CN103865417B - The manufacturing process of acrylate sealing tape - Google Patents
The manufacturing process of acrylate sealing tape Download PDFInfo
- Publication number
- CN103865417B CN103865417B CN201310749012.XA CN201310749012A CN103865417B CN 103865417 B CN103865417 B CN 103865417B CN 201310749012 A CN201310749012 A CN 201310749012A CN 103865417 B CN103865417 B CN 103865417B
- Authority
- CN
- China
- Prior art keywords
- heat
- adhesion coating
- conducting glue
- heat conduction
- glue adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of manufacturing process of pressure-sensitive adhesive tape, and linking agent and toluene, ethyl acetate and butanone Homogeneous phase mixing are obtained dilution; Graphite Powder 99 is mixed with the first step dilution; Acrylic ester adhesive is mixed with the mixed solution of second step, and through high speed agitator dispersion 2 ~ 10 hours, thus mix the gluing mixed solvent of formation heat conduction; Coupling agent adds sizing agent, stirs 0.5-1 hour; The gluing mixed solvent of heat conduction that 3rd step obtains is coated the lower surface that upper surface has the PET film of aluminium foil layer; Baking is carried out to the gluing mixed solvent of heat conduction in the 4th step and forms heat-conducting glue adhesion coating; By separated type material of fitting through another surface of the heat-conducting glue adhesion coating of overbaking in the 5th step.The present invention can keep the sticking strength with the contact strength of electron device for a long time, and greatly reduces the technological deficiency of the viscosity of low adhesive linkage when overcoming long-time heat conduction.
Description
Technical field
The present invention relates to a kind of manufacturing process of acrylate sealing tape, belong to adhesive material technical field.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause volume reducing like this, function grow is large, directly causes the cooling requirements of electronic devices and components more and more higher.And the fan type radiating adopted in the past, because volume is large, the problems such as noise can be produced, gradually by market.And then create other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect also do not imagine in good, slowly, all finding new efficient heat sink material.Secondly, due to the diversity of electronic product, existing product often needs customization, thus difficulty is suitable for concrete use occasion and limits the popularization of its application; Therefore, a kind ofly for electronic product feature, there is high-performance Heat dissipation adhesive tape if designed, become the direction that those of ordinary skill in the art make great efforts.
Summary of the invention
The object of the invention is to provide a kind of manufacturing process of acrylate sealing tape, the manufacturing process of this acrylate sealing tape substantially increases thermal conductivity in length and thickness direction, and when overcoming long-time heat conduction, greatly reduce the technological deficiency of the viscosity of adhesive linkage, the sticking strength with the contact strength of electron device can be kept for a long time, achieve the stability of heat dispersion, thus improve the work-ing life of adhesive tape further.
For achieving the above object, the technical solution used in the present invention is: a kind of manufacturing process of acrylate sealing tape, comprising a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating is obtained by following technique:
One step, obtains dilution by 0.2 part of linking agent and 150 parts of toluene, 125 parts of ethyl acetate and 150 parts of butanone Homogeneous phase mixing, this linking agent be selected from following general formula (
) compound,
（
）；
In formula, R
1, R
2, R
3represent the residue after carbochain that carbonatoms is the ketone of 3 ~ 8 removing a hydrogen atom independently of one another, M represents Fe or Al;
Second step: 150 parts of Graphite Powder 99s are mixed with the first step dilution, and stir formation mixed solution 84 ~ 86 DEG C of conditions;
3rd step: 100 parts of acrylic ester adhesives are mixed with the mixed solution of second step, and through high speed agitator dispersion 2 ~ 10 hours, thus mix the gluing mixed solvent of formation heat conduction;
4th step: 0.8 part of coupling agent adds sizing agent, stirs 0.5-1 hour;
5th step: the gluing mixed solvent of heat conduction that the 3rd step obtains is coated the lower surface that upper surface has the PET film of aluminium foil layer;
6th step: baking is carried out to the gluing mixed solvent of heat conduction in the 4th step and forms heat-conducting glue adhesion coating;
7th step: by separated type material of fitting through another surface of the heat-conducting glue adhesion coating of overbaking in the 5th step;
8th step: rolling;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:18:9;
Described Graphite Powder 99 diameter is 4 ~ 4.2 microns.
