.0A 2012-01-13 2012-11-14 功率转换装置 Expired - Fee Related CN103999343B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-005490 2012-01-13
JP2012005490 2012-01-13
PCT/JP2012/007310 WO2013105166A1 (ja) 2012-01-13 2012-11-14 電力変換装置

Publications (2)

Publication Number Publication Date
CN103999343A CN103999343A (zh) 2014-08-20
CN103999343B true CN103999343B (zh) 2017-05-10

Family

ID=48781145

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280061309.0A Expired - Fee Related CN103999343B (zh) 2012-01-13 2012-11-14 功率转换装置

Country Status (2)

Country Link
CN (1) CN103999343B (ja)
WO (1) WO2013105166A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10964622B2 (en) * 2017-05-24 2021-03-30 Mitsubishi Electric Corporation Semiconductor package
US11343942B2 (en) * 2018-05-14 2022-05-24 Mitsubishi Electric Corporation Power conversion device including cooling components
CN112236929B (zh) * 2018-06-12 2024-01-16 东芝三菱电机产业***株式会社 半导体装置
JP7036092B2 (ja) * 2018-08-10 2022-03-15 株式会社デンソー 電力変換装置
JP7208757B2 (ja) * 2018-10-03 2023-01-19 川崎重工業株式会社 制御装置
CN110518814A (zh) * 2019-09-19 2019-11-29 江西精骏电控技术有限公司 一种用于车载逆变器的双面冷却结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134542A (ja) * 2002-10-10 2004-04-30 Hitachi Ltd 電力変換装置
JP2004282804A (ja) * 2003-03-12 2004-10-07 Toshiba Corp インバータ装置
CN101064289A (zh) * 2006-04-27 2007-10-31 株式会社日立制作所 电力变换装置
JP2009094175A (ja) * 2007-10-05 2009-04-30 Hitachi Ltd 制御装置
JP2009240023A (ja) * 2008-03-26 2009-10-15 Nidec Shibaura Corp モータ制御装置、ブラシレスモータ及び電動工具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174180A (ja) * 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
JP2005032912A (ja) * 2003-07-10 2005-02-03 Hitachi Industrial Equipment Systems Co Ltd 電力変換装置
JP5157431B2 (ja) * 2007-12-27 2013-03-06 株式会社デンソー 電力変換装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134542A (ja) * 2002-10-10 2004-04-30 Hitachi Ltd 電力変換装置
JP2004282804A (ja) * 2003-03-12 2004-10-07 Toshiba Corp インバータ装置
CN101064289A (zh) * 2006-04-27 2007-10-31 株式会社日立制作所 电力变换装置
JP2009094175A (ja) * 2007-10-05 2009-04-30 Hitachi Ltd 制御装置
JP2009240023A (ja) * 2008-03-26 2009-10-15 Nidec Shibaura Corp モータ制御装置、ブラシレスモータ及び電動工具

Also Published As

Publication number Publication date
WO2013105166A1 (ja) 2013-07-18
CN103999343A (zh) 2014-08-20

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170510

Termination date: 20191114

CF01 Termination of patent right due to non-payment of annual fee