In technique scheme, further improved plan is as follows:
In such scheme, the whipping temp of described second step is 85 DEG C.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the manufacturing process of acrylate sealing tape of the present invention, it substantially increases thermal conductivity in length and thickness direction, and when overcoming long-time heat conduction, greatly reduce the technological deficiency of the viscosity of low adhesive linkage, the sticking strength with the contact strength of electron device can be kept for a long time, achieve the stability of heat dispersion, thus improve the work-ing life of adhesive tape further.
Specific linking agent is added in the formula of 2, the manufacturing process of acrylate sealing tape of the present invention, the technological deficiency of the viscosity of low adhesive linkage is greatly reduced when overcoming long-time heat conduction, the sticking strength with the contact strength of electron device can be kept for a long time, achieve the stability of heat dispersion, thus improve the work-ing life of adhesive tape further
3, the present invention adopts the component of three kinds of certain content as solvent, effectively prevent graphite granule agglomeration in the gluing system of subsequent technique acrylate, thus is conducive to length and thickness direction heat conduction synchronously improves;
4, the present invention is specific according to its formula, adopt diameter to be the graphite of 4 ~ 4.2 microns and Thickness Ratio to be the heat conduction pad pasting of PET film, heat-conducting glue adhesion coating and the aluminium foil layer that 10:18:9 superposes successively, taking into account existing pad pasting performance simultaneously, more be conducive to spread heat and the transmission of electron device, thus further avoid concentrating of adhesive tape amount of localized heat, improve the work-ing life of product.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of manufacturing process of acrylate sealing tape, comprising a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating is obtained by following technique:
The first step, obtains dilution by 0.2 part of linking agent and 150 parts of toluene, 125 parts of ethyl acetate and 150 parts of butanone Homogeneous phase mixing, this linking agent be selected from following general formula (
) compound,
（
）；
In formula, R
1, R
2, R
3represent the residue after carbochain that carbonatoms is the ketone of 3 ~ 8 removing a hydrogen atom independently of one another, M represents Fe or Al;
Second step: 150 parts of Graphite Powder 99s are mixed with the first step dilution, and stir formation mixed solution 84 ~ 86 DEG C of conditions;
3rd step: 100 parts of acrylic ester adhesives are mixed with the mixed solution of second step, and through high speed agitator dispersion 2 ~ 10 hours, thus mix the gluing mixed solvent of formation heat conduction;
4th step: 0.8 part of coupling agent adds sizing agent, stirs 0.5-1 hour;
5th step: the gluing mixed solvent of heat conduction that the 3rd step obtains is coated the lower surface that upper surface has the PET film of aluminium foil layer;
6th step: baking is carried out to the gluing mixed solvent of heat conduction in the 4th step and forms heat-conducting glue adhesion coating;
7th step: by separated type material of fitting through another surface of the heat-conducting glue adhesion coating of overbaking in the 5th step;
8th step: rolling;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:18:9;
Described Graphite Powder 99 diameter is 4 ~ 4.2 microns.
The whipping temp of above-mentioned second step is 85 DEG C.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to spirit of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (2)
1. the manufacturing process of an acrylate sealing tape, it is characterized in that: comprising a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating is obtained by following technique:
The first step, obtains dilution by 0.2 part of linking agent and 150 parts of toluene, 125 parts of ethyl acetate and 150 parts of butanone Homogeneous phase mixing, this linking agent be selected from following general formula (
) compound,
（
）；
In formula, R
1, R
2, R
3represent the residue after carbochain that carbonatoms is the ketone of 3 ~ 8 removing a hydrogen atom independently of one another, M represents Fe or Al;
Second step: 150 parts of Graphite Powder 99s are mixed with the first step dilution, and stir formation mixed solution 84 ~ 86 DEG C of conditions;
3rd step: 100 parts of acrylic ester adhesives are mixed with the mixed solution of second step, and through high speed agitator dispersion 2 ~ 10 hours, thus mix the gluing mixed solution of formation heat conduction;
4th step: 0.8 part of coupling agent adds the gluing mixed solution of heat conduction, stirs 0.5-1 hour;
5th step: the gluing mixed solution of heat conduction that the 4th step obtains is coated the lower surface that upper surface has the PET film of aluminium foil layer;
6th step: baking is carried out to the gluing mixed solution of heat conduction in the 5th step and forms heat-conducting glue adhesion coating;
7th step: by separated type material of fitting through another surface of the heat-conducting glue adhesion coating of overbaking in the 6th step;
8th step: rolling;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:18:9;
Described Graphite Powder 99 diameter is 4 ~ 4.2 microns.
2. the manufacturing process of acrylate sealing tape according to claim 1, is characterized in that: the whipping temp of described second step is 85 DEG C.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550169.5A CN103059758B (en) | 2012-12-18 | 2012-12-18 | Heat conducting adhesive tape for electronic device and preparation method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210550169.5A Division CN103059758B (en) | 2012-12-18 | 2012-12-18 | Heat conducting adhesive tape for electronic device and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103865417A CN103865417A (en) | 2014-06-18 |
| CN103865417B true CN103865417B (en) | 2016-04-27 |
Family
ID=48102668
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210550169.5A Active CN103059758B (en) | 2012-12-18 | 2012-12-18 | Heat conducting adhesive tape for electronic device and preparation method thereof |
| CN201310751466.0A Active CN103911084B (en) | 2012-12-18 | 2012-12-18 | Acrylate adhesive tape |
| CN201410356814.9A Active CN104152071B (en) | 2012-12-18 | 2012-12-18 | For the preparation method of high viscosity adhesive tape |
| CN201410357427.7A Active CN104152073B (en) | 2012-12-18 | 2012-12-18 | For the preparation method of electronic product pad pasting |
| CN201310749012.XA Active CN103865417B (en) | 2012-12-18 | 2012-12-18 | The manufacturing process of acrylate sealing tape |
| CN201310751336.7A Active CN103911083B (en) | 2012-12-18 | 2012-12-18 | Acrylate sealing tape |
Family Applications Before (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210550169.5A Active CN103059758B (en) | 2012-12-18 | 2012-12-18 | Heat conducting adhesive tape for electronic device and preparation method thereof |
| CN201310751466.0A Active CN103911084B (en) | 2012-12-18 | 2012-12-18 | Acrylate adhesive tape |
| CN201410356814.9A Active CN104152071B (en) | 2012-12-18 | 2012-12-18 | For the preparation method of high viscosity adhesive tape |
| CN201410357427.7A Active CN104152073B (en) | 2012-12-18 | 2012-12-18 | For the preparation method of electronic product pad pasting |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310751336.7A Active CN103911083B (en) | 2012-12-18 | 2012-12-18 | Acrylate sealing tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (6) | CN103059758B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106398567A (en) * | 2014-01-26 | 2017-02-15 | 斯迪克新型材料（江苏）有限公司 | Pressure sensitive adhesive tape for notebook computer |
| WO2017113084A1 (en) * | 2015-12-29 | 2017-07-06 | 江苏斯迪克新材料科技股份有限公司 | Modified ultra-thin adhesive tape with high heat conductivity based on synthetic graphite |
| CN105585972B (en) * | 2016-03-21 | 2018-12-11 | 林宝领 | A kind of electronic device adhesive tape |
| CN110183997B (en) * | 2019-06-11 | 2021-07-02 | 厦门市光博士光电有限公司 | Manufacturing process of pressure-sensitive adhesive tape |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201352082Y (en) * | 2008-12-02 | 2009-11-25 | 王晓山 | Composite graphite heat conducting and radiating sheet |
| CN102101994A (en) * | 2010-12-20 | 2011-06-22 | 苏州斯迪克电子胶粘材料有限公司 | Low viscosity acrylate adhesive used for protective film |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| TW201207606A (en) * | 2010-07-05 | 2012-02-16 | Youl Chon Chemical Co Ltd | Heat radiation tape and manufacturing method thereof |
| CN202374617U (en) * | 2011-11-02 | 2012-08-08 | 杜明亮 | Ultrathin heat radiation film having electromagnetic shielding function |
| CN102782068A (en) * | 2010-03-26 | 2012-11-14 | 栗村化学株式会社 | Heat-dissipating tape and method for manufacturing same |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000281995A (en) * | 1999-03-30 | 2000-10-10 | Polymatech Co Ltd | Thermally conductive adhesive film and semiconductor device |
| US6616999B1 (en) * | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
| CN1312242C (en) * | 2005-05-26 | 2007-04-25 | 厦门丰友胶粘制品有限公司 | Laminated adhesive aluminium foil band and it mfg. process |
| JP5235294B2 (en) * | 2006-11-10 | 2013-07-10 | 日東電工株式会社 | Heat-foaming type removable acrylic adhesive tape or sheet |
| KR100774440B1 (en) * | 2007-01-17 | 2007-11-08 | 조인셋 주식회사 | Conductive pressure sensitive adhesive tape |
| WO2009035439A1 (en) * | 2007-09-14 | 2009-03-19 | Henkel Ag & Co, Kgaa | Thermally conductive composition |
| CN101488435B (en) * | 2008-01-18 | 2010-09-22 | 西安东旺精细化学有限公司 | Production and installation method for graphite composite sheet |
| KR100953679B1 (en) * | 2009-06-15 | 2010-04-20 | 두성산업 주식회사 | Material for radiating heat, and method for producing the said material |
| CN101693817A (en) * | 2009-09-30 | 2010-04-14 | 东莞市富邦科技应用材料有限公司 | Superconductivity copper foil tape |
| JP2011231319A (en) * | 2010-04-09 | 2011-11-17 | Nitto Denko Corp | Pressure-sensitive adhesive composition and acrylic pressure-sensitive adhesive tape |
| CN102260472B (en) * | 2010-12-14 | 2013-01-09 | 上海凯鑫森产业投资控股有限公司 | High-strength repeelable pressure-sensitive adhesive for window film and preparation method thereof |
| CN102260478B (en) * | 2010-12-14 | 2013-02-20 | 上海凯鑫森产业投资控股有限公司 | Pressure-sensitive adhesive for PET protective film and preparation method thereof |
| CN102260477B (en) * | 2010-12-14 | 2012-08-08 | 上海凯鑫森产业投资控股有限公司 | Pressure-sensitive adhesive for biaxially-oriented polypropylene (BOPP) protective film and preparation method thereof |
| JP2012149182A (en) * | 2011-01-19 | 2012-08-09 | Nitto Denko Corp | Double-sided adhesive tape or sheet, and method for processing adherend |
| JP5760572B2 (en) * | 2011-03-24 | 2015-08-12 | Dic株式会社 | Double-sided adhesive tape |
| KR101314169B1 (en) * | 2011-04-28 | 2013-10-04 | 주식회사 솔루에타 | Heat conduction tape to horizontality and preparation method thereof |
| CN102504712B (en) * | 2011-11-17 | 2014-06-04 | 北京天山新材料技术股份有限公司 | Double-sided pressure sensitive adhesive tape capable of movement in short time, and preparation method thereof |
| CN102651961B (en) * | 2012-05-29 | 2016-02-03 | 安顿雷纳(上海)纤维材料科技有限公司 | A kind of Heat-conduction heat-dissipation interface material and manufacture method thereof |
-
2012
- 2012-12-18 CN CN201210550169.5A patent/CN103059758B/en active Active
- 2012-12-18 CN CN201310751466.0A patent/CN103911084B/en active Active
- 2012-12-18 CN CN201410356814.9A patent/CN104152071B/en active Active
- 2012-12-18 CN CN201410357427.7A patent/CN104152073B/en active Active
- 2012-12-18 CN CN201310749012.XA patent/CN103865417B/en active Active
- 2012-12-18 CN CN201310751336.7A patent/CN103911083B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201352082Y (en) * | 2008-12-02 | 2009-11-25 | 王晓山 | Composite graphite heat conducting and radiating sheet |
| CN102782068A (en) * | 2010-03-26 | 2012-11-14 | 栗村化学株式会社 | Heat-dissipating tape and method for manufacturing same |
| TW201207606A (en) * | 2010-07-05 | 2012-02-16 | Youl Chon Chemical Co Ltd | Heat radiation tape and manufacturing method thereof |
| CN102101994A (en) * | 2010-12-20 | 2011-06-22 | 苏州斯迪克电子胶粘材料有限公司 | Low viscosity acrylate adhesive used for protective film |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN202374617U (en) * | 2011-11-02 | 2012-08-08 | 杜明亮 | Ultrathin heat radiation film having electromagnetic shielding function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103911083A (en) | 2014-07-09 |
| CN104152071A (en) | 2014-11-19 |
| CN104152073A (en) | 2014-11-19 |
| CN103059758A (en) | 2013-04-24 |
| CN103911084A (en) | 2014-07-09 |
| CN103911083B (en) | 2016-03-02 |
| CN103059758B (en) | 2014-09-03 |
| CN104152071B (en) | 2016-04-27 |
| CN103865417A (en) | 2014-06-18 |
| CN103911084B (en) | 2016-03-02 |
| CN104152073B (en) | 2016-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103045117B (en) | Heat dissipation adhesive tape applied to electronic device and preparation process of same | |
| CN202941075U (en) | Combined-type graphite heat radiation sheet | |
| CN103865417B (en) | The manufacturing process of acrylate sealing tape | |
| CN103059760B (en) | Heat conductive adhesive film with heat dissipation function and manufacturing method thereof | |
| CN202936356U (en) | Double-sided adhesive for heat dissipation of electronic elements | |
| US20170322600A1 (en) | Compositions having a matrix and a hydrated salt of an acid and a group i or ii elment of the periodic table dispersed therein, and electronic devices assembled therewith | |
| CN103865414A (en) | Preparation process of heat dissipation type pressure sensitive tape | |
| CN202941076U (en) | Graphite heat radiation sheet for electronic product | |
| CN202941077U (en) | Graphite heat radiation structure for electronic product | |
| CN103571365B (en) | Heat sinking acrylic ester adhesive tape | |
| CN103059757B (en) | Pressure-sensitive adhesive tape for heat dissipation and preparation method thereof | |
| CN103694919A (en) | Graphite heat-dissipation adhesive tape for electronic products | |
| CN104152072B (en) | The preparation technology of high reliability heat conduction adhesive tape | |
| CN103756584B (en) | The preparation method of heat radiation type acrylate adhesive tape | |
| CN103694918A (en) | Graphite heat-conducting adhesive tape | |
| CN204022732U (en) | Composite base material type heatproof adhesive tape | |
| CN103865413A (en) | Acrylate rubber belt for electronic device | |
| CN104059555B (en) | The manufacturing process of anti-static self-adhesive strip | |
| CN103694920A (en) | Manufacturing method of graphite heat-conducting adhesive tape | |
| CN202945195U (en) | Heat radiating adhesive tape for electronic product | |
| CN107987748A (en) | The preparation method and applications of heat conduction pressure sensitive adhesive | |
| CN104059557B (en) | Anti-static self-adhesive strip | |
| CN203021492U (en) | Heat-conducting double-faced adhesive tape | |
| CN113563832B (en) | Composite adhesive and preparation method thereof | |
| CN202936350U (en) | Graphite heat-dissipation sticking tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: Jiangsu Stick new materials Polytron Technologies Inc Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: Suzhou Sidike New Material Science & Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170705 Address after: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee after: Taicang Stick new Mstar Technology Ltd Address before: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee before: Jiangsu Stick new materials Polytron Technologies Inc |
|
| TR01 | Transfer of patent right